HD49330AF/AHF CDS/PGA & 12-bit A/D Converter REJ03F0102-0100Z (Previous: ADE-207-344) Rev.1.0 Apr.05.2004 Description The HD49330AF/AHF is a CMOS IC that provides CDS-PGA analog processing (CDS/PGA) suitable for CCD camera digital signal processing systems together with a 12-bit A/D converter in a single chip. Functions • • • • • • • Correlated double sampling PGA Offset compensation Serial interface control 12-bit ADC Operates using only the 3 V voltage Corresponds to switching mode of power dissipation and operating frequency Power dissipation: 150 mW (Typ), maximum frequency: 36 MHz Power dissipation: 80 mW (Typ), maximum frequency: 20 MHz • ADC direct input mode • Y-IN direct input mode • QFP 48-pin package Features • Suppresses low-frequency noise output from CCD by the S/H type correlated double sampling. • The S/H response frequency characteristics for the reference level can be adjusted using values of external parts and registers. • High sensitivity is achieved due to the high S/N ratio and a wide coverage provided by a PG amplifier. • Feedback is used to compensate and reduce the DC offsets including the output DC offset due to PGA gain change and the CCD offset in the CDS (correlated double sampling) amplifier input. • PGA, standby mode, etc., is achieved via a serial interface. • High precision is provided by a 12-bit-resolution A/D converter. Rev.1.0, Apr.05.2004, page 1 of 19 HD49330AF/AHF ADCIN AVSS Y IN AVDD BIAS BLKC CDSIN BLKFB BLKSH AVDD AVSS AVSS Pin Arrangement 36 35 34 33 32 31 30 29 28 27 26 25 37 24 38 23 39 22 40 21 41 20 42 19 43 18 17 44 45 16 46 15 47 14 48 13 1 2 3 4 5 6 7 8 9 10 11 12 DVDD (NC) SPSIG SPBLK OBP PBLK DVDD DVDD ADCLK DVSS DVSS DRDVDD D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 VRM VRT VRB DVDD DVSS OEB DVDD DVDD DVSS CS SDATA SCK (Top view) Pin Description Pin No. Symbol Description I/O Analog(A) or Digital(D) 1 D0 Digital output (LSB) O D 2 to 11 12 D1 to D10 D11 Digital output Digital output (MSB) O O D D 13 14 DRDVDD DVSS Output buffer power supply (3 V) Digital ground (0 V) — — D D 15 16 DVSS ADCLK Digital ground (0 V) ADC conversion clock input pin — I D D 17 18 DVDD DVDD Digital power supply (3 V) Digital power supply (3 V) — — D D 19 20 PBLK OBP Preblanking input pin Optical black pulse input pin I I D D 21 22 SPBLK SPSIG Black level sampling clock input pin Signal level sampling clock input pin I I D D 23 24 NC DVDD No connection pin Output power supply (3 V) — — — D 25 26 AVSS AVSS Analog ground (0 V) Analog ground (0 V) — — A A 27 28 AVDD BLKSH Analog power supply (3 V) Black level S/H pin — — A A 29 30 BLKFB CDSIN Black level FB pin CDS input pin — I A A 31 BLKC Black level C pin — A Rev.1.0, Apr.05.2004, page 2 of 19 HD49330AF/AHF Pin Description (cont.) Pin No. Symbol Description I/O Analog(A) or Digital(D) 32 BIAS Internal bias pin Connect a 33 kΩ resistor between BIAS and AVSS. — A 33 34 AVDD Y IN Analog power supply (3 V) Y input pin — — A A 35 36 AVSS ADCIN Analog ground (0 V) ADC input pin — — A A 37 VRM — A 38 VRT Reference voltage pin 1 Connect a 0.1 µF ceramic capacitor between VRM and AVSS. Reference voltage pin 3 Connect a 0.1 µF ceramic capacitor between VRT and AVSS. — A 39 VRB — A 40 DVDD Reference voltage pin 2 Connect a 0.1 µF ceramic capacitor between VRB and AVSS. Digital power supply (3 V) — D 41 42 DVSS 1 OEB * Digital ground (0 V) Digital output enable pin — — D D 43 44 DVDD DVDD Digital power supply (3 V) Digital power supply (3 V) — — D D 45 46 DVSS CS Digital ground (0 V) Serial interface control input pin — I D D 47 48 SDATA SCK Serial data input pin Serial clock input pin I I D D Note: 1. With pull-down resistor. Rev.1.0, Apr.05.2004, page 3 of 19 HD49330AF/AHF Input/Output Equivalent Circuit Pin Name Digital output Equivalent Circuit D0 to D11 DVDD DIN Digital output STBY Digital input ADCLK, OBP, SPBLK, SPSIG, CS, SCK, SDATA, PBLK, OEB DVDD Digital