HD49334ANP/AHNP CDS/PGA & 10-bit A/D Converter REJ03F0106-0200 Rev.2.00 May 20, 2005 Description The HD49334ANP/AHNP is a CMOS IC that provides CDS-PGA analog processing (CDS/PGA) suitable for CCD camera digital signal processing systems together with a 10-bit A/D converter in a single chip. Functions • • • • • • • Correlated double sampling PGA Offset compensation Serial interface control 10-bit ADC Operates using only the 3 V voltage Corresponds to switching mode of power dissipation and operating frequency Power dissipation: 120 mW (Typ), maximum frequency: 36 MHz (HD49334AHNP) Power dissipation: 60 mW (Typ), maximum frequency: 25 MHz (HD49334ANP) • ADC direct input mode • QFN 36-pin package Features • Suppresses low-frequency noise output from CCD by the S/H type correlated double sampling. • The S/H response frequency characteristics for the reference level can be adjusted using values of external parts and registers. • High sensitivity is achieved due to the high S/N ratio and a wide coverage provided by a PG amplifier. • Feedback is used to compensate and reduce the DC offsets including the output DC offset due to PGA gain change and the CCD offset in the CDS (correlated double sampling) amplifier input. • PGA, standby mode, etc., is achieved via a serial interface. • High precision is provided by a 10-bit-resolution A/D converter. Rev.2.00 May 20, 2005 page 1 of 21 HD49334ANP/AHNP ADCIN AVSS AVDD BIAS BLKC CDSIN BLKFB BLKSH AVDD Pin Arrangement 27 26 25 24 23 22 21 20 19 28 18 17 29 30 16 31 15 14 32 33 13 34 12 11 35 36 10 1 2 3 4 5 6 7 8 9 AVSS SPSIG SPBLK OBP PBLK DVDD ADCLK DVSS DRDVDD D1 D2 D3 D4 D5 D6 D7 D8 D9 VRM VRT VRB DVDD DVSS CS SDATA SCK D0 (Top view) Pin Description Pin No. Symbol Description I/O Analog(A) or Digital(D) 1 to 9 D0 to D9 Digital output O D 10 11 DRDVDD DVSS Output buffer power supply (3 V) Digital ground (0 V) — — D D 12 13 ADCLK DVDD ADC conversion clock input pin Digital power supply (3 V) I — D D 14 15 PBLK OBP Preblanking input pin Optical black pulse input pin I I D D 16 17 SPBLK SPSIG Black level sampling clock input pin Signal level sampling clock input pin I I D D 18 19 AVSS AVDD Analog ground (0 V) Analog power supply (3 V) — — A A 20 21 BLKSH BLKFB Black level S/H pin Black level FB pin — — A A 22 23 CDSIN BLKC CDS input pin Black level C pin I — A A 24 BIAS — A 25 AVDD Internal bias pin Connect a 33 kΩ resistor between BIAS and AVSS. Analog power supply (3 V) — A 26 27 AVSS ADCIN Analog ground (0 V) ADC input pin — — A A 28 VRM — A 29 VRT Reference voltage pin 1 Connect a 0.1 µF ceramic capacitor between VRM and AVSS. Reference voltage pin 3 Connect a 0.1 µF ceramic capacitor between VRT and AVSS. — A 30 VRB — A Reference voltage pin 2 Connect a 0.1 µF ceramic capacitor between VRB and AVSS. Rev.2.00 May 20, 2005 page 2 of 21 HD49334ANP/AHNP Pin Description (cont.) Pin No. Symbol Description I/O Analog(A) or Digital(D) 31 DVDD Digital power supply (3 V) — D 32 33 DVSS CS Digital ground (0 V) Serial interface control input pin — I D D 34 35 SDATA SCK Serial data input pin Serial clock input pin I I D D 36 D0 Digital output O D Note: 1. With pull-down resistor. Input/Output Equivalent Circuit Pin Name Digital output Equivalent Circuit D0 to D9 DVDD DIN Digital output STBY Digital input Analog ADCLK, OBP, SPBLK, SPSIG, CS, SCK, SDATA, PBLK DVDD Digital input CDSIN Internally connected to VRT AVDD CDSIN ADCIN AVDD Internally connected to VRM ADCIN BLKSH, BLKFB, BLKC AVDD + − BLKFB BLKSH BLKC VRT, VRM, VRB + − VRT VRB AVDD + − + − BIAS AVDD BIAS Rev.2.00 May 20, 2005 page 3 of 21 VRM HD49334ANP/AHNP 16 18 19 DVSS AVSS DRDVDD DVDD AVDD SPSIG SPBLK ADCLK Block Diagram 31 16 18 19 19 42 OEB Timing generator ADCIN 27 9 D9 PBLK 26 BLKSH 28 8 D8 10bit ADC PGA CDS Output latch circuit CDSIN 26 BLKC 28 BLKFB 29 DC offset compensation circuit Serial interface Bias generator 7 D7 6 D6 5 D5 4 D4 3 D3 2 D2 D1 32 34 33 SCK SDATA BIAS VRT Rev.2.00 May 20, 2005 page 4 of 21 VRB 35 VRM 44 45 43 CS 17 OBP D0 HD49334ANP/AHNP Internal Functions Functional Description • CDS input CCD low-frequency noise is suppressed by CDS (correlated double sampling). The signal level is clamped at 14 LSB to 76 LSB by resister during the OB period. *1 Gain