LAMINATE Data Sheet PBGA Features Plastic Ball Grid Array (PBGA) J-Devices PBGA package is designed for cost/performance applications with flexibility and efficiency in substrate utilization. PBGA design incorporates low inductance, improved thermal operation, enhanced SMT ability and significant improvement in electrical responses due to increase in I/O capability and more direct routing of power, ground and signal traces. Thermally Enhanced PBGA (TEPBGA) This PBGA option with built-in heat slug is available for applications requiring increased heat dissipation. Applications • TV, gaming, PC, network, automotive and industrial applications • Applications where high pin count, high density, high heat dissipation and higher electrical performances are required Innovative designs and expanding package offerings provide a platform from prototype-to-production. • Custom ball counts up to 814 • 0.80-1.27 mm ball pitch • 21-35 mm body sizes • Thin Au wire and Cu wire available • Chip-on-Chip (CoC) • Large mold cap for quality enhancement • Low profile and lightweight • Improved thermal properties and electrical enhancement • Highly flexible internal routing of signal, power and ground for device performance and system compatibility • HDI designs possible • Suitable substrate for multi-die (MCM) and integrated SMT structures • Mature high yielding strip based manufacturing process • Perimeter, staggered rows, and full ball array options • Multi-layer, ground/power • Excellent reliability • Pb-free solder balls Thermal Performance Body Size (mm) Wire Image θJA at 1.0W 0 Airflow (°C/W) PBGA TEPBGA 23 18.6 14.2 27 16.9 13.7 31 16.0 12.4 35 15.5 11.9 *Additional thermal data available *Die size 8.0 x 8.0 mm *Die thickness 0.29 mm *Ta 25°C Wire Image (Chip-to-Chip) DSJD401A Rev Date: 5/15 www.j-devices.co.jp LAMINATE Data Sheet PBGA Process Highlights Cross-section PBGA vs TEPBGA • • • • • • TEBGA Die thickness: 0.29 mm Bond pad pitch: 40 µm Au wire diameter: 15-23 µm Cu wire diameter: 18-23 µm Marking: Laser mark Wafer back grinding: Available Reliability Qualification • Moisture Sensitivity: Pre-condition of: 30°C/60% RH,192 hours, IR reflow 260°C 3X • uHAST: 130°C/85% RH, 96 hours • Temp Cycle: -55°C/+125°C, 1000 cycles • High Temp Storage: 150°C, 1000 hours Standard Materials Heat Slug (Thermally Enhanced BGA) Spacer J-Devices’ TEPBGA is able to convey the heat from the chip directly to the heat slug. This spreads the heat in the package, resulting in efficient dissipation. • Package substrate – Conductor: Cu – Dielectric: Epoxy resin glass reinforced • Die attach: Conductive epoxy • Mold compound: Epoxy mold compound • Solder ball: Pb-free Heat Slug Test Services • Program conversion • Product engineering • Wafer sort • 256 pin x 20 MHz test system available • -55°C to +125°C test available • Burn-in capabilities • Tape and reel services Cross Section Shipping • JEDEC outline trays Wire Image With respect to the information in this document, J-Devices makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. J-Devices shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify J-Devices’ warranty on any product beyond that set forth in its standard terms and conditions of sale. J-Devices reserves the right to make changes in its product and specifications at any time and without notice. © 2015, J-Devices Corporation. All Rights Reserved. DSJD401A Rev Date: 5/15 www.j-devices.co.jp