CLASSIFICATION
No.
151S-ECJ-KZM76E
PAGE
1 of 1
DATE Dec 9, 2005
SPECIFICATIONS
SUBJECT
Multilayer Ceramic Chip Capacitors 06 type (EIA 0201)
High Capacitance (P/N : ECJZEBFJ104K) Individual Specification
1. Scope
This specification applies to High Capacitance Multilayer Ceramic Chip Capacitor 06 type (EIA 0201), Temp. Char:X5R,
Rated voltage DC6.3V , Nominal Capacitance 0.1 µF.
2. Style and Dimensions
W
Table 1
T
Symbol
Dimensions(mm)
L
0.60+/-0.03
W
0.30+/-0.03
T
0.30+/-0.03
L1,L2
0.15+/-0.05
L1
L
L2
3. Operating Temperature Range
Table 2
Temperature Characteristics
X5R
Class2
Operating Temp. Range.
-55 to +85 °C
4. Individual Specification
Table 3
Part Number
Rated
Voltage
Temp. Char.
Nominal
Capacitance
Cap. Tolerance
ECJZEBFJ104K
DC 6.3V
X5R
0.1 µF
+/-10 %
5. Explanation of Part Numbers
ECJ
Z
E
B
Show in
Table 4
Size Code
Code
Z
F
Temp. Char.
Code
Common Code
Size
06 type
(EIA 0201)
J
1
0
4
Nominal Cap.
Rated Voltage
Code
Voltage
FJ
DC 6.3V
Packaging Style
Code
Packaging Style
E φ180Reel Paper Taping 15,000 pcs./reel
K
Cap.
Tolerance
Code
Show in
Table 3
6. Temperature Characteristics
Table 4
Temp. Char.
Code
B
Capacitance Change rate from Temperature
Temp. Char.
Without voltage application
X5R
+/-15 %
Measurement
Temperature Range
Reference
Temperature
-55 to +85 °C
+25 °C
7. Soldering method
Flow soldering shall not be applied.
Note ;
APPROVAL
Panasonic Electronic Devices Co., Ltd.
Y.Sakaguchi
CHECK
S. Endoh
DESIGN
T.Shinriki
CLASSIFICATION
SPECIFICATIONS
SUBJECT
Multilayer Ceramic Chip Capacitors06 type (EIA 0201)
High Capacitance (P/N : ECJZEBFJ104K) Common Specification
No.
151S-ECJ-KGM76E
PAGE
1 of 7
DATE
Dec 9, 2005
1. Information
1- 1.Applicable laws and regulations
(1) Any ozone-depleting substances listed in the Montreal Protocol are not used in the manufacturing processes for
parts and materials used in this product.
(2) PBB and PBDE are intentionally excluded from materials used in this product.
(3) All the materials used in this product are registered materials under the Law Concerning Examination and Regulation of Manufacture and Handling of Chemical Substances.
(4) This product complies with the RoHS, DIRECTIVE 2002/95/EC on the Restriction of the use of certain Hazardous Substances in electrical and electronic equipment.
(5) This product is exported with export procedures under export related laws and regulations such as the Foreign
Exchange and Foreign Trade Law.
1- 2.Limitation in Applications
This product was designed and manufactured for general-purpose electronic equipment such as household, office,
information & communication equipment. When the following applications, which are required higher reliability and
safety because the trouble or malfunction of this product may threaten the lives and/or properties, are examined,
separate specifications suitable for the application should be exchanged.
・Aerospace / Aircraft equipment, Warning / Antitheft equipment, Medical equipment, Transport equipment (Motor
vehicles, Trains, Ship and Vessel ), Highly public information processing equipment, Others equivalent to the
above.
1- 3.Production factory
(1) Panasonic Electronic Devices Hokkaido Co., Ltd.
(2) Panasonic Electronic Devices (Tianjin) Co., Ltd. (PEDTJ)
(3) Matsushita Electronic Devices (M) Sdn. Bhd.(MEDEM)
2. Scope
2- 1.This specification applies to High Capacitance Multilayer Ceramic Chip Capacitor 06type (P/N : ECJZEBFJ104K) .
If there is a difference between this common specification and any individual specifications, priority shall be given to
the individual specifications.
2- 2.This product shall be used for general-purpose electronic equipment such as audiovisual, household, office, information & communication equipment.
Unreasonable applications may accelerate performance deterioration or short/open circuits as failure modes affecting the life end.
Adequate safety shall be ensured especially for product design required a high level of safety with the following considerations.
1)Previously examine how a single trouble in this product affects the end product.
2)Design a protection circuit as Failsafe-design to avoid unsafe system resulting from a single trouble with this
product.
Whenever a doubt about safety arises from this product, immediately inform us for technical consultation without fail,
please.
2- 3.This specification is a part of contract documents pertaining to the trade made by and between your company and
Matsushita Electric Industrial Co., Ltd.
3. Part Number Code
ECJ
(1)
Z
(2)
E
(3)
B
(4)
FJ
(5)
104
(6)
K
(7)
3- 1.Common Code (1)
ECJ : Multilayer Ceramic Chip Capacitors
3- 2.Size (2), Packaging Styles (3), Temperature Characteristic (4), Rated Voltage (5), Capacitance Tolerance (7) : Shown
in Individual Specification.
Note ;
APPROVAL
Panasonic Electronic Devices Co., Ltd.
Y.Sakaguchi
CHECK
S.Endoh
DESIGN
T.Shinriki
CLASSIFICATION
No.
151S-ECJ-KGM76E
PAGE
SPECIFICATIONS
SUBJECT
Multilayer Ceramic Chip Capacitors06 type (EIA 0201)
High Capacitance (P/N : ECJZEBFJ104K) Common Specification
3- 3.Nominal Capacitance (6)
The Nominal Capacitance value is expressed in pico farads(pF) and is
identified by a three-digit number ; the first two digit
represent significant figures and the last digit specifies the number of
zero to follow.
Symbol (Ex.)
105
106
226
2 of 7
DATE
Dec 9, 2005
Nominal Cap.
1000000pF(1µF)
10000000pF(10µF)
22000000pF(22µF)
4. Operating Temperature Range
Shown in Individual Specification.
5. Performance
The performance of the capacitor and its test condition shall be specified in Table 2.
5- 1.Pretreatment
Before test and measurements, the following pretreatment shall be applied when necessary.
5-1-1. Heat Treatment
The capacitors shall be kept in a temperature of 150+0/-10°C for 1 hour and then shall be stored in a room temperature for 48±4 hours, before initial measurement.
5-1-2. Voltage Treatment
D.C. voltage shall be applied for 1 hour in the specified test condition and then shall be stored in a room temperature
for 48 +/- 4 hours, before initial measurement.