can be adjusted using 8 bits of register (0.132 dB steps) within the range from –2.36 dB to 31.40 dB. *2 • ADC input The center level of the input signal is clamped at 512 LSB (Typ). Gain can be adjusted using 8 bits of register (0.01784 times steps) within the range from 0.57 times (–4.86 dB) to 5.14 times (14.22 dB). *1 • Automatic offset calibration of PGA and ADC • DC offset compensation feedback for CCD and CDS • Pre-blanking CDS input operation is protected by separating it from the large input signal. Digital output is set at clamp level by resister. • Digital output enable function Notes: 1. It is not covered by warranty when 14LSB settings 2. Full-scale digital output is defined as 0 dB (one time) when 1 V is input. Operating Description Figure 1 shows CDS/PGA + ADC function block. ADCIN PG AMP CDS AMP C2 CDSIN SH AMP C1 Gain setting (register) Current DAC VRT D0 to D9 10bit ADC DAC Clamp data (register) Offset calibration logic DC offset feedback logic BLKC BLKSH BLKFB C4 C3 OBP Figure 1 HD49334ANP/AHNP Functional Block Diagram 1. CDS (Correlated Double Sampling) Circuit The CDS circuit extracts the voltage differential between the black level and a signal including the black level. The black level is directly sampled at C1 by using the SPBLK pulse, buffered by the SHAMP, then provided to the CDSAMP. The signal level is directly sampled at C2 by using the SPSIG pulse, and provided to CDSAMP (see figure 1). The difference between these two signal levels is extracted by the CDSAMP, which also operates as a programmable gain amplifier at the previous stage. The CDS input is biased with VRT (2 V) during the SPBLK pulse validation period. During the PBLK period, the above sampling and bias operation are paused. Rev.2.00 May 20, 2005 page 5 of 21 HD49334ANP/AHNP 2. PGA Circuit The PGAMP is the programmable gain amplifier for the latter stage. The PGAMP and the CDSAMP set the gain using 8 bits of register. The equation below shows how the gain changes when register value N is from 0 to 255. In CDSIN mode: Gain = (–2.36 dB + 0.132 dB) × N (LOG linear). In ADCIN mode: Gain = (0.57 times + 0.00446 times) × N (linear). Full-scale digital output is defined as 0 dB (one time) when 1 V is input. 3. Automatic Offset Calibration Function and Black-Level Clamp Data Setting The DAC DC voltage added to the output of the PGAMP is adjusted by automatic offset calibration. The data, which cancels the output offset of the PGAMP and the input offset of the ADC, and the clamp data (14 LSB to 76 LSB) set by register are added and input to the DAC. The automatic offset calibration starts automatically after the RESET mode set by register 1 is cancelled and terminates after 40000 clock cycles (when fclk = 20 MHz, 2 ms). 4. DC Offset Compensation Feedback Function Feedback is done to set the black signal level input during the OB period to the DC standard, and all offsets (including the CCD offset and the CDSAMP offset) are compensated for. The offset from the ADC output is calculated during the OB period, and SHAMP feedback capacitor C3 is charged by the current DAC (see figure 1). The open-loop differential gain (∆Gain/∆H) per 1 H of the feedback loop is given by the following equation. 1H is the one cycle of the OBP. ∆Gain/∆H = 0.078/(fclk × C3) (fclk: ADCLK frequency, C3: SHAMP external feedback capacitor) Example: When fclk = 20 MHz and C3 = 1.0 µF, ∆Gain/∆H = 0.0039 When the PGAMP gain setting is changed, the high-speed lead-in operation state is entered, and the feedback loop gain is increased by a multiple of N. Loop gain multiplication factor N can be selected from 4 times, 8 times, 16 times, or 32 times by changing the register settings (see table 1). Note that the open-loop differential gain (∆Gain/∆H) must be one or lower. If it is two or more, oscillation occurs. The time from the termination of high-speed lead-in operation to the return of normal loop gain operation can be selected from 1 H, 2 H, 4 H, or 8 H. If the offset error is over 32 LSB, the high-speed lead-in operation continues, and when the offset error is 32 LSB or less, the operation returns to the normal loop-gain operation after 1 H, 2 H, 4 H, or 8 H depending on the register settings. See table 2. Table 1 Loop Gain Multiplication Factor during High-Speed Lead-In Operation HGain-Nsel (register settings) [0] [1] L L H L L H H H Multiplication Factor N 4 8 16 32 Table 2 High-Speed Lead-In Operation Cancellation Time HGstop-Hsel (register settings) [0] [1] L L H L L H H H Cancellation Time 1H 2H 4H 8H 5. Pre-Blanking Function During the PBLK input period, the CDS input operation is separated and protected from the large input signal. The ADC digital output is fixed to clamp data (14 to 76 LSB). Rev.2.00 May 20, 2005 page 6 of 21 HD49334ANP/AHNP H Notes: 1. 