RClamp0561Z Femto Farad RailClamp® 1-Line, 120fF ESD Protection for High-Speed Lines PROTECTION PRODUCTS Description Features RClamp®0561Z is an ultra low capacitance ESD protection device specifically designed to protect highspeed differential lines. It offers desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. • High ESD withstand voltage IEC 61000-4-2 (ESD) 15kV (air), 12kV (contact) • Ultra-Low capacitance: 0.12pF Typical • Very small PCB area • Protects one high-speed data line • Working voltage: 5.5V • Low reverse leakage current: 50nA max at VR=5.5V • Low Insertion Loss: 0.15dB (Typical) at 5GHz • Large operating bandwidth: 17.5GHz • Solid-state silicon-avalanche technology RClamp0561Z features extremely good ESD protection characteristics highlighted by low peak ESD clamping voltage, and high ESD withstand voltage (+/-12kV contact per IEC 61000-4-2). RClamp0561Z has a typical capacitance of 0.12pF allowing it to be used in high bandwidth applications such as HDMI 2.0 4K/2K, Thunderbolt, and USB 3.1. Each device will protect one high-speed data line operating up to 5.5 volts. RClamp0561Z is in a 2-pin SGP0603P2X3 package measuring 0.62 x 0.32 mm with a nominal height of only 0.30mm. Leads are finished with NiPdAu. The small package gives the designer the flexibility to protect single lines in applications where arrays are not practical. Nominal Dimensions Mechanical Characteristics • • • • • • SGP0603P2X3 Package Pb-Free, Halogen Free, RoHS/WEEE Compliant Nominal Dimensions: 0.62 x 0.32 x 0.30 mm Lead Finish: NiPdAu Marking : Marking Code Packaging : Tape and Reel Applications • • • • • • • HDMI 1.4 and HDMI 2.0 USB 3.0 and USB 3.1 USB Type-C Thunderbolt MIPI / MDDI 10GbE DVI Schematic and Pin Configuration 0.62 1 0.32 0.22 0.17 0.385 BSC 2 0.30 Nominal Dimensions in mm RClamp0561Z Final Datasheet March 18, 2016 Rev 6.0 RClamp0561Z (Bottom View) www.semtech.com 1 Semtech Absolute Maximum Ratings Rating Symbol Value Units Peak Pulse Power (tp = 8/20µs) PPK 50 W Peak Pulse Current (tp = 8/20µs) IPP 2.5 A ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact)(1) VESD ±15 ±12 kV Operating Temperature TJ -40 to +85 O Storage Temperature TSTG -55 to +150 O (1) C C Electrical Characteristics (T=25OC unless otherwise specified) Parameter Symbol Conditions Reverse Stand-Off Voltage Reverse Breakdown Voltage VRWM VBR Min. Typ. -40OC to 85OC It = 1mA, Units 5.5 V 9.5 10.5 V T = 25OC 0.1 50 nA T = 85 C 1 150 nA 20 V -40OC to 85OC VRWM = 5.5V Max. 6.5 Reverse Leakage Current IR Clamping Voltage VC IPP = 2A, tp = 8/20µs, 16.5 ESD Clamping Voltage2 VC IPP = 4A, tp = 0.2/100ns (TLP) 17 V ESD Clamping Voltage2 VC IPP = 16A, tp = 0.2/100ns (TLP) 36 V Dynamic Resistance2, 3 RDYN tp = 0.2/100ns (TLP) 1.5 Ohms Junction Capacitance CJ VR = 0V, f = 1MHz Cutoff Frequency FC -3dB O T = 25OC 0.12 17.5 0.15 pF GHz Notes: (1): Measured with a 40dB attenuator, 50 Ohm scope input impedance, 2GHz bandwidth. ESD gun return path connected to Ground Reference Plane (GRP) (2): Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and V TLP averaging window: t1 = 70ns to t2 = 90ns. (3): Dynamic resistance calculated from ITLP = 4A to ITLP = 16A RClamp0561Z Final Datasheet March 18, 2016 Rev 6.0 www.semtech.com 2 Semtech Typical Characteristics ESD Clamping (+8kV Contact per IEC 61000-4-2) 180 0 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 40dB attenuator. ESD gun return path connected to ESD ground plane. 