ROHM BD1754HFN-TR

Datasheet
Constant Current LED Driver
with 64 Dimming Steps for up to 4 LEDs
BD1754HFN
●General Description
The multi-level brightness control LED works as a
constant current driver in 64 steps, so that the driving
current can be adjusted finely. BD1754HFN is best
suited to turn on LEDs that require high-accuracy LED
brightness control.
●Key Specification
 Operating power supply voltage range: 2.7V to 5.5V
 Quiescent Current:
0.1μA (Typ.)
 Operating temperature range:
-30°C to +85°C
●Package W(Typ.) x D(Typ.) x H(Max.)
●Features
 Current regulation for LED up to 4 parallels
 Adjustable constant current 64 steps
 High accuracy and matching of each current
channel (0.5% Typ.)
 Brightness control via a single-line digital control
interface (Uni-Port Interface Control = UPIC)
●Applications
This driver can be used in various fields such as
mobile phones, portable game machines and etc.
HSON8
2.90mm x 3.00mm x 0.60mm
Figure 1. HSON8
●Typical Application Circuit
Power Supply
L1
L2
L3
L4
VIN
Cin
0.1µF
EN
BD1754HFN
ISET
RISET
GND
120kΩ
(When ILED-max =32mA)
Figure 2. Application Circuit
○Product structure：Silicon monolithic integrated circuit
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○This product is not designed protection against radioactive rays
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Datasheet
BD1754HFN
●Absolute Maximum Ratings (Ta = 25°C)
Parameter
Symbol
Ratings
Unit
Terminal voltage
VMAX
7
V
Power dissipation
Pd
630 (*1)
mW
Operating temperature range
Topr
-30 to +85
°C
Storage temperature range
Tstg
-55 to +150
°C
(*1)
This value is the measurement value when the driver is mounted on a glass epoxy board (70 mm x 70 mm x 1.6 mm).
When using the driver at Ta of 25°C or higher, the power is dissipated by approx. 5.04 mW/°C.
●Recommended Operating Ratings (Ta = -30°C to +85°C)
Parameter
Operating power supply voltage
Driver pin voltage range
Symbol
Limits
Unit
Min.
Typ.
Max.
VIN
2.7
3.6
5.5
V
VDRV
0.2
-
VIN-1.4
V
Condition
When Current driver power on.
●Electrical Characteristics (Unless otherwise specified, Ta = 25°C and VIN = 3.6 V)
Limits
Parameter
Symbol
Unit
Min.
Typ.
Max.
Condition
Iq
-
0.1
1
μA
EN=0V
IDD
-
1.2
2.0
mA
Except LED current
Maximum current
ILED-max
29.76
32.0
34.24
mA
RISET = 120kΩ
LED Current accuracy
ILED-diff
-
-
7.0
%
LED Current matching
ILED-match
-
0.5
3.0(*1)
%
Low threshold voltage
VIL
-
-
0.4
V
High threshold voltage
VIH
1.4
-
-
V
‘H’ level input current
IIH
-
0
2
μA
EN=VIN
‘L’ level input current
IIL
-2
0
-
μA
EN=0V
EN ‘H’ time
THI
0.05
-
100
μs
EN ‘L’ time
TLO
0.3
-
100
μs
TOFF
1
-
-
ms
VIN supply -> EN active time
TVINON
1
-
-
ms
EN stand-by -> VIN Off time
TVINOFF
0
-
-
ms
Quiescent current
Circuit current
[Current driver]
When current 16.5 mA setting
RISET = 120kΩ
When current 16.5 mA setting
RISET = 120kΩ
[Logic controller]
EN Off time-out
(*1)
The following formula is used for calculation:
ILED-match = {(Imax - Imin) / (Imax + Imin)} x 100
Imax = Current value in a channel with the maximum current value among all channels
Imin = Current value in a channel with the minimum current value among all channels
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Datasheet
BD1754HFN
●Pin Descriptions
ESD Diode
Pin Name
In/
Out
For Power
For GND
1
EN
In
VIN
GND
2
GND
-
VIN
-
3
ISET
Out
VIN
GND
Bias current
4
VIN
-
-
GND
Power supply voltage input
5
L1
In
-
GND
Current sink for LED 1
6
L2
In
-
GND
Current sink for LED 2
7
L3
In
-
GND
Current sink for LED 3
8
L4
In
-
GND
-
Thermal PAD
-
-
-
Current sink for LED 4
Heat radiation PAD of back side
Connect to GND
No.