2. 3. Table 4 PBLK D9 D8 ADC Digital Output D7 D6 D5 D4 D3 X X X Hi-Z L L H Same as in table 4. L H H D9 is inverted in table 4. H L H D8 to D0 are inverted in table 4. H H H D9 to D0 are inverted in table 4. X X L Output code is set up to Clamp Level. H L L H Same as in table 5. L H H D9 is inverted in table 5. H L H D8 to D0 are inverted in table 5. H H H D9 to D0 are inverted in table 5. X X L Output code is set up to Clamp Level. H L H L H L X L L X L L H L H L L H X H H L H L H H L X L H L H L H H H X STBY, TEST, LINV, and MINV are set by register. Mode setting for the PBLK is done by external input pins. The polarity of the PBLK pin when the register setting is SPinv is low. D2 D1 D0 X L Operating Mode Low-power wait state Normal operation Pre-blanking Normal operation H H L L L L H H H H L L L L H H Pre-blanking Test mode ADC Output Code Output Pin Output Steps codes Table 5 MINV X L LINV TEST0 H L TEST1 STBY 6. ADC Digital Output Control Function The ADC digital output includes the functions output enable, code conversion, and test mode. Tables 3, 4 and 5 show the output functions and the codes. Table 3 ADC Digital Output Functions 3 4 5 6 D9 L L L L D8 L L L L D7 L L L L D6 L L L L D5 L L L L D4 L L L L D3 L L L L D2 L H H H D1 H L L H D0 H L H L 511 512 L H H L H L H L H L H L H L H L H L H L 1020 1021 1022 1023 H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H L L H H L H L H ADC Output Code (TEST1) Output Pin Output Steps codes 3 4 5 6 D9 L L L L D8 L L L L D7 L L L L D6 L L L L D5 L L L L D4 L L L L D3 L L L L D2 L H H H D1 H H H L D0 L L H H 511 512 L H H H L L L L L L L L L L L L L L L L 1020 1021 1022 1023 H H H H L L L L L L L L L L L L L L L L L L L L L L L L L L L L H H L L L H H L Rev.2.00 May 20, 2005 page 7 of 21 HD49334ANP/AHNP 7. Adjustment of Black-Level S/H Response Frequency Characteristics The CR time constant that is used for sampling/hold (S/H) at the black level can be adjusted by changing the register settings, as shown in table 6. Table 6 SHSW CR Time Constant Setting SHSW-fsel (Register setting) [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] L L L L H L L L L H L L H H L L L L H L H L H L L H H L H H H L 2.20 nsec 2.30 nsec 2.51 nsec 2.64 nsec 2.93 nsec 3.11 nsec 3.52 nsec 3.77 nsec CR Time Constant (Typ) (cutoff frequency conversion) (72 MHz) (69 MHz) (63 MHz) (60 MHz) (54 MHz) (51 MHz) (45 MHz) (42 MHz) SHSW-fsel (Register setting) [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] L L L H H L L H L H L H H H L H L L H H H L H H L H H H H H H H 4.40 nsec 4.80 nsec 5.87 nsec 6.60 nsec 8.80 nsec 10.6 nsec 17.6 nsec 26.4 nsec CR Time Constant (Typ) (cutoff frequency conversion) (36 MHz) (33 MHz) (27 MHz) (24 MHz) (18 MHz) (15 MHz) (9 MHz) (6 MHz) 8. The SHAMP frequency characteristics can be adjusted by changing the register settings and the C4 value of the external 23rd pin. The settings are shown in table 7. Values other than those shown in the table 7 cannot be used. Table 7 BLKC 23 C4 SHAMP Frequency Characteristics Setting LoPwr (Register setting) "Lo" [0] H [1] L SHA-fsel (Register setting) [0] [1] L H 75 MHz 13000 pF (300 pF) 32 MHz 22000 pF (750 pF) 116 MHz 10000 pF (270 pF) 49 MHz "Hi" 15000 pF (620 pF) Note: Upper line : SHAMP cutoff frequency (Typ) Middle line : Standard value of C4 (maximum value is not defined) Lower line : Minimum value of C4 (do not set below this value) Rev.2.00 May 20, 2005 page 8 of 21 [0] H [1] H 56 MHz 18000 pF (360 pF) 24 MHz 27000 pF (820 pF) HD49334ANP/AHNP Timing Chart Figure 2 shows the timing chart when CDSIN and ADCIN input modes are used. 0 1 2 ~ 9 10 11 • When CDSIN input mode is used N CDSIN N+1 N+2 N+9 N+10 N+11 