6. Test
Unless otherwise specified, all test and measurements shall be made at a temperature of 15 to 35°C and at a relative
humidity of 45 to 75%.
If results obtained are doubted a further test should be carried out at a temperature of 20±2℃ and a relative humidity of
60 to 70%.
7. Structure
The structure shall be in a monolithic form as shown in Fig. 1.
Fig. 1 Table 1
No.
①
②
③
④
⑤
.
Note ;
Name
Dielectric
Inner electrode
Substrate electrode
Intermediate electrode
External electrode
CLASSIFICATION
No.
151S-ECJ-KGM76E
PAGE
SPECIFICATIONS
SUBJECT
Multilayer Ceramic Chip Capacitors06 type (EIA 0201)
High Capacitance (P/N : ECJZEBFJ104K) Common Specification
3 of 7
DATE
Dec 9, 2005
Table 2
No
Contents
Performance
Test Method
1
Appearance
There shall be no defects which affect
the life and use.
With a magnifying glass (3 times).
2
Dimensions
Shown in Individual Specification.
With slide calipers and a micrometer.
3
Dielectric Withstanding voltage
There shall be no dielectric breakdown
or damage.
Test voltage : 250% of rated voltage
Apply a DC voltage of the above value for 1 to 5
seconds.
Charge/discharge current shall be within 50mA.
4
Insulation
Resistance(I.R.)
100/C MΩ min.
(C : Nominal Cap. in µF)
Measuring voltage : Rated voltage
Measuring voltage time : 60+/-5s
Charge/discharge current shall be within 50mA.
5
Capacitance
Shall be within the specified tolerance.
6
Dissipation Factor
(tan δ)
0.15 max.
Measuring
Frequency
1kHz+/-10%
Measuring
Voltage
1.0+/-0.2Vrms
For the class2 Capacitors, perform the heat
treatment in par. 5-1-1.
Our Measurement instrument is shown in the
Table 3.
7
Temperature
Coefficient
Without
Voltage
Application
Temp. Char.
X5R : Within +/- 15%
Measure the capacitance at each stage by
changing the temperature in the order of step 1
to 4 shown in the table below. Calculate the
rate of change regarding the capacitance at
stage 3 as the reference.
(Unit : °C)
Temp.
Stage
Char.
1
2
3
4
5
X5R
25+/-2 -55+/-3 25+/-2 85+/-2 25+/-2
Measuring
Frequency
1kHz+/-10%
8
Adhesion
The terminal electrode shall be free
from peeling or signs of peeling.
Measuring
Voltage
0.50+/-0.05Vrms
Solder the specimen to the testing jig shown in
the figure., and apply a 2N force in the arrow
direction for 10 seconds.
0.3
Material : Alumina board (95% min.) or glass
epoxy board.
Thickness : 1.0mm min.
(continue)
Note ;
CLASSIFICATION
No.
151S-ECJ-KGM76E
PAGE
SPECIFICATIONS
SUBJECT
Multilayer Ceramic Chip Capacitors06 type (EIA 0201)
High Capacitance (P/N : ECJZEBFJ104K) Common Specification
4 of 7
DATE
Dec 9, 2005
Table 2
No
9
10
11
12
Contents
Bending
Strength
Vibration
Proof
Resistance
to Solder
Heat
Solderability
Performance
Test Method
Appearance
There shall be no cracks and other
mechanical damage.
Capacitance
Temp.
Char.
X5R
After soldering capacitor on the substrate 1mm
of bending shall be applied for 5 seconds.
Bending speed : 1mm/s
(shown in Fig. 3)
Appearance
There shall be no cracks and other
mechanical damage.
Capacitance
Shall be within the specified tolerance.
tan δ
Shall meet the specified initial value.
Appearance
There shall be no cracks and other
mechanical damage.
Capacitance
Temp.
Char.
X5R
tan δ
Shall meet the specified initial value.
Change from the value
before test.
Within +/- 12.5%
Change from the value
before test.
Within +/- 7.5%
I.R.
Shall meet the specified initial value.
Withstand
voltage
There shall be no dielectric breakdown
or damage.
More than 95% of the soldered area of
both terminal electrodes shall be
covered with fresh solder.
(continue)
Note ;
Solder the specimen to the testing jig shown
in Fig. 2. Apply a variable vibration of 1.5mm
total amplitude in the 10 to 55 to10Hz vibration
frequency range swept in 1 min. in 3 mutually
perpendicular directions for 2 hours each, a
total of 6 hours.
Solder both method
Preconditioning : Heat Temperature
(See 5.1.1)/Class2
Solder temperature : 270+/-5°C
Dipping period : 3+/-0.5s
Preheat condition :
Order
1
2
Temp.(°C)
80 to 100
150 to 200
Period(s)
120 to 180
120 to 180
Use solder H63A(JIS-Z-3282).For the flux,
use rosin (JIS-K-5902) ethanol solution of a
concentration of about 25% by weight. Use
tweezers for the holder to dip the specimen.
Recovery : 48+/-4 hours
Solder temperature : 230+/-5°C
Dipping period : 4+/-1s
Dip the specimen in solder so that both
terminal electrodes are completely submerged.
Use solder H63A(JIS-Z-3282). For the flux use
rosin (JIS-K-5902) of ethanol solution of a
concentration of about 25% by weight.
Use tweezers for the holder to dip the
specimen.
CLASSIFICATION
SPECIFICATIONS
SUBJECT
Multilayer Ceramic Chip Capacitors06 type (EIA 0201)
High Capacitance (P/N : ECJZEBFJ104K) Common Specification
No.
151S-ECJ-KGM76E
PAGE
5 of 7
DATE
Dec 9, 2005
Table 2
No
13
Contents
Temperature
cycle
Performance
Appearance
There shall be no cracks and other
mechanical damage.
Capacitance
Temp.
Char.
X5R
tan δ
I.R.
Shall meet the specified initial value.
Withstand
voltage
There shall be no dielectric breakdown
or damage.
Change from the value
before test.
Within +/- 7.5%
Shall meet the specified initial value.
Test Method
Solder the specimen to the testing jig shown
in Fig. 2. Condition the specimen to each
temperature from step 1 to 4 in this order for
the period shown in the table below. Regarding this conditioning as one cycle, perform
5 cycles continuously.
Step
1
2
3
4
14
Moisture
Resistance
Appearance
There shall be no cracks and other
mechanical damage.
Capacitance
Temp. Change from the value
Char.
before test.
X5R
Within +/- 20%
0.25 max.
tan δ
15
Moisture
Resistant
Loading
Temperature
(°C)
Minimum operation
temperature +/- 3
Room temperature
Maximum operation
temperature +/-5
Room temperature
Period
(min.)
30+/-3
3 max.
30+/-3
3 max.
For the class2 capacitors, perform the heat
treatment in par. 5-1-1.