Functions
LED enable and Brightness control signal
Ground
●Block Diagram
L1
L2
L3
L4
VIN
EN
UPIC
6
ISET
Current
DAC
GND
Figure 3. Block Diagram
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Datasheet
BD1754HFN
●Typical Performance Curves
Ta=85℃
Ta=25℃
Ta=-30℃
Ta=-30,25,85℃
Figure 4. Quiescent Current
Figure 5. Circuit current
Ta=-30,25,85℃
Ta=-30,25,85℃
Figure 6. LED off-leakage current
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Figure 7. LED output current vs. LED pin voltage
(VIN = 3.6 V, at 32 mA of LED current)
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Datasheet
BD1754HFN
●Typical Performance Curves - continued
Ta=-30,25,85℃
Ta=-30,25,85℃
Figure 9. LED current characteristics
(VIN = 3.6 V, differential linearity error)
Figure 8. LED output current vs. VIN
(at 32 mA of LED current)
Ta=85℃
Ta=-30℃
Ta=25℃
Ta=-30,25,85℃
Figure 10. LED current characteristics
(VIN = 3.6 V, integral linearity error)
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Figure 11. LED current relative accuracy
(VIN = 3.6 V)
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Datasheet
BD1754HFN
●Typical Performance Curves - continued
RISET [kΩ]
Figure 12. LED current vs. RISET
(VIN = 3.6 V, at the maximum current setting)
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Datasheet
BD1754HFN
●Description of Operations
(1) UPIC (= Uni-Port Interface Control) interface
BD1754HFN has a single-line digital control interface (UPIC) that can control the power ON/OFF and LED current
value through the EN pin. The LED current decreases by one step depending on the number of rising edges. After the
number of rising edge is reached to the minimum output current (64 rising edges), the next rising edge changes the
output current to the maximum value at startup time. To maintain any output current, the EN pin must be kept at ‘H’
level. To power off, the EN pin must be kept at ‘L’ level for more than 1ms.
THI
TLO
TOFF
EN
(Internal)
State
OFF
ILED
C64
C63
C62
C62
C61
C60
C2
C1
C64
OFF
C63
MAX Current
MAX Current
OFF
OFF
MIN Current
Figure 13. Brightness Control Method
THI
TLO
TOFF
EN
Figure 14. UPIC Interface
By following sequence, UPIC can control current driver for MAX current and OFF state only.
TOFF
TOFF
EN
(Internal)
OFF
State
ILED
C64
OFF
C64
OFF
MAX
MAX
OFF
OFF
OFF
Figure 15. UPIC Interface usage for MAX current or OFF only
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Datasheet
BD1754HFN
(2) Current Driver
The MAX Current is determined by the ISET resistance and the following formula.
ILED-max [mA] = 6.4 x 600 [mV] / RISET [kΩ]
The LED current state can be changed by the EN control signal. When the state is Cn, the output current (ILED) can be
obtained from the following formula (where, n indicates a state number).
ILED [mA] = ILED-max x n / 64
The following table is the example of LED current, when ISET resistance is 120 [kΩ].
