Datasheet MLX91205 old 641 DownloadLink 5505

MLX91205
IMC Current Sensor (Triaxis™ Technology)
Features and Benefits
Applications Examples
 Triaxis™ Hall Technology
 Sensitive to a magnetic field parallel to the
chip surface
 Very high sensitivity
 Linear output voltage proportional to a
magnetic field
 Wideband: DC to 100kHz
 Short response time 8μs
 Low offset and offset drift
 Very low noise
 Isolated from current conductor
 Surface mount SOIC8 package
 AC and/or DC contactless current
measurement
 Wideband Magnetic Field Measurement
 Battery Management
 AC/DC Converters
 Motor Control
 Solar Power Converter (MPPT)
 Power Management
Ordering Information
Part No.
MLX91205KDC-LB
MLX91205KDC-HB
Temperature Code
(-40°C to 125°C)
(-40°C to 125°C)
Package Code
DC (SOIC)
DC (SOIC)
1 Functional diagram
NC
Tria is™
VDD
Demodulator
Buffer
Offset
Cancellation
Biasing
Unit
2 General description
GND
Amplifier
Modulator
Calibration Unit
PV
PC
PD
Option code
CO_OUT
A_OUT
The new Triaxis™ current sensor MLX91205 is a
single axis integrated magnetic sensor based on
the Hall Effect. It produces an analog linear, ratiometric output voltage proportional to the applied
magnetic field parallel with the chip surface.
The circuit is fabricated using a standard CMOS
process. The additional ferromagnetic layer
(Triaxis™ or IMC™ = Integrated Magnetic
Concentrator) that is added in a simple postprocessing step, amplifies the magnetic field and
concentrates it on the Hall elements. Therefore,
the circuit features very high magnetic sensitivity,
low offset, and low noise.
The MLX91205 is ideally suited for current
sensing
in
automotive
and
industrial
environments.
There are 2 different product versions available.
The 91205HB features a linear magnetic field
range of ±25mT and the 91205LB features a linear
range of ±10mT.
HB refers to a high magnetic field, whereas LB
refers to a low magnetic field range.
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Data Sheet
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MLX91205
IMC Current Sensor (Triaxis™ Technology)
Table of Contents
1 Functional diagram......................................................................................................... 1
2 General description ........................................................................................................ 1
3 Glossary of Terms .......................................................................................................... 3
4 Maximum ratings ............................................................................................................ 3
5 Pad definitions and descriptions................................................................................... 3
6 MLX91205 General Electrical Specifications ................................................................ 4
MLX91205 Sensor Specific Specifications ..................................................................... 4
7........................................................................................................................................... 4
7.1 91205 LB: Low Field version 10mT (marking xxL) ..............................................................................................................................4
7.2 91205HB: High Field version 25mT (marking xxH) .............................................................................................................................5
8 Detailed General Description ......................................................................................... 6
9 Unique Features.............................................................................................................. 6
10 Performance Graphs .................................................................................................... 7
10.1 Offset over Temperature ...................................................................................................................................................................7
10.2 Sensitivity over Temperature.............................................................................................................................................................7
11 Applications Information.............................................................................................. 8
11.1 Low current measurement up to ±2 A ...............................................................................................................................................8
11.2 Medium current up to ±30 A ..............................................................................................................................................................8
11.3 High current measurement up to ±600 A...........................................................................................................................................8
11.4 Customer Calibration with MCU ........................................................................................................................................................8
12 Application Diagram ..................................................................................................... 9
12.1 Direct Single Ended Output ...............................................................................................................................................................9
12.2 Direct Differential Output ...................................................................................................................................................................9
13 Standard information regarding manufacturability of Melexis products with
different soldering processes......................................................................................... 10
14 ESD Precautions ......................................................................................................... 11
15 Package Information................................................................................................... 11
15.1 Package Dimensions.......................................................................................................................................................................11
15.2 Pinout and marking..........................................................................................................................................................................12
15.3 Hall plate positioning .......................................................................................................................................................................12
16 Disclaimer.................................................................................................................... 13
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MLX91205
IMC Current Sensor (Triaxis™ Technology)
3 Glossary of Terms
Gauss (G), Tesla (T): Magnetic flux density units where 1 mT = 10 G.
ADC: Analog-to-Digital Converter
TC: Sensitivity Temperature Coefficient (in ppm/Deg.C.).