input *1 Note: Only OEB is pulled down to about 70 kΩ. Analog CDSIN Internally connected to VRT AVDD CDSIN ADCIN AVDD Internally connected to VRM ADCIN Y IN AVDD Y IN + − BLKSH, BLKFB AVDD + − BLKFB VRT, VRM, VRB VRT VRM + − VRB AVDD + − BIAS AVDD BIAS Rev.1.0, Apr.05.2004, page 4 of 19 BLKSH HD49330AF/AHF 16 18 19 DVSS AVSS DRDVDD DVDD AVDD SPSIG SPBLK ADCLK Block Diagram 31 16 18 19 19 42 OEB ADCIN 27 Y IN 26 Timing generator 11 D11 10 D10 PBLK 26 BLKSH 28 CDS 9 D9 12 bit ADC PGA Output latch circuit CDSIN 26 BLKC 28 BLKFB 29 DC offset compensation circuit Serial interface Bias generator 8 D8 7 D7 6 D6 5 D5 4 D4 3 D3 2 D2 D1 32 34 33 SCK SDATA BIAS VRT Rev.1.0, Apr.05.2004, page 5 of 19 VRB 35 VRM 44 45 43 CS 17 OBP D0 HD49330AF/AHF Internal Functions Functional Description • CDS input CCD low-frequency noise is suppressed by CDS (correlated double sampling). The signal level is clamped at 56 LSB to 304 LSB by resister during the OB period. Gain can be adjusted using 10 bits of register (0.033 dB steps) within the range from –2.36 dB to 31.40 dB. *1 • ADC input The center level of the input signal is clamped at 2048 LSB (Typ). Gain can be adjusted using 10 bits of register (0.00446 times steps) within the range from 0.57 times (–4.86 dB) to 5.14 times (14.22 dB). *1 • Y-IN input The input signal is clamped at 280 LSB (Typ) by SYNC Tip clamp. • Automatic offset calibration of PGA and ADC • DC offset compensation feedback for CCD and CDS • Pre-blanking CDS input operation is protected by separating it from the large input signal. Digital output is fixed at 32 LSB. • Digital output enable function Note: 1. Full-scale digital output is defined as 0 dB (one time) when 1 V is input. Operating Description Figure 1 shows CDS/PGA + ADC function block. ADCIN PG AMP CDS AMP C2 CDSIN C1 SH AMP Gain setting (register) Current DAC VRT BLKFB BLKSH D0 to D11 12-bit ADC DAC Offset calibration logic Clamp data (register) DC offset feedback logic BLKC C4 OBP C3 Figure 1 HD49330AF/AHF Functional Block Diagram 1. CDS (Correlated Double Sampling) Circuit The CDS circuit extracts the voltage differential between the black level and a signal including the black level. The black level is directly sampled at C1 by using the SPBLK pulse, buffered by the SHAMP, then provided to the CDSAMP. The signal level is directly sampled at C2 by using the SPSIG pulse, and provided to CDSAMP (see figure 1). The difference between these two signal levels is extracted by the CDSAMP, which also operates as a programmable gain amplifier at the previous stage. The CDS input is biased with VRT (2 V) during the SPBLK pulse validation period. During the PBLK period, the above sampling and bias operation are paused. Rev.1.0, Apr.05.2004, page 6 of 19 HD49330AF/AHF 2. PGA Circuit The PGAMP is the programmable gain amplifier for the latter stage. The PGAMP and the CDSAMP set the gain using 10 bits of register. The equation below shows how the gain changes when register value N is from 0 to 1023. In CDSIN mode: Gain = (–2.36 dB + 0.033 dB) × N (LOG linear). In ADCIN mode: Gain = (0.57 times + 0.00446 times) × N (linear). Full-scale digital output is defined as 0 dB (one time) when 1 V is input. 3. Automatic Offset Calibration Function and Black-Level Clamp Data Setting The DAC DC voltage added to the output of the PGAMP is adjusted by automatic offset calibration. The data, which cancels the output offset of the PGAMP and the input offset of the ADC, and the clamp data (56 LSB to 304 LSB) set by register are added and input to the DAC. The automatic offset calibration starts automatically after the RESET mode set by register 1 is cancelled and terminates after 40000 clock cycles (when fclk = 20 MHz, 2 ms). 