SPBLK SPSIG ADCLK D0 to D9 N−10 N−9 N−8 N−1 N • When ADCIN input mode is used N+1 N ADCIN N+11 N+10 N+2 N+9 N+8 ADCLK D0 to D9 N−9 N−8 N−1 N N+1 Note: The phases of SPBLK and SPSIG are those when the serial data SPinv bit is set to low. Figure 2 Output Timing Chart when CDSIN and ADCIN Input Modes are Used • The ADC output (D0 to D9) is output at the rising edge of the ADCLK in both modes. • Pipe-line delay is ten clock cycles when CDSIN is used and nine when ADCIN is used. • In ADCIN input mode, the input signal is sampled at the rising edge of the ADCLK. Rev.2.00 May 20, 2005 page 9 of 21 HD49334ANP/AHNP Detailed Timing Specifications Detailed Timing Specifications when CDSIN Input Mode is Used Figure 3 shows the detailed timing specifications when the CDSIN input mode is used, and table 8 shows each timing specification. Black level Signal level CDSIN (2) (3) (1) SPBLK Vth (5) (4) SPSIG Vth (6) (7) (8) ADCLK Vth (9) (10) D0 to D9 Note: 1. When serial data Spinv bit is set to low. (When the Spinv bit is set to high, the polarities of the SPBLK and the SPSIG are inverted.) Figure 3 Detailed Timing Chart when CDSIN Input Mode is Used Table 8 Timing Specifications when the CDSIN Input Mode is Used No. Timing Symbol Min Typ Max Unit (1) (2) Black-level signal fetch time 1 SPBLK low period * tCDS1 tCDS2 — Typ × 0.8 (1.5) 1/4fCLK — Typ × 1.2 ns ns (3) (4) Signal-level fetch time 1 SPSIG low period * tCDS3 tCDS4 — Typ × 0.8 (1.5) 1/4fCLK — Typ × 1.2 ns ns (5) (6) SPBLK rising to SPSIG rising time * 1 SPBLK rising to ADCLK rising inhibition time * tCDS5 tCDS6 Typ × 0.85 1 1/2fCLK 5 Typ × 1.15 11 ns ns (7), (8) (9) ADCLK tWH min./tWL min. ADCLK rising to digital output hold time tCDS7, 8 tCHLD9 11 3 — 7 — — ns ns (10) ADCLK rising to digital output delay time tCOD10 — 16 24 ns Note: 1 1. SPBLK and SPSIG polarities when serial data Spinv bit is set to low. OBP Detailed Timing Specifications Figure 4 shows the OBP detailed timing specifications. The OB period is from the fifth to the twelfth clock cycle after the OB pulse is input. The average of the black signal level is taken for eight input cycles during the OB period and becomes the clamp level (DC standard). OB period *1 CDSIN N N+1 N+5 N+12 N+13 OBP OB pulse > 2 clock cycles This edge is used, when OBP pulse-width period is clamp-on. When serial data OBPinv bit is set to low (When the OBPinv is set to high, the polarity of the OBP is inverted.) Note: 1. Shifts ±1 clock cycle depending on the OBP input timing. Figure 4 OBP Detailed Timing Specifications Rev.2.00 May 20, 2005 page 10 of 21 HD49334ANP/AHNP Detailed Timing Specifications at Pre-Blanking Figure 5 shows the pre-blanking detailed timing specifications. PBLK Vth VOH Digital output (D0 to D9) ADC data ADC data Clamp level VOL ADCLK × 10 clocks (shifts one clock cycle depending on the PBLK input timing) When serial data SPinv bit is set to low (When the SPinv is set to high, the PBLK polarity is inverted.) tPBLK ADCLK × 2 clocks Figure 5 Detailed Timing Specifications at Pre-Blanking Detailed Timing Specifications when ADCIN Input Mode is Used Figure 6 shows the detailed timing chart when ADCIN input mode is used, and table 9 shows each timing specification. ADCIN (1) (2) (3) ADCLK Vth (4) (5) D0 to D9 VDD/2 Figure 6 Detailed Timing Chart when ADCIN Input Mode is Used Table 9 Timing Specifications when ADCIN Input Mode is Used No. Timing Symbol Min Typ Max (1) Signal fetch time tADC1 — (6) — ns (2), (3) (4) ADCLK tWH min./tWL min. ADCLK rising to digital output hold time tADC2, 3 tAHLD4 Typ × 0.85 10 1/2fADCLK 14.5 Typ × 1.15 — ns ns (5) ADCLK rising to digital output delay time tAOD5 — 23.5 31.5 ns Rev.2.00 May 20, 2005 page 11 of 21 Unit HD49334ANP/AHNP Serial Interface Specifications Table 10 Serial Data Function List Resister 0 Resister 1 Resister 2 Resister 3 Resister 4 to 7 *7 Test Mode (can not be used) DI 00 (LSB) Low High Low High Low to High DI 01 Low Low High High Low to High DI 02 Low Low Low Low High DI 03 Cannot be used. All low DI 04 SLP Low: Normal operation mode Clamp-level [0] (LSB) High: Sleep mode C-Bias off STBY Low: Normal operation mode Clamp-level [1] High: Standby mode Output mode setting (TEST1) DI 05 PGA gain setting (LSB) Output