DMS2220LFDB P-CHANNEL ENHANCEMENT MODE MOSFET WITH INTEGRATED SBR® SUPER BARRIER RECTIFIER Features Mechanical Data • • • • • • • • • • • Low On-Resistance • 95mΩ @VGS = -4.5V • 120mΩ @VGS = -2.5V • 86mΩ (typ) @VGS = -1.8V Low Gate Threshold Voltage, -1.3V Max Fast Switching Speed Low Input/Output Leakage Incorporates Low VF Super Barrier Rectifier (SBR) Low Profile, 0.5mm Max Height Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability U-DFN2020-6 Type B Case: U-DFN2020-6 Type B Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminal Connections: See Diagram Terminals: Finish – NiPdAu over Copper leadframe. Solderable per MIL-STD-202, Method 208 e4 Weight: 0.0065 grams (approximate) • • • • D NC A 3 2 1 Q1 A NC D1 K Bottom View D 4 5 6 S G K K D G S Bottom View Pin Configuration Top View Internal Schematic Ordering Information (Note 4) Part Number DMS2220LFDB-7 Notes: Case U-DFN2020-6 Type B Packaging 3000/Tape & Reel 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. For packaging details, go to our website at http://www.diodes.com. ME Date Code Key Year Code Month Code 2008 V Jan 1 2009 W Feb 2 2010 X Mar 3 YM Marking Information 2011 Y Apr 4 May 5 ME = Marking Code YM = Date Code Marking Y = Year (ex: V = 2008) M = Month (ex: 9 = September) Dot denotes Pin 1 2012 Z Jun 6 2013 A Jul 7 2014 B Aug 8 2015 C Sep 9 2016 D Oct O Nov N 2017 E Dec D SBR is a registered trademark of Diodes Incorporated. DMS2220LFDB Document number: DS31546 Rev. 9 - 2 1 of 7 www.diodes.com January 2013 © Diodes Incorporated DMS2220LFDB Maximum Ratings – TOTAL DEVICE (@TA = +25°C, unless otherwise specified.) Characteristic Power Dissipation (Note 5) Thermal Resistance, Junction to Ambient Operating and Storage Temperature Range Symbol PD RθJA TJ, TSTG Value 1.4 89 -55 to +150 Unit W °C/W °C Maximum Ratings – P-CHANNEL MOSFET – Q1 (@TA = +25°C, unless otherwise specified.) Characteristic Drain-Source Voltage Gate-Source Voltage Drain Current (Note 5) Pulsed Drain Current (Note 6) Symbol VDSS VGSS ID IDM Value -20 ±12 -3.5 -12 Units V V A A Symbol VRRM VRWM VR Value Unit 20 V VR(RMS) 14 V IO 1 A IFSM 3 A Maximum Ratings – SBR – D1 (@TA = +25°C, unless otherwise specified.) Characteristic Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Average Rectified Output Current Non-Repetitive Peak Forward Surge Current 8.3ms single half sine-wave superimposed on rated load Electrical Characteristics – P-CHANNEL MOSFET – Q1 (@TA = +25°C, unless otherwise specified.) Characteristic OFF CHARACTERISTICS (Note 7) Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate-Source Leakage ON CHARACTERISTICS (Note 7) Gate Threshold Voltage Static Drain-Source On-Resistance Forward Transfer Admittance Diode Forward Voltage (Note 7) DYNAMIC CHARACTERISTICS Input Capacitance Output Capacitance Reverse Transfer Capacitance Symbol Min Typ Max Unit BVDSS IDSS -20 — — — V µA IGSS — — — — — -1 ±100 ±800 VGS(th) -0.45 — -1.3 V RDS(ON) — — — 60 74 86 95 120 mΩ VDS = VGS, ID = -250µA VGS = -4.5V, ID = -2.8A VGS = -2.5V, ID = -2.0A |Yfs| VSD — — 8 0.7 — -1.2 S V VGS = -1.8V, ID = -1.0A VDS = -5V, ID = -2.8A VGS = 0V, IS = -1.6A Ciss Coss Crss — — — 632 65 54 — — — pF pF pF nA — Test Condition VGS = 0V, ID = -250µA VDS = -20V, VGS = 0V VGS = ±8V, VDS = 0V VGS = ±12V, VDS = 0V VDS = -10V, VGS = 0V f = 1.0MHz Electrical Characteristics – SBR – D1 (@TA = +25°C, unless otherwise specified.) Characteristic Reverse Breakdown Voltage (Note 7) Symbol V(BR)R Min 20 Typ — Max — Unit V Forward Voltage VF — — — — 0.45 0.52 V IF = 0.5A IF = 1.0A Reverse Current (Note 7) IR — — 100 µA VR = 20V Notes: Test Condition IR = 1mA 5. Device mounted on FR-4 PCB, on minimum recommended, 2oz Copper pad layout. 6. Repetitive rating, pulse width limited by junction temperature. 7. Short duration pulse test used to minimize self-heating effect. SBR is a registered trademark of Diodes Incorporated. DMS2220LFDB Document number: DS31546 Rev. 9 - 2 2 of 7 www.diodes.com January 2013 © Diodes Incorporated DMS2220LFDB Q1 - P-CHANNEL MOSFET 10 10 VGS = -8.0V VDS = -5V VGS = -4.5V 8 VGS = -2.5V -ID, DRAIN CURRENT (A) -ID, DRAIN CURRENT (A) 8 VGS = -2.0V 6 VGS = -1.5V 4 VGS = -1.0V 0 VGS = -1.2V 1 2 3 4 -VDS, DRAIN-SOURCE VOLTAGE (V) Fig. 1 Typical Output Characteristics 0 0.5 5 RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω) RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω) TA = 150°C 0.12 0.1 0.08 VGS = -1.8V 0.06 VGS = -2.5V VGS = -4.5V 0.04 0.02 0 0 1 2 3 4 5 6 7 -ID, DRAIN CURRENT (A) Fig. 3 Typical On-Resistance vs. Drain Current and Gate Voltage 8 RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω) 1.6 1.4 VGS = -2.5V ID = -2A 1.2 VGS = -4.5V ID = -5A 1.0 0.8 0.6 -50 TA = 125°C TA = 85°C TA = 25°C 0.14 RDS(ON), DRAIN-SOURCE ON-RESISTANCE (NORMALIZED) 4 2 2 0 6 -25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (°C) Fig. 5 On-Resistance Variation with Temperature TA = -55°C 1.0 1.5 -VGS, GATE SOURCE VOLTAGE (V) Fig. 2 Typical Transfer Characteristics 2.0 0.14 0.12 0.1 TA = 150°C TA = 125°C 0.08 TA = 85°C 0.06 TA = 25°C 0.04 TA = -55°C 0.02 0 0 1 2 3 4 5 6 7 -ID, DRAIN CURRENT (A) Fig. 4 Typical Drain-Source On-Resistance vs. Drain Current and Temperature 8 0.11 0.09 VGS = -2.5V ID = -2A 0.07 VGS = -4.5V ID = -5A 0.05 0.03 -50 -25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (°C) Fig. 6 On-Resistance Variation with Temperature SBR is a registered trademark of Diodes Incorporated. DMS2220LFDB Document number: DS31546 Rev. 9 - 2 3 of 7 www.diodes.com January 2013 © Diodes Incorporated DMS2220LFDB 10,000 1 -VGS(TH), GATE THRESHOLD VOLTAGE (V) C, CAPACITANCE (pF) f = 1MHz 1,000 Ciss 100 Coss Crss 10 0 4 8 12 16 -VDS, DRAIN-SOURCE VOLTAGE (V) Fig. 7 Typical Capacitance 20 0.9 0.8 0.7 0.6 ID = -1mA 0.5 ID = -250µA 0.4 0.3 0.2 -50 -25 0 25 50 75 100 125 