Datasheet BD555BKFV AC/DC Controller IC for mains dimmable LED lighting BD555BKFV ●Key Specifications Input voltage range........................................16~39V Regulated supply voltage.................................11.5V Fixed DC/DC operating frequency.........40~400kHz Detectable phase-cut range........................45°~135° Typical current consumption.............................1mA Under Voltage Lock Out detection.....................9.0V Operating temperature range.................-40~+110°C ●General Description The BD555BKFV controller AC/DC controller IC can be used in a wide range of dimmable LED lighting driver applications. The main target application is dimmable retro-fit LED lighting, replacing existing incandescent light bulbs, halogen spot lights, CFL tubes etc. ●Features Fixed frequency DC/DC controller (selectable) Peak current or average current control (PCC/ACC) Dynamic Load Current Controller (DLCC) Logarithmic compensation of detected dimming level Dimmer detector function Anti-flash function when dimmer is OFF PWM and analog dimming control supported Over Current Protection (OCP) Thermal Shutdown protection (TSD) Under Voltage Lock Out (UVLO) ●Package SSOP-B14 W(Typ.) x D(Typ.) x H(Max.) 5.00mm x 6.40mm x 1.15mm ●Applications Retro-fit dimmable LED lighting (E27, E14, GU10, T8 etc.). Wide range of TRIAC and transistor dimmers supported by DLCC function. Custom LED lighting with PWM or voltage controlled dimming. ●Typical Application Circuits Figure 1. Typical application circuit for non-isolated dimmable buck topology ○Product structure：Silicon monolithic integrated circuit .www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product is not designed protection against radioactive rays 1/12 TSZ02201-0W1W0C300010-1-2 30.July.2013 Rev.003 Datasheet BD555BKFV ●Pin Configuration Figure 2. Pin configuration Figure 3. Equivalent circuit ●Pin Description Pin Pin name I/O 1 BLDR Out 2 WBLD In 3 ISYS *1 4 GND - 5 DIM In/Out 6 DET 7 8 REF In Driver for dynamic load current controller (DLCC) transistor Internal strong load current input (connected to internal ‘open drain’ NMOS) Sense voltage input for DLCC ON/OFF function Ground terminal Detected dimming level reference voltage Input for detecting phase-cut angle *2 Out Pin for external resistor to set LED current (average current control mode) *2 Out Pin for external resistor to set DC/DC operating frequency OSC *3 9 FB 10 ISNS *4 11 PGND 12 SW 13 VDDH 14 SUP *1 *2 *3 *4 In/Out Function In Average current feedback input or PCC mode selection (VFB <1.5V) In Sense voltage for peak current regulation & over current protection (OCP) - Ground terminal for internal BLDR and SW driver stages Out In/Out In Driver output for gate of external DC/DC switching MOSFET Regulated supply voltage Input supply voltage Between ISYS and GND are internal anti-parallel surge diodes Connect only resistive load according to application instructions FB terminal is ‘pre-charged’ to 4V during start-up in order to have smooth start of the LED current regulation. Never connect this pin directly to GND. Between GND and PGND are internal anti-parallel diodes www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/12 TSZ02201-0W1W0C300010-1-2 30.July.2013 Rev.003 Datasheet BD555BKFV ●Block Diagram Figure 4. Block diagram ●Description of Blocks Startup sequence: When an AC input voltage is applied, the rectified mains voltage (VHV) is buffered by capacitor C2 and starts supplying the BD555BKFV via start-up resistor R6. The VDDH capacitor C5 will be charged by the internal regulator until the system UVLO condition is released, after which a PWM signal from terminal SW can start driving the external NMOS when the anti-flash detector is released. Anti-flash detector: Some dimmers require a small leakage current to power an internal electronic control circuit or an indicator LED. In order to prevent a ‘false start’ when the VHV buffer cap was accidentally charged by this leakage current, the detection level voltage on the DIM terminal needs to rise above 400mV, before the SW terminal starts switching, lighting up the LEDs. DC/DC buck converter: When the SW signal is high, it turns ON the MN2 MOSFET, building up a current in coil L1 via the LED