160 140 -20 Clamping Voltage - VC (V) Clamping Voltage - VC (V) ESD Clamping (-8kV Contact per IEC 61000-4-2) 120 100 80 60 40 -60 -80 -100 -120 -140 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 40dB attenuator. ESD gun return path connected to ESD ground plane. -160 20 0 -40 -10 0 10 20 30 40 50 60 70 -180 80 -10 0 10 20 Time (ns) 30 0 25 -1 15 10 Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns 5 70 80 0.15 dB @ 5GHz 0.40 dB @ 10GHz 0 10 20 30 40 50 -3 -4 -5 -6 60 -7 70 Clamping Voltage (V) RClamp0561Z‐SW‐SPCD‐IL 0 5 Capacitance vs. Reverse Voltage 0.25 15 20 f = 1MHz VR = 0V 0.18 0.16 0.2 Junction Capacitancs - CJ (pF) 0.14 0.12 0.15 0.1 0.08 0.06 0.04 0.1 0.05 0.02 0 10 Frequency (GHz) Capacitance vs. Temperature 0.2 Junction Capacitance - CJ (pF) 60 -2 20 0 50 Insertion Loss (S21) Insertion Loss (dB) TLP Current (A) TLP IV Curve 30 40 Time (ns) f = 1 MHz 0 1 2 3 4 5 6 0 -50 Voltage (V) RClamp0561Z Final Datasheet March 18, 2016 Rev 6.0 www.semtech.com -35 -20 -5 10 25 40 Temperature (°C) 55 70 85 100 3 Semtech Typical Characteristics (Continued) 5Gb/s (USB 3.0) Eye Diagram with RClamp0561Z 5Gb/s (USB 3.0) Eye Diagram without RClamp0561Z Horizontal Scale: 33.3ps/div Vertical Scale: 200mV/div Data Rate: 5.0 Gb/s Mask: USB 3.0 Horizontal Scale: 33.3ps/div Vertical Scale: 200mV/div Data Rate: 5.0 Gb/s Mask: USB 3.0 10Gb/s (USB 3.1) Eye Diagram with RClamp0561Z 10Gb/s (USB 3.1) Eye Diagram without RClamp0561Z Horizontal Scale: 16.6ps/div Vertical Scale: 200mV/div Data Rate: 10.0 Gb/s Mask: USB 3.1 Horizontal Scale: 16.6ps/div Vertical Scale: 200mV/div Data Rate: 10.0 Gb/s Mask: USB 3.1 3.4Gb/s (HDMI) Eye Diagram with RClamp0561Z 3.4Gb/s (HDMI) Eye Diagram without RClamp0561Z Horizontal Scale: 49ps/div Vertical Scale: 200mV/div Data Rate: 3.4 Gb/s Mask: HDMI 1.4 Horizontal Scale: 49ps/div Vertical Scale: 200mV/div Horizontal Scale: 49ps/div Data Rate: 3.4 Gb/s Vertical Scale: 200mV/div Mask: HDMI 1.4 Horizontal Scale: 49ps/div Vertical Scale: 200mV/div Data Rate: 3.4 Gb/s Mask: HDMI 1.4 Data Rate: 3.4 Gb/s Mask: HDMI 1.4 RClamp0561Z Final Datasheet March 18, 2016 Rev 6.0 www.semtech.com 4 Semtech Typical Characteristics (Continued) 5.94Gb/s (HDMI 2.0) Eye Diagram with RClamp0561Z 5.94Gb/s (HDMI 2.0) Eye Diagram without RClamp0561Z Horizontal Scale: 28ps/div Vertical Scale: 200mV/div Data Rate: 5.94 Gb/s Mask: HDMI 2.0 RClamp0561Z Final Datasheet March 18, 2016 Rev 6.0 Horizontal Scale: 28ps/div Vertical Scale: 200mV/div Data Rate: 5.94 Gb/s Mask: HDMI 2.0 www.semtech.com 5 Semtech Application Information USB Type-C Interface Protection USB Type-C is a new 12-pin connector which supports USB 3.1 SuperSpeed+ (10Gb/s) connections and USB power delivery (USB PD). It is also backwards compatible (via an adaptor) with USB 3.0 and USB 2.0. The USB Type-C connector does not imply the use of USB 3.1 technology. USB Type-C is a connector shape. The underlying technology may be USB 2.0, USB 3.0, or USB 3.1. USB Type-C plugs are reversible (i.e. can be either be inserted right-side up or upside-down position) so there are connections on both the top and bottom of the PCB. The USB Type-C receptacle consists of 24-pins including: SuperSpeed RX and TX signal pairs, USB 2.0 DP and DM data pins, Auxiliary pins, Configuration pins, and Power and Ground Pins. Any of these connections are capable of conducting ESD current and should be protected. Protection Solutions SuperSpeed data line pairs are located on both the top and bottom of the PCB to support Type-C plug reversal (i.e. flip-ability). ESD protection of the SuperSpeed line pairs is achieved using one RClamp0561Z between each line and ground. A total of eight devices are required. The low capacitance of