VISHAY HFA180NH40PBF

HFA180NH40PbF
Vishay High Power Products
HEXFRED®
Ultrafast Soft Recovery Diode, 180 A
FEATURES
• Very low Qrr and trr
• Lead (Pb)-free
• Designed and qualified for industrial level
Lug terminal
anode
RoHS
COMPLIANT
BENEFITS
• Reduced RFI and EMI
• Reduced snubbing
Base
cathode
HALF-PAK (D-67)
DESCRIPTION
HEXFRED® diodes are optimized to reduce losses and
EMI/RFI in high frequency power conditioning systems. An
extensive characterization of the recovery behavior for
different values of current, temperature and dI/dt simplifies
the calculations of losses in the operating conditions. The
softness of the recovery eliminates the need for a snubber in
most applications. These devices are ideally suited for
power converters, motors drives and other applications
where switching losses are significant portion of the total
losses.
PRODUCT SUMMARY
IF(AV)
180 A
VR
400 V
IF(DC) at TC
200 A at 100 °C
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
TEST CONDITIONS
MAX.
UNITS
400
V
Cathode to anode voltage
VR
Continuous forward current
IF
TC = 100 °C
200
Single pulse forward current
IFSM
Limited by junction temperature
1200
Non-repetitive avalanche energy
EAS
L = 100 µH, duty cycle limited by maximum TJ
1.4
TC = 25 °C
657
TC = 100 °C
263
Maximum power dissipation
Operating junction and storage
temperature range
PD
TC = 25 °C
395
TJ, TStg
A
mJ
W
- 55 to + 150
°C
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
Cathode to anode
breakdown voltage
SYMBOL
VBR
TEST CONDITIONS
IR = 100 µA
IF = 180 A
Maximum forward voltage
VFM
IF = 360 A
See fig. 1
IF = 180 A, TJ = 125 °C
Maximum reverse
leakage current
IRM
TJ = 125 °C, VR = 400 V
See fig. 2
Junction capacitance
CT
VR = 200 V
See fig. 3
Series inductance
LS
From top of terminal hole to mounting plane
Document Number: 94061
Revision: 01-Aug-08
For technical questions, contact: [email protected]
MIN.
TYP.
MAX.
UNITS
400
-
-
-
1.08
1.46
-
1.22
1.8
-
0.99
1.34
-
-
4
-
370
500
pF
-
6.0
-
nH
V
mA
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HFA180NH40PbF
Vishay High Power Products
HEXFRED®
Ultrafast Soft Recovery
Diode, 180 A
DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
Reverse recovery time
See fig. 5
trr
Peak recovery current
See fig. 6
IRRM
Reverse recovery charge
See fig. 7
Peak rate of recovery current
See fig. 8
Qrr
dI(rec)M/dt
TEST CONDITIONS
MIN.
TYP.
MAX.
TJ = 25 °C
-
90
140
TJ = 125 °C
-
280
440
TJ = 25 °C
IF = 135 A
dIF/dt = 200 A/µs
VR = 200 V
TJ = 125 °C
TJ = 25 °C
-
9
16
-
18
32
-
300
950
TJ = 125 °C
-
2650
6300
TJ = 25 °C
-
300
-
TJ = 125 °C
-
290
-
UNITS
ns
A
nC
A/µs
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
VALUES
UNITS
- 55 to 150
°C
Maximum junction and storage
temperature range
TJ, TStg
Maximum thermal resistance,
junction to case
RthJC
DC operation
See fig. 4
0.19
Typical thermal resistance,
case to heatsink
RthCS
Mounting surface, smooth and greased
0.05
Approximate weight
Mounting torque
Terminal torque
Case style
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2
°C/W
30
g
1.06
oz.
minimum
3 (26.5)
maximum
4 (35.4)
N·m
minimum
3.4 (30)
(lbf · in)
maximum
5 (44.2)
HALF-PAK module
For technical questions, contact: [email protected]
Document Number: 94061
Revision: 01-Aug-08
HFA180NH40PbF
140
100
TJ = 150 °C
TJ = 125 °C
TJ = 25 °C
10
120
100
DC
80
60
40
20
1
0
0
0.5
1.0
1.5
2.0
2.5
0
3.0
100
200
300
500
400
VFM - Forward Voltage Drop (V)
IF(AV) - DC Forward Current (A)
Fig. 1 - Maximum Forward Voltage Drop vs.