mode setting (LINV) Clamp-level [2] DI 06 PGA gain setting Output mode setting (MINV) Clamp-level [3] DI 07 PGA gain setting Output mode setting (TEST0) Clamp-level [4] (MSB) DI 08 PGA gain setting SHA-fsel [0] (LSB) DI 09 PGA gain setting SHA-fsel [1] (MSB) DI 10 PGA gain setting SHSW-fsel [0] (LSB) DI 11 PGA gain setting DI 12 PGA gain setting (MSB) DI 13 HGain-Nsel [0] High-speed lead-in SHSW gain SHSW-fsel [1] frequency HGain-Nsel [1] multiplication characteristics SHSW-fsel [2] Low_PWR switching SPinv, SHSW-fsel [3] (MSB) SPSIG/SPBLK/PBLK inversion Cannot be used. All low DI 14 DI 15 (MSB) CSEL Low: CDSIN input mode High: CIN input mode CS SHAMP High-speed frequency HGstop-Hsel [0] lead-in charactercancellation istics HGstop-Hsel [1] time switching Cannot be used. All low Latches SDATA at SCK rising edge tINT1 Cannot be used. All low 0 0 Cannot be used. 0 0 0 Cannot be used. 1 0 OBPinv, OBP inversion 0 RESET Low: Reset mode High: Normal operation mode 1 Data is determined at CS rising edge fSCK tINT2 SCK tsu SDATA tho DI DI DI DI DI DI DI DI DI DI DI DI DI DI DI DI 00 01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 Figure 7 Serial Interface Timing Specifications 2 byte continuous communications. SDATA is latched at SCK rising edge. Insert 16 clocks of SCK while CS is low. Data is invalid if data transmission is aborted during transmission. The gain conversion table differs in the CDSIN input mode and the ADCIN input mode. STBY: Reference voltage generator circuit is in the operating state. SLP: All circuits are in the sleep state. 7. This bit is used for the IC testing, and cannot be used by the user. The use of this address is prohibited. 8. Circuit current and the frequency characteristic are switched. Data = 0: 36 MHz guarantee Data = 1: 25 MHz guarantee Notes: 1. 2. 3. 4. 5. 6. Rev.2.00 May 20, 2005 page 12 of 21 Timing Specifications Min Max fSCK 5 MHz tINT1, 2 50 ns tsu 50 ns 50 ns tho HD49334ANP/AHNP Explanation of Serial Data of CDS Part Serial data of CDS part has the following functions. • PGA gain (D5 to D12 of register 0) Details are referred to page 5 block diagram. At CDS_in mode: –2.36 dB + 0.132 dB × N (Log linear) At ADC_in mode: 0.57 times + 0.01784 times × N (Times linear) ∗: Full-scale digital output is defined as 0 dB when 1 V is input. Above PGA gain definition means input signal 1 Vp-p to CDS_in, and set N = 18 (correspond 2.36 dB), and then PGA outputs the 2 V full-range, and also ADC out puts the full code (1023). This mean offset gain of PGA has 6 dB – 2.36 dB = 3.64 dB, therefore it should be decided that how much dB add on. (1.0 V) (2.0 V) (1023) (1.0 V) CDS PGA ADC 0 dB when set N = 18 which correspond to 2.36 dB (1) Level dia explain 2V CDS PGA 1023 ADC (CDS = 0 dB) 3.64 dB + 0.132 dB × N (2) Level dia on the circuit Figure 8 Level Dia of PGA • CSEL (D15 of register 0) Data = 0: Select CDSIN Data = 1: Select ADCIN 0 1 STD1[7:0] (L) STD2[15:8] (H) D4 D3 D2 D1 D0 D15 D14 D13 D12 D11 D10 D9 D8 SLP 0 STBY Address 1 0 LINV 1 MINV 1 test0 1 test_I2 SHSW_fsel SHA_fsel • SLP and STBY (D3, D4 of register 1) SLP: Stop the all circuit. Consumption current of CDS part is less than 10 µA. Start up from offset calibration when recover is needed. STBY: Only the standard voltage generating circuit is operated. Consumption current of CDS part is about 3 mA. Allow 50 H time for feedback clamp is stabilized until recover. • Output mode (D5 to D7 of register 1 and D4 of register 3) It is a test mode. Combination details are table 3 to 5. Normally set to all 0. • SHA-fsel (D8 to D9 of register 1) It is a LPF switching of SH amplifier. Frequency characteristics are referred to page 9. To get rough idea, set the double cut off frequency point with using. • SHSW-fsel (D10 to D13 of register 1) It is a time constant which sampling the black level of SH amplifier. Frequency characteristics are referred to page 9. To get rough idea, set the double cut off frequency point with using. S/N changes by this data, so find the appropriate point with set data to up/down. Rev.2.00 May 20, 2005 page 13 of 21 HD49334ANP/AHNP • Clamp (D3 to D7 of register 2) Determine the OB part level with digital code of ADC output. Clamp level = setting data × 2 + 14 Default