MOSFET CJ3134K-HF N-Channel RoHS Device Halogen Free V(BR)DSS SOT-723 ID RDS(ON)MAX 380mΩ@4.5V 20V 450mΩ@2.5V 0.011(0.27) 0.007(0.17) 0.75A 1 800mΩ@1.8V 0.049(1.25) 0.031(0.80) 0.045(1.15) 3 Typ. Features 0.015(0.37) 0.011(0.27) 2 0.033(0.85) 0.030(0.75) - Lead free product is acquired - Surface mount package 0.049(1.25) 0.045(1.15) - N-Channel switch with low RDS(on) - Operated at low logic level gate drive 0.020(0.50) 0.017(0.43) 0.002(0.05) 0.000(0.00) Mechanical data 0.006(0.15) 0.003(0.08) - Case: SOT-723, molded plastic. - Terminals: Solderable per MIL-STD-750, method 2026. Dimensions in inches and (millimeter) Circuit Diagram D 1. G : Gate 2. S : Source 3. D : Drain G S Maximum Rating (at TA=25°C unless otherwise noted) Symbol Value Unit Drain-Source voltage VDS 20 V Typical Gate-Source voltage VGS ±12 V ID 0.75 Pulsed drain current (tp=10µs) IDM 1.8 Power dissipation (note1) PD 150 mW RΘJA 833 °C/W Junction temperature TJ 150 °C Storage temperature TSTG -55 to +150 °C TL 260 °C Parameter Continuous drain current (note1) A Thermal resistance from junction to ambient (note1) Lead temperature for soldering purposes (1/8” from case for 10 s) Notes: 1. Surface mounted on FR4 board using the minimum recommended pad size. Company reserves the right to improve product design , functions and reliability without notice. REV: B Page 1 QW-JTR14 Comchip Technology CO., LTD. MOSFET Electrical Characteristics (at TA=25°C unless otherwise noted) Parameter Symbol Conditions Min Typ Max Unit Static Characteristics Drain-source breakdown voltage V(BR) DSS VGS =0V , ID=250µA Zero gate voltage drain current IDSS VDS =20V , VGS=0V 1 µA Gate-body leakage current IGSS VGS=±10V , VDS =0V ±20 µA VGS(th) VDS =VGS , ID=250µA 0.54 1.1 V VGS=4.5V , ID=0.65A 270 380 VGS=2.5V , ID=0.55A 320 450 VGS=1.8V , ID=0.45A 390 800 1.6 Gate threshold voltage (note 2) Drain-source on-state resistance (note 2) RDS(on) Forward transconductance (note 2) gFS VDS=10V , ID=0.8A Diode forward voltage VSD IS=0.15A , VGS=0V 20 0.35 V mΩ S 1.2 V Dynamic Characteristics (note 4) Input capacitance ciss Output capacitance Coss Reverse transfer capacitance 79 120 13 20 Crss 9 15 td(on) 6.7 VDS=16V , VGS=0V, f=1MHZ pF Switching Characteristics (note 4) Turn-on delay time (note 3) Turn-on rise time (note 3) tr VGS=4.5V , VDS=10V 4.8 ID=500mA , RGEN=10Ω 17.3 nS Turn-off delay time (note 3) td(off) tf Turn-off fall time (note 3) 7.4 Notes: 1. Surface mounted on FR4 board using the minimum recommended pad size. 2. Pulse test: Pulse width=300µs, Duty cycle=2% 3. Switching characteristics are independent of operating junction temperatures. 4. Guaranteed by design, not subject to producting. Company reserves the right to improve product design , functions and reliability without notice. REV: B Page 2 QW-JTR14 Comchip Technology CO., LTD. MOSFET RATING AND CHARACTERISTIC CURVES (CJ3134K-HF) Fig.2 - Transfer Characteristics Fig.1 - Output Characteristics 5.0 VGS=4V, 5V Pulsed TA=25°C 4.5 4.0 VGS=3V VDS=3V Pulsed 3.5 4.0 3.0 Drain Current, ID (A) Drain Current, ID (A) VGS=2.5V 3.5 3.0 VGS=2V 2.5 2.0 1.5 TA=100°C 2.5 TA=25°C 2.0 1.5 1.0 1.0 VGS=1.5V 0.5 0.5 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0 5.0 0 Drain to Soruce Voltage, VDS (V) 1 3 4 Fig.4 - RDS(ON) — VGS Fig.3 - RDS(ON) — ID 500 800 Pulsed Pulsed TA=25°C 450 700 ON-Resistance, RDS(ON) (mΩ) ON-Resistance, RDS(ON) (mΩ) 2 Gate to Source Voltage, VGS (V) VGS=1.8V 400 350 VGS=2.5V 300 VGS=4.5V 250 ID=0.65A 600 500 TA=100°C 400 300 TA=25°C 200 200 100 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1 Drain Current, ID (A) 2 3 4 5 Gate to Source Voltage, VGS (V) Fig.5 - IS — VSD Fig.6 - Threshold Voltage 0.8 2 Pulsed 0.7 Threshold Voltage, VTH (V) Source Current, IS (A) 1 TA=100°C TA=25°C 0.1 0.6 ID=250μA 0.5 0.4 0.3 0.01 0.0 0.2 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 25 Source to Drain Voltage, VSD (V) 50 75 100 125 Junction Temperature, TJ (°C) Company reserves the right to improve product design , functions and reliability without notice. REV: B Page 3 QW-JTR14 Comchip Technology CO., LTD. MOSFET Reel Taping Specification P1 d P0 W B F E T C 12 o 0 D2 D1 D W1 Trailer Tape Leader Tape 100±4 Empty Pockets 200±4 Empty Pockets Components End SOT-723 SOT-723 Start SYMBOL A B C d D D1 D2 (mm) 1.33 ± 0.05 1.45 ± 0.05 0.61 ± 0.05 1.50 ± 0.10 178 ± 2.00 54.40 ± 1.00 13.00 ± 1.00 (inch) 0.052 ± 0.002 0.057 ± 0.002 0.024 ± 0.002 0.059 + 0.004 7.008 ± 0.078 2.142 ± 0.039 0.512 ± 0.039 SYMBOL E F P P0 P1 W W1 (mm) 1.75 ± 0.10 3.50 ± 0.05 2.00 ± 0.10 4.00 ± 0.10 2.00 ± 0.10 8.00 + 0.30 /–0.10 12.30 ± 1.00 (inch) 0.069 ± 0.004 0.138 ± 0.002 0.079 ± 0.004 0.158 ± 0.004 0.079 ± 0.004 0.315 + 0.012 /–0.004 0.484 ± 0.039 Company reserves the right to improve product design , functions and reliability without notice. REV: B Page 4 QW-JTR14 Comchip Technology CO., LTD. MOSFET Marking Code 3 Part Number Marking Code CJ3134K-HF KF KF 1 2 Solid dot “ ” = Halogen Free Suggested PAD Layout A SOT-723 SIZE (mm) (inch) A 0.42 0.017 B 0.30 0.012 C 0.30 0.012 D 0.32 0.013 E 0.80 0.031 F 1.00 0.039 B F C D Note: 1.General tolerance: ±0.05mm. 2.The pad layout is for reference purposes only. E Standard Packaging REEL PACK Case Type SOT-723 REEL Reel Size ( pcs ) (inch) 8,000 7 Company reserves the right to improve product design , functions and reliability without notice. REV: B Page 5 QW-JTR14 Comchip Technology CO., LTD.