TriaisTM : The Triais™ technology refers to the Melexis Hall technology that is based on both planar and
vertical (bulk & IMC) Hall plates. This technology allows the realization of Hall effect sensors able to sense
the flux density along the 3 axis (i.e. X, Y & Z) as well as position sensors able to sense the magnetic vector
over 360 degrees.
IMC: Integrated Magneto Concentrator. It concentrates the magnetic flux lines and bends them at the
extremity under the planar Hall plate. Furthermore, it can provide some magnetic gain factor.
4 Maximum ratings
Parameter
Units
Supply Voltage, V DD (overvoltage)
6V
Supply Voltage, V DD (operating)
5.5V
Reverse Voltage Protection
0V
Operating Temperature Range, T A
-40 to +125C
Storage Temperature Range, T S
-40 to +150C
Table 1: Absolute maximum ratings
Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute maximum
rated conditions for extended periods may affect device reliability.
5 Pad definitions and descriptions
Pad Name
Function
VDD
Supply
GND
Supply Common
A_out
Analog Output
CO_out
Output Common (VDD/2)
PV
Programming Voltage (default VDD)
PC
Programming Clock (default VDD)
PD
Programming Data (default GND)
Table 2: Pin description MLX91205
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MLX91205
IMC Current Sensor (Triaxis™ Technology)
6 MLX91205 General Electrical Specifications
DC Operating Parameters T A = -40oC to +125oC, V DD = 5.000V (unless otherwise specified)
Parameter
Symbol
Nominal Supply Voltage
Vdd
Supply Current
Idd
Common Output
CO_out
Output Current
Iout
Output Load Resistance
Rload
Output Load Capacitance
Cload
Start-up cycle
ts
Table 3: Electrical specifications
Test Conditions
Iout=0mA
Referring to VDD/2
Min
4.5
-50
-1
5
Typ
5
11
VDD/2
Max
5.5
16
+50
1
1000
150
Units
V
mA
mV
mA
kΩ
pF
μs
7 MLX91205 Sensor Specific Specifications
7.1 91205 LB: Low Field version 10mT (marking xxL)
DC Operating Parameters T A = -40oC to 125oC, V DD = 5.000V, differential output (unless otherwise specified)
Parameter.
Symbol Test Conditions
Min
Typ
Max
Units
Magnetic Sensitivity
S
275
280
285
V/T
Magnetic Sensitivity over Temp.
S
270
280
290
V/T
Thermal Sensitivity Drift
Offset Voltage
Offset Voltage over Temperature
Fullscale Magnetic Field Range
Non Linearity
Hysteresis
Max. Output Voltage Swing
Response Time
Bandwidth (-3 dB) DC to
Spectral Noise Density
TC
Voff
Voff
Bfs
NL
Hyst
Vout,max
tr
BW
ΔBnoise
T=25°C 1)
T= -40, 25, 125°C; Chapter 10.2
1)
T= 25°C
T= 25°C
T= -40, 25, 125°C; Chapter 10.1
B<Bfs
B<100mT
B>Bfs; A_out; Iout=0mA
R Load >1MΩ; C Load <10pF
-20
-50
-10
<+/-200
0
0
20
50
10
±0.5
<±10
5
95
8
100
<125
ppm/°C
mV
mV
mT
%
μT
%VDD
μs
kHz
nT/sqrt(Hz)
Table 4: Sensor specifications 10mT version (low-field version)
Note 1: The absolute accuracy on magnetic sensitivity trimming is +/- 2%
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MLX91205
IMC Current Sensor (Triaxis™ Technology)
7.2 91205HB: High Field version 25mT (marking xxH)
DC Operating Parameters T A = -40oC to 125oC, V DD = 5.000V, differential output (unless otherwise specified)
Parameter.
Magnetic Sensitivity
Magnetic Sensitivity over Temp.