4. DC Offset Compensation Feedback Function Feedback is done to set the black signal level input during the OB period to the DC standard, and all offsets (including the CCD offset and the CDSAMP offset) are compensated for. The offset from the ADC output is calculated during the OB period, and SHAMP feedback capacitor C3 is charged by the current DAC (see figure 1). The open-loop differential gain (∆Gain/∆H) per 1 H of the feedback loop is given by the following equation. 1H is the one cycle of the OBP. ∆Gain/∆H = 0.078/(fclk × C3) (fclk: ADCLK frequency, C3: SHAMP external feedback capacitor) Example: When fclk = 20 MHz and C3 = 1.0 µF, ∆Gain/∆H = 0.0039 When the PGAMP gain setting is changed, the high-speed lead-in operation state is entered, and the feedback loop gain is increased by a multiple of N. Loop gain multiplication factor N can be selected from 2 times, 4 times, 8 times, or 16 times by changing the register settings (see table 1). Note that the open-loop differential gain (∆Gain/∆H) must be one or lower. If it is two or more, oscillation occurs. The time from the termination of high-speed lead-in operation to the return of normal loop gain operation can be selected from 1 H, 2 H, 4 H, or 8 H. If the offset error is over 64 LSB, the high-speed lead-in operation continues, and when the offset error is 64 LSB or less, the operation returns to the normal loop-gain operation after 1 H, 2 H, 4 H, or 8 H depending on the register settings. See table 2. Table 1 Loop Gain Multiplication Factor during High-Speed Lead-In Operation HGain-Nsel (register settings) [0] [1] L L H L L H H H Multiplication Factor N 4 8 16 32 Table 2 High-Speed Lead-In Operation Cancellation Time HGstop-Hsel (register settings) [0] [1] L L H L L H H H Cancellation Time 1H 2H 4H 8H 5. Pre-Blanking Function During the PBLK input period, the CSD input operation is separated and protected from the large input signal. The ADC digital output is fixed to clamp data (56 to 304 LSB). Rev.1.0, Apr.05.2004, page 7 of 19 HD49330AF/AHF PBLK MINV LINV TEST1 TEST0 OEB STBY 6. ADC Digital Output Control Function The ADC digital output includes the functions output enable, code conversion, and test mode. Tables 3, 4 and 5 show the output functions and the codes. Table 3 ADC Digital Output Functions ADC Digital Output D11 D10 D9 D8 D7 D6 D5 D4 D3 H X X X X X X Hi-Z L H X X X X X Hi-Z L L L L L H Same as in table 4. L H H D11 is inverted in table 4. H L H D10 to D0 are inverted in table 4. H H H D11 to D0 are inverted in table 4. X X L Output code is set up to Clamp Level. H L L H Same as in table 5. L H H D11 is inverted in table 5. H L H D10 to D0 are inverted in table 5. H H H D11 to D0 are inverted in table 5. X X L Output code is set up to Clamp Level. H L L H L H L H H H X L L X L L H L H L H L H L H X H H L H L H L H L H L X L H L H L H L H L H H X Notes: 1. STBY, TEST, LINV, and MINV are set by register. 2. Mode setting for the OEB and the PBLK are done by external input pins. 3. The polarity of the PBLK pin when the register setting is SPinv is low. Table 4 D1 D0 Operating Mode Low-power wait state Output Hi-Z Normal operation Pre-blanking Normal operation L L H H H H L L L L H H Pre-blanking Test mode ADC Output Code Output Pin Output Steps codes Table 5 D2 D11 L L L L L L L D10 L L L L L L L D9 L L L L L L L D8 L L L L L L L D7 L L L L L L L D6 L L L L L L L D5 L L L L L L L D4 L L L L L L L D3 L L L L L L L D2 L L L L H H H D1 L L H H L L H D0 L H L H L H L 2047 2048 L H H L H L H L H L H L H L H L H L H L H L H L 4092 4093 4094 4095 H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H L L H H L H L H 0 1 2 3 4 5 6 ADC Output Code (TEST1) Output Pin Output Steps codes D11 L L L L L L L D10 L L L L L L L D9 L L L L L L L D8 L L L L L L L D7 L L L L L L L D6 L L L L L L L D5 L L L L L L L D4 L L L L L L L D3 L L L L L L L D2 L L L L H H H D1 L L H H H H L D0 L H H L L H H 2047 2048 L H H H L L L L L L L L L L L L L L L L L L L L 4092 4093 4094 4095 H H H H L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L H H L L L H H L 0 1 2 3 4 5 6 