MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TO−220 FULLPACK, 2−LEAD CASE 221AG ISSUE B DATE 27 AUG 2015 A B E A P E/2 0.14 SCALE 1:1 SEATING PLANE M B A H1 M A1 4 Q D C NOTE 3 1 2 3 L L1 3X 3X c b b2 0.25 M B A M C A2 e SIDE VIEW e1 TOP VIEW A NOTE 6 NOTE 6 D H1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. CONTOUR UNCONTROLLED IN THIS AREA. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH AND GATE PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO EXCEED 0.13 PER SIDE. THESE DIMENSIONS ARE TO BE MEASURED AT OUTERMOST EXTREME OF THE PLASTIC BODY. 5. DIMENSION b2 DOES NOT INCLUDE DAMBAR PROTRUSION. LEAD WIDTH INCLUDING PROTRUSION SHALL NOT EXCEED 2.00. MILLIMETERS DIM MIN MAX A 4.30 4.70 A1 2.50 2.90 A2 2.50 2.90 b 0.54 0.84 b2 1.10 1.40 c 0.49 0.79 D 14.22 15.88 E 9.65 10.67 e 2.54 BSC e1 5.08 BSC H1 6.40 6.90 L 12.70 14.73 L1 --2.80 P 3.00 3.40 Q 2.80 3.20 GENERIC MARKING DIAGRAM* D XX XXXXXXXXX AWLYWWG SECTION A−A A ALTERNATE CONSTRUCTION SECTION D−D 1 A WL Y WW G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. DOCUMENT NUMBER: STATUS: 98AON52563E ON SEMICONDUCTOR STANDARD NEW STANDARD: SemiconductorComponents ComponentsIndustries, Industries,LLC, LLC,2000 2002 ©© Semiconductor October, DESCRIPTION: 2002 February, 2000 − − Rev. Rev. 009AA http://onsemi.com 1 TO−220 FULLPACK, 2−LEAD 1 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. Case Case Outline Outline Number: Number: PAGE 1221A−09 OFXXX 2 DOCUMENT NUMBER: 98AON52563E PAGE 2 OF 2 ISSUE REVISION DATE O RELEASED FOR PRODUCTION. REQ. BY D. TRUHITTE. 10 AUG 2010 A CHANGED DIMENSION A2 MAX VALUE TO 2.90. REQ. BY D. TRUHITTE. 10 APR 2013 B ADDED ALTERNATE CONSTRUCTION FOR TAB AREA. CHANGED H1 FROM 5.97 MIN & 6.48 MAX TO 6.4 MIN & 6.9 MAX. REQ. BT D. TRUHITTE. 27 AUG 2015 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2015 August, 2015 − Rev. B Case Outline Number: 221AG