Instantaneous Forward Current
Fig. 4 - Maximum Allowable Case Temperature vs. DC
Forward Current
400
10
TJ = 150 °C
TJ = 125 °C
TJ = 25 °C
350
IF = 200 A
IF = 180 A
IF = 70 A
1
300
TJ = 125 °C
0.1
trr (ns)
IR - Reverse Current (µA)
Vishay High Power Products
160
1000
Maximum Allowable
Case Temperature (°C)
IF - Instantaneous Forward Current (A)
HEXFRED®
Ultrafast Soft Recovery
Diode, 180 A
0.01
250
200
150
100
TJ = 25 °C
0.001
50
0.0001
100
200
300
0
100
400
VR - Reverse Voltage (V)
dIF/dt (A/µs)
Fig. 2 - Typical Reverse Current vs.
Reverse Voltage
Fig. 5 - Typical Reverse Recovery Time vs. dIF/dt
80
10 000
70
TJ = 125 °C
TJ = 25 °C
60
IRRM (A)
CT - Junction Capacitance (pF)
1000
TJ = 25 °C
1000
50
40
IF = 200 A
IF = 180 A
IF = 70 A
30
20
10
100
1
10
100
1000
0
100
VR - Reverse Voltage (V)
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
Document Number: 94061
Revision: 01-Aug-08
1000
dIF/dt (A/µs)
Fig. 6 - - Typical Recovery Current vs. dIF/dt
For technical questions, contact: [email protected]
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HFA180NH40PbF
Vishay High Power Products
HEXFRED®
Ultrafast Soft Recovery
Diode, 180 A
6000
Qrr (nC)
4000
IF = 200 A
IF = 180 A
IF = 70 A
dI(rec)M/dt (A/µs)
5000
10 000
TJ = 125 °C
TJ = 25 °C
3000
2000
200 A
180 A
70 A
1000
1000
TJ = 125 °C
TJ = 25 °C
0
100
100
100
1000
1000
dIF/dt (A/µs)
dIF/dt (A/µs)
Fig. 7 - - Typical Stored Charge vs. dIF/dt
Fig. 8 - Typical dI(rec)M/dt vs. dIF/dt
ZthJC - Thermal Response
1
0.1
0.01
Single pulse
(thermal response)
0.001
0.00001
0.0001
D = 0.50
D = 0.33
D = 0.25
D = 0.17
D = 0.08
0.001
0.01
0.1
1
10
t1 - Rectangular Pulse Duration (s)
Fig. 9 - Maximum Thermal Impedance ZthJC Characteristics
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For technical questions, contact: [email protected]
Document Number: 94061
Revision: 01-Aug-08
HFA180NH40PbF
HEXFRED®
Ultrafast Soft Recovery
Diode, 180 A
Vishay High Power Products
VR = 200 V
0.01 Ω
L = 70 µH
D.U.T.
dIF/dt
adjust
D
IRFP250
G
S
Fig. 10 - Reverse Recovery Parameter Test Circuit
(3)
trr
IF
ta
tb
0
Qrr
(2)
IRRM
(4)
0.5 IRRM
dI(rec)M/dt (5)
0.75 IRRM
(1) dIF/dt
(4) Qrr - area under curve defined by trr
and IRRM
(1) dIF/dt - rate of change of current
through zero crossing
(2) IRRM - peak reverse recovery current
Qrr =
(3) trr - reverse recovery time measured
from zero crossing point of negative
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current.
trr x IRRM
2
(5) dI(rec)M/dt - peak rate of change of
current during tb portion of trr
Fig. 11 - Reverse Recovery Waveform and Definitions
L = 100 µH
High-speed
switch
D.U.T.
Rg = 25 Ω
Current
monitor
IL(PK)
Freewheel
diode
+
Decay
time
Vd = 50 V
V(AVAL)
VR(RATED)
Fig. 12 - Avalanche Test Circuit and Waveforms
Document Number: 94061
Revision: 01-Aug-08
For technical questions, contact: [email protected]
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5
HFA180NH40PbF
Vishay High Power Products
HEXFRED®
Ultrafast Soft Recovery
Diode, 180 A
ORDERING INFORMATION TABLE
Device code
HFA
180
N
H
40
PbF
1
2
3
4
5
6
1
- HEXFRED® family, electron irradiated
2
- Average current rating
3
- N = Not isolated
4
- H = HALF-PAK
5
- Voltage rating (400 V)
6
- Lead (Pb)-free
LINKS TO RELATED DOCUMENTS
Dimensions
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http://www.vishay.com/doc?95020
For technical questions, contact: [email protected]
Document Number: 94061
Revision: 01-Aug-08
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
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