Before the measurement after test, the
specimen shall be left to stand at room
temperature for the following period :
48+/-4 h
For the class2 capacitors, perform the heat
treatment in par. 5-1-1.
Solder the specimen to the testing jig shown
in Fig. 2.
Test temperature : 40+/-2°C
Relative humidity : 90 to 95%
Test period : 500+24/0 h
I.R.
10/C MΩ min.
(C : Nominal Cap. in µF)
Before the measurement after test, the specimen shall be left to stand at room temperature for the following period :
48+/-4 h
Appearance
There shall be no cracks and other
Mechanical damage.
Capacitance
Temp. Change from the value
Char.
before test.
X5R
Within +/- 20%
0.25 max.
For the class2 capacitors, perform the heat
treatment in par. 5-1-2.
Solder the specimen to the testing jig shown
in Fig. 2.
tan δ
I.R.
5/C MΩ min.
(C : Nominal Cap. in µF)
Test temperature : 40+/-2°C
Relative humidity : 90 to 95%
Applied voltage : Rated voltage
(DC Voltage)
Charge/discharge current : within 50mA.
Test period : 500+24/0 h
Before the measurement after test, the specimen shall be left to stand at room temperature for the following period :
48+/-4 h
(continue)
Note ;
CLASSIFICATION
SPECIFICATIONS
SUBJECT
Multilayer Ceramic Chip Capacitors06 type (EIA 0201)
High Capacitance (P/N : ECJZEBFJ104K) Common Specification
No.
151S-ECJ-KGM76E
PAGE
6 of 7
DATE
Dec 9, 2005
Table 2
No
16
Contents
High
Temperature
Resistant
Loading
Performance
Appearance
There shall be no cracks and other
mechanical damage.
Capacitance
Temp.
Char.
X5R
tan δ
0.25 max.
I.R.
10/C MΩ min.
(C : Nominal Cap. in µF)
Change from the value before test.
Within +/- 20%
Test Method
For the class2 capacitors, perform the voltage
treatment in par. 5-1-2.
Solder the specimen to the testing jig shown
in Fig. 2.
Test temperature :
Max. Rated temp. +/-3°C
Applied voltage : Rated voltage
(DC Voltage)
Charge/discharge current : within 50mA.
Test period : 1000+48/0 h
Before the measurement after test, the specimen shall be left to stand at room temperature for the following period : 48+/-4 h
When uncertainty occurs in the weather resistance characteristic tests (temperature cycle, moisture resistance,
moisture resistant loading, high temperature resistant loading), the same tests shall be performed for the capacitor itself.
Table 3
Our Standard Measuring Instrument
Measuring Instrument
4284A Precision LCR Meter (Agilent Technologies)
Measuring Mode
Parallel Mode
Recommended
Measuring Jig
16034e Test Fixture (Agilent Technologies)
For High Cap Type, signal voltage may be unable to be applied to depending on conditions of measuring instruments.
We would appreciate it if you would confirm whether High Cap Type is under the measurable environment or not by
checking that the fixed signal voltage is applied or not. (For example, ALC function is ON, HPA is expanded.)
Note ;
CLASSIFICATION
No.
151S-ECJ-KGM76E
PAGE
SPECIFICATIONS
SUBJECT
Multilayer Ceramic Chip Capacitors06 type (EIA 0201)
High Capacitance (P/N : ECJZEBFJ104K) Common Specification
Fig. 2
7 of 7
DATE
Dec 9, 2005
Testing jig
Table 4
Type
(EIA)
A
B
C
06type
(0201)
0.3
0.9
0.3
Unit : mm
Material : Glass epoxy board
Thickness : 1.6mm
:Copper foil (0.035mm thick)
:Solder resist
Fig. 3
Testing jig
Table 5
Type
(EIA)
A
B
C
06type
(0201)
0.3
0.9
0.3
Unit : mm
Material : Glass epoxy board
Thickness : 0.6mm
:Copper foil (0.035mm thick)
:Solder resist
Note ;
CLASSIFICATION
SUBJECT
No.
151S-ECJ-SS009E
PAGE
SPECIFICATIONS
Multilayer Ceramic Chip Capacitor
Common Specification ( Precautions for Use)
1 of
DATE
10
1 Apr, 2005
1. Precautions for Use
！
The Multilayer Ceramic Chip Capacitors (hereafter referred to as “Capacitors”) may fail in a short circuit mode in an
open-circuit mode when subjected to severe conditions of electrical, environmental and/or mechanical stress
beyond the specified “Rating and specified “Conditions” in the Specifications, resulting in burn out, flaming or
glowing in the worst case.
The following “Operating Conditions and Circuit Design” and “Precautions for Assembly” shall be taken in your
major consideration.
If you have a question about the “Precautions for Use”, please contact our engineering section or factory.
2. Operating Conditions and Circuit Design
2- 1.Circuit Design
2-1-1. Operating Temperature Range
The specified “Operating Temperature Range” in the Specifications is absolute maximum and minimum
temperature rating.
So in any case, each of the Capacitors shall be operated within the specified “Operating Temperature Range”.
2-1-2. Design of Voltage application
The Capacitors shall not be operated exceeding the specified “Rated Voltage” in the Specification.
If voltage ratings are exceeded, the Capacitors could result in failure or damage. In case of application of DC and
AC voltages to the Capacitors, the designed peak voltage shall be within the specified “Rated Voltage”.
In case of AC of pulse voltage, the peak voltage shall be within the specified “Rated Voltage”. If high frequency
voltage or fast rising pulse voltage is applied continuously even within the “Rated Voltage”, contact our
engineering section before use. Such continuous application affects the life of the Capacitors.
2-1-3. Charging and Discharging Current
The Capacitors shall not be operated beyond the specified “Maximum Charging/Discharging Current Ratings” in
the Specifications. Applications to a low impedance circuit such as a ”secondary power circuit” are not
recommended for safety.
2-1-4. Temperature Rise by Dielectric Loss of the Capacitors
The “Operating Temperature Range” mentioned above shall include a maximum surface temperature rise of 20℃,
which is caused by the Dielectric loss of the Capacitor and applied electrical stresses (such as voltage, frequency
and wave form etc.). It is recommended to measure and check “Surface Temperature of the Capacitor” in your
equipment at room temperature (up to 25℃).
2-1-5. Restriction on Environmental Conditions
The Capacitors shall not be operated and / or stored under the following environmental conditions.
(1) Environmental conditions
(a) To be exposed directly to water or salt water
(b) To be dew formation
(c) Under conditions of corrosive gases such as hydrogen sulfide, sulfurous acid, chlorine and ammonia
(2) Under severe conditions of vibration or impact beyond the specified conditions in the Specifications
2-1-6. DC voltage characteristics
The Capacitors (Class 2) employ dielectric ceramics with dielectric constant having voltage dependency, and if
applied DC voltage is high, capacitance may broadly change. For the specified capacitance, the following should
be confirmed.