string. During the OFF period of MN2, the current flows via fly-back diode D4. Capacitor C4 stabilizes the LED voltage to reduce the LED current ripple. The LED current is regulated by controlling the LED forward voltage. Auxiliary supply voltage: The alternating current in the primary side of inductor L1 is coupled np:ns to the secondary side, creating a voltage alternating between VVHV (MN2=ON) and (VLED + Vth,D4)* ns/np (MN2=OFF). This last voltage is passed on to capacitor C3 via diode D5. This creates an auxiliary supply which improves efficiency by reducing the resistive power loss in the start-up resistor R6. LED average current control (ACC) mode: The BD555BKFV features two feedback mechanisms by average current control (ACC) or peak current control (PCC). In ACC mode, the high-side sensing resistor R7 is used in the LED current mirror (typically 1:500), creating an LED feedback current in transistor Q1. This current flows to the FB terminal and creating a reference voltage (for LED current regulation) across resistor R12 at the REF terminal. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/12 TSZ02201-0W1W0C300010-1-2 30.July.2013 Rev.003 Datasheet BD555BKFV LED peak current control (PCC) mode: Alternatively, in PCC mode (VFB <1.5V), the duty-cycle of the SW signal is determined by the ‘peak current’ through resistor R10. The ISNS terminal senses the voltage across resistor R10. When this voltage reaches the reference voltage, the SW signal will be pulled low. During startup and in ACC mode, this function is used as ‘Over Current Protection’ to limit the current through inductor L1. In both ACC and PCC mode, the REF voltage will be adjusted to the detected phase-cut in case a dimmer is connected. Phase-cut detection: via resistive divider R4/R5 at the DET terminal, the rising and falling edge of the phase-cut are detected, generating an internal PWM signal. Via an internal resistor and external capacitor C1, this PWM signal is averaged into a dimming reference voltage at the DIM terminal. An internal conversion function creates a logarithmically corrected voltage at the REF terminal. This allows achieving a ‘natural’ LED light intensity curve as perceived by the human eye, when turning the dimmer knob. Dimmer stability: based on the phase-cut detection at the DET terminal, the DLCC dynamically adjusts the total load current for stable operation of ‘leading edge’ TRIAC dimmers. For ‘trailing edge’ dimmers, the DLCC load current pulls down the dimmer output voltage, in order to detect the falling edge. In case the VHV current exceeds the minimum load current requirement, the DLCC load current can disabled completely. This allows to achieve high efficiency without dimmers. Dimmer detector: when a dimmer is not present, the DLCC will be switched OFF. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/12 TSZ02201-0W1W0C300010-1-2 30.July.2013 Rev.003 Datasheet BD555BKFV ●Absolute Maximum Ratings Parameter Symbol Maximum rating Unit Supply voltage (SUP terminal) VSUP 40 V Internal supply regulator voltage (VDDH terminal) VVDDH 15.5 V SW output current *1 ISW BLDR output current 600 *1 IBLDR WLBD, ISNS terminal voltage 60 VWBLD, VISNS mA mA 15.5 *2 300 V mA WBLD input current (strong load current) ISBLD DIM, DET, OSC, REF, FB terminal voltage VDIM, VDET, VOSC, VREF, VFB 4.5 V IFB 4.0 mA VISYS, VPGND +/- 0.5 V foperating 400 kHz FB input current (VFB=4.5V) ISYS, PGND terminal voltage Operating frequency *4 Maximum power dissipation Pd Operating ambient temperature range Ta -40 ～ +110 °C Tstorage -55 ～ +150 °C Tjunction,max +150 °C Storage temperature range Maximum junction temperature 0.87 W *1 ISW pulse current duration <100ns@foperating *2 IBLDR pulse current duration <1us@fmains never exceed 0.8*Pd *3 IWBLD pulse current duration <300us@fmains *4 SSOP-B14 package thermal resistance RθJA=143°C/W, mounted on a two-layer PCB of 70x70x1.6mm3 Notice1: Due to in case of the applied voltage or operating ambient temperature range or etc. exceed the absolute maximum ratings, a damage maybe occurs, and the damage mode (short or open or etc.) can not be supposed, please take a physical safety measure (such as add a fuse) while some special modes in which the absolute maximum ratings may be