C64
Output current
[mA]
32.0
C48
Output current
[mA]
24.0
C63
C62
31.5
C47
31.0
C46
C61
30.5
C60
C59
RISET : 120[kΩ]
Output current
[mA]
8.0
C32
Output current
[mA]
16.0
23.5
C31
15.5
C15
7.5
23.0
C30
15.0
C14
7.0
C45
22.5
C29
14.5
C13
6.5
30.0
C44
22.0
C28
14.0
C12
6.0
29.5
C43
21.5
C27
13.5
C11
5.5
C58
29.0
C42
21.0
C26
13.0
C10
5.0
C57
28.5
C41
20.5
C25
12.5
C9
4.5
C56
28.0
C40
20.0
C24
12.0
C8
4.0
C55
27.5
C39
19.5
C23
11.5
C7
3.5
C54
27.0
C38
19.0
C22
11.0
C6
3.0
C53
26.5
C37
18.5
C21
10.5
C5
2.5
C52
26.0
C36
18.0
C20
10.0
C4
2.0
C51
25.5
C35
17.5
C19
9.5
C3
1.5
C50
25.0
C34
17.0
C18
9.0
C2
1.0
C49
24.5
C33
16.5
C17
8.5
C1
0.5
State
State
State
State
C16
When the state is C64 (the maximum value), the output current value can be changed on the ISET resistance value as below.
State : C64
Total output current of the four
channels (mA)
ISET resistance value (kΩ)
Output current per channel (mA)
240
16.0
64.0
120
32.0
128.0
90
42.7
170.8
60
64.0
256.0
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Datasheet
BD1754HFN
●Application Circuit Examples
(1) Circuit example when the power supply is separated
Power Supply2=5V
(Ex.)
On the assumption that Vf is 3 V
Power Supply1
L1
L2
L3
The voltage value of L* pin must
be VIN-1.4 V at the maximum
when the LED is powered ON.
L4
(Maximum rating = 7.0 V)
VIN
Cin
0.1µF
EN
UPIC
6
ISET
Current
DAC
RISET
120kΩ
(When ILED-max =32mA)
GND
Figure 16. Circuit example when the power supply is separated
This figure shows a circuit example when the power supply for VIN and for LEDs is separated. Apply a voltage of Vf
(threshold voltage value of a white LED) or higher to the LED. In this case, please note that when the LED is powered
ON, the voltage value of L* pin (each pin of L1 to L4) must be VIN-1.4 V at the maximum. If a voltage of higher than
VIN-1.4 V is applied to L* pin, a desired current value cannot be obtained. Also, please pay attention to the voltage
application procedure at start-up. Be sure to power the current driver ON using the UPIC after applying power supply
voltages to the VIN and the LED-anode pins. If the current driver is powered ON prior to applying power supply
voltages to the LED, a rush current occurs in the LED. Determine the resistance value with which the LED current
value is maximized and then connect such resistor between the ISET and the GND pins. The power ON/OFF and the
brightness of the LEDs are controlled through the EN pin in accordance with the UPIC format.
(2) Circuit example when using only two LEDs
Connect to the GND pin.
L1
L2
L3
L4
VIN
Cin
0.1µF
EN
UPIC
6
Current
DAC
ISET
RI SET
120kΩ
GND
(When ILED-max =32mA)
Figure 17. Circuit Example when using only two LEDs
This figure shows a circuit example when none of L3 and L4 LEDs are used. Connect both of the unused L3 and L4
pins to the GND pin. Likewise, it is possible to make the L1 and/or the L2 pins unused, which allows the back lights to
be used with the one or three LED(s) turned on. In all cases, connect the unused L* pin to the GND pin. Determine the
resistance value with which the LED current value is maximized and then connect such resistor between the ISET and
the GND pins. The power ON/OFF and the brightness of the LEDs are controlled through the EN pin in accordance
with the UPIC format.
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BD1754HFN
(3) Circuit example when the EN pin is powered on at all times
L1
L2
L3
L4
VIN
Cin
0.1µF
Rs
EN
UPIC
Cs
6
Current
DAC
ISET
RISET
120kΩ
GND
(When ILED-max =32mA)
Figure 18. Circuit example when the EN pin is powered on at all times
This figure shows a circuit example when the EN pin is powered on at all times. To prevent a rush current from
occurring in the driver, it is necessary to apply voltages to the VIN pin and the LEDs prior to powering the current driver
ON. Mount an RC filter between the VIN and the EN pins to delay the EN pin rising against the power-supply voltage
rising. Determine the resistance value with which the LED current value is maximized and then connect such resistor
between the ISET and the GND pins.