Rev.1.0, Apr.05.2004, page 8 of 19 HD49330AF/AHF 7. Adjustment of Black-Level S/H Response Frequency Characteristics The CR time constant that is used for sampling/hold (S/H) at the black level can be adjusted by changing the register settings, as shown in table 6. Table 6 SHSW CR Time Constant Setting SHSW-fsel (Register setting) [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] L L L L H L L L L H L L H H L L L L H L H L H L L H H L H H H L 2.20 nsec 2.30 nsec 2.51 nsec 2.64 nsec 2.93 nsec 3.11 nsec 3.52 nsec 3.77 nsec CR Time Constant (Typ) (cutoff frequency conversion) (72 MHz) (69 MHz) (63 MHz) (60 MHz) (54 MHz) (51 MHz) (45 MHz) (42 MHz) SHSW-fsel (Register setting) [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] L L L H H L L H L H L H H H L H L L H H H L H H L H H H H H H H CR Time Constant (Typ) 4.40 nsec 4.80 nsec 5.87 nsec 6.60 nsec 8.80 nsec 10.6 nsec 17.6 nsec 26.4 nsec (cutoff frequency conversion) (36 MHz) (33 MHz) (27 MHz) (24 MHz) (18 MHz) (15 MHz) (9 MHz) (6 MHz) 8. The SHAMP frequency characteristics can be adjusted by changing the register settings and the C4 value of the external 31st pin. The settings are shown in table 7. Values other than those shown in the table 7 cannot be used. Table 7 BLKC 31 C4 SHAMP Frequency Characteristics Setting LoPwr (Register setting) "Lo" [0] H [1] L SHA-fsel (Register setting) [0] [1] L H 75 MHz 13000 pF (300 pF) 32 MHz 22000 pF (750 pF) 116 MHz 10000 pF (270 pF) "Hi" 49 MHz 15000 pF (620 pF) Note: Upper line : SHAMP cutoff frequency (Typ) Middle line : Standard value of C4 (maximum value is not defined) Lower line : Minimum value of C4 (do not set below this value) Rev.1.0, Apr.05.2004, page 9 of 19 [0] H [1] H 56 MHz 18000 pF (360 pF) 24 MHz 27000 pF (820 pF) HD49330AF/AHF Timing Chart Figure 2 shows the timing chart when CDSIN and ADCIN input modes are used. 0 1 2 ~ 11 12 13 • When CDSIN input mode is used N CDSIN N+1 N+2 N+11 N+12 N+13 SPBLK SPSIG ADCLK D0 to D11 N−12 N−11 N−10 N−1 N • When ADCIN input mode is used N+1 N N+13 N+12 N+2 ADCIN N+11 N+10 ADCLK D0 to D11 N−11 N−10 N−1 N N+1 Note: The phases of SPBLK and SPSIG are those when the serial data SPinv bit is set to low. Figure 2 Output Timing Chart when CDSIN and ADCIN Input Modes are Used • The ADC output (D0 to D11) is output at the rising edge of the ADCLK in both modes. • Pipe-line delay is twelve clock cycles when CDSIN is used and eleven when ADCIN is used. • In ADCIN input mode, the input signal is sampled at the rising edge of the ADCLK. Rev.1.0, Apr.05.2004, page 10 of 19 HD49330AF/AHF Detailed Timing Specifications Detailed Timing Specifications when CDSIN Input Mode is Used Figure 3 shows the detailed timing specifications when the CDSIN input mode is used, and table 8 shows each timing specification. Black level Signal level CDSIN (2) (3) (1) SPBLK Vth (5) (4) SPSIG Vth (6) (7) (8) ADCLK Vth (9) (10) D0 to D11 Note: 1. When serial data Spinv bit is set to low. (When the Spinv bit is set to high, the polarities of the SPBLK and the SPSIG are inverted.) Figure 3 Detailed Timing Chart when CDSIN Input Mode is Used Table 8 Timing Specifications when the CDSIN Input Mode is Used No. Timing Symbol Min Typ Max Unit (1) Black-level signal fetch time tCDS1 — (1.5) — ns (2) (3) SPBLK low period * Signal-level fetch time 1 tCDS2 tCDS3 Typ × 0.8 — 1/4fCLK (1.5) Typ × 1.2 — ns ns (4) (5) SPSIG low period * 1 SPBLK rising to SPSIG rising time * 1 tCDS4 tCDS5 Typ × 0.8 Typ × 0.85 1/4fCLK 1/2fCLK Typ × 1.2 Typ × 1.15 ns ns (6) (7), (8) SPSIG rising to ADCLK rising inhibition time * ADCLK tWH min./tWL min. tCDS6 tCDS7, 8 1 11 5 — 9 — ns ns (9) (10) ADCLK rising to digital output hold time ADCLK rising to digital output delay time tCHLD9 tCOD10 3 — 7 16 — 24 ns ns Note: 1 1. SPBLK and SPSIG polarities when serial data Spinv bit is set to low. OBP Detailed Timing Specifications Figure 4 shows the OBP detailed timing specifications. The