JD TO-252 Data Sheet

DISCRETE PACKAGE
Data Sheet
TO-252
Standard Materials
Introduction
TO-252 is followed JEDEC standard for
medium-power discrete products.
Application
TO-252 is suitable for medium-power applications
(reference values 80W*/60A), designed for low
on-resistance and high-speed switching MOSFETs:
• Motor drivers
• Power supply circuits
• DC-DC converters
• Consumer products
• Automotive products
*Tc = 25°C, Tj = Max 150°C
Enhanced Feature Options
• Low on-resistance and high current density due
to thick Al wire bonding
• Full turnkey available from wafer probe through
test and packing
• Pb-free plating
Under Developments
• Environmentally friendly die attach Pb-free solder
• Halogen free mold compound
Process Highlights
• Interconnect: Thick Al wire bonding technology
• Plating: 100% matte Sn
• Marking: Laser mark
• Leadframe: Copper with Ni plating on wire
bonding area
• Die attach: Pb solder
• Interconnect: Al wire 11.8 mil max
• Mold compound: With halogen
Reliability Qualification
J-Devices packages are assembled with proven
reliable semiconductor materials.
• All reliability testing include: JEDEC standard
pre-conditioning except high temperature
storage
• 85°C/85%RH, 168 hours, IR reflow 260°C 3X
• PCT: 121°C/100% RH/2 atm, 96 hours
• Temp Cycle: -65°C/+150°C, 300 cycles
• High Temp Storage: 150°C, 1000 hours
Test Service
J-Devices offers full turnkey business for all power
discrete products with the capability to test various
types of power devices including: MOSFETs,
intelligent power devices, etc.
• Power discrete test capability:
– DC
– Capacitance *1
– Rg *1
– Avalanche test
– Thermal resistance
• Program conversion
• Electrical failure analysis
• Integrated test, marking, vision inspection and
tape & reel services
*1 Sampling test only
Shipping
• Tape and reel packing
– 2000 pcs per reel
– Tape width 10.7 mm
– Reel Ф = 330 mm
• Barcode packing label
DSJD414A
Rev Date: 3/15
www.j-devices.co.jp
Data Sheet
DISCRETE PACKAGE
TO-252
Cross-section
Top & Bottom View
Mold compound
Leadframe
Die
Wire
Die Attach Material
Package Outline Drawing – TO-252
Unit: mm
With respect to the information in this document, J-Devices makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. J-Devices shall not be responsible for any loss or damage of
whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify J-Devices’ warranty on any product beyond that set forth in its standard terms and conditions of sale.
J-Devices reserves the right to make changes in its product and specifications at any time and without notice. © 2015, J-Devices Corporation. All Rights Reserved.
DSJD414A
Rev Date: 3/15
www.j-devices.co.jp