150 TA, AMBIENT TEMPERATURE (°C) Fig. 8 Gate Threshold Variation vs. Ambient Temperature -IS, SOURCE CURRENT (A) 10 8 6 TA = 25°C 4 2 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 -VSD, SOURCE-DRAIN VOLTAGE (V) Fig. 9 Diode Forward Voltage vs. Current r(t), TRANSIENT THERMAL RESISTANCE 1 D = 0.7 D = 0.5 D = 0.3 0.1 D = 0.9 D = 0.1 D = 0.05 RθJA(t) = r(t) * RθJA RθJA = 146°C/W D = 0.02 0.01 P(pk) D = 0.01 t2 TJ - TA = P * RθJA(t) Duty Cycle, D = t 1/t2 D = 0.005 0.001 0.00001 t1 0.0001 0.001 0.01 0.1 1 t1, PULSE DURATION TIME (s) 10 100 1,000 Fig. 10 Transient Thermal Response SBR is a registered trademark of Diodes Incorporated. DMS2220LFDB Document number: DS31546 Rev. 9 - 2 4 of 7 www.diodes.com January 2013 © Diodes Incorporated DMS2220LFDB D1 - SBR IF, INSTANTANEOUS FORWARD CURRENT (A) 0.7 PD, POWER DISSIPATION (W) 0.6 0.5 0.4 0.3 0.2 0.1 0 0 0.5 1 1.5 IF(AV), AVERAGE FORWARD CURRENT (A) Fig. 11 Forward Power Dissipation TA = 150°C 0.1 TA = 85°C 0.01 TA = 25°C 0.001 0.0001 0 TA = -55°C 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 VF, INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 12 Typical Forward Characteristics TA = 150°C 1,000 T A = 125°C C, CAPACITANCE (pF) 100 1,000 TA = 85°C 10 1 TA = 25°C f = 1MHz 100 10 0.1 0.01 0 1 0.1 5 10 15 20 25 30 35 40 VR, INSTANTANEOUS REVERSE VOLTAGE (V) Fig. 13 Typical Reverse Characteristics 1.6 1.4 1.2 Note 5 1.0 0.8 0.6 0.4 0.2 0 25 1 10 100 VR, DC REVERSE VOLTAGE (V) Fig. 14 Total Capacitance vs. Reverse Voltage 150 TA, DERATED AMBIENT TEMPERATURE (°C) IF(AV), AVERAGE FORWARD CURRENT (A) TA = 125°C 10,000 10,000 IR, INSTANTANEOUS REVERSE CURRENT(uA) 1 50 75 100 125 150 TA, AMBIENT TEMPERATURE (°C) Fig. 15 Forward Current Derating Curve 175 125 100 75 50 25 0 0 10 20 30 VR, DC REVERSE VOLTAGE (V) Fig. 16 Operating Temperature Derating 40 SBR is a registered trademark of Diodes Incorporated. DMS2220LFDB Document number: DS31546 Rev. 9 - 2 5 of 7 www.diodes.com January 2013 © Diodes Incorporated DMS2220LFDB Package Outline Dimensions Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version. A A3 SEATING PLANE A1 D Pin#1 ID D2 z d E E2 f f L e b U-DFN2020-6 Type B Dim Min Max Typ A 0.545 0.605 0.575 A1 0 0.05 0.02 A3 0.13 ⎯ ⎯ b 0.20 0.30 0.25 D 1.95 2.075 2.00 d 0.45 ⎯ ⎯ D2 0.50 0.70 0.60 e 0.65 ⎯ ⎯ E 1.95 2.075 2.00 E2 0.90 1.10 1.00 f 0.15 ⎯ ⎯ L 0.25 0.35 0.30 z 0.225 ⎯ ⎯ All Dimensions in mm Suggested Pad Layout Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. C Y G X2 G1 X1 G Z Y1 Dimensions Z G G1 X1 X2 Y Y1 C Value (in mm) 1.67 0.20 0.40 1.0 0.45 0.37 0.70 0.65 SBR is a registered trademark of Diodes Incorporated. 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Copyright © 2013, Diodes Incorporated www.diodes.com SBR is a registered trademark of Diodes Incorporated. DMS2220LFDB Document number: DS31546 Rev. 9 - 2 7 of 7 www.diodes.com January 2013 © Diodes Incorporated