OB period is from the fifth to the twelfth clock cycle after the OB pulse is input. The average of the black signal level is taken for eight input cycles during the OB period and becomes the clamp level (DC standard). OB period *1 CDSIN N N+1 N+5 N+12 N+13 OBP OB pulse > 2 clock cycles This edge is used, when OBP pulse-width period is clamp-on. When serial data OBPinv bit is set to low (When the OBPinv is set to high, the polarity of the OBP is inverted.) Note: 1. Shifts ±1 clock cycle depending on the OBP input timing. Figure 4 OBP Detailed Timing Specifications Rev.1.0, Apr.05.2004, page 11 of 19 HD49330AF/AHF Detailed Timing Specifications at Pre-Blanking Figure 5 shows the pre-blanking detailed timing specifications. PBLK Vth VOH Digital output (D0 to D11) ADC data ADC data Clamp level VOL ADCLK × 12 clocks (shifts one clock cycle depending on the PBLK input timing) When serial data SPinv bit is set to low (When the SPinv is set to high, the PBLK polarity is inverted.) tPBLK ADCLK × 2 clocks Figure 5 Detailed Timing Specifications at Pre-Blanking Detailed Timing Specifications when ADCIN Input Mode is Used Figure 6 shows the detailed timing chart when ADCIN input mode is used, and table 9 shows each timing specification. ADCIN (1) (2) (3) ADCLK Vth (4) (5) D0 to D11 VDD/2 Figure 6 Detailed Timing Chart when ADCIN Input Mode is Used Table 9 Timing Specifications when ADCIN Input Mode is Used No. Timing Symbol Min Typ Max Unit (1) (2), (3) Signal fetch time ADCLK tWH min./tWL min. tADC1 tADC2, 3 — Typ × 0.85 (6) 1/2fADCLK — Typ × 1.15 ns ns (4) (5) ADCLK rising to digital output hold time ADCLK rising to digital output delay time tAHLD4 tAOD5 10 — 14.5 23.5 — 31.5 ns ns Detailed Timing Specifications for Digital Output-Enable Control Figure 7 shows the detailed timing specifications for digital output enable control. When the OEB pin is set to high, output disable mode is entered, and the output state becomes High-Z. tLZ, tZL measurement load DVDD OEB Vth DVDD 2 kΩ DVDD/2 Digital output (D0 to D11) tLZ tZL 10 pF VOL DVSS VOH tHZ, tZH measurement load DVDD/2 tHZ tZH 10 pF DVSS DVSS Figure 7 Detailed Timing Specifications for Digital Output Enable Control Rev.1.0, Apr.05.2004, page 12 of 19 2 kΩ DVSS HD49330AF/AHF Serial Interface Specifications Table 10 Serial Data Function List Resister 0 Resister 1 Resister 2 Resister 3 Resister 4 to 7 Test Mode (can not be used) DI 00 (LSB) Low High Low High Low to High DI 01 Low Low High High Low to High DI 02 Low Low Low Low High DI 03 PGA gain setting (LSB) *5 SLP Low: Normal operation mode Clamp-level [0] (LSB) High: Sleep mode DI 04 PGA gain setting *5 STBY Low: Normal operation mode Clamp-level [1] High: Standby mode DI 05 PGA gain setting *5 Output mode setting (LINV) Clamp-level [2] Cannot be used. *7 All low DI 06 PGA gain setting *5 Output mode setting (MINV) Clamp-level [3] Average4, 4 lines average DI 07 PGA gain setting *5 Output mode setting (TEST0) Clamp-level [4] (MSB) DI 08 PGA gain setting *5 SHA-fsel [0] (LSB) DI 09 PGA gain setting *5 SHA-fsel [1] (MSB) DI 10 PGA gain setting *5 DI 11 DI 12 DI 13 DI 14 SHAMP frequency HGstop-Hsel [0] characteristics HGstop-Hsel [1] switching YC-Bias off Output mode setting (TEST1) High-speed lead-in cancellation time Cannot be used. *7 All low Cannot be used. *7 All low HGain-Nsel [0] High-speed lead-in SHSW gain PGA gain setting *5 SHSW-fsel [1] frequency HGain-Nsel [1] multiplication characteristics PGA gain setting (MSB) *5 SHSW-fsel [2] LoPwr Low: Normal mode High: Low power mode switching SPinv, X SHSW-fsel [3] (MSB) SPSIG/SPBLK/PBLK inversion Cannot be used. *8 Low YSEL Low: CDSIN input mode High: YIN input mode Cannot be used. *8 Low DI 15 (MSB) CSEL Low: CDSIN input mode High: YIN input mode CS SHSW-fsel [0] (LSB) Cannot be used. *7 All low Latches SDATA at SCK rising edge tINT1 OBPinv, OBP inversion Cannot be used. *8 Low Cannot be used. *8 