(1) If capacitance change by applied voltage is within the allowable range, or if its application allows unlimited
capacitance change.
(2) DC voltage characteristics demonstrate, even if applied voltage is under the rated voltage, capacitance
change rate increases with higher voltage (Capacitance down). Accordingly, when the Capacitors are used
for circuits with narrow capacitance allowable range such as time constant circuits, we recommend to apply
lower voltage upon due consideration on capacitance aging in addition to the above.
Note ;
APPROVAL
Panasonic Electronic Devices Co., Ltd.
Y.Sakaguchi
CHECK
S.Endoh
DESIGN
T.Shinriki
CLASSIFICATION
SUBJECT
SPECIFICATIONS
Multilayer Ceramic Chip Capacitor
Common Specification ( Precautions for Use)
No.
151S-ECJ-SS009E
PAGE
2 of
DATE
10
1 Apr, 2005
Capacitance change vs. DC voltage
DC voltage (V)
2-1-7. Capacitance aging
The ceramic dielectrics of the Capacitors (Class 2) have capacitance aging. Accordingly, when the Capacitors
are used for the circuits, which require a narrow capacitance allowable range, such as time constant circuits, pay
due consideration to capacitance aging for use.
Under Ordinary Temperature
Before and After Heat treatment
Heat treatment
Time (h)
Time (h)
2-1-8. Piezoelectricity
Dielectrics used for the Capacitors (Class 2) may cause the following Piezoelectricity (or Electrostriction).
(1) If the signal of a specific frequency is applied to the Capacitors, electric and acoustic noise may be
generated by resonating the characteristic frequency which is determined by the dimensions of the
Capacitor.
As a measure to prevent this phenomenon, changing the size of the Capacitor is effective to change its
resonance frequency.
Also there is another measure changing the materials of the Capacitors to the Low-loss type, which has no
(or less) piezoelectricity, or to Class1.
which has no (or less) piezoelectricity, or to Class1 is also available.
(2) Vibration or impact applied to the Capacitors may cause noise because mechanical force is converted to
electrical signals (Especially, application to around the amplifier unit) .
As a measure to prevent this phenomenon, changing the materials of the Capacitor to the Low-loss type,
which has no (or less) piezoelectricity, or to Class1 is also available.
(3) Even if a whining sound is generated, there is no problem in product performance and reliability, however,
check the worrisome phenomenon which may generate noise in your equipment.
As a measure to prevent this phenomenon, changing to the Capacitor different in characteristics, size and
shape as shown in the (1), (2) above is effective.
As the other measures, changing the mounting direction of the Capacitors to bring under control the
resonance with equipment bodies such as printed circuit board, or the Capacitors are fixed with equipment
bodies such as printed circuit board by adhesive may be effective.
2- 2.Design of Printed Circuit Board
2-2-1. Selection of Printed Circuit Board
When the Capacitors are mounted and soldered on an Aluminum Substrate, the substrate has influences on
Capacitor’s reliabilities against “Temperature Cycles” and “Heat shock” because of difference in thermal
expansion coefficient between them.
It shall be carefully confirmed that the actual board applied does not deteriorate the characteristics of the
Capacitors.
Note ;
CLASSIFICATION
No.
151S-ECJ-SS009E
PAGE
SPECIFICATIONS
SUBJECT
Multilayer Ceramic Chip Capacitor
Common Specification ( Precautions for Use)
10
3 of
DATE
1 Apr, 2005
2-2-2. Design of Land Pattern
(1) Recommended land dimensions are shown below for proper amount of solder to prevent cracking at the time
of excessive stress to the Capacitors due to increased amount of solder.
{ Recommended land dimensions (Ex.) }
[ For General Electronic Equipment, High Capacitance, Low ProfileType, 100V･200V series ]
Unit in mm
SMD
c
Land
b
Solder
resist
a
Type
(EIA)
06 (0201)
10 (0402)
11 (0603)
12 (0805)
13 (1206)
23 (1210)
34 (1812)
Component Dimension
L
W
T
0.6
0.3
0.3
1.0
0.5
0.5
1.6
0.8
0.8
2.0 1.25 0.6 to 1.25
3.2
1.6
0.6 to 1.6
3.2
2.5
1.4 to 2.5
4.5
3.2
2.5 to 3.2
Type
(EIA)
21(0508)
31(0612)
Component Dimension
Ｌ
Ｗ
Ｔ
1.25
2.0
0.85
1.6
3.2
0.85
a
b
c
0.2 to 0.3
0.4 to 0.5
0.8 to 1.0
0.8 to 1.2
1.8 to 2.2
1.8 to 2.2
3.0 to 3.5
0.25 to 0.3
0.4 to 0.5
0.6 to 0.8
0.8 to 1.0
1.0 to 1.2
1.0 to 1.2
1.2 to 1.6
0.2 to 0.3
0.4 to 0.5
0.6 to 0.8
0.8 to 1.0
1.0 to 1.3
1.8 to 2.3
2.3 to 3.0
[ W ide-width Type ]
Land
SMD
c
Unit in mm
ｂ
ｃ
0.5 to 0.7
0.8 to 1.0
0.5 to 0.6
0.6 to 0.7
1.4 to 1.9
2.5 to 3.0
Solder
resist
a
b
ａ
[ Array Type ]
4 Cap. Array
c
Unit in mm
P/2 P
a
b
Type
(EIA)
12
(0805)
13
(1206)
SMD
Component Dimension
L
W
T
2.0
1.25
0.85
3.2
1.6
0.85
a
b
c
P
0.55
to 0.75
0.9
to 1.1
0.5
to 0.6
0.7
to 0.9
0.2
to 0.3
0.35
to 0.45
0.4
to 0.6
0.7
to 0.9
Land
2-fold Array
Unit in mm
a
b
c
SMD
Type
(EIA)
Land
11
(0504)
Component
Dimension
L
W
T
0.6
1.37
1.0
0.8
P
a
b
c
P
0.3
to 0.4
0.3
to 0.6
0.45
to 0.55
0.4
to 0.7
0.3
to 0.4
0.46
to 0.56
0.54
to 0.74
0.71
to 0.91
(2) The size of lands shall be designed to be equal between the right and left sides. If the amount of solder on
the right land is different from that on the left land, the component may be cracked by stress to one side of
the component since the side with a larger amount of solder solidifies later at the time of cooling.
Recommended Amount of Solder
(a) Excessive amount
(b) Proper amount
of solder
of solder
←solder
←solder
Note ;
(c)Insufficient
amount
←solder
↑
↑
↑
PC
PC
PC
CLASSIFICATION
SUBJECT
No.
