NTA4153N D

NTA4153N, NTE4153N,
NVA4153N, NVE4153N
Small Signal MOSFET
20 V, 915 mA, Single N−Channel
with ESD Protection, SC−75 and SC−89
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Features
•
•
•
•
•
Low RDS(on) Improving System Efficiency
Low Threshold Voltage, 1.5 V Rated
ESD Protected Gate
NV Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
Pb−Free Packages are Available
V(BR)DSS
RDS(on) TYP
ID MAX
0.127 W @ 4.5 V
0.170 W @ 2.5 V
20 V
915 mA
0.242 W @ 1.8 V
0.500 W @ 1.5 V
3
N−Channel MOSFET
Applications
•
•
•
•
Load/Power Switches
Power Supply Converter Circuits
Battery Management
Portables like Cell Phones, PDAs, Digital Cameras, Pagers, etc.
1
2
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Symbol
Value
Units
Drain−to−Source Voltage
VDSS
20
V
Gate−to−Source Voltage
VGS
±6.0
V
ID
915
mA
Parameter
Continuous Drain
Current (Note 1)
Steady
State
Power Dissipation
(Note 1)
Pulsed Drain Current
TA = 25°C
TA = 85°C
Steady State
tp =10 ms
3
1
SC−75 / SOT−416
CASE 463
2
STYLE 5
660
PD
300
mW
IDM
1.3
A
TJ,
TSTG
−55 to
150
°C
Continuous Source Current (Body Diode)
IS
280
mA
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
TL
260
°C
Operating Junction and Storage Temperature
MARKING DIAGRAM &
PIN ASSIGNMENT
3
SC−89
CASE 463C
2
1
3
Drain
XX MG
G
1
Gate
2
Source
XX
= Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
SC−75, SC−89
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Junction−to−Ambient − Steady State (Note 1)
SC−75 / SOT−416
SC−89
RqJA
Value
Units
°C/W
Gate
1
416
400
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Surface mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
3
Source
Drain
2
Top View
ORDERING INFORMATION
See detailed ordering and shipping information on page 4 of
this data sheet.
© Semiconductor Components Industries, LLC, 2014
December, 2014 − Rev. 7
1
Publication Order Number:
NTA4153N/D
NTA4153N, NTE4153N, NVA4153N, NVE4153N
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise stated)
Symbol
Test Condition
Min
Typ
Drain−to−Source Breakdown Voltage
V(BR)DSS
VGS = 0 V, ID = 250 mA
20
26
V
Drain−to−Source Breakdown Voltage
Temperature Coefficient
V(BR)DSS/TJ
18.4
mV/°C
Parameter
Max
Unit
OFF CHARACTERISTICS
Zero Gate Voltage Drain Current
IDSS
VGS = 0 V, VDS = 16 V
100
nA
Gate−to−Source Leakage Current
IGSS
VDS = 0 V, VGS = ±4.5 V
±1.0
mA
VGS(TH)
VGS = VDS, ID = 250 mA
1.1
V
ON CHARACTERISTICS (Note 2)
Gate Threshold Voltage
Negative Threshold Temperature
Coefficient
VGS(TH)/TJ
Drain−to−Source On Resistance
RDS(on)
Forward Transconductance
gFS
0.45
0.76
−2.15
mV/°C
VGS = 4.5 V, ID = 600 mA
127
230
VGS = 2.5 V, ID = 500 mA
170
275
VGS = 1.8 V, ID = 350 mA
242
700
VGS = 1.5 V, ID = 40 mA
500
950
VDS = 10 V, ID = 400 mA
1.4
S
110
pF
mW
CHARGES AND CAPACITANCES
CISS
Input Capacitance
VGS = 0 V, f = 1.0 MHz,
VDS = 16 V
Output Capacitance
COSS
Reverse Transfer Capacitance
CRSS
12
Total Gate Charge
QG(TOT)
1.82
Threshold Gate Charge
QG(TH)
0.2
Gate−to−Source Charge
QGS
Gate−to−Drain Charge
QGD
0.42
td(ON)
3.7
VGS = 4.5 V, VDS = 10 V,
ID = 0.2 A
16
nC
0.3
SWITCHING CHARACTERISTICS (Note 3)
Turn−On Delay Time
Rise Time
Turn−Off Delay Time
Fall Time
tr
td(OFF)
VGS = 4.5 V, VDD = 10 V,
ID = 0.2 A, RG = 10 W
tf
ns
4.4
25
7.6
DRAIN−SOURCE DIODE CHARACTERISTICS
Forward Diode Voltage
VSD
VGS = 0 V,
IS = 200 mA
TJ = 25°C
0.67
TJ = 125°C
0.54
1.1
V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Pulse Test: pulse width ≤ 300 ms, duty cycle ≤ 2%.