RClamp0561Z (0.15pF maximum) exhibits minimal effect on the transmission line impedance and excellent insertion loss characteristics (0.8dB loss at 10GHz). Single line devices make it easier for the designer to route the traces and maintain equal distance between the differential pairs for maximum signal integrity. USB 2.0 pins support Type-C plug reversal by shorting Figure 1 - USB Type-C Top Layer Protection Example together the D+ pins and D- pins in the plug receptacle. This means protection components only need to be placed on the side of the PCB where the traces are routed. RClamp5011ZA is recommended for protection of these lines. Maximum capacitance is only 0.45pF. It also features very good ESD characteristics highlighted by an extremely low dynamic resistance of 0.25 Ohms. Likewise, these devices can be used to protect the configuration channel (CC) and Sideband (SBU) pins. VBus pins are connected together within the Type-C plug and bussed together on the PCB. USB Type-C default power is fixed at 5V. Single line devices such as uClamp0571P are recommended for surge and ESD protection. Note that in power delivery (PD) applications, higher working voltage TVS devices may be needed. Options exist for ESD and surge protection up to 24V. Examples of USB Type-C ESD protection topology using single line protection devices are shown in Figures 1 and 2. A multi-line array such as RClamp7534P is an alternative solution for protecting the D+, D-, SBU, and CC pins. Device Placement Placement of the protection component is a critical element for effective ESD suppression. TVS diodes should be placed as close to the connector as possible. This helps reduce transient coupling to nearby traces. Ground connections should be made directly to the ground plane using micro-vias. This reduces parasitic inductance in the ground path and minimizes the clamping voltage seen by the protected device. Figure 2 - USB Type-C Bottom Layer Protection Example Pins B1 – B12 Pins A1 – A12 GND TX1+ TX1VBUS CC1 D+ DSBU1 VBUS RX2RX2+ GND RClamp0561Z Final Datasheet March 18, 2016 GND RClamp0561Z RX1+ RX1- RClamp0561Z VBUS SBU2 DD+ RClamp5011ZA (2 Each) RClamp5011ZA (2 Each) CC2 VBUS RClamp0561Z TX2TX2+ RClamp0561Z Rev 6.0 GND www.semtech.com RClamp0561Z RClamp0561Z uClamp0571P RClamp5011ZA (2 each) RClamp0561Z RClamp0561Z 6 Semtech Applications Information Assembly Guidelines Recommended Mounting Pattern 0.320 The small size of this device means that some care must be taken during the mounting process to insure reliable solder joints. The figure at the right details Semtech’s recommended mounting pattern. Recommended assembly guidelines are shown in Table 1. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. Exact manufacturing parameters will require some experimentation to get the desired solder application. Semtech’s recommended mounting pattern is based on the following design guidelines: 0.300 0.272 0.620 0.175 Component Land Pad Stencil Opening Land Pattern All Dimensions are in mm. The recommended land pattern follows IPC standards and is designed for maximum solder coverage. Detailed dimensions are shown elsewhere in this document. Land Pad. Stencil opening Component Table 1 - Recommended Assembly Guidelines Assembly Parameter Recommendation Solder Stencil Solder Stencil Design Laser Cut, Electro-Polished Stencil design is one of the key factors which will determine the volume of solder paste which is deposited onto the land pad. The area ratio of the stencil aperture will determine how well the stencil will print. The area ratio takes into account