VISHAY HFB25PB60

HFA25PB60
Vishay High Power Products
HEXFRED®
Ultrafast Soft Recovery Diode, 25 A
FEATURES
•
•
•
•
•
•
BENEFITS
Cathode
to base
•
•
•
•
•
4
2
1
Cathode
Ultrafast recovery
Ultrasoft recovery
Very low IRRM
Very low Qrr
Specified at operating conditions
Designed and qualified for industrial level
3
Anode
2
Reduced RFI and EMI
Reduced power loss in diode and switching transistor
Higher frequency operation
Reduced snubbing
Reduced parts count
DESCRIPTION
HFA25PB60 is a state of the art ultrafast recovery diode.
Employing the latest in epitaxial construction and advanced
processing techniques it features a superb combination of
characteristics which result in performance which is
unsurpassed by any rectifier previously available. With basic
ratings of 600 V and 25 A continuous current, the
HFA25PB60 is especially well suited for use as the
companion diode for IGBTs and MOSFETs. In addition to
ultrafast recovery time, the HEXFRED® product line features
extremely low values of peak recovery current (IRRM) and
does not exhibit any tendency to “snap-off” during the
tb portion of recovery. The HEXFRED features combine to
offer designers a rectifier with lower noise and significantly
lower switching losses in both the diode and the switching
transistor. These HEXFRED advantages can help to
significantly reduce snubbing, component count and
heatsink sizes. The HEXFRED HFA25PB60 is ideally suited
for applications in power supplies and power conversion
systems (such as inverters), motor drives, and many other
similar applications where high speed, high efficiency is
needed.
TO-247AC modified
PRODUCT SUMMARY
VR
600 V
VF at 25 A at 25 °C
1.7 V
IF(AV)
25 A
trr (typical)
23 ns
TJ (maximum)
150 °C
Qrr (typical)
112 nC
dI(rec)M/dt (typical)
250 A/µs
IRRM
10 A
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Cathode to anode voltage
TEST CONDITIONS
VR
Maximum continuous forward current
IF
TC = 100 °C
VALUES
UNITS
600
V
25
Single pulse forward current
IFSM
225
Maximum repetitive forward current
IFRM
100
Maximum power dissipation
PD
Operating junction and storage temperature range
Document Number: 93084
Revision: 30-Jul-08
TC = 25 °C
151
TC = 100 °C
60
TJ, TStg
For technical questions, contact: [email protected]
- 55 to + 150
A
W
°C
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HFA25PB60
Vishay High Power Products
HEXFRED®
Ultrafast Soft Recovery Diode, 25 A
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
TEST CONDITIONS
Cathode to anode
breakdown voltage
VBR
IR = 100 µA
Maximum forward voltage
VFM
IF = 50 A
IF = 25 A
See fig. 1
MIN.
TYP.
MAX.
600
-
-
-
1.3
1.7
-
1.5
2.0
UNITS
V
IF = 25 A, TJ = 125 °C
-
1.3
1.7
VR = VR rated
-
1.5
20
-
600
2000
-
55
100
pF
-
12
-
nH
UNITS
Maximum reverse
leakage current
IRM
Junction capacitance
CT
VR = 200 V
Series inductance
LS
Measured lead to lead 5 mm from package body
TJ = 125 °C, VR = 0.8 x VR rated
See fig. 2
See fig. 3
µA
DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER
Reverse recovery time
See fig. 5, 10
Peak recovery current
See fig. 6, 10
Reverse recovery charge
See fig. 7, 10
Peak rate of fall of recovery
current during tb
See fig. 8, 10
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
-
23
-
trr
IF = 1.0 A, dIF/dt = 200 A/µs, VR = 30 V
trr1
TJ = 25 °C
-
50
75
trr2
TJ = 125 °C
-
105
160
IRRM1
TJ = 25 °C
-
4.5
10
IRRM2
TJ = 125 °C
-
8.0
15
-
112
375
-
420
1200
IF = 25 A
dIF/dt = 200 A/µs
VR = 200 V
ns
A
Qrr1
TJ = 25 °C
Qrr2
TJ = 125 °C
dI(rec)M/dt1
TJ = 25 °C
-
250
-
dI(rec)M/dt2
TJ = 125 °C
-
160
-
MIN.
TYP.
MAX.
UNITS
-
-
300
°C
-
-
0.83
nC
A/µs
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
Lead temperature
Tlead
Thermal resistance,
junction to case
RthJC
Thermal resistance,
junction to ambient
RthJA
Typical socket mount
-
-
40
Thermal resistance,
case to heatsink
RthCS
Mounting surface, flat, smooth and greased
-
0.25
-
-
6.0
-
g
-
0.21
-
oz.
