Halogen containing

CONSTITUTION MATERIALS LIST
Datasheet
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TR-TSMT3-JE_Rev.5
Type
Part No.
Package
JEDEC (JEITA)
Mass
(mg)
TSMT3
- (SC-96)
12.5000
Transistor
Part Name
№
1
Mold compound
Weight
(mg)
5.6360
CAS №
Weight
(mg)
Portion vs.
Products
Portion vs.
Part Name
Silica (amorphous)
60676-86-0
4.6699
37.36%
82.86%
Epoxy resin
29690-82-2
0.4086
3.27%
7.25%
Phenol-formaldehyde resin
9003-35-4
0.4086
3.27%
7.25%
Epoxy resin bromide
68541-56-0
0.0584
0.47%
1.04%
Antimony trioxide
Substance Name
1309-64-4
0.0292
0.23%
0.52%
Organic phosphorus
compounds
-
0.0438
0.35%
0.78%
Bismuth compounds
-
0.0175
0.14%
0.31%
Copper (Cu)
7440-50-8
6.0919
48.74%
99.90%
Iron (Fe)
7439-89-6
0.0061
0.05%
0.10%
Subtotal
2
Lead frame (Base material)
6.0980
5.6360
Subtotal
3
Lead frame (Surface treatment)
0.1250
6.0980
7440-50-8
Silver (Ag)
Subtotal
4
External plating
0.1190
0.1250
Die
0.3670
Die attach
0.0430
Bonding wire
0.1120
1.00%
100%
100.00%
1.00%
100%
0.1148
0.92%
96.50%
Silver (Ag)
7440-22-4
0.0036
0.03%
3.00%
Copper (Cu)
7440-50-8
0.0006
0.00%
0.50%
0.1190
0.95%
100%
Silicon (Si)
7440-21-3
0.3569
2.86%
97.25%
Nickel (Ni)
7440-02-0
0.0055
0.04%
1.50%
Silver (Ag)
7440-22-4
0.0032
0.03%
0.87%
Gold (Au)
7440-57-5
0.0014
0.01%
0.38%
Silver (Ag)
7440-22-4
0.0360
0.29%
83.70%
Epoxy resin
29690-82-2
0.0070
0.06%
16.30%
0.3670
Subtotal
7
48.78%
7440-31-5
Subtotal
6
100%
Tin (Sn)
Subtotal
5
0.1250
45.09%
0.0430
7440-57-5
Gold (Au)
Subtotal
Total
-
0.1120
2.94%
100%
0.34%
0.90%
0.1120
0.90%
12.5000
100%
100%
100.00%
100%
-
Note
Disclaimer
・All information in this document is furnished for exploratory or indicative purposes only.
・This information provides estimates of the average weights and content of component materials. and does not include impurities or metals diffused in the silicon.
・ROHM strives for the accuracy of the information, however, ROHM does not give any representations or warranties as to the accuracy or completeness of
such information and shall have no liability for the consequences of use of such information.
・ROHM may make changes to information published in this document at any time and without notice.
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2014.4 - Rev.A