Halogen containing

CONSTITUTION MATERIALS LIST
Datasheet
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TR-SST3-JE_Rev.5
Type
Part No.
Package
JEDEC (JEITA)
Mass
(mg)
SST3
SOT-23
7.7600
Transistor
Part Name
№
1
Mold compound
Weight
(mg)
4.5050
CAS №
Weight
(mg)
Portion vs.
Products
Portion vs.
Part Name
Silica (amorphous)
60676-86-0
3.2699
42.14%
72.58%
Epoxy resin
29690-82-2
0.5606
7.22%
12.44%
Phenol-formaldehyde resin
9003-35-4
0.4204
5.42%
9.33%
Epoxy resin bromide
68541-56-0
0.1635
2.11%
3.63%
Antimony trioxide
Substance Name
1309-64-4
0.0467
0.60%
1.04%
Organic phosphorus
compounds
-
0.0234
0.30%
0.52%
Azo compound *1
-
0.0187
0.24%
0.42%
-
0.0018
0.02%
0.04%
Chromium compounds except
for hexavalent chromium
compounds
Subtotal
2
Lead frame (Base material)
2.6338
Iron (Fe)
Nickel (Ni)
4.5050
Lead frame (Surface treatment)
0.3512
Copper (Cu)
4
External plating
0.1770
1.5276
19.69%
58.00%
7440-02-0
1.1062
14.26%
42.00%
2.6338
Tin (Sn)
7440-31-5
0.1708
2.20%
96.50%
Silver (Ag)
7440-22-4
0.0053
0.07%
3.00%
Copper (Cu)
7440-50-8
0.0009
0.01%
0.50%
Silicon (Si)
7440-21-3
0.0770
0.99%
94.36%
Gold (Au)
7440-57-5
0.0046
0.06%
5.64%
7440-57-5
0.0114
0.3512
0.0816
0.1770
Subtotal
6
Bonding wire
0.0114
Gold (Au)
0.0816
Subtotal
Total
-
4.53%
100%
0.3512
Subtotal
Die
33.94%
7440-50-8
Subtotal
5
100%
7439-89-6
Subtotal
3
58.05%
100.00%
4.53%
100%
2.28%
100%
1.05%
0.15%
0.0114
0.15%
7.7600
100%
100%
100.00%
100%
-
Note
*1 : Not created amine.
Disclaimer
・All information in this document is furnished for exploratory or indicative purposes only.
・This information provides estimates of the average weights and content of component materials. and does not include impurities or metals diffused in the silicon.
・ROHM strives for the accuracy of the information, however, ROHM does not give any representations or warranties as to the accuracy or completeness of
such information and shall have no liability for the consequences of use of such information.
・ROHM may make changes to information published in this document at any time and without notice.
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2014.4 - Rev.A