(4)
Circuit example when performing a PWM brightness control
L1
L2
L3
L4
VIN
Cin
0.1µF
EN
UPIC
6
ISET
Current
DAC
RISET
120kΩ
GND
1MΩ
PWM
Figure 19. Circuit example when performing a PWM brightness control
This figure shows a circuit example when performing a PWM brightness control. Through switching the ISET resistance
value by the PWM input signal, the LED current is outputted under a PWM mode. The EN signal is controlled by an
applied voltage level. In the circuit example shown above, the LED current value is changed to 3.43 mA in 0 % of the
PWM duty cycle, 17.72 mA in 50 % of that and 32 mA in 100 % of that.
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Datasheet
BD1754HFN
(5) Circuit example when driving a large current with only one LED powered on.
ILED=128mA
L1
L3
L2
L4
VIN
Cin
0.1µF
EN
UPIC
6
ISET
Current
DAC
RISET
120kΩ
GND
(When ILED-max =32mA)
Figure 20. Circuit example when driving a large current with only one LED powered on.
This figure shows a circuit example when driving a large current through all of four channels with only one LED
powered on. By shorting out all the LED driver pins, in the example of using 120 kΩ RISET, a current up to 128 mA (32
mA x 4) can be driven. In this example, the brightness can be adjusted in 64 gradations with 2 mA step (0.5 mA
step/channel x 4 channels). For higher current values, using 60 kΩ RISET allows a current up to 256 mA to be driven
into one of the LEDs. The power ON/OFF and the brightness of the LEDs are controlled through the EN pin in
accordance with the UPIC format.
(6)
Circuit example when making the eight LEDs available by connecting the two BD1754HFN drivers
ILED=32mA
L1
L2
L3
ILED=32mA
L4
L1
VIN
Cin
L2
L3
L4
VIN
0.1µF
Cin
0.1µF
EN
EN
UPIC
UPIC
6
6
ISET
Current
DAC
RISET
ISET
Current
DAC
R ISET
120kΩ
GND
120kΩ
GND
(When ILED-max =32mA)
(When ILED-max =32mA)
Figure 21. Circuit example when making the eight LEDs available by connecting the two BD1754HFN drivers
This figure shows a circuit example when making eight LEDs available by connecting two BD1754HFN drivers.
By connecting the control signals to the EN pins in parallel, the eight LED channels can be controlled concurrently.
This parallel connection scheme can increase the number of the LED channels further as necessary (such as twelve,
sixteen, or more). Determine the resistance value with which the LED current value is maximized and then connect
such resistor between the ISET and the GND pins. The power ON/OFF and the brightness of the LEDs are controlled
through the EN pin in accordance with the UPIC format.
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BD1754HFN
(7) Circuit example when connecting the two LEDs to each of the channels in series
Power Supply2=6.2~7V
(Ex.)
On the assumption that Vf is 3 V
The voltage value of L* pin must
be VIN-1.4 V at the maximum
when the LED is powered ON.
Power Supply1
L1
L2
L3
L4
(Maximum rating = 7.0 V)
VIN
0.1µF
EN
UPIC
6
ISET
Current
DAC
120kΩ
(When ILED-max =32mA)
GND
Figure 22. Circuit example when connecting the two LEDs to each of the channels in series
This figure shows a circuit example when making 8 (2 x 4) LEDs available by connecting two LEDs to each of the
channels in series. In this example, when Vf is set to approx. 3 V in order to ensure the voltage to L1 through L4 pins, it
is necessary to apply a voltage of 6.2 V (3 V x 2 LED’s in series + 0.2 V of the minimum voltage value of the driver pin)
or higher to the LED anode pin as its power supply voltage. Pay attention that the voltage should not exceed the 7.0-V
maximum rating of the L1 through L4 pins. Determine the resistance value with which the LED current value is
maximized and then connect such resistor between the ISET and the GND pins. The power ON/OFF and the
brightness of the LEDs are controlled through the EN pin in accordance with the UPIC format.
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Datasheet
BD1754HFN
●Selection of Components Externally Connected
<Capacitor>
Symbol
Recommended value
Recommended component
Manufacturer
0.1µF
GRM188B31H104KA92B
MURATA
Recommended value
Recommended component
Manufacturer
120kΩ
MCR10PZHZF1203
ROHM
Cin
<Resistor>
Symbol
RISET
●Recommended PCB Layout
Design PCB pattern to provide low impedance for the wiring to the power supply line.
