RClamp7538P Low Capacitance RClamp® 8-Line ESD protection PROTECTION PRODUCTS - RailClamp® Description PRELIMINARY Features RailClamp® TVS arrays are ultra low capacitance ESD protection devices designed to protect high speed data interfaces. This series has been specifically engineered to protect sensitive components which are connected to high-speed data and transmission lines from overvoltage caused by ESD (electrostatic discharge), CDE (Cable Discharge Events), and EFT (electrical fast transients). The RClamp®7538P will protect eight lines or four differential pairs. Each line has a maximum capacitance of only 0.60pF between any I/O pin and ground. This allows it to be used on circuits operating in excess of 3GHz with minimal signal attenuation. They feature high maximum ESD withstand voltage of +/- 20kV contact, +/-25kV air discharge per IEC 61000-4-2. The RClamp7538P is in a 9-pin SLP3810N9 package. It measures 3.8 x 1.0mm with a nominal height of 0.50mm. Intra-pair lead pitch is 0.40mm while the pair-to-pair pitch is 0.5mm. The innovative flow through package design simplifies pcb layout and allows matched trace lengths for consistant impedance between high speed differential lines. The combination of small size, low capacitance, and high level of ESD protection makes this device a flexible solution for applications such as HDMI, MHL, LVDS, and eSATA interfaces. ESD protection for high-speed data lines to IEC 61000-4-2 (ESD) ±25kV (air), ±20kV (contact) IEC 61000-4-5 (Lightning) 5A (8/20μs) IEC 61000-4-4 (EFT) 40A (5/50ns) Package design optimized for high speed lines Flow-Through design Protects eight high-speed lines Low capacitance: 0.60pF Maximum (I/O to Ground) Low ESD clamping voltage Low dynamic resistance: 0.42 Ohms (Typ) Solid-state silicon-avalanche technology Mechanical Characteristics SLP3810N9 9-pin package (3.8 x 1.0 x 0.50mm) Pb-Free, Halogen Free, RoHS/WEEE Compliant Lead Pitch: 0.4mm (intra-pair), 0.50mm (pair-topair) Lead finish: NiPdAu Marking: Marking Code Packaging: Tape and Reel Applications Dimensions HDMI 1.4 V-By-One MHL LVDS Interfaces eSATA Interfaces Circuit Diagram 0.40 BSC 3.80 1 2 1.00 1 2 4 5 6 7 8 9 0.50 BSC 3 0.50 Nominal Dimensions in mm (Bottom View) Revision 6/27/2013 8-Line Protection 1 www.semtech.com RClamp7538P PRELIMINARY PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20μs) Pp k 75 Watts Peak Pulse Current (tp = 8/20μs) IP P 5 A ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) VESD +/- 25 +/- 20 kV TJ -55 to +125 °C TSTG -55 to +150 °C Op erating Temp erature Storage Temp erature Electrical Characteristics (T=25oC) Parameter Symbol Conditions Reverse Stand-Off Voltage VRWM Any I/O to GN D Reverse Breakdown Voltage V BR It = 1mA, Any I/O to GN D Reverse Leakage Current IR VRWM = 5.0V, Any I/O to GN D Clamping Voltage VC Clamping Voltage Minimum Maximum Units 5 V 9 11 V 0.005 0.100 μA IPP = 1A, tp = 8/20μs Any I/O to GN D 12 V VC IPP = 5A, tp = 8/20μs Any I/O to GN D 15 V ESD Clamping Voltage1 VC IPP = 4A, tlp = 0.2/100ns 12 V ESD Clamping Voltage1 VC IPP = 16A, tlp = 0.2/100ns 17 V Dynamic Resistance2 RD tp = 100ns 0.42 Ohms Junction Capacitance Cj VR = 0V, f = 1MHz, Any I/O to GN D 0.50 0.60 pF VR = 0V, f = 1MHz, Between I/O pins 0.25 0.4 pF 6.5 Typical Notes 1)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns. 2) Dynamic resistance calculated between Ipp = 4A and Ipp = 16A © 2013 Semtech Corporation 2 www.semtech.com RClamp7538P PRELIMINARY PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time 10 8/20us Pulse Waveform 110 DR040412-75 Waveform Parameters: tr = 8µs td = 20µs 90 80 1 70 Percent of IPP Peak Pulse Power - PPP (kW) 100 e 60 -t 50 40 0.1 td = IPP/2 30 20 10 0 0.01 0 0.1 1 10 Pulse Duration - tp (µs) 100 13 0.70 12 0.60 Capacitance - Cj(pf) Clamping Voltage -VC (V) 0.80 11 10 9 8 3 4 5 30 0.50 0.40 0.30 f = 1 MHz 0.00 6 0 1 2 3 Reverse Voltage - VR(V) Peak Pulse Current - IPP (A) TLP Characteristic (Positive) 4 5 TLP Characteristic (Negative) 0 30 Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns 25 Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns -5 20 TLP Current (A) TLP Current (A) 25 0.10 6 2 20 0.20 Waveform Parameters: tr = 8µs td = 20µs 7 15 Junction Capacitance vs. Reverse Voltage (Between any I/O and Ground) 14 1 10 Time (µs) Clamping Voltage vs. Peak Pulse Current (Between any I/O and Ground) 0 5 1000 15 10 5 -10 -15 -20 -25 0 -30 0 5 10 15 20 25 -40 TLP Voltage (V) © 2013 Semtech Corporation 3 -35 -30 -25 -20 -15 TLP Voltage (V) -10 -5 0 www.semtech.com RClamp7538P PRELIMINARY PROTECTION PRODUCTS Typical Characteristics (Con’t) ESD Clamping (+8kV Contact per IEC 61000-4-2) (Between any I/O and Ground) ESD Clamping (-8kV Contact per IEC 61000-4-2) (Between any I/O and Ground) 140 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane 100 0 -40 Clamping Voltage (V) Clamping Voltage (V) 120 80 60 40 20 -80 -120 -160 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane -200 0 -20 -240 -10 0 10 20 30 40 50 60 70 80 -10 0 10 Time (ns) LOG 40 50 60 70 80 Analog Crosstalk 6 dB / REF 0 dB CH1 S21 1: - .09000 dB 800 MHz 0 dB 5 12 3 -12 dB -18 dB -24 dB -20 dB 4: - 1.1907 dB 2.5 GHz -40 dB 5: - 1.3072 dB 2.7 GHz -60 dB -80 dB -36 dB -100 dB -42 dB -120 dB START . 030 MHz © 2013 Semtech Corporation 10 MHz 100 MHz 20dB / REF 0 dB 0 dB -30 dB 1 MHz LOG 2: - .09670 dB 900 MHz 4 3: - .38870 dB 1.8 GHz -6 dB -48 dB 30 Time (ns) Typical Insertion Loss S21 CH1 S21 20 -140 dB 3 1 GHz GHz -160 dB STOP 3000. 000000 MHz START . 030 MHz 4 STOP 3000. 000000 MHz www.semtech.com RClamp7538P PRELIMINARY PROTECTION PRODUCTS Applications Information Assembly Guidelines The small size of this device means that some care must be taken during the mounting process to insure reliable solder joint. Semtech's recommended assembly guidelines for mounting this device are shown in the Table. The figure below details Semtech’s recommended aperture based on the below recommendations. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. The exact manufacturing parameters will require some experimentation to get the desired solder application. Assembly Parameter R ecommendation Solder Stencil Design Laser cut, Electro-polished Aper ture shape Rectangular with rounded corners Solder Stencil Thickness Solder Paste Type 0.100 mm (0.004") Type 4 size sphere or smaller Solder Reflow Profile PCB Solder Pad Design Per JEDEC J-STD-020 N on-Solder mask defined PCB Pad Finish OSP OR N iAu Stencil Opening 0.250 Land Pad ( Follow Drawing) 0.700 0.350 1.000 3.800 All Dimensions are in mm. Land Pad. Stencil opening Component Recommended Mounting Pattern © 2013 Semtech Corporation 5 www.semtech.com RClamp7538P PRELIMINARY PROTECTION PRODUCTS Outline OutlineDrawing Drawing- -SO-8 SLP3810N9 A D DIMENSIONS MILLIMETERS MIN NOM MAX B PIN 1 INDICATOR (LASER MARK) DIM E A SEATING PLANE aaa C C A1 A2 A A1 A2 b D E e e1 L N aaa bbb 0.45 0.50 0.55 0.00 0.02 0.05 (0.13) 0.15 0.20 0.25 3.70 3.80 3.90 0.90 1.00 1.10 0.80 BSC 0.90 BSC 0.25 0.30 0.35 9 0.08 0.10 D/2 e1 e 1 2 LxN E/2 N e/2 e bxN e1 bbb C A B NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SLP3810N9 P1 P P/2 DIMENSIONS (C) G Z Y DIM C G P P1 X Y Z MILLIMETERS (0.95) 0.35 0.80 0.90 0.20 0.60 1.55 X (P) (P1) NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. © 2013 Semtech Corporation 6 www.semtech.com RClamp7538P PRELIMINARY PROTECTION PRODUCTS Marking Code Ordering Information 7538P PIN 1 INDICATOR YYWW YYWW = Date Code Part Number Qty per Reel Device to Device Pitch Reel Size RClamp7538P.TZT 5,000 4mm 7 Inch RClamp7538P.TN T 10,000 2mm 7 Inch RailClamp and RClamp are trademarks of Semtech Corporation. Carrier Tape Specification 7538P YYWW 7538P YYWW 7538P YYWW 7538P YYWW 7538P YYWW Notes: 1) Pin 1 towards sprocket holes 2) Every pocket populated Device Orientation in Tape (5K Piece Option) © 2013 Semtech Corporation 7538P YYWW 7538P YYWW 7538P YYWW 7538P YYWW 7538P YYWW 7538P YYWW Notes: 1) Pin 1 towards sprocket holes 2) Every other pocket populated Device Orientation in Tape (10K Piece Option) 7 www.semtech.com RClamp7538P PRELIMINARY PROTECTION PRODUCTS Contact Information Semtech Corporation Protection Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 © 2013 Semtech Corporation 8 www.semtech.com