exceeded are considered. Notice2: The power dissipation in BD555BKFV is mainly decided by the switching frequency of the DCDC converter and the current which is applied to the BLDR pin. Please make the power dissipation caused by those less than 80% of the maximum power dissipation of the package. ●Recommended Operating Range (Ta= -40 ~ +110°C) Parameter Supply voltage Symbol Range Unit VSUP 16 ~ 39 V ●Electrical Characteristics Parameter Symbol Limits Min. Typ. Max. Unit Comments Internal Supply Regulator*1 Startup current ISUP,start - 0.4 0.8 mA In UVLO condition Supply current ON ISUP,NS - 0.8 1.0 mA No switching. Supply current ON 1 ISUP,ON1 - 1.0 1.3 mA No load on SW/BLDR, fSW =40kHz. Supply current ON 2 ISUP,ON2 - 2 2.4 mA No load on SW/BLDR, fSW =400kHz. VDDH internal regulator voltage VVDDH 10.0 11.5 15.0 V VDDH load current IVDDH < 10mA UVLO release voltage VUVLO,rl 9.20 10.0 10.8 V VDDH rising UVLO trigger voltage VUVLO,tr V VDDH falling UVLO hysteresis VUVLO,tr - VUVLO,hys VUVLO,hys 0.75 1.00 1.25 V Minimum frequency fSW_min 32 40 48 kHz Maximum frequency fSW_max 320 400 480 kHz δmax 70 75 80 % Switching regulator SW maximum duty cycle www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/12 6 ±20% , fSW = 9.0×10 /R11 (kHz) for frequency range 40KHz to 400KHz. TSZ02201-0W1W0C300010-1-2 30.July.2013 Rev.003 Datasheet BD555BKFV Parameter Symbol Limits Min. Typ. Max. Unit Comments SW minimum ON-time tON,min - 80 140 ns Determines minimum duty-cycle SW slew rate tSW,slew - 50 100 ns VSW = 1…11V at 1nF load (rising/falling) SW driver ON resistance (PMOS) RSW,P - 15 40 Ω VSW=0V, ISW=-10mA SW driver OFF resistance (NMOS) RSW,N - 15 40 Ω VSW= VDDH, ISW=10mA Duty cycle, FB=3.5V δ20 2 20 38 % Duty cycle, FB=2.9V δ60 36 60 80 % VFB,mode 1.4 1.6 1.9 V PCC (VFB<1.4V), ACC (VFB>1.9V) ISNS trigger voltage (OCP) VOCP 1.08 1.20 1.36 V Inductor current limiter in ACC mode ISNS blanking time (OCP) tOCP,blank 90 140 180 ns Used in PCC & ACC mode DET phase cut voltage (rising) VDET,r 215 260 300 mV DET phase cut voltage (falling) VDET,f 75 110 190 mV DET phase cut hysteresis VDET,hys 75 130 180 mV DIM voltage (no dimming) VDIM1 2.85 3.0 3.15 V Phase-cut = 135° DIM voltage (max dimming) VDIM2 0.95 1.0 1.05 V Phase-cut = 45° REF voltage (no dimming) ACC VREF,A1 1.85 2.0 2.15 V REF voltage (max dimming) ACC VREF,A2 75 100 135 mV ACC mode (VFB>1.9), 2kΩ < RREF < 10kΩ ISNS voltage (no dimming) PCC VISNS,P1 1.12 1.24 1.36 V ISNS voltage (max dimming) PCC VISNS,P2 200 260 316 mV PCC mode (VFB < 1.5V). VISNS peak current threshold, RREF=2kΩ BLDR driver slew rate tBLDR,slew - 1 5 us VSW = 1…11V at 1nF load (rising/falling) BLDR driver ON resistance RBLDR,P - 100 300 Ω VBLDR=0V, IBLDR=-10mA BLDR driver OFF resistance RBLDR,N - 100 300 Ω VBLDR= VDDH, IBLDR=10mA Strong load current ISBLD,sat 200 250 - mA Strong load current ON (VISYS<100mV, VDIM<3.4V, VVDDH=11.5V, VWBLD-VISYS=8V) Strong load internal NMOS RON RON,SBLD - 10 300 Ω Strong load current ON (VISYS<100mV, VDIM<3.4V, VVDDH=11.5V, VWBLD-VISYS=8V) Strong load current OFF delay tSB,OFF 180 250 320 µs After phase-cut rising edge Dimmer detector trigger voltage VDIM,tr 3.3 3.5 3.7 V DLCC load current OFF Dimmer detector release voltage VDIM,rl V DLCC load current ON FB mode selection threshold ACC mode Dimmer phase-cut detector Monitored at output bridge rectifier Dynamic Load Current Controller VDIM,tr-VDIM,hys Dimmer detector hysteresis VDIM,hys 50 100 170 mV ISYS load current OFF voltage VISYS,OFF -260 -200 -160 mV DLCC load current OFF ISYS load current ON voltage VISYS,ON VISYS,OFF+VISYS,hys mV DLCC load current ON ISYS current sense hysteresis VISYS,hys 75 100 140 mV Anti-flash detector threshold VDIM,start 360 400 440 mV DC/DC starts switching (VDIM >400mV) *1 The supply regulator has a thermal shutdown function that triggers at about 175°C, having a hysteresis of about 20°C. This protects against a too high junction-temperature (e.g. due to ‘short’ currents of VDDH, SW or BLDR to (P)GND on the PCB or excessive ambient temperatures). www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6/12 TSZ02201-0W1W0C300010-1-2 30.July.2013 Rev.003 Datasheet BD555BKFV ●Application Examples The BD555BKFV is typically used as a controller IC in retro-fit