data is 9 = 32 LSB. • HGstop-Hsel, HGain-Nsel (D8 to D11 of register 2) Determine the lead-in speed of OB clamp. Details are referred to page 7. PGA gain need to be changed for switch the high speed leading mode. Transfer the gain +1/–1 to previous field, its switch to high speed leading mode. • Low_PWR (D12 of register 2) Switch circuit current and frequency characteristic. Data = 0: 36 MHz guarantee Data = 1: 25 MHz guarantee • SPinv (D13 of register 2) SPSIG/SPBLK/PBLK input signal inverted switching. Data = 1: Normal Data = 0: Inverted • Reset (D15 of register 2) Software reset. Data = 1: Normal Data = 0: Reset Offset calibration should be done when starting up with using this bit. Details are referred to page 18. • C_Bias_off (D3 of register 3) Center bias is turned off in ADCIN mode. Data = 0: Normally on Data = 1: Off • Ave_4H (D6 of register 3) Clamp detection data is averaged 4H. Data = 0: 1H Data = 1: Averaged 4H Differential Code and Gray Code (D4 to D5 and D7 to D9 of register 3) • Gray code (D4 to D5 of register 3) DC output code can be change to following type. Gray Code [1] 0 0 1 1 Gray Code [0] 0 1 0 1 Output Code Binary code Gray code Differential encoded binary Differential encoded gray • Serial data setting items (D7 to D9 of register 3) Setting Bit Gray_test[0] Gray_test[1] Gray_test[2] Setting Contents Standard data output timing control signal (Refer to the following table) ADCLK polar with OBP. (Lo→Positive edge, HI→Negative edge) • Standard data output timing Gray_test[1] Low Low High High Gray_test[0] Low High Low High Rev.2.00 May 20, 2005 page 14 of 21 Standard Data Output Timing Third and fourth Fourth and fifth Fifth and sixth Sixth and seventh HD49334ANP/AHNP Ripple (pseudo outline made by quantized error) occurres on the point which swithing the ADC output multiple bit in parallel. When switching the several of ADC output at the same time, ripple (pseudo outline caused by miss quantization) occurs to the image. Differential code and gray code are recommended for this countermeasure. Figure 9 indicates circuit block. When luminance signal changes are smoothly, the number of bit of switching digital output bit can be reduced and easily to reduce the ripple using this function. This function is especially effective for longer the settings of sensor more than clk = 30 kHz, and ADC output. Figure 10 indicates the timing specifications. 10 Differential SW(D5) ADC + − 2clk_DL Carry bit round Standard data control signal (D9,D8,D7) Gray SW(D4) Standard data selector 10-bit output Gray→Binary conversion Figure 9 Differential Code, Gray Code Circuit (In case of select the positive edge of ADCLK with D8) ADCLK OBP (In case of select the positive polar) (Beginning edge of OBP and standard edge of ADCLK should be exept ±5 ns) 1 Digital output Differential data 2 3 4 5 6 Standard data 7 8 9 10 Differential data Figure 10 Differential Code Timing Specifications To use differential code, complex circuit is necessary at DSP side. From ADC Gray → Binary D9 Carry bit round Standard data control signal Standard data selector 2clk_DL (1) Differential coded D7 D7 D0 D0 (2) Gray → Binary conversion Figure 11 Complex Circuit Example Rev.2.00 May 20, 2005 page 15 of 21 D8 D9 D8 11 HD49334ANP/AHNP Absolute Maximum Ratings (Ta = 25°C) Item Symbol Ratings Unit Power supply voltage Analog input voltage VDD(max) VIN(max) 4.1 –0.3 to AVDD +0.3 V V Digital input voltage Operating temperature VI(max) Topr –0.3 to DVDD +0.3 –10 to +75 V °C Power dissipation Storage temperature Pt(max) Tstg 400 –55 to +125 mW °C Power supply voltage range Vopr 2.7 to 3.3 V Notes: 1. VDD indicates AVDD and DVDD. 2. AVDD and DVDD must be commonly connected outside the IC. When they are separated by a noise filter, the potential difference must be 0.3 V or less at power on, and 0.1 V or less during operation. Electrical Characteristics (Unless othewide specified, Ta = 25°C, AVDD = 3.0 V, DVDD = 3.0 V, and RBIAS = 33 kΩ) • Items Common to CDSIN and ADCIN Input Modes Item Symbol Min Typ Max Unit Power supply voltage range VDD 2.7 3.0 3.3 V Conversion frequency fCLK hi 20 — 36 fCLK low 5.5 — 25 VIH DVDD 2.0 × 3.0 — DVDD V VIL 0 — DVDD 0.8 × 3.0 V Digital input pins other than CS, SCK and