RClamp3324T Low Voltage RailClamp® 4-Line ESD Protection PROTECTION PRODUCTS - RailClamp® Description PRELIMINARY Features ESD protection for high-speed data lines to The RClamp®3324T provides ESD protection for USB3.0, HDMI1.3/1.4, and other high-speed ports. It features a high maximum ESD withstand voltage of ±25kV contact and ±30kV air discharge per IEC 61000-4-2. RClamp3324T is designed to minimize both the ESD peak clamping and the TLP clamping. Peak ESD clamping voltage is extremely low and approximately the same at each pin. The dynamic resistance is among the industry’s lowest at 0.35 Ohms (typical). Typical capacitance on each line to ground is approximately 0.40pF. This allows the RClamp3324T to be used in applications operating in excess of 5GHz without signal attenuation. These devices are manufactured using Semtech’s proprietary low voltage EPD technology for superior characteritics at operating voltages up to 3.3 volts. Each device will protect up to four lines (two high-speed pairs). The RClamp3324T is in a 6-pin SLP1710P4T package. It measures 1.7 x 1.0mm with a nominal height of 0.40mm. The leads have a nominal pin-to-pin pitch of 0.40mm. The flow- through package design simplifies PCB layout and maintains signal integrity on high-speed lines. The combination of low peak ESD clamping, low dynamic resistance, and innovative package design enables this device provides the highest level of ESD protection for applications such as USB 3.0, HDMI and V-By-One interfaces. IEC 61000-4-2 (ESD) ±30kV (air), ±25kV (contact) IEC 61000-4-5 (Lightning) 5A (8/20μs) IEC 61000-4-4 (EFT) 40A (5/50ns) Flow-Through design Protects four high-speed lines Low capacitance: 0.40pF typical (I/O to ground) Low ESD clamping voltage Extremely low dynamic resistance: 0.35 Ohms (Typ) Solid-state silicon-avalanche technology Mechanical Characteristics SLP1710P4T 6L package Pb-Free, Halogen Free, RoHS/WEEE Compliant Nominal Dimensions: 1.7 x 1.0 x 0.40 mm Lead Finish: NiPdAu Molding compound flammability rating: UL 94V-0 Marking : Marking code + date code Packaging : Tape and Reel Applications Circuit Diagram USB 3.0 HDMI 1.3/1.4 10GBase-T Ethernet V-By-One Display Port MHL LVDS Interfaces eSATA Interfaces Pin Configuration (Top View) I/O 1 1 GND I/O 2 Pin 1 Pin 2 Pin 3 Pin 4 I/O 3 I/O 4 5, 6 Revision 9/24/2014 1 GND www.semtech.com RClamp3324T PRELIMINARY PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20μs) Pp k 75 Watts Peak Pulse Current (tp = 8/20μs) IP P 5 A ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) VESD +/- 30 +/- 25 kV TJ -40 to +125 °C TSTG -55 to +150 °C Op erating Temp erature Storage Temp erature Electrical Characteristics (T=25oC Unless Otherwise Specified) Parameter Symbol Conditions VRWM Any I/O to GN D V PT IPT = 2μA Any I/O to GN D Reverse Leakage Current IR VRWM = 3.3V Any I/O to GN D Clamp ing Voltage VC Clamp ing Voltage Junction Cap acitance Reverse Stand-Off Voltage Punch-Through Voltage © 2014 Semtech Corporation Maximum Units 3.3 V 4.8 5.5 V 0.005 0.100 μA IPP = 1A, tp = 8/20μs Any I/O to GN D 7 V VC IPP = 5A, tp = 8/20μs Any I/O to GN D 10.5 V Cj VR = 0V, f = 1MHz, Any I/O to GN D 0.40 0.65 pF VR = 0V, f = 1MHz, Between I/O p ins 0.30 0.4 pF 2 Minimum 3.8 Typical www.semtech.com RClamp3324T PRELIMINARY PROTECTION PRODUCTS Electrical Characteristics (T=25oC Unless Otherwise Noted) ESD R atings (Each Pin) P ar am et er S y m b ol Con d i t i on s Mi n i mu m Ty p i c a l M ax i m u m Units ESD Withstand Voltage1 Contact discharge per IEC 61000-4-2 25 kV ESD Withstand Voltage1 Air discharge per IEC 61000-4-2 30 kV ESD Peak Voltage1 V pk +8kV per IEC 61000-4-2 55 V ESD Peak Voltage1 V pk -8kV per IEC 61000-4-2 -60 V ESD Clamping Voltage2 V tl p IPP = 16A, tlp = 0.2/100ns 11.5 V ESD Clamping Voltage2 V tl p IPP = -16A, tlp = 0.2/100ns 11 V Dynamic Resistance (Positive)2, 3 RDyn tp = 100ns 0.35 Ohms Dynamic Resistance (N egative)2, 3 RDyn tp = 100ns 0.50 Ohms Notes 1)ESD peak voltage measured with a 20dB attenuator, 50 Ohm scope input impedance, 2GHz bandwidth. ESD gun return path connected to ESD ground plane. 