3. Switching characteristics are independent of operating junction temperatures.
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2
NTA4153N, NTE4153N, NVA4153N, NVE4153N
TYPICAL ELECTRICAL CHARACTERISTICS
1.2
1.2
VDS w 10 V
1.0
ID, DRAIN CURRENT (AMPS)
ID, DRAIN CURRENT (AMPS)
2.0 V
VGS = 2.6 V to 5.0 V
0.8
1.8 V
0.6
0.4
1.6 V
0.2
1.0
0.8
0.6
0.4
0.2
TJ = −55°C
1.4 V
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0
4.0
0.4
1.6
Figure 2. Transfer Characteristics
0.3
0.2
TJ = 125°C
TJ = 25°C
0.1
TJ = −55°C
0.1
0.2
0.3
0.4
0.5
0.6
0.7
2.0
0.4
VGS = 2.5 V
0.3
TJ = 125°C
0.2
TJ = 25°C
TJ = −55°C
0.1
0
0
0.1
0.2
ID, DRAIN CURRENT (AMPS)
0.3
0.4
0.5
0.6
0.7
ID, DRAIN CURRENT (AMPS)
Figure 4. On−Resistance vs. Drain Current and
Temperature
Figure 3. On−Resistance vs. Drain Current and
Temperature
1.6
200
ID = 0.35 A
VGS = 4.5 V
TJ = 25°C
VGS = 0 V
C, CAPACITANCE (pF)
RDS(on), DRAIN−TO−SOURCE
RESISTANCE (NORMALIZED)
1.2
Figure 1. On−Region Characteristics
VGS = 4.5 V
1.4
0.8
VGS, GATE−TO−SOURCE VOLTAGE (VOLTS)
0.4
0
0
0
VDS, DRAIN−TO−SOURCE VOLTAGE (VOLTS)
RDS(on), DRAIN−TO−SOURCE RESISTANCE (W)
RDS(on), DRAIN−TO−SOURCE RESISTANCE (W)
0
TJ = 25°C
TJ = 125°C
1.2
1.0
0.8
0.6
−50
160
CISS
120
80
COSS
40
−25
0
25
50
75
100
125
150
0
CRSS
0
TJ, JUNCTION TEMPERATURE (°C)
4
8
12
16
DRAIN−TO−SOURCE VOLTAGE (VOLTS)
Figure 5. On−Resistance Variation with
Temperature
Figure 6. Capacitance Variation
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3
20
NTA4153N, NTE4153N, NVA4153N, NVE4153N
0.6
5
QT
IS, SOURCE CURRENT (AMPS)
VGS, GATE−TO−SOURCE VOLTAGE (VOLTS)
TYPICAL ELECTRICAL CHARACTERISTICS
4
3
QGS
2
QGD
ID = 0.2 A
TA = 25°C
1
VGS = 0 V
0.5
0.4
0.3
TJ = 125°C
0.2
0.1
TJ = 25°C
0
0
0
0.4
0.8
1.2
1.6
QG, TOTAL GATE CHARGE (nC)
2.0
0
0.4
0.6
0.8
VSD, SOURCE−TO−DRAIN VOLTAGE (VOLTS)
Figure 8. Diode Forward Voltage vs. Current
Figure 7. Gate−to−Source Voltage vs. Total
Gate Charge
r(t), NORMALIZED TRANSIENT THERMAL RESISTANCE
0.2
1.0
D = 0.5
0.1
0.2
0