Footprint for wave soldering

SO & SOJ FOOTPRINT (WAFE SOLDERING)
Philips Semiconductors
enlarged solder land
handbook, full pagewidth
solder lands
C
0.3 1.20
B
solder resist
A
occupied area
F
board direction
0.60
1.27((N−2)x)
MLC745
G
Wave soldering
PACKAGE
NAME
FOOTPRINT DIMENSIONS (mm)
PHILIPS OUTLINE
CODE
N
C
F
G
SO8
SOT96-1
8
6.60
4.00
1.30
7.00
5.50
±0.25
SO8
SO14
SOT176-1
8
11.00
8.00
1.50
11.40
8.40
±0.25
SOT108-1
14
6.60
4.00
1.30
7.00
9.30
±0.25
SO16
SOT109-1
16
6.60
4.00
1.30
7.00
10.50
±0.25
SO16
SOT109-2
16
6.60
4.00
1.30
7.00
10.50
±0.25
SO16
SOT109-3
16
6.60
4.00
1.30
7.00
10.50
±0.25
SO16
SOT162-1
16
11.00
8.00
1.50
11.40
10.90
±0.25
SO20
SOT163-1
20
11.00
8.00
1.50
11.40
13.40
±0.25
SO24
SOT137-1
24
11.00
8.00
1.50
11.40
16.00
±0.25
SO28
SOT136-1
28
11.00
8.00
1.50
11.40
18.50
±0.25
SO32
SOT287-1
32
11.00
8.00
1.50
11.40
21.20
±0.25
SOJ40
SOT449-1
40
Not suitable for wave soldering.
PDF: 2001 Feb 14
B
PC board footprint
A
PLACEMENT
ACCURACY