151S-ECJ-SS009E
PAGE
SPECIFICATIONS
Multilayer Ceramic Chip Capacitor
Common Specification ( Precautions for Use)
4 of
DATE
10
1 Apr, 2005
2-2-3. Applications of Solder Resist
Applications of Solder resist are effective to prevent solder bridges and to control amounts of solder on PC
boards.
(1) Solder resist shall be utilized to equalize the amounts of solder on both sides.
(2) If the Capacitors are arranged in succession, solder resist shall be used to divide the pattern in the mixed
mounting with a component with lead wires or in the arrangement near a chassis etc. See the table below.
NG Examples and Recommended Examples
NG Examples
Improved Examples by pattern division
The lead wire of
Solder resist
a component with
lead wires
Mixed mounting
with a component with
lead wires
Arrangement
near chassis
Sectional view
Sectional view
Chassis
Solder (ground solder)
Retrofitting of
Component with lead
wires
Soldering iron
Lateral arrangement
Land
Solder resist
Sectional view
Sectional view
Lead wire of
Retrofitted
component
Solder resist
Sectional view
Portion to be
excessively
soldered
Sectional view
Solder resist
2-2-4. Component Layout
The Capacitors / components shall be placed on the PC board so as to have both electrodes subjected to uniform
stresses, or to position the component electrodes at right angles to the grid glove or bending line to avoid
cracking in the Capacitors caused by the bending of the PC board after or during placing / mounting the
Capacitors / components on the PC board.
(1) The recommended layout of the Capacitor to minimize mechanical stress caused by warp or bending of a
PC board is as below.
NG Example
Warp of
Circuit board
Recommended Example
Lay out the Capacitor
sideways against the
stressing direction
(2) The following drawing is for your reference since
mechanical stress near the dividing/breaking
position of a PC board varies depending on the
mounting position of the Capacitors.
(3) The magnitude of mechanical stress applied to
the Capacitors when the circuit board is divided is
in the order of push back < slit < V-groove <
perforation.
Also take into account the layout of the Capacitors
and the dividing/breaking method.
2-2-5. Mounting Density and Spaces
If components are arranged in too narrow spaces, the
components are affected by Solder bridges and
Solder balls. Each space between components
Note ;
E
D
Perforation
C
A
B
Slit
Magnitude of stress A＞B＝C＞D＞
CLASSIFICATION
SUBJECT
SPECIFICATIONS
Multilayer Ceramic Chip Capacitor
Common Specification ( Precautions for Use)
No.
151S-ECJ-SS009E
PAGE
5 of
DATE
10
1 Apr, 2005
should be carefully determined.
3. Precautions for Assembly
3- 1.Storage
(1) The Capacitors shall be stored under 5 - 40℃ and 20 - 70%RH, not under severe conditions of high temperature
and humidity.
(2) If the storage place is humid, dusty, and contains corrosive gasses (hydrogen sulfide, sulfurous acid, hydrogen
chloride and ammonia, etc.), the solderability of the terminal electrodes may deteriorate.
Also, storage in a place subjected to heating or exposed to direct sunlight causes deformed tapes and reels of
taped version and/or components sticking to tapes, which results in troubles at the time of mounting.
(3) The storage period shall be within 6 months. Products stored for more than 6 months shall be checked their
solderability before use.
(4) The Capacitors of high dielectric constant series (Class 2, Characteristic B,X7R,X5R and F,Y5V) change in
capacitance with the passage of time, “Capacitance aging”, due to the inherent characteristics of ceramic
dielectric materials. The changed capacitance can be recovered by heat treatment to each initial value at the
time of shipping. (See 2. Operating Condition and Circuit Design, 2-1-7. Capacitance aging)
(5) When the initial capacitance is measured, the Capacitors shall be heat-treated at 150+0/-10℃ for 1 hour and
then subjected to ordinary temperature and humidity for 48±4 hours before measuring the initial value.
3- 2.Adhesives for Mounting
(1) The amount and viscosity of an adhesive for mounting shall be such that the adhesive shall not flow off on the
land during it’s curing.
(2) If the amount of adhesive is insufficient for mounting, the Capacitor may fall after or during soldering.
(3) If the adhesive is too low in its viscosity, the Capacitors may be out of alignment after or during soldering.
(4) Adhesives for mounting can be cured by ultraviolet or infrared radiation. In order to prevent the terminal
electrodes of the Capacitors from oxidizing, the curing shall be dune at conditions of 160℃ max., for 2 minutes
max.
(5) If curing is insufficient, the Capacitor may fall after or during soldering. Also insulation resistance between
terminal electrodes may deteriorate due to moisture absorption. In order to prevent these problems, the curing
conditions shall be sufficiently examined.
3- 3.Chip Mounting Consideration
(1) When mounting the Capacitors/components on a PC board, the capacitor bodies shall be free from excessive
impact loads such as mechanical impact or stress in the positioning, pushing force and displacement of vacuum
nozzles at the time of mounting.
(2) The maintenance and inspections for Chip Mounter must be performed regularly.
(3) If the bottom dead center of the vacuum nozzle is too low, the Capacitor is cracked by an excessive force at the
time of mounting.
The following precautions and recommendations are for your reference in use.
(a) Set and adjust the bottom dead center of the vacuum nozzles to the upper surface of the PC board after
correcting the warp of the PC board.
(b) Set the pushing force of the vacuum nozzle at the time of mounting to 1 to 3 N in static load.
(c) For double surface mounting, apply a supporting pin on the rear surface of the PC board to suppress the
bending of the PC board in order to minimize the impact of the vacuum nozzles. The typical examples are
shown in the table below.
(d) Adjust the vacuum nozzles so that their bottom dead center at the time of mounting is not too low.
(4) The closing dimensions of positioning chucks shall be controlled and the maintenance, checks and replacement
of positioning chucks shall be regularly performed to prevent chipping or cracking of the Capacitors caused by
mechanical impact at the time of positioning due to worn positioning chucks.
(5) Maximum stroke of the nozzle shall be adjusted so that the maximum bending of PC board does not exceed
0.5mm at 90mm span. The PC board shall be supported by means of adequate supporting pins.
Note ;
CLASSIFICATION
SUBJECT
No.
151S-ECJ-SS009E
PAGE
SPECIFICATIONS
Multilayer Ceramic Chip Capacitor
Common Specification ( Precautions for Use)
NG Examples
6 of
DATE
10
1 Apr, 2005
Improved Examples by pattern division
Crack
Single surface
mounting
Supporting
pin
The supporting pin must not
be necessarily positioned
beneath the capacitor.
Double surface
mounting
Separation
of solder
Crack
Supporting
pin
3- 4.Selection of Soldering Flux
Soldering flux may seriously affect the performance of the Capacitors. The following shall be confirmed before use.