2)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns. 3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A © 2014 Semtech Corporation 3 www.semtech.com RClamp3324T PRELIMINARY PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time 120 DR040412-75 100 % of Rated Power or IPP Peak Pulse Power - P PP (kW) 10 Power Derating Curve 1 0.1 80 60 40 20 DR040512:25:125:150 0 0.01 0 0.1 1 10 Pulse Duration - tp (µs) 100 25 1000 75 100 125 150 O Clamping Voltage vs. Peak Pulse Current Capacitance vs. Reverse Voltage 1.0 9 0.9 8 0.8 7 Capacitance - Cj (pf) Clamping Voltage -VC (V) 50 Ambient Temperature - TA ( C) 6 5 4 3 Waveform Parameters: tr = 8µs td = 20µs 2 1 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 f = 1 MHz 0.0 0 1 2 3 4 5 6 0 0.5 1 1.5 2 2.5 3 Reverse Voltage - VR (V) Peak Pulse Current - IPP (A) TLP Characteristic (Positive Pulse) TLP Characteristic (Negative Pulse) 30 0 25 -5 RDYN = 0.35 -10 Current (A) Current (A) 20 15 10 RDYN= 0.50 -15 -20 Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns 5 Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns -25 0 -30 0 5 10 15 20 -20 Voltage (V) © 2014 Semtech Corporation -15 -10 -5 0 Voltage (V) 4 www.semtech.com RClamp3324T PRELIMINARY PROTECTION PRODUCTS Typical Characteristics ESD Clamping at Each Pin (+8kV Contact per IEC 61000-4-2) ESD Clamping at Each Pin (-8kV Contact per IEC 61000-4-2) 60 0 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane 50 -10 -20 Voltage (V) Voltage (V) 40 30 -30 -40 20 -50 10 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane -60 -70 0 -10 0 10 20 30 40 50 60 70 -10 80 0 10 20 30 50 60 70 ESD Clamping vs. Positive Discharge Voltage (Contact Discharge per IEC 61000-4-2) ESD Clamping vs. Negative Discharge Voltage (Contact Discharge per IEC 61000-4-2) 60 10 50 +8kV Vpk=54.6V 40 +6kV VPK=41.8V Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane -10 +4kV Vpk=34.1V 30 80 0 Voltage (V) Voltage (V) 40 Time (ns) Time (ns) +2kV Vpk=22.5V 20 -20 -30 -2kV Vpk= -19.20V -40 -4kV Vpk= -35.36V -50 -6kV Vpk= -48.00V -60 -8kV Vpk= -60.20V 10 0 -10 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane -70 -10 0 10 20 30 40 50 60 -10 0 10 20 Time (ns) 30 40 50 60 Time (ns) Typical Insertion Loss S21 (5GhZ) Analog Crosstalk 0 -20 Insertion Loss (dB) Insertion Loss (dB) -3 -9 -40 -60 -80 -100 -120 Data includes loss due to SMA connector -15 1.00E+06 1.00E+07 1.00E+08 1.00E+09 -140 1.00E+07 1.00E+10 © 2014 Semtech Corporation 1.00E+08 1.00E+09 1.00E+10 Frequency (Hz) Frequency (Hz) 5 www.semtech.com RClamp3324T PRELIMINARY PROTECTION PRODUCTS Applications Information Layout Guidelines RClamp3324T is designed to protect 2 high speed differential pairs. The PCB traces enter and exit each I/O pin. Ground is connected at pins 5 and 6. Figure 2 is an example of how to route the high speed differential traces through the RClamp3324T. The differential impedance of each pair can be controlled for high-speed interfaces such as HDMI (100 Ohms +/15%) and USB 3.0 (85 Ohms +/-15%) while maintaining a minimum trace-to-trace and trace-to-pad spacing of 0.125mm when using 0.100mm wide traces. These are only guidelines. Individual PCB design constraints may necessitate different spacing or trace width. Both ground pads should be connected for optimal performance. Ground connection is made using 0.254mm diameter filled via-in-pad. The via should be filled with a conductive paste. This technique saves board space and eliminates the capillary effect