Also, provide a bypass capacitor if needed.
LED_PWR
Connect
Cin
input-bypass
capacitor in close proximity
between the VIN and GND pins.
Connect the RISET resistor in
close proximity to the ISET pin.
L4
L3
L2
L1
EN
GND
ISET
VIN
Cin
LED_PWR
RISET
Cin
RISET
EN
GND
VIN
Figure 23. Layout image of the application components (Top View)
EN
GND
VIN
Figure 24. Surface (Top View)
<Heat radiation PAD of back side>
PAD is used for improving the efficiency of IC heat radiation. Solder PAD to GND pin.
Moreover, connect ground plane (GND) of board using via as shown in the patterns of next page.
The efficiency of heat radiation improves according to the area of ground plane (GND).
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BD1754HFN
●Operational Notes
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as applied voltage, temperature range of operating conditions, can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical
safety measures including the use of fuses, etc.
(2) Recommended Operating Conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter. The voltage and temperature
characteristics are also shown under the conditions in respect of electrical ones.
(3) Reverse Connection of Power Supply Connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown
due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power
supply terminal.
(4) Power Supply Line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal.
At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure that the characteristics of the
capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus
determining the constant.
(5) GND Voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure that no terminal is operated at a potential lower than the GND voltage including an
actual electric transient.
(6) Short Circuit between Terminals and Erroneous Mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting
can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or
between the terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in Strong Electromagnetic Field
Be noted that using ICs in the strong electromagnetic field can cause a malfunction.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to
the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In
addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention
to the transportation and the storage of the set PCB.
(9) Input Terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of
the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input
terminals a voltage lower than that applied to the GND respectively, so that any parasitic element will operate.
Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In
addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply
voltage or within the guaranteed value of electrical characteristics.
(10) Ground Wiring Pattern
If small-signal GND and large-current GND are provided, it will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of
the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) Thermal Design
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in
actual states of use.
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority.
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Datasheet
BD1754HFN
●Ordering Information
B
D
1
7
5
4
H
Part Number
F
N
Package
HFN: HSON8
-
TR
Packaging and forming specification
TR: Embossed tape and reel
●Marking Diagram
HSON8 (TOP VIEW)
Part Number Marking
B D 1
LOT Number
7 5 4
1PIN MARK
●Physical Dimension Tape and Reel Information
HSON8
<Tape and Reel information>
(0.05)
(0.3)
(0.2)
1234
5678
(0.45)
(0.2) (1.8)
8 765
2.8 ± 0.1
3.0 ± 0.2
0.475
(2.2)
(0.15)
2.9±0.1
(MAX 3.1 include BURR)
4321
+0.1
0.13 –0.05
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
1pin
1PIN MARK
S
+0.03
0.02 –0.02
0.6MAX
)
0.1
S
0.65
0.32±0.1
0.08
Direction of feed
M
(Unit : mm)
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
Reel
15/16
∗ Order quantity needs to be multiple of the minimum quantity.
TSZ02201-0G3G0C200060-1-2
9.NOV.2012 Rev.001
Datasheet
BD1754HFN
●Revision History
Date
Revision
09.Nov.2012
001
Changes
New Release
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
16/16
TSZ02201-0G3G0C200060-1-2
9.NOV.2012 Rev.001
Datasheet
Notice
●General Precaution
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2) All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
●Precaution on using ROHM Products
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
2)
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3)
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4)
The Products are not subject to radiation-proof design.
5)
Please verify and confirm characteristics of the final or mounted products in using the Products.
6)
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7)
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8)
Confirm that operation temperature is within the specified range described in the product specification.
9)
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
Datasheet
●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2)
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2)
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
●Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2)
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3)
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4)
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
●Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
●Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
●Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
●Precaution Regarding Intellectual Property Rights
1) All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2)
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
Datasheet
●Other Precaution
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2)
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3)
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4)
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5)
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.