the aperture shape, aperture size, and stencil thickness. An area ratio of 0.70 – 0.75 is preferred for the subject package. The area ratio of a rectangular aperture is given as: Aperture Shape Rectangular with rounded corners Solder Stencil Thickness 0.100mm (0.004”) Solder Paste Type Type 4 size sphere or smaller Solder Reflow Profile Per JEDEC J-STD-020 PCB Solder pad Design Non-Solder Mask Defined PCB Pad Finish OSP or NiAu Area Ratio = (L * W )/ (2 * (L + W) * T) Where: L = Aperture Length W = Aperture Width T = Stencil Thickness Semtech recommends a stencil thickness of 0.100mm for this device. The stencil should be laser cut with electropolished finish. The stencil should have a positive taper of approximately 5 degrees. Electro polishing and tapering the walls results in reduced surface friction and better paste release. For small pitch components, Semtech recommends a square aperture with rounded corners for consistent solder release. Due to the small aperture size, a solder paste with Type 4 or smaller particles are recommended. RClamp0561Z Final Datasheet March 18, 2016 Rev 6.0 www.semtech.com 7 Semtech Outline Drawing - SGP0603P2X3 A B D DIM A A1 b D E e L N aaa bbb E TOP VIEW A DIMENSIONS MILLIMETERS MIN NOM MAX 0.25 0.30 0.35 0.00 0.02 0.03 0.17 0.22 0.27 0.57 0.62 0.67 0.27 0.32 0.37 0.385 BSC 0.17 0.22 0.12 2 0.08 0.10 SEATING PLANE aaa C C A1 D/2 e/2 bbb E/2 bxN C A B 2xL e BOTTOM VIEW NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SGP0603P2X3 DIMENSIONS (C) Z G DIM C G X Y Z MILLIMETERS (0.425) 0.175 0.270 0.250 0.675 Y X NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. RClamp0561Z Final Datasheet March 18, 2016 Rev 6.0 www.semtech.com 8 Semtech Marking Code U Notes: Device is electrically symmetrical Tape and Reel Specification - Plastic Tape U www.semtech.com U Rev 6.0 U U RClamp0561Z Final Datasheet March 18, 2016 9 Semtech Tape and Reel Specification - Paper Tape U U U U Ordering Information Part Number RClamp0561Z.TFT RClamp0561Z.TNT Qty per Reel 15000 10000 Reel Size 7 Inch 7 Inch Tape Material Paper Plastic RailClamp and RClamp are registered trademarks of Semtech Corporation. RClamp0561Z Final Datasheet March 18, 2016 Rev 6.0 www.semtech.com 10 Semtech IMPORTANT NOTICE Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves the right to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. Semtech warrants performance of its products to the specifications applicable at the time of sale, and all sales are made in accordance with Semtech’s standard terms and conditions of sale. SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS, OR IN NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESULT IN PERSONAL INJURY, LOSS OF LIFE OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE UNDERTAKEN SOLELY AT THE CUSTOMER’S OWN RISK. Should a customer purchase or use Semtech products for any such unauthorized application, the customer shall indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney fees which could arise. The Semtech name and logo are registered trademarks of the Semtech Corporation. All other trademarks and trade names mentioned may be marks and names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described in this document without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the suitability of its products for any particular purpose. All rights reserved. © Semtech 2015 Contact Information Semtech Corporation 200 Flynn Road, Camarillo, CA 93012 Phone: (805) 498-2111, Fax: (805) 498-3804 www.semtech.com RClamp0561Z Final Datasheet March 18, 2016 Rev 6.0 11 Semtech