SDATA VIH2 DVDD 2.25 × 3.0 — DVDD V CS, SCK, SDATA VIL2 0 — DVDD 0.6 × 3.0 V VOH DVDD –0.5 — — V IOH = –1 mA VOL — — 0.5 V IOL = +1 mA VIH = 3.0 V Digital input voltage Digital output voltage Test Conditions Remarks MHz LoPwr = low HD49334AHNP MHz LoPwr = high HD49334ANP IIH — — 50 µA IIH2 — — 250 µA VIH = 3.0 V IIL –50 — — µA VIL = 0 V IOZH — — 50 µA VOH = VDD IOZL –50 — — µA VOL = 0 V ADC resolution RES 10 10 10 bit ADC integral linearity INL — 3 — LSBp-p fCLK = 25 MHz ADC differential linearity+ DNL+ — 0.3 0.9 LSB fCLK = 25 MHz *1 *1 Digital input current Digital output current ADC differential linearity– DNL– –0.9 –0.3 — LSB fCLK = 25 MHz Sleep current ISLP –100 0 100 µA Digital input pin is set to 0 V, output pin is open Standby current ISTBY — 3 5 mA Digital I/O pin is set to 0 V Notes: 1. Differential linearity is the calculated difference in linearity errors between adjacent codes. 2. Values within parentheses ( ) are for reference. Rev.2.00 May 20, 2005 page 16 of 21 HD49334ANP/AHNP Electrical Characteristics (cont.) (Unless othewide specified, Ta = 25°C, AVDD = 3.0 V, DVDD = 3.0 V, and RBIAS = 33 kΩ) • Items for CDSIN Input Mode Item Symbol Min Typ Max Unit Test Conditions Remarks Consumption current (1) IDD1 — 45.0 54.5 mA fCLK = 36 MHz CDSIN mode LoPwr = low Consumption current (2) IDD2 — 23.5 31.0 mA fCLK = 25 MHz CDSIN mode LoPwr = high CCD offset tolerance range VCCD (–100) — (100) mV Timing specifications (1) tCDS1 — (1.5) — ns Timing specifications (2) tCDS2 Typ × 0.8 1/4fCLK Typ × 1.2 ns Timing specifications (3) tCDS3 — (1.5) — ns Timing specifications (4) tCDS4 Typ × 0.8 1/4fCLK Typ × 1.2 ns Timing specifications (5) tCDS5 Typ × 0.85 1/2fCLK Typ × 1.15 ns Timing specifications (6) tCDS6 1 5 9 ns Timing specifications (7) tCDS7 11 — — ns Timing specifications (8) tCDS8 11 — — ns Timing specifications (9) tCHLD9 3 7 — ns Timing specifications (10) tCOD10 — 16 24 ns Clamp level CLP(00) — (14) — LSB CLP(09) — (32) — LSB CLP(31) — (76) — LSB PGA gain at CDS input PGA(0) –4.4 –2.4 –0.4 dB PGA(63) 4.1 6.1 8.1 dB PGA(127) 12.5 14.5 16.5 dB PGA(191) 21.0 23.0 25.0 dB PGA(255) 29.4 31.4 33.4 dB See table 8 CL = 10 pF Note : Values within parentheses ( ) are for reference. • Items for ADCIN Input Mode Item Symbol Min Typ Max Unit Test Conditions Remarks Consumption current (3) IDD3 — 30.0 38.0 mA fCLK = 36 MHz ADCIN mode LoPwr = low Consumption current (4) IDD4 — 17.0 21.5 mA fCLK = 25 MHz ADCIN mode LoPwr = high Timing specifications (11) tADC1 — (6) — ns Timing specifications (12) tADC2 Typ × 0.85 1/2fADCLK Typ × 1.15 ns Timing specifications (13) tADC3 Typ × 0.85 1/2fADCLK Typ × 1.15 ns Timing specifications (14) tAHLD4 10 14.5 — ns Timing specifications (15) tAOD5 — 23.5 31.5 ns Input current at ADC input IINCIN –110 — 110 µA LSB Clamp level at ADC input OF2 — (512) — PGA gain at ADC input GSL(0) 0.45 0.57 0.72 Times GSL(63) 1.36 1.71 2.16 Times GSL(127) 2.27 2.86 3.60 Times GSL(191) 3.18 4.00 5.04 Times GSL(255) 4.08 5.14 6.47 Times Note : Values within parentheses ( ) are for reference. Rev.2.00 May 20, 2005 page 17 of 21 See table 9 CL = 10 pF VIN = 1.0 V to 2.0 V HD49334ANP/AHNP Operation Sequence at Power On Must be stable within the operating power supply voltage range VDD 0 ms or more SPBLK Start control SPSIG of TG and ADCLK camera DSP OBP etc. 0 ms or more HD49334ANP/AHNP serial data transfer 2 ms or more (1) Register 2 setting 0 ms or more (2) Register 2 setting (3) Registers 0, 1 and 3 settings 2 ms or more RESET bit Automatic offset calibration RESET = "Low" (RESET mode) RESET = "High" (RESET cancellation) Offset calibration (automatically starts after RESET cancellation) Ends after 40000 clock cycles The following describes the above serial data transfer. For details on registers 0, 1, 2, and 3, refer to table 10. (1) Register 2 setting (2) Register 2 setting : Set all bits in register 2 to the usage condition, and set the RESET bit to low. : Cancel the RESET mode by setting the register 2 RESET bit to high. Do not change other register 2 settings. Offset calibration starts automatically. (3) Register 0, 1 and 3 settings : After the offset calibration is terminated, set registers 0, 1 and 3. Rev.2.00 May 20, 2005 page 18 of 21 HD49334ANP/AHNP Notice for Use 1. Careful handling is necessary to prevent damage due to static electricity. 