of a non filled via. I/O 1 1 GND I/O 2 I/O 3 I/O 4 GND Figure 1 - Pin Configuration Figure 2 - Example Flow-Through Layout © 2014 Semtech Corporation 6 www.semtech.com RClamp3324T PRELIMINARY PROTECTION PRODUCTS Applications Information USB 3.0 - Type A Host Connector SSRX- RClamp3324T GND D+ SSRX+ GND D- SSTX- RClamp3324T VBus SSTX+ uClamp0541T Land Pad Trace Via Device Outline Figure 3 - USB 3.0 Layout (Type A Host Connector) USB 3.0 - Type B Device Connector SSTX- RClamp3324T SSTX+ D+ D- GND GND SSRX- RClamp3324T SSRX+ uClamp0541T VBus Land Pad Trace Via Device Outline Figure 4 - USB 3.0 Layout (Type B Device Connector) © 2014 Semtech Corporation 7 www.semtech.com RClamp3324T PRELIMINARY PROTECTION PRODUCTS Applications Information HDMI Connector HPD 5V SDA SCL HEC_DAT CEC RClamp7528T CLK CLK+ D0 D0+ RClamp3324T D1 D1+ D2 D2+ Land Pad Trace Via Device Outline RClamp3324T Figure 5 - HDMI 1.4 Layout Recommended Assembly Parameters Stencil Opening Assembly Parameter Land Pad ( Follow drawing ) R ecommendation .25 Solder Stencil Design Laser cut, Electro-polished Aper ture shape Rectangular with rounded corners Solder Stencil Thickness Solder Paste Type Solder Reflow Profile PCB Solder Pad Design PCB Pad Finish .75 0.100 mm (0.004") 1.00 .20 Type 3 size sphere or smaller Per JEDEC J-STD-020 .50 N on-Solder mask defined 1.70 OSP OR N iAu Note that these are only recommendations and should serve only as a starting point for design. The exact manufacturing parameters will require some experimentation to get the desired solder application. © 2014 Semtech Corporation .17 .23 8 All Dimensions are in mm. Land Pad. Stencil opening Component Recommended Mounting Pattern www.semtech.com RClamp3324T PRELIMINARY PROTECTION PRODUCTS Outline OutlineDrawing Drawing- -SO-8 SLP1710P4T A B D DIMENSIONS MILLIMETERS MIN NOM MAX DIM PIN 1 INDICATOR (LASER MARK) E A SEATING PLANE aaa C C A1 A2 e A A1 A2 b D E e e1 L L1 N aaa bbb 0.37 0.40 0.43 0.00 0.02 0.05 (0.13) 0.15 0.20 0.25 1.65 1.70 1.78 0.95 1.00 1.08 0.40 BSC 1.00 BSC 0.20 0.25 0.30 0.45 0.50 0.55 4 0.08 0.10 e/2 1 N LxN E/2 L1x2 e1/2 e1 bx6 bbb D/2 C A B NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. Land Pattern - SLP1710P4T P1 P1/2 Y1 Z (C) G Y P/2 P X DIM C G P P1 X Y Y1 Z DIMENSIONS MILLIMETERS (0.825) 0.25 0.40 1.00 0.20 0.45 0.70 1.40 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. © 2014 Semtech Corporation 9 www.semtech.com RClamp3324T PRELIMINARY PROTECTION PRODUCTS Marking Codes Ordering Information 3324T YYWW Part Number Qty per Reel R eel Size RClamp 3324T.TCT 3,000 7 Inch RailClamp and RClamp are trademarks of Semtech Corporation. YYWW = Alphanumeric character Date Code Carrier Tape Specification 3324T YYWW 3324T YYWW 3324T YYWW Pin 1 Location (Towards Sprocket Holes) User Direction of feed A0 1.18 +/-0.05 mm Tape Width 8 mm B0 K0 1.88 +/-0.05 mm B, (Max) D 4.2 mm 1.5 + 0.1 mm - 0.0 mm ) Device Orientation in Tape 0.53 +/-0.05 mm D1 E 0.5 mm ±0.05 1.750±.10 mm F 3.5±0.05 mm K (MAX) P P0 P2 2.4 mm 4.0±0.1 mm 4.0±0.1 mm 2.0±0.05 mm T(MAX) 0.4 mm W 8.0 mm + 0.3 mm - 0.1 mm Contact Information for Semtech International AG Taiw an Branch Korea Branch Shanghai Office Japan (Osaka) Office Tel: 886-2-2748-3380 Fax: 886-2-2748-3390 Japan (Tokyo) Office Tel: 81-3-5719-7560 Fax: 81-3-5719-7561 Tel: 82-2-527-4377 Fax: 82-2-527-4376 Semtech Limited (U.K.) Tel: 44-1794-527-600 Fax: 44-1794-527-601 Tel: 86-21-6391-0830 Fax: 86-21-6391-0831 Semtech France SARL Tel: 33-(0)169-28-22-00 Fax: 33-(0)169-28-12-98 Semtech Germany GmbH Tel: 49-(0)8161-140-123 Fax: 49-(0)8161-140-124 Tel: 81-6-6347-6570 Fax: 81-6-6347-6571 Semtech International AG is a wholly-owned subsidiary of Semtech Corporation, which has its headquarters in the U.S.A. © 2014 Semtech Corporation 10 www.semtech.com