Thermal Sensitivity Drift
Offset Voltage
Offset Voltage over Temperature
Fullscale Magnetic Field Range
Non Linearity
Hysteresis
Max. Output Voltage Swing
Response Time
Bandwidth (-3 dB) DC to
Spectral Noise Density
Symbol Test Conditions
S
T=25°C (Note 1)
T= -40, 25, 125°C; Chapter 10.2
S
(Note 1)
TC
T= 25°C
Voff
T= 25°C
T= -40, 25, 125°C; Chapter 10.1
Voff
Bfs
NL
B<Bfs
Hyst
B<100mT
Vout,max B>Bfs; A_out; Iout=0mA
Tr
R Load >1MΩ; C Load <10pF
BW
ΔBnoise
Min
97.5
Typ
100
Max
102.5
95
100
105
V/T
20
50
25
ppm/°C
mV
mV
mT
-20
-50
-25
<+/-200
0
0
±0.5
<±20
5
95
8
100
<125
Units
V/T
μT
%VDD
μs
kHz
nT/sqrt(Hz)
Table 5: Sensor specifications 25mT version (high-field version)
Note 1: The absolute accuracy on magnetic sensitivity trimming is +/- 2%
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MLX91205
IMC Current Sensor (Triaxis™ Technology)
8 Detailed General Description
Melexis IMC current sensor MLX91205 is a single axis magnetic field sensor based on the Hall effect. It is an
integrated combination of a CMOS Hall circuit and a thin ferromagnetic concentrator. The CMOS circuit
contains two pairs of Hall elements for its sensitivity direction parallel with the chip surface. The ferromagnetic
concentrator amplifies the external magnetic field and concentrates it on the Hall elements.
The MLX91205 is ideally suited for current sensing in harsh automotive and industrial environments for both
AC and DC currents. It produces an analog, linear, ratio-metric output voltage proportional to the applied
magnetic field parallel with the chip surface.
The circuit is fabricated using a standard CMOS process and the ferromagnetic layer is added in a simple
post-processing step. The monolithic device incorporates Hall elements, offset cancellation circuitry, current
source, chopper stabilized amplification circuitry, parameter programming capability.
By dynamic offset cancellation any offset voltage caused by temperature variations, packaging stress or
others is strongly reduced. As a result, the device has an extremely stable signal output, is immune to
mechanical stress and is virtually immune to temperature cycling.
Therefore, the circuit features a wide application range and very high accuracy.
9 Unique Features
Different to other linear Hall sensors the MLX91205 measures the magnetic field parallel with the chip
surface.
Therefore this sensor is ideally used as an open-loop current sensor for PCB mounting. It features small size
application design and a simple construction for various current range.
Due to short Response time and high Bandwidth this sensor is suitable for high speed current
measurement in a contactless, high current, high voltage setup.
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MLX91205
IMC Current Sensor (Triaxis™ Technology)
10 Performance Graphs
10.1 Offset over Temperature
The product is calibrated at room temperature and tested at -40°C, 25°C and +125°C. The Offset
performance 0V ±20mV at room temperature and is 0V ±50mV over the temperature range from -40 to 125°
C. The typical temperature drift is < 0mV/°C ± 0.3 mV/°C
10.2 Sensitivity over Temperature
The product is calibrated at room temperature and tested at -40°C, 25°C and +125°C. The Sensitivity
performance for the low field version is 280V/T ±5 V/T at room temperature and 280V/T ±10 V/T over the
temperature range from -40 to 125° C. The typical temperature drift is < 200 ppm/ °C.
The corresponding sensitivity performance for the high field version is 100V/T ±2.5 V/T at room temperature
and 100V/T ±5 V/T over the temperature range from -40 to 125° C.
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MLX91205
IMC Current Sensor (Triaxis™ Technology)
11 Applications Information
11.1 Low current measurement up to ±2 A
Low currents can be measured with the MLX91205 by
increasing the magnetic field via a coil around the sensor.
The sensitivity (output voltage vs. current in coil) of the
measurement will depend on the size of coil and number
of turns. Additional sensitivity and increased immunity to
external fields can be gained by adding a shield around
the coil. The bobbin provides very high dielectric isolation
making this a suitable solution for high voltage power
supplies with relative low currents. The output should be
scaled to obtain the maximum voltage for the highest
current to be measured in order to obtain the best
accuracy and resolution.
11.2 Medium current up to ±30 A
With a single conductor located on the PCB, currents in the
range of up to 30 amps can be measured. The sizing of the
PCB trace needs to take into account the current handling
capability and the total power dissipation. The PCB trace
needs to be thick enough and wide enough to handle the
RMS current continuously.
The differential output voltage for this configuration can be
approximated by the following equation:
Vout = typ. 35 - 40 mV/A * I
For a current level of 30 A, the output will be approximately
1050 mV.
