IPP029N06N Data Sheet (1.8 MB, EN)

MOSFET
MetalOxideSemiconductorFieldEffectTransistor
OptiMOSTM
OptiMOSTMPower-Transistor,60V
IPP029N06N
DataSheet
Rev.2.6
Final
PowerManagement&Multimarket
OptiMOSTMPower-Transistor,60V
IPP029N06N
1Description
TO-220-3
tab
Features
•OptimizedforhighperformanceSMPS,e.g.sync.rec.
•100%avalanchetested
•Superiorthermalresistance
•N-channel
•QualifiedaccordingtoJEDEC1)fortargetapplications
•Pb-freeleadplating;RoHScompliant
•Halogen-freeaccordingtoIEC61249-2-21
Table1KeyPerformanceParameters
Parameter
Value
Unit
VDS
60
V
RDS(on),max
2.9
mΩ
ID
100
A
QOSS
65
nC
QG(0V..10V)
56
nC
Drain
Pin 2, Tab
Gate
Pin 1
Source
Pin 3
Type/OrderingCode
Package
Marking
RelatedLinks
IPP029N06N
PG-TO220-3
029N06N
-
1)
J-STD20 and JESD22
Final Data Sheet
2
Rev.2.6,2015-02-10
OptiMOSTMPower-Transistor,60V
IPP029N06N
TableofContents
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Electrical characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Final Data Sheet
3
Rev.2.6,2015-02-10
OptiMOSTMPower-Transistor,60V
IPP029N06N
2Maximumratings
atTj=25°C,unlessotherwisespecified
Table2Maximumratings
Parameter
Symbol
Continuous drain current
Values
Unit
Note/TestCondition
100
100
24
A
VGS=10V,TC=25°C
VGS=10V,TC=100°C
VGS=10V,TC=25°C,RthJA=50K/W
-
400
A
TC=25°C
-
-
110
mJ
ID=100A,RGS=25Ω
VGS
-20
-
20
V
-
Power dissipation
Ptot
-
-
136
3.0
W
TC=25°C
TA=25°C,RthJA=50K/W
Operating and storage temperature
Tj,Tstg
-55
-
175
°C
IEC climatic category;
DIN IEC 68-1: 55/175/56
Unit
Note/TestCondition
Min.
Typ.
Max.
ID
-
-
ID,pulse
-
Avalanche energy, single pulse
EAS
Gate source voltage
Pulsed drain current1)
2)
3Thermalcharacteristics
Table3Thermalcharacteristics
Parameter
Symbol
Thermal resistance, junction - case,
bottom
Values
Min.
Typ.
Max.
RthJC
-
0.7
1.1
K/W
-
Device on PCB,
minimal footprint
RthJA
-
-
62
K/W
-
Device on PCB,
6 cm² cooling area3)
RthJA
-
-
40
K/W
-
Soldering temperature, wave and
reflow soldering are allowed
Tsold
-
-
260
°C
Reflow MSL1
1)
See figure 3 for more detailed information
See figure 13 for more detailed information
3)
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection.
PCB is vertical in still air.
2)
Final Data Sheet
4
Rev.2.6,2015-02-10
OptiMOSTMPower-Transistor,60V
IPP029N06N
4Electricalcharacteristics
Table4Staticcharacteristics
Parameter
Symbol
Drain-source breakdown voltage
Values
Unit
Note/TestCondition
-
V
VGS=0V,ID=1mA
2.8
3.3
V
VDS=VGS,ID=75µA
-
0.5
10
1
100
µA
VDS=60V,VGS=0V,Tj=25°C
VDS=60V,VGS=0V,Tj=125°C
IGSS
-
10
100
nA
VGS=20V,VDS=0V
Drain-source on-state resistance
RDS(on)
-
2.7
3.3
2.9
4.4
mΩ
VGS=10V,ID=100A
VGS=6V,ID=25A
Gate resistance1)
RG
0.65
1.3
1.95
Ω
-
Transconductance
gfs
80
160
-
S
|VDS|>2|ID|RDS(on)max,ID=100A
Unit
Note/TestCondition
Min.
Typ.
Max.
V(BR)DSS
60
-
Gate threshold voltage
VGS(th)
2.1
Zero gate voltage drain current
IDSS
Gate-source leakage current
Table5Dynamiccharacteristics1)
Parameter
Symbol
Input capacitance
Values
Min.
Typ.
Max.