High Cannot be used. *8 Low RESET Low: Reset mode Cannot be used. *8 High High: Normal operation mode Data is determined at CS rising edge fSCK tINT2 SCK tsu SDATA tho DI DI DI DI DI DI DI DI DI DI DI DI DI DI DI DI 00 01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 Figure 8 Serial Interface Timing Specifications 2 byte continuous communications. SDATA is latched at SCK rising edge. Insert 16 clocks of SCK while CS is low. Data is invalid if data transmission is aborted during transmission. The gain conversion table differs in the CDSIN input mode and the ADCIN input mode. STBY: Reference voltage generator circuit is in the operating state. SLP: All circuits are in the sleep state. 7. This bit is used for the IC testing, and cannot be used by the user. Please do not set up in addition to "ALL Low". 8. This bit is used for the IC testing, and cannot be used by the user. It is set to the state on the right of a column when RESET bit is set to low. The register 3 should transmit by setup on the right of a column. Notes: 1. 2. 3. 4. 5. 6. Rev.1.0, Apr.05.2004, page 13 of 19 Timing Specifications Min Max fSCK 5 MHz tINT1, 2 50 ns tsu 50 ns 50 ns tho HD49330AF/AHF Absolute Maximum Ratings (Ta = 25°C) Item Symbol Ratings Unit Power supply voltage Analog input voltage VDD(max) VIN(max) 4.1 –0.3 to AVDD +0.3 V V Digital input voltage Operating temperature VI(max) Topr –0.3 to DVDD +0.3 –10 to +75 V °C Power dissipation Storage temperature Pt(max) Tstg 400 –55 to +125 mW °C Power supply voltage range Vopr 2.85 to 3.3 V Notes: 1. VDD indicates AVDD and DVDD. 2. AVDD and DVDD must be commonly connected outside the IC. When they are separated by a noise filter, the potential difference must be 0.3 V or less at power on, and 0.1 V or less during operation. Electrical Characteristics (Unless othewide specified, Ta = 25°C, AVDD = 3.0 V, DVDD = 3.0 V, and RBIAS = 33 kΩ) • Items Common to CDSIN and ADCIN Input Modes Item Symbol Min Typ Max Unit Power supply voltage range VDD 2.85 3.0 3.3 V Conversion frequency fCLK low 5.5 — 20 MHz LoPwr = high fCLK hi 20 — 36 MHz LoPwr = low VIH DVDD 2.0 × 3.0 — DVDD V VIL 0 — DVDD 0.8 × 3.0 V Digital input pins other than CS, SCK and SDATA VIH2 DVDD 2.25 × 3.0 — DVDD V CS, SCK, SDATA VIL2 0 — DVDD 0.6 × 3.0 V VOH DVDD –0.5 — — V IOH = –1 mA VOL — — 0.5 V IOL = +1 mA VIH = 3.0 V Digital input voltage Digital output voltage Test Conditions Remarks IIH — — 50 µA IIH2 — — 250 µA VIH = 3.0 V IIL –50 — — µA VIL = 0 V IOZH — — 50 µA VOH = VDD IOZL –50 — — µA VOL = 0 V ADC resolution RES 12 12 12 bit ADC integral linearity INL — (8) — LSBp-p fCLK = 20 MHz ADC differential linearity+ DNL+ — 0.6 0.95 LSB fCLK = 20 MHz *1 *1 Digital input current Digital output current ADC differential linearity– DNL– –0.95 –0.6 — LSB fCLK = 20 MHz Sleep current ISLP –100 0 100 µA Digital input pin is set to 0 V, output pin is open Standby current ISTBY — 3 5 mA Digital I/O pin is set to 0 V Digital output Hi-Z delay time tHZ — — 100 ns tLZ — — 100 ns RL = 2 kΩ, CL = 10 pF tZH — — 100 ns tZL — — 100 ns Notes: 1. Differential linearity is the calculated difference in linearity errors between adjacent codes. 2. Values within parentheses ( ) are for reference. Rev.1.0, Apr.05.2004, page 14 of 19 See figure 7 HD49330AF/AHF Electrical Characteristics (cont.) (Unless othewide specified, Ta = 25°C, AVDD = 3.0 V, DVDD = 3.0 V, and RBIAS = 33 kΩ) • Items for CDSIN Input Mode Item Symbol Min Typ Max Unit Test Conditions Consumption current (1) IDD1 — 54 65 mA LoPwr = low fCLK = 36 MHz Consumption current (2) IDD2 — 28 35 mA LoPwr = high fCLK = 20 MHz CCD offset tolerance range VCCD (–100) — (100) mV Timing specifications (1) tCDS1 — (1.5) — ns Timing specifications (2) tCDS2 Typ × 0.8 1/4fCLK Typ × 1.2 ns Timing specifications (3) tCDS3 — (1.5) — ns Timing specifications (4) tCDS4 Typ × 0.8 1/4fCLK Typ × 1.2 ns Timing specifications (5) tCDS5 Typ × 