11.3 High current measurement up to ±600 A
Another method of measuring high currents on PCB’s is to
use a large thick gauge copper trace capable of carrying
the current on the opposite side of the PCB. The
MLX91205 should be located near the center of the trace,
however because the trace is wide, the output is less
sensitive to location on the PCB. This configuration also
has less sensitivity due to the distance and width of the
conductor.
11.4 Customer Calibration with MCU
In many applications one measures the output voltage of the 91205 with a microcontroller. The currentsensor-system accuracy can be significantly increased by customer calibration of the system after
assembling the 91205 in the application. By applying a known current i.e.100 Amperes, one can calibrate by
means of the microcontroller the output voltage to the exact value i.e. 2.000V at 100 Amps. By doing so, the
offset and sensitivity can be calibrated simply at a certain temperature.
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MLX91205
IMC Current Sensor (Triaxis™ Technology)
12 Application Diagram
12.1 Direct Single Ended Output
For reliable operation within the specifications the sensor must be connected as follows:
* if the supply voltage is disturbed by EMI it can be useful to place a second capacitor (100pF ceramic)
parallel to the 100nF capacitor.
12.2 Direct Differential Output
For reliable operation within the specifications the sensor must be connected as follows:
* if the supply voltage is disturbed by EMI it can be useful to place a second capacitor (100pF ceramic)
parallel to the 100nF capacitor.
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MLX91205
IMC Current Sensor (Triaxis™ Technology)
13 Standard information regarding manufacturability of Melexis
products with different soldering processes
Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity
level according to following test methods:
Reflow Soldering SMD’s (Surface Mount Devices)


IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)
EIA/JEDEC JESD22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
(reflow profiles according to table 2)
Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)


EN60749-20
Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat
EIA/JEDEC JESD22-B106 and EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Iron Soldering THD’s (Through Hole Devices)

EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)

EIA/JEDEC JESD22-B102 and EN60749-21
Solderability
For all soldering technologies deviating from above mentioned standard conditions (regarding peak
temperature, temperature gradient, temperature profile etc) additional classification and qualification tests
have to be agreed upon with Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of
adhesive strength between device and board.
Melexis is contributing to global environmental conservation by promoting lead free solutions. For more
information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of
the use of certain Hazardous Substances) please visit the quality page on our website:
http://www.melexis.com/quality.asp
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MLX91205
IMC Current Sensor (Triaxis™ Technology)
14 ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products. A
well designed (capacitors close to pins and low resistive ground layout) PCB layout will help to improve ESD
robustness.
15 Package Information
15.1 Package Dimensions
1.27 TYP
NOTES:
3.81
3.99**
4.80
4.98*
5.84
6.20**
1.40
1.55
1.55
1.73
0.35
0.49***
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All dimensions are in millimeters (anlges in degrees).
* Dimension does not include mold flash, protrusions or
gate burrs (shall not exceed 0.15 per side).
** Dimension does not include interleads flash or protrusion
(shall not exceed 0.25 per side).
*** Dimension does not include dambar protrusion.
Allowable dambar protrusion shall be 0.08 mm total in
excess of the dimension at maximum material condition.
Dambar cannot be located on the lower radius of the foot.
0.19
0.25
0.127
0.250
0°
8°
0.41
0.89
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MLX91205
IMC Current Sensor (Triaxis™ Technology)
15.2 Pinout and marking
15.3 Hall plate positioning
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MLX91205
IMC Current Sensor (Triaxis™ Technology)
16 Disclaimer
Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its
Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the
information set forth herein or regarding the freedom of the described devices from patent infringement.
Melexis reserves the right to change specifications and prices at any time and without notice. Therefore, prior
to designing this product into a system, it is necessary to check with Melexis for current information. This
product is intended for use in normal commercial applications. Applications requiring extended temperature
range, unusual environmental requirements, or high reliability applications, such as military, medical lifesupport or life-sustaining equipment are specifically not recommended without additional processing by
Melexis for each application.
The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be
liable to recipient or any third party for any damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential
damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical
data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis’ rendering
of technical or other services.
© 2005 Melexis NV. All rights reserved.
For the latest version of this document, go to our website at
www.melexis.com
Or for additional information contact Melexis Direct:
Europe, Africa, Asia:
Phone: +32 1367 0495
E-mail: [email protected]
America:
Phone: +1 603 223 2362
E-mail: [email protected]
ISO/TS 16949 and ISO14001 Certified
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