Ciss
-
4100
5125
pF
VGS=0V,VDS=30V,f=1MHz
Output capacitance
Coss
-
980
1225
pF
VGS=0V,VDS=30V,f=1MHz
Reverse transfer capacitance
Crss
-
39
78
pF
VGS=0V,VDS=30V,f=1MHz
Turn-on delay time
td(on)
-
17
-
ns
VDD=30V,VGS=10V,ID=100A,
RG,ext,ext=3Ω
Rise time
tr
-
15
-
ns
VDD=30V,VGS=10V,ID=100A,
RG,ext,ext=3Ω
Turn-off delay time
td(off)
-
30
-
ns
VDD=30V,VGS=10V,ID=100A,
RG,ext,ext=3Ω
Fall time
tf
-
8
-
ns
VDD=30V,VGS=10V,ID=100A,
RG,ext,ext=3Ω
1)
Defined by design. Not subject to production test
Final Data Sheet
5
Rev.2.6,2015-02-10
OptiMOSTMPower-Transistor,60V
IPP029N06N
Table6Gatechargecharacteristics1)
Parameter
Symbol
Gate to source charge
Gate charge at threshold
Values
Unit
Note/TestCondition
-
nC
VDD=30V,ID=100A,VGS=0to10V
11
-
nC
VDD=30V,ID=100A,VGS=0to10V
-
11
15
nC
VDD=30V,ID=100A,VGS=0to10V
Qsw
-
19
-
nC
VDD=30V,ID=100A,VGS=0to10V
Gate charge total
Qg
-
56
66
nC
VDD=30V,ID=100A,VGS=0to10V
Gate plateau voltage
Vplateau
-
4.8
-
V
VDD=30V,ID=100A,VGS=0to10V
Gate charge total, sync. FET
Qg(sync)
-
49
-
nC
VDS=0.1V,VGS=0to10V
Qoss
-
65
82
nC
VDD=30V,VGS=0V
Unit
Note/TestCondition
Min.
Typ.
Max.
Qgs
-
20
Qg(th)
-
Gate to drain charge
Qgd
Switching charge
2)
2)
2)
Output charge
Table7Reversediode
Parameter
Symbol
Diode continuous forward current
Diode pulse current
Values
Min.
Typ.
Max.
IS
-
-
120
A
TC=25°C
IS,pulse
-
-
480
A
TC=25°C
VSD
-
1.0
1.2
V
VGS=0V,IF=100A,Tj=25°C
Reverse recovery time
trr
-
54
86
ns
VR=30V,IF=100A,diF/dt=100A/µs
Reverse recovery charge
Qrr
-
77
-
nC
VR=30V,IF=100A,diF/dt=100A/µs
Diode forward voltage
2)
1)
2)
See ″Gate charge waveforms″ for parameter definition
Defined by design. Not subject to production test
Final Data Sheet
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Rev.2.6,2015-02-10
OptiMOSTMPower-Transistor,60V
IPP029N06N
5Electricalcharacteristicsdiagrams
Diagram1:Powerdissipation
Diagram2:Draincurrent
160
120
140
100
120
80
ID[A]
Ptot[W]
100
80
60
60
40
40
20
20
0
0
25
50
75
100
125
150
175
0
200
0
25
50
75
TC[°C]
100
125
150
175
200
TC[°C]
Ptot=f(TC)
ID=f(TC);VGS≥10V
Diagram3:Safeoperatingarea
Diagram4:Max.transientthermalimpedance
3
101
10
1 µs
10 µs
2
10
100 µs
1 ms
DC
0.5
ZthJC[K/W]
ID[A]
100
101
10 ms
0.2
0.1
10
-1
0.05
0.02
0.01
0
10
single pulse
10-1
10-1
100
101
102
10-2
10-5
10-4
VDS[V]
10-2
10-1
tp[s]
ID=f(VDS);TC=25°C;D=0;parameter:tp
Final Data Sheet
10-3
ZthJC=f(tp);parameter:D=tp/T
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Rev.2.6,2015-02-10
OptiMOSTMPower-Transistor,60V
IPP029N06N
Diagram5:Typ.outputcharacteristics
400
10 V
Diagram6:Typ.drain-sourceonresistance
8
7V
5V
360
5.5 V
6V
7
6V
320
6
280
5
RDS(on)[mΩ]
ID[A]
240
5.5 V
200
160
4
7V
3
10 V
120
5V
2
80
1
40
0
0.0
0.5
1.0
1.5
2.0
2.5
0
3.0
0
80
160
VDS[V]
240
320
400
80
100
ID[A]
ID=f(VDS);Tj=25°C;parameter:VGS
RDS(on)=f(ID);Tj=25°C;parameter:VGS
Diagram7:Typ.transfercharacteristics
Diagram8:Typ.forwardtransconductance
400
200
360
320
150
280
gfs[S]
ID[A]
240
200
100
160
120
50
80
40
0