0.85 1/2fCLK Typ × 1.15 ns Timing specifications (6) tCDS6 1 5 9 ns Timing specifications (7) tCDS7 11 — — ns Timing specifications (8) tCDS8 11 — — ns Timing specifications (9) tCHLD9 3 7 — ns Timing specifications (10) tCOD10 — 16 24 ns Clamp level CLP(00) — (56) — LSB CLP(09) — (128) — LSB CLP(31) — (304) — LSB PGA gain at CDS input AGC(0) –4.4 –2.4 –0.4 dB AGC(256) 4.1 6.1 8.1 dB AGC(512) 12.5 14.5 16.5 dB AGC(768) 21.0 23.0 25.0 dB AGC(1023) 29.4 31.4 33.4 dB Remarks See table 8 CL = 10 pF Note : Values within parentheses ( ) are for reference. • Items for ADCIN Input Mode Item Symbol Min Typ Max Unit Test Conditions Consumption current (3) IDD3 — 39 49 mA LoPwr = low fCLK = 36 MHz Consumption current (4) IDD4 — 21 26 mA LoPwr = high fCLK = 20 MHz Timing specifications (11) tADC1 — (6) — ns Timing specifications (12) tADC2 Typ × 0.85 1/2fADCLK Typ × 1.15 ns Timing specifications (13) tADC3 Typ × 0.85 1/2fADCLK Typ × 1.15 ns Timing specifications (14) tAHLD4 — 14.5 — ns Timing specifications (15) tAOD5 — 23.5 31.5 ns Input current at ADC input IINCIN –110 — 110 µA Clamp level at ADC input OF2 — (2048) — LSB Clamp level at YIN input OF1 — (280) — LSB PGA gain at ADC input GSL(0) 0.45 0.57 0.72 Times GSL(256) 1.36 1.71 2.16 Times GSL(512) 2.27 2.86 3.60 Times GSL(768) 3.18 4.00 5.04 Times GSL(1023) 4.08 5.14 6.47 Times Note : Values within parentheses ( ) are for reference. Rev.1.0, Apr.05.2004, page 15 of 19 Remarks See table 9 CL = 10 pF VIN = 1.0 V to 2.0 V HD49330AF/AHF Operation Sequence at Power On Must be stable within the operating power supply voltage range VDD 0 ms or more SPBLK Start control SPSIG of TG and ADCLK camera DSP OBP etc. 0 ms or more HD49330AF/AHF serial data transfer 2 ms or more (1) Register 2 setting 0 ms or more (2) Register 2 setting (3) Registers 0, 1 and 3 settings 2 ms or more RESET bit Automatic offset calibration RESET = "Low" (RESET mode) RESET = "High" (RESET cancellation) Offset calibration (automatically starts after RESET cancellation) Ends after 40000 clock cycles The following describes the above serial data transfer. For details on registers 0, 1, 2, and 3, refer to table 10. (1) Register 2 setting (2) Register 2 setting : Set all bits in register 2 to the usage condition, and set the RESET bit to low. : Cancel the RESET mode by setting the register 2 RESET bit to high. Do not change other register 2 settings. Offset calibration starts automatically. (3) Register 0, 1 and 3 settings : After the offset calibration is terminated, set registers 0, 1 and 3. Rev.1.0, Apr.05.2004, page 16 of 19 HD49330AF/AHF Notice for Use 1. Careful handling is necessary to prevent damage due to static electricity. 2. This product has been developed for consumer applications, and should not be used in non-consumer applications. 3. As this IC is sensitive to power line noise, the ground impedance should be kept as small as possible. Also, to prevent latchup, a ceramic capacitor of 0.1 µF or more and an electrolytic capacitor of 10 µF or more should be inserted between the ground and power supply. 4. Common connection of AVDD and DVDD should be made off-chip. If AVDD and DVDD are isolated by a noise filter, the phase difference should be 0.3 V or less at power-on and 0.1 V or less during operation. 5. If a noise filter is necessary, make a common connection after passage through the filter, as shown in the figure below. Analog +3.0V Digital +3.0V Noise filter AVDD DVDD HD49330AF/AHF AVSS DVSS Noise filter DVDD Example of noise filter AVDD HD49330AF/AHF DVSS 100 µH 0.01 µF 0.01 µF AVSS 6. Connect AVSS and DVSS off-chip using a common ground. If there are separate analog system and digital system set grounds, connect to the analog system. 