6.0
(5.0)
-
12
(10)
kgf · cm
(lbf · in)
0.063" from case (1.6 mm) for 10 s
Weight
Mounting torque
Marking device
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Case style TO-247AC modified (JEDEC)
For technical questions, contact: [email protected]
K/W
HFA25PB60
Document Number: 93084
Revision: 30-Jul-08
HFA25PB60
HEXFRED®
Vishay High Power Products
Ultrafast Soft Recovery Diode, 25 A
10000
T = 150°C
J
1000
100
TJ = 125°C
100
10
1
0.1
TJ = 150°C
TJ = 25°C
0.01
0
100
T = 125°C
200
300
400
Reverse Voltage - V
J
500
600
R (V)
T = 25°C
J
Fig. 2 - Typical Reverse Current vs.
Reverse Voltage
10
1000
A
TJ = 25°C
100
1
0.6
1.0
1.4
1.8
2.2
2.6
Forward Voltage Drop - V FM (V)
10
1
10
100
1000
Reverse Voltage - V R (V)
Fig. 1 - Maximum Forward Voltage Drop vs. Instantaneous
Forward Current
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
Thermal Response (Z thJC )
1
D = 0.50
0.20
0.1
0.01
0.00001
0.10
PDM
0.05
t1
0.02
0.01
t2
SINGLE PULSE
(THERMAL RESPONSE)
0.0001
Notes:
1. Duty factor D = t 1 / t 2
2. Peak TJ = P DM x Z thJC + TC
0.001
0.01
0.1
1
t1 , Rectangular Pulse Duration (sec)
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics
Document Number: 93084
Revision: 30-Jul-08
For technical questions, contact: [email protected]
www.vishay.com
3
HFA25PB60
Vishay High Power Products
HEXFRED®
Ultrafast Soft Recovery Diode, 25 A
1400
140
VR = 200V
TJ = 125°C
TJ = 25°C
I F = 50A
I F = 25A
120
1200
I F = 10A
I F = 50A
1000
100
I F = 25A
80
800
60
600
40
400
20
200
VR = 200V
TJ = 125°C
TJ = 25°C
0
100
I F = 10A
di f /dt - (A/µs)
1000
0
100
Fig. 5 - Typical Reverse Recovery Time vs. dIF/dt
30
di f /dt - (A/µs)
1000
Fig. 7 - Typical Stored Charge vs. dIF/dt
10000
VR = 200V
TJ = 125°C
TJ = 25°C
VR = 200V
TJ = 125°C
TJ = 25°C
25
I F = 50A
I F = 50A
IF = 25A
I F = 25A
20
I F = 10A
15
1000
IF = 10A
10
5
0
100
di f /dt - (A/µs)
1000
Fig. 6 - Typical Recovery Current vs. dIF/dt
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100
100
di f /dt - (A/µs)
1000
Fig. 8 - Typical dI(rec)M/dt vs. dIF/dt
For technical questions, contact: [email protected]
Document Number: 93084
Revision: 30-Jul-08
HFA25PB60
HEXFRED®
Vishay High Power Products
Ultrafast Soft Recovery Diode, 25 A
VR = 200 V
0.01 Ω
L = 70 µH
D.U.T.
dIF/dt
adjust
D
IRFP250
G
S
Fig. 9 - Reverse Recovery Parameter Test Circuit
(3)
trr
IF
ta
tb
0
Qrr
(2)
IRRM
(4)
0.5 IRRM
dI(rec)M/dt (5)
0.75 IRRM
(1) dIF/dt
(1) dIF/dt - rate of change of current
through zero crossing
(2) IRRM - peak reverse recovery current
(3) trr - reverse recovery time measured
from zero crossing point of negative
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current.
(4) Qrr - area under curve defined by trr
and IRRM
Qrr =
trr x IRRM
2
(5) dI(rec)M/dt - peak rate of change of
current during tb portion of trr
Fig. 10 - Reverse Recovery Waveform and Definitions
Document Number: 93084
Revision: 30-Jul-08
For technical questions, contact: [email protected]
www.vishay.com
5
HFA25PB60
Vishay High Power Products
HEXFRED®
Ultrafast Soft Recovery Diode, 25 A
ORDERING INFORMATION TABLE
Device code
HF
A
25
PB
60
-
1
2
3
4
5
6
1
-
HEXFRED® family
2
-
Process designator: A = Electron irradiated
B = Platinum diffused
3
-
Current rating (25 = 25 A)
4
-
Package outline (PB = TO-247, 2 pins)
5
-
Voltage rating (60 = 600 V)
6
-
None = Standard production
PbF = Lead (Pb)-free
LINKS TO RELATED DOCUMENTS
Dimensions
http://www.vishay.com/doc?95253
Part marking information
http://www.vishay.com/doc?95255
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For technical questions, contact: [email protected]
Document Number: 93084
Revision: 30-Jul-08
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
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