175 °C
0
2
25 °C
4
6
8
0
0
VGS[V]
40
60
ID[A]
ID=f(VGS);|VDS|>2|ID|RDS(on)max;parameter:Tj
Final Data Sheet
20
gfs=f(ID);Tj=25°C
8
Rev.2.6,2015-02-10
OptiMOSTMPower-Transistor,60V
IPP029N06N
Diagram9:Drain-sourceon-stateresistance
Diagram10:Typ.gatethresholdvoltage
7.0
5
6.5
6.0
4
5.5
5.0
3
4.0
VGS(th)[V]
RDS(on)[mΩ]
4.5
max
3.5
3.0
typ
750 µA
75 µA
2
2.5
2.0
1.5
1
1.0
0.5
0.0
-60
-20
20
60
100
140
0
-60
180
-20
20
Tj[°C]
60
100
140
180
Tj[°C]
RDS(on)=f(Tj);ID=100A;VGS=10V
VGS(th)=f(Tj);VGS=VDS
Diagram11:Typ.capacitances
Diagram12:Forwardcharacteristicsofreversediode
4
103
10
25 °C
175 °C
Ciss
103
102
IF[A]
C[pF]
Coss
102
101
Crss
101
0
20
40
60
100
0.0
0.5
VDS[V]
C=f(VDS);VGS=0V;f=1MHz
Final Data Sheet
1.0
1.5
2.0
VSD[V]
IF=f(VSD);parameter:Tj
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Rev.2.6,2015-02-10
OptiMOSTMPower-Transistor,60V
IPP029N06N
Diagram13:Avalanchecharacteristics
Diagram14:Typ.gatecharge
103
12
30 V
10
12 V
102
48 V
8
VGS[V]
IAV[A]
100 °C
25 °C
125 °C
101
6
4
2
100
100
101
102
103
0
0
10
tAV[µs]
20
30
40
50
60
Qgate[nC]
IAS=f(tAV);RGS=25Ω;parameter:Tj(start)
VGS=f(Qgate);ID=100Apulsed;parameter:VDD
Diagram15:Drain-sourcebreakdownvoltage
Gate charge waveforms
70
66
VBR(DSS)[V]
62
58
54
50
-60
-20
20
60
100
140
180
Tj[°C]
VBR(DSS)=f(Tj);ID=1mA
Final Data Sheet
10
Rev.2.6,2015-02-10
OptiMOSTMPower-Transistor,60V
IPP029N06N
6PackageOutlines
Figure1OutlinePG-TO220-3,dimensionsinmm/inches
Final Data Sheet
11
Rev.2.6,2015-02-10
OptiMOSTMPower-Transistor,60V
IPP029N06N
RevisionHistory
IPP029N06N
Revision:2015-02-10,Rev.2.6
Previous Revision
Revision
Date
Subjects (major changes since last revision)
2.5
2014-07-25
Rev.2.5
2.6
2015-02-10
Insert Rg min value = 0.65 Ohm
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Theinformationgiveninthisdocumentshallinnoeventberegardedasaguaranteeofconditionsorcharacteristics.With
respecttoanyexamplesorhintsgivenherein,anytypicalvaluesstatedhereinand/oranyinformationregardingtheapplication
ofthedevice,InfineonTechnologiesherebydisclaimsanyandallwarrantiesandliabilitiesofanykind,includingwithout
limitation,warrantiesofnon-infringementofintellectualpropertyrightsofanythirdparty.
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Duetotechnicalrequirements,componentsmaycontaindangeroussubstances.Forinformationonthetypesinquestion,
pleasecontactthenearestInfineonTechnologiesOffice.
TheInfineonTechnologiescomponentdescribedinthisDataSheetmaybeusedinlife-supportdevicesorsystemsand/or
automotive,aviationandaerospaceapplicationsorsystemsonlywiththeexpresswrittenapprovalofInfineonTechnologies,ifa
failureofsuchcomponentscanreasonablybeexpectedtocausethefailureofthatlife-support,automotive,aviationand
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intendedtobeimplantedinthehumanbodyortosupportand/ormaintainandsustainand/orprotecthumanlife.Iftheyfail,itis
reasonabletoassumethatthehealthoftheuserorotherpersonsmaybeendangered.
Final Data Sheet
12
Rev.2.6,2015-02-10