2. This product has been developed for consumer applications, and should not be used in non-consumer applications. 3. As this IC is sensitive to power line noise, the ground impedance should be kept as small as possible. Also, to prevent latchup, a ceramic capacitor of 0.1 µF or more and an electrolytic capacitor of 10 µF or more should be inserted between the ground and power supply. 4. Common connection of AVDD and DVDD should be made off-chip. If AVDD and DVDD are isolated by a noise filter, the phase difference should be 0.3 V or less at power-on and 0.1 V or less during operation. 5. If a noise filter is necessary, make a common connection after passage through the filter, as shown in the figure below. Analog +3.0V Digital +3.0V Noise filter AVDD DVDD HD49334ANP/AHNP AVSS DVSS Noise filter DVDD Example of noise filter AVDD HD49334ANP/AHNP DVSS AVSS 100 µH 0.01 µF 0.01 µF 6. Connect AVSS and DVSS off-chip using a common ground. If there are separate analog system and digital system set grounds, connect to the analog system. 7. When VDD is specified in the data sheet, this indicates AVDD and DVDD. 8. No Connection (NC) pins are not connected inside the IC, but it is recommended that they be connected to power supply or ground pins or left open to prevent crosstalk in adjacent analog pins. 9. To ensure low thermal resistance of the package, a Cu-type lead material is used. As this material is less tolerant of bending than Fe-type lead material, careful handling is necessary. 10. The infrared reflow soldering method should be used to mount the chip. Note that general heating methods such as solder dipping cannot be used. 11. Serial communication should not be performed during the effective video period, since this will result in degraded picture quality. Also, use of dedicated ports is recommended for the SCK and SDATA signals used in the HD49330AF. If ports are to be shared with another IC, picture quality should first be thoroughly checked. 12. At power-on, automatic adjustment of the offset voltage generated from PGA, ADC, etc., must be implemented in accordance with the power-on operating sequence (see page 15). Rev.2.00 May 20, 2005 page 19 of 21 HD49334ANP/AHNP Example of Recommended External Circuit • At CDS Input R10 R11 R12 R13 R14 100 100 100 100 100 from Timing generator C11 0.1 C10 0.1 from CCD out C14 0.1 19 AVDD AVSS SPSIG SPBLK OBP PBLK DVDD ADCLK DVSS DRDVDD 18 17 16 15 14 13 12 11 10 D9 D8 D7 D6 D5 D4 D3 D2 D1 20 BLKSH C1 2 1 µ C3* 1 µ 21 BLKFB C4*1 22 CDSIN 23 BLKC R15 33 k 24 BIAS C15 0.1 25 AVDD HD49334ANP/AHNP (CDS/PGA+ADC) 26 AVSS 8 7 6 to Camera signal processor 5 4 3 2 1 VRM VRT VRB DVDD DVSS CS SDATA SCK D0 27 ADCIN 9 L2 47 µ 28 29 30 31 32 33 34 35 36 C16 47/6 L1 47 µ C21 47/6 GND C17 C18 C19 C22 0.1 0.1 0.1 0.1 Serial data input 3.0 V Notes: 1. For C4, see table 5. 2. For C3, see page 8 "DC Offset Compensation Feedback Function". • At ADC Input from Timing generator C11 0.1 C10 0.1 C14 0.1 19 AVDD AVSS SPSIG SPBLK OBP PBLK DVDD ADCLK DVSS DRDVDD 18 17 16 15 14 13 12 11 10 20 BLKSH 21 BLKFB 22 CDSIN R15 33 k 24 BIAS C15 0.1 25 AVDD + − 23 BLKC 26 AVSS HD49334ANP/AHNP (CDS/PGA+ADC) 27 ADCIN with ADC input 9 8 7 6 4 3 2 1 L2 47 µ 28 29 30 31 32 33 34 35 36 C16 47/6 L1 47 µ C21 47/6 C17 C18 C19 C22 0.1 0.1 0.1 0.1 3.0 V Note: External circuit is same as above except for ADC input. Rev.2.00 May 20, 2005 page 20 of 21 to Camera signal processor 5 VRM VRT VRB DVDD DVSS CS SDATA SCK D0 C2 2.2/16 D9 D8 D7 D6 D5 D4 D3 D2 D1 Serial data input GND Unit: R: Ω C: F HD49334ANP/AHNP Package Dimensions JEITA Package Code P-VQFN36-6x6-0.50 RENESAS Code PVQN0036KA-A Previous Code TNP-36/TNP-36V MASS[Typ.] 0.07g HD D 19 18 E HE 28 e 27 Reference Symbol Dimension in Millimeters Min 10 ZE 36 9 x4 E 6.0 A2 0.89 ZD b b1 t A1 b ×M b 0.005 0.02 0.04 0.17 0.22 0.27 0.20 1 e L y1 0.5 p 0.50 0.60 0.05 A A2 c c1 y 0.20 1 0.20 A1 t y HD 6.2 HE 6.2 1.0 ZD 1.0 ZE c c Rev.2.00 May 20, 2005 page 21 of 21 0.70 0.05 x y Max 0.95 A Lp 1 Nom 6.0 D 0.17 1 0.22 0.20 0.25 Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. 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