7. When VDD is specified in the data sheet, this indicates AVDD and DVDD. 8. No Connection (NC) pins are not connected inside the IC, but it is recommended that they be connected to power supply or ground pins or left open to prevent crosstalk in adjacent analog pins. 9. To ensure low thermal resistance of the package, a Cu-type lead material is used. As this material is less tolerant of bending than Fe-type lead material, careful handling is necessary. 10. The infrared reflow soldering method should be used to mount the chip. Note that general heating methods such as solder dipping cannot be used. 11. Serial communication should not be performed during the effective video period, since this will result in degraded picture quality. Also, use of dedicated ports is recommended for the SCK and SDATA signals used in the HD49330AF. If ports are to be shared with another IC, picture quality should first be thoroughly checked. 12. At power-on, automatic adjustment of the offset voltage generated from PGA, ADC, etc., must be implemented in accordance with the power-on operating sequence (see page 16). Rev.1.0, Apr.05.2004, page 17 of 19 HD49330AF/AHF Example of Recommended External Circuit • At CDS Input R10 R11 R12 R13 R14 C13 0.1 100 100 100 100 100 from Timing generator C12 C11 0.1 0.1 C10 0.1 DVDD (NC) SPSIG SPBLK OBP PBLK DVDD DVDD ADCLK DVSS DVSS DRDVDD 24 23 22 21 20 19 18 17 16 15 14 13 25 AVSS 26 AVSS from CCD out C14 0.1 27 AVDD 28 BLKSH C1 2 1 µ C3* 1 µ 29 BLKFB C4*1 30 CDSIN 31 BLKC R15 33 k 32 BIAS C15 0.1 33 AVDD HD49330AF/AHF (CDS/PGA+ADC) 34 Y IN 35 AVSS VRM VRT VRB DVDD DVSS OEB DVDD DVDD DVSS CS SDATA SCK 36 ADCIN D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 12 11 10 9 8 to Camera signal processor 7 6 5 4 3 2 1 L2 47 µ 37 38 39 40 41 42 43 44 45 46 47 48 C16 47/6 C21 47/6 L1 47 µ C17 C18 C19 C20 0.1 0.1 0.1 0.1 GND C21 C22 0.1 0.1 Serial data input 3.0 V Notes: 1. For C4, see table 5. 2. For C3, see page 8 "DC Offset Compensation Feedback Function". • At ADC/Yin Input from Timing generator C12 C11 0.1 0.1 C13 0.1 DVDD (NC) SPSIG SPBLK OBP PBLK DVDD DVDD ADCLK DVSS DVSS DRDVDD 24 23 22 21 20 19 18 17 16 15 14 13 25 AVSS 26 AVSS C14 0.1 27 AVDD 28 BLKSH 29 BLKFB 30 CDSIN 31 BLKC R15 33 k 32 BIAS C15 0.1 33 AVDD HD49330AF/AHF (CDS/PGA+ADC) 34 Y IN with Y input + − C23 0.47 35 AVSS VRM VRT VRB DVDD DVSS OEB DVDD DVDD DVSS CS SDATA SCK 36 ADCIN with ADC input C2 2.2/16 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 12 11 10 9 8 6 5 4 3 2 1 L2 47 µ 37 38 39 40 41 42 43 44 45 46 47 48 C16 47/6 L1 47 µ C21 47/6 C17 C18 C19 C20 0.1 0.1 0.1 0.1 GND C21 C22 0.1 0.1 3.0 V Note: External circuit is same as above except for ADC/Y input. Rev.1.0, Apr.05.2004, page 18 of 19 to Camera signal processor 7 Serial data input Unit: R: Ω C: F HD49330AF/AHF Package Dimensions As of January, 2003 Unit: mm 24 48 13 12 0.75 0.10 *Dimension including the plating thickness Base material dimension Rev.1.0, Apr.05.2004, page 19 of 19 M 1.40 1.70 Max 0.08 *0.17 ± 0.05 0.15 ± 0.04 1 *0.21 ± 0.05 0.19 ± 0.04 0.5 37 0.13 +0.09 –0.05 9.0 ± 0.2 9.0 ± 0.2 7.0 36 25 1.00 0.75 0˚ – 8˚ 0.50 ± 0.10 Package Code JEDEC JEITA Mass (reference value) FP-48C — Conforms 0.2 g Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein. http://www.renesas.com RENESAS SALES OFFICES Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500 Fax: <1> (408) 382-7501 Renesas Technology Europe Limited. Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, United Kingdom Tel: <44> (1628) 585 100, Fax: <44> (1628) 585 900 Renesas Technology Europe GmbH Dornacher Str. 3, D-85622 Feldkirchen, Germany Tel: <49> (89) 380 70 0, Fax: <49> (89) 929 30 11 Renesas Technology Hong Kong Ltd. 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2375-6836 Renesas Technology Taiwan Co., Ltd. FL 10, #99, Fu-Hsing N. Rd., Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. 26/F., Ruijin Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1, Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 © 2004. Renesas Technology Corp., All rights reserved. Printed in Japan. Colophon .1.0