dimmable LED lighting systems. The external component selection is fully dependent on the type of LED driver. For more information about this, please refer to the BD555BKFV application note. The example circuit below shows a dimmable non-isolated buck converter. A non-isolated topology is suitable for relatively low LED power (e.g. VLED=100V and ILED=40mA) applications in which the LED heatsink is electrically isolated by a non-conductive LED lamp casing. Figure 5. Final application circuit for non-isolated dimmable ACC LED driver ●Notes of Board Layout There are a few considerations for designing a small-sized PCB that fits inside a LED lamp casing. Special attention needs to be given to component placement for optimal grounding and minimum distances of high-voltage wiring. 1) 2) 3) 4) OCP sense resistor ROCP and snubber resistor Rs need to be connected as close as possible to the minus terminal of the VHV buffer capacitor. The drain terminal of switching NMOS MN2 should be close to the inductor L1p and fly-back diode D4. The GND and PGND terminals need to be connected directly on the PCB. For mains-isolated designs (not described in this document), the isolated PCB terminals need to be separated from the 'hot' side electronics. ●Selection of Components Externally Connected Please refer to the BD555BKFV application note for more information about selecting the external components. ●Notes of Pin Connections a. Never connect FB pin to GND. It is suggested that pull down the FB pin to GND with a resistance over 10kΩ, while you want to use the PCC mode. b. In case of a dimmable LED driver application, please use a diode with a forward bias from ISYS pin to GND for protecting the ISYS pin when you want to sense the GND current. For a more stable operation, please add a capacitance over 1uF between ISYS pin and GND. c. Never connect capacitive loads to REF pin and OSC pin. Please connect resistive loads to these two pins. d. Always make the GND pin connecting with the PGND pin on the PCB. Especially, notice that please keep the GND pin away from the noise. And never apply a minus voltage to all pins except the ISYS pin. e. Never apply voltage to IC pins while the SUP pin is not applied with a voltage. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/12 TSZ02201-0W1W0C300010-1-2 30.July.2013 Rev.003 Datasheet BD555BKFV Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply terminals. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Rush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/12 TSZ02201-0W1W0C300010-1-2 30.July.2013 Rev.003 Datasheet BD555BKFV Operational Notes – continued 11. Unused Input Terminals Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Figure xx. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). 15. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 16. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/12 TSZ02201-0W1W0C300010-1-2 30.July.2013 Rev.003 Datasheet BD555BKFV ●Ordering Information B D 5 5 5 B K Part No. F V Package FV: SSOP14 - E 2 Packaging and forming specification E2: Embossed tape and reel None: Tray, Tube ●Marking Diagram (TOP VIEW) SSOP-B14 Product Name. 555BK LOT No. 1PIN MARK www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/12 TSZ02201-0W1W0C300010-1-2 30.July.2013 Rev.003 Datasheet BD555BKFV ●Physical Dimension, Tape and Reel Information Package Name SSOP-B14 <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 11/12 TSZ02201-0W1W0C300010-1-2 30.July.2013 Rev.003 Datasheet BD555BKFV ●Revision History Date Revision 29.May.2012 19.July.2013 30.July.2013 001 002 003 Changes New Release Revision Update p.2 ･Add “I/O” column to “Pin Description”. p.5 ･Add “Notice1” and “Notice2” to “Absolute Maximum Ratings”. p.7 ･Delete the descriptions for “Power Dissipation”. ･Add the descriptions for “Notes of Pins Connections”. p.13, p.14 ･Add “Notice”. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/12 TSZ02201-0W1W0C300010-1-2 30.July.2013 Rev.003 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. 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If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice – GE © 2013 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. 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