(1) Soldering flux having a halogen based content of 0.1 wt. % (converted to chlorine) or below shall be used.
Do not use soldering flux with strong acid.
(2) When applying water-soluble soldering flux, wash the Capacitors sufficiently because the soldering flux residue
on the surface of PC boards may deteriorate the insulation resistance on the Capacitor surface due to insufficient
cleaning.
3- 5.Soldering
3-5-1. Flow soldering
In flow soldering process, abnormal and large thermal and mechanical stresses, caused by ”Temperature
Gradient" between the mounted Capacitors and melted solder in a soldering bath, may be applied directly to the
Capacitors, resulting in failures and damages of the Capacitors, So it is essential that soldering process shall be
controlled to the following recommended conditions.
(1) Application of Soldering flux:
The soldering flux shall be applied to the mounted Capacitors thinly and uniformly by foaming method.
(1) Preheating:
The mounted Capacitors/Components shall be preheated sufficiently so that the “Temperature Gradient”
between the Capacitors/Components and the melted solder shall be 150℃ max. (100 to130℃)
(3) Immersion into Soldering Bath:
The Capacitors shall be immersed into a soldering bath of 240 to 260℃ for 3 to 5 seconds.
(4) Gradual Cooling:
The Capacitors shall be cooled gradually to room ambient temperature with the cooling temperature rates of
8℃/s max. from 250℃ to 170℃ and 4℃/s max. from 170℃ to 130℃.
(5) Flux Cleaning:
When the Capacitors are immersed into a cleaning solvent, it shall be confirmed that the surface
temperatures of devices do not exceed 100℃.
(6) One time of flow soldering under the conditions shown in the figure below [Recommended profile of Flow
soldering (Ex)] do not cause any problems.
However, fully pay attention to the possible warp and bending of the PC board.
Note ;
CLASSIFICATION
SPECIFICATIONS
SUBJECT
Multilayer Ceramic Chip Capacitor
Common Specification ( Precautions for Use)
No.
151S-ECJ-SS009E
PAGE
7 of
DATE
10
1 Apr, 2005
Recommended profile of Flow soldering [Ex.]
Soldering
240
to 260℃
Gradual cooling
(at ordinary
temperature）
∆T
〈Allowable temperature difference ∆T〉
Size
Temp. Tol.
0603 to 1206
∆T ≦ 150 °C
0508, 0612
Temp.
(℃)
Time
60 to120s
3 to 5s
3-5-2. Reflow soldering
In reflow soldering, the mounted Capacitors/Components are generally heated and soldered by a thermal
conduction system such as an “Infrared radiation and hot blast soldering system” or a “Vapor Phase Soldering
System (VPS)”.
Large temperature gradients such as a rapid heating and cooling in the process may cause electrical failures and
mechanical damages of the devices.
It is essential that the soldering process shall be controlled by the following recommended conditions and
precautions.
(1) Preheating 1:
The mounted Capacitors/Components shall be preheated sufficiently for 60 to 90 seconds so that the
surface temperatures of them to be 140 to 160℃.
(2) Preheating 2 :
After “Preheating 1”, the mounted Capacitors/Components shall be heated to the elevated temperature of
150 to 220℃ for 2 to 5 seconds.
(3) Soldering:
Heating section:220℃ or above within 20 sec .
(4) Gradual cooling:
After the soldering, the mounted Capacitors/Components shall be gradually cooled to room ambient
temperature for preventing mechanical damages such as cracking of the devices.
(1) Flux Cleaning:
When the Capacitors are immersed into a cleaning solvent, it shall be confirmed that the surface
temperatures of devices do not exceed 100℃.
(6) Two times of flow soldering under the conditions shown in the figure below [Recommended profile of Reflow
soldering (Ex)] do not cause any problem. However, fully pay attention to the possible warp and bending of
the PC board.
Recommended profile of Reflow soldering (Ex.)
③Soldering
240
to 260℃
220℃
∆T
④Gradual
cooling
Temp.
(℃)
②Preheating 2
①Preheating1
Time
60s min.
120s max.
Note ;
20s max.
〈 Allowable temperature difference ∆T〉
Size
Temp. Tol.
0201 to 1206
∆T≦ 150 °C
0508, 0612, 0504
∆T≦ 130 °C
1210 to 1812
CLASSIFICATION
SUBJECT
SPECIFICATIONS
Multilayer Ceramic Chip Capacitor
Common Specification ( Precautions for Use)
No.
151S-ECJ-SS009E
PAGE
8 of
DATE
10
1 Apr, 2005
3-5-3. Hand soldering
In hand soldering of the Capacitors, large temperature gradient between the preheated Capacitors and the tip of
soldering iron may cause electrical failures and mechanical damages such as cracking or breaking of the
devices.
The soldering shall be carefully controlled and carried out so that the temperature gradient is kept minimum with
the following recommended conditions for hand soldering.
(1) Condition 1 (with preheating)
(a) Soldering :
φ1.0mm Thread eutectic solder with soldering flux* in the core.
*Rosin-based and non-activated flux is recommended.
(b) Preheating:
The Capacitors shall be preheated so that “Temperature Gradient” between the devices and the tip of
soldering iron is 150℃ or below.
(c) Temperature of Iron tip: 300℃ max.
(The required amount of solder shall be melted in advance on the soldering tip.)
(d) Gradual Cooling:
After soldering, the Capacitors shall be cooled gradually at room ambient temperature.
Recommended profile of Hand Soldering [Ex.]
Soldering
Gradual
cooling
∆T
〈Allowable temperature difference ∆T〉
Size
Temp. Tol.
0201 to 1206
∆T≦ 150 °C
0508, 0612, 0504
∆T≦ 130 °C
1210 to 1812
Preheating
60 to 120 s
3 s max.
(2) Condition 2 (without preheating)
Modification with a soldering iron is acceptable without preheating if within the conditions specified below.
(a) Soldering iron tip shall never directly touch the ceramic dielectrics and terminal electrodes of the
Capacitors.
(b) The lands are sufficiently preheated with a soldering iron tip before sliding the soldering iron tip to the
terminal electrode of the Capacitor for soldering.
Conditions of Hand soldering without preheating
Condition
Chip size
0201 to 0805, 0508, 0504 1206 to 1812 , 0612
Temperature of soldering iron
270 °C Max.
250 °C Max.
Wattage
20W Max.
Shape of soldering iron tip
φ3mm Max.
Soldering time with soldering iron
3s Max.
3- 6.Post Soldering Cleaning
3-6-1. Residues of soldering fluxes on the PC board after cleaning with an inappropriate solvent may deteriorate on the
electrical characteristics and reliability (particularly, insulation resistance) of the Capacitors.
3-6-2. Inappropriate cleaning conditions (Such as insufficient cleaning, excessive cleaning) may impair the electrical
characteristics and reliability of the Capacitors.
(1) If cleaning is insufficient :
(a) The halogen substance in the residues of the soldering flux may cause the metal of terminal electrodes to
corrode.
(b) The halogen substance in the residues of the soldering flux on the surface of the Capacitors may
deteriorate the insulation resistance.
(c) Water-soluble soldering flux may have more remarkable tendencies of (a) and (b) above compared to
those of rosin soldering flux.
(2) If cleaning is excessive :
Note ;
CLASSIFICATION
SUBJECT
No.
151S-ECJ-SS009E
PAGE
SPECIFICATIONS
Multilayer Ceramic Chip Capacitor
Common Specification ( Precautions for Use)
9 of
DATE
10
1 Apr, 2005
(a) Too much output of ultrasonic cleaning may deteriorate the strength of the terminal electrodes or cause
cracking in the solder and/or ceramic bodies of the Capacitors due to vibrated PC boards.
The following conditions are for Ultrasonic cleaning.
Ultrasonic wave output: 20 W/L max.
Ultrasonic wave frequency: 40 kHz max.
Ultrasonic wave cleaning time: 5 min. max.
3-6-3. Cleaning with contaminated cleaning solvent may cause the same results in case of insufficient cleaning due to
the high density of liberated halogen.
3- 7.Process Inspection
When the mounted PC boards are inspected with measuring terminal pins, abnormal and excess mechanical
stresses shall not be applied to the PC board and mounted components, to prevent failures or damages of the
devices.
(1) The mounted PC boards shall be supported by some adequate supporting pins setting their bending to 90 mm
span 0.5mm max.
(2) It shall be confirmed that measuring pins have a right tip shape, are equal in height and are set in the right
positions.
The following figures are for your reference to avoid the possible bending of PC board.
NG Example
Bending of PC board
Recommended Example
Check pin
Check pin
Supporting
pin
Separated
3- 8.Protective Coat
When the surface of a PC board on which the Capacitors have been mounted is coated with resin to protect against
moisture and dust, it shall be confirmed that the protective coat does not have influences on the reliability of the
Capacitors in the actual equipment.
(1) Coating materials, such as being corrosive and chemically active, shall not be applied to the Capacitors and
other components.
(2) Coating materials with large thermal expansivity shall not be applied to the Capacitors for preventing failures or
damages (such as cracking) of the devices in the curing process.
3- 9.Dividing/Breaking of PC Boards
(1) Abnormal and excessive mechanical stresses such as bending or torsion as
below, which cause cracking in the Capacitors, on the components on the
PC board shall be kept minimum in the dividing/breaking.
(2) Dividing/Breaking of the PC boards shall be done carefully at moderate
speed by using a jig or apparatus to prevent the Capacitors on the boards
from mechanical damages.
Bending
Torsion
(3) Examples of PCB dividing/breaking jig
The outline of PC board breaking jig is shown below.
As a recommended example, Dividing/Breaking of the PC boards shall be done by holding the position near the
jig where is free from bending, and so as to be compressive stress for the components such as the Capacitors on
the PC board.
And as a NG example, if holding the PC board at any position apart from the jig, tensile stress to the Capacitor
may cause cracking in the Capacitors.
Outline of Jig
Recommended Example
NG Example
V-groove
PC board
V-groove
Load direction
Load direction
Load position
PC board
PC board
Load position
PC board
splitting jig
Note ;
Chip component
V-groove
CLASSIFICATION
SUBJECT
No.
151S-ECJ-SS009E
PAGE
SPECIFICATIONS
Multilayer Ceramic Chip Capacitor
Common Specification ( Precautions for Use)
3- 10.Mechanical Impact
(1) The Capacitors shall be free from any excessive mechanical impact.
The Capacitor body, which is made of ceramics, may be damaged or
cracked by dropping impact.
Never use dropped capacitors because their quality may be already
impaired and its failure level of significance may be increased. Particularly,
large size capacitors tend to be damaged or cracked more easily.
(2) When handling the PC boards on which the Capacitors are mounted, the
Capacitors shall not collide with another PC board.
When mounted PC boards are handled or stored in a stacked state, impact
caused by colliding between the corner of the PC board and the Capacitor
may cause damage or cracking in the Capacitor and deteriorate the
withstand voltage and insulation resistance of the Capacitor.
10 of
DATE
1 Apr, 2005
Crack
Floor
Crack
4. Other
Various precautions described above are typical ones.
For special mounting conditions, please contact us.
Precautions for Use above are from
The Technical Report EIAJ RCR-2335 Caution Guide Line for Operation of Fixed Multilayer
Ceramic Capacitors for Electronic Equipment by Japan Electronics and Information Technology
Industries Association (March 2002 issued)
Please refer to above technical report for details.
Note ;
10
Mounted PCB
CLASSFICATION
SUBJECT
No.
151S-ECJ-SV036E
PAGE
SPECIFICATIONS
Multilayer Ceramic Chip Capacitor
Taped and Reeled Packaging Specifications
1
DATE
of 6
28 Apr, 2004
1. Scope
This specification applies to taped and reeled packing for Multilayer ceramic chip capacitors.
2. Applicable Standards
EIAJ (Electric Industries Association of Japan) Standard EIAJ RC-1009B
JIS (Japanese Industrial Standard) Standard JIS C 0806
3. Packing Specification
3- 1.Structure and Dimensions
Paper taping packaging is carried out according the following diagram
1) Carrier tape
: Shown in Fig. 5.
2) Reel
: Shown in Fig. 6.
3) Packaging
: We shall pack suitably in order prevent damage during transportation or storage.
3- 2.Packing Quantity
Carrier-Tape
Thickness of
Capacitor(mm)
Type
06type (0201)
10type (0402)
11type (0603)
12type (0805)
13type (1206)
23type (1210)
34type (1812)
Taping
Pitch
Material
Quantity (pcs./reel)
φ180mm Reel
φ330mm Reel
Packaging
Packaging
Quantity
Quantity
Code
Code
E
15000
----E
10000
W
50000
V
4000
Z
10000
0.30 +/- 0.03
0.50 +/- 0.05
0.8 +/- 0.1
Paper Taping
Paper Taping
Paper Taping
2mm
2mm
4mm
0.6
Paper Taping
4mm
V
5000
Z
20000
Paper Taping
4mm
V
4000
Z
10000
Embossed Tap.
4mm
F
3000
---
---
Paper Taping
Paper Taping
Embossed Tap.
Embossed Tap.
Embossed Tap.
Embossed Tap.
Embossed Tap.
Embossed Tap.
4mm
4mm
4mm
4mm
4mm
4mm
8mm
8mm
V
V
F
Y
Y
Y
Y
Y
5000
4000
3000
2000
2000
1000
500
500
Z
Z
-------------
20000
10000
-------------
+/- 0.1
0.85 +/- 0.10
1.25 +/- 0.10
1.25 +/- 0.15
1.25 +/- 0.20
0.6 +/- 0.1
0.85 +/- 0.10
1.15 +/- 0.10
1.6 +/- 0.2
2.0 +/- 0.2
2.5 +/- 0.3
2.5 +/- 0.3
3.2 +/- 0.3
Explanation of Part Numbers (Example)
ECJ
1
V
B
1C
104
K
Packaging Code
3- 3.Marking on the Reel
The following items are described in the side of a reel in English at least.
1) Part Number
2) Quantity
3) Lot Number
4) Place of origin
Note ;
01 Apr, 2005
Change the company name.
Previous : Matsushita Electronic Components Co., Ltd.
New
: Panasonic Electronic Devices Co., Ltd.
APPROVAL
Panasonic Electronic Devices Co., Ltd.
Y.Sakaguchi
CHECK
S.Endoh
DESIGN
T.Shinriki
CLASSFICATION
SUBJECT
SPECIFICATIONS
Multilayer Ceramic Chip Capacitor
Taped and Reeled Packaging Specifications
No.
151S-ECJ-SV036E
PAGE
2
DATE
28 Apr, 2004
3- 4.Structure of Taping
1) The direction of winding of taping on the reel shall be in accordance with the following diagram.
Fig. 1 Paper Taping
Fig. 2 Embossed Taping
2) The specification of the leader and empty portion shall be in accordance with the following diagram.
Fig. 3 Leader Part and Taped End
100mm min.
160mm min.
Note ;
400mm min.
of 6
CLASSFICATION
No.
151S-ECJ-SV036E
PAGE
SPECIFICATIONS
SUBJECT
Multilayer Ceramic Chip Capacitor
Taped and Reeled Packaging Specifications
3
DATE
of 6
28 Apr, 2004
4. Efficiency
4- 1.Breakage strength of the tape : 10N or more.
4- 2.Peel strength of the cover tape (refer to the Fig. 4).
1) Peel angle : 165 to 180 degree from the tape adhesive face.
2) Peel velocity : 300mm per min.
3) Peel strength : 0.1 to 0.7N
Fig. 4 Peel strength of the cover tape
Paper Taping
Embossed Taping
4- 3.Barrs on tape
There shall be no barrs preventing suction when products are taken out.
4- 4.Missing of products
The missing of products shall be 0.1% or less per reel and there shall be no continuous missing of products.
4- 5.Adherence to the tape
Products shall not be stuck to the cover tape or bottom tape.
Fig. 5 Carrier Tape Dimension
(a) 06 and 10 type : 2mm taping pitch for Paper taping
Code
W
F
E
P1
P2
P0
D0
t1
t2
Type
Code
A
B
Note ;
”06” (0201)
”10” (0402)
0.37 +/- 0.03
0.67 +/- 0.05
0.62 +/- 0.05
1.12 +/- 0.05
Dimension
8.0 +/- 0.2
3.50 +/- 0.05
1.75 +/- 0.10
2.00 +/- 0.05
2.00 +/- 0.05
4.00 +/- 0.05
φ1.5
+0.1/-0
“06”
0.5
Type
max.
“10”
0.7
Type
max.
“06”
0.8
Type
max.
“10”
1.0
Type
max.
Unit : mm
CLASSFICATION
SUBJECT
No.
151S-ECJ-SV036E
PAGE
SPECIFICATIONS
Multilayer Ceramic Chip Capacitor
Taped and Reeled Packaging Specifications
4
DATE
of 6
28 Apr, 2004
(b) 11 and 12 and 13 type : 4mm taping pitch for Paper taping.
Code
W
F
E
P1
P2
P0
D0
t1
t2
Type
Code
A
B
”11” (0603)
“12” (0805)
“13” (1206)
1.0 +/- 0.1
1.8 +/- 0.1
1.65 +/- 0.20
2.4 +/- 0.2
2.0 +/- 0.2
3.6 +/- 0.2
Dimension
8.0 +/- 0.2
3.50 +/- 0.05
1.75 +/- 0.10
4.0 +/- 0.1
2.00 +/- 0.05
4.0 +/- 0.1
φ1.5
+0.1/-0
1.1 max.
1.4 max.
Unit : mm
(c) 12 and 13 and 23 type : 4mm taping pitch for Embossed taping.
Code
W
F
E
P1
P2
P0
D0
D1
t1
t2
Type
Code
A
B
Note ;
“12” (0805)
“13” (1206)
“23” (1210)
1.55 +/- 0.20
2.35 +/- 0.20
1.90 +/- 0.20
3.5 +/- 0.2
2.8 +/- 0.2
3.5 +/- 0.2
Dimension
8.0 +/- 0.2
3.50 +/- 0.05
1.75 +/- 0.10
4.0 +/- 0.1
2.00 +/- 0.05
4.0 +/- 0.1
φ1.5
+0.1/-0
φ1.1+/- 0.1
0.6 max.
“12”
2.5
”13”
max.
Type
“23”
3.5
Type
max.
Unit : mm
CLASSFICATION
SUBJECT
No.
151S-ECJ-SV036E
PAGE
SPECIFICATIONS
Multilayer Ceramic Chip Capacitor
Taped and Reeled Packaging Specifications
5
DATE
of 6
28 Apr, 2004
(d) 34 type : 8mm chip taping pitch for Embossed taping.
Code
W
F
E
P1
P2
P0
D0
t1
Dimension
12.0 +/- 0.3
5.50 +/- 0.05
1.75 +/- 0.10
8.0 +/- 0.1
2.00 +/- 0.05
4.0 +/- 0.1
φ1.5
+0.1/-0
0.6 max.
t2
4.0max.
Unit:mm
Type
Code
A
B
Note ;
“34” (1812)
3.6 +/- 0.3
4.9 +/- 0.3
CLASSFICATION
SUBJECT
SPECIFICATIONS
Multilayer Ceramic Chip Capacitor
Taped and Reeled Packaging Specifications
No.
151S-ECJ-SV036E
PAGE
6
DATE
of 6
28 Apr, 2004
Fig. 6 Reel Dimension
(a) φ180mm Reel (Standard Reel)
Code
A
B
C
D
E
W
W1
Dimension
φ180+0/-3.0
φ60 +/- 0.5
13.0 +/- 0.5
21.0 +/- 0.8
2.0 +/- 0.5
9.0 +/- 0.3
11.4 +/- 0.1
Unit : mm
Code
A
B
C
D
E
W
W1
Dimension
φ330 +/- 5.0
φ50 min.
13.0 +/- 0.5
20 min.
2.0 +/- 0.5
9.5 +/- 1.0
2.0 +/- 0.5
Unit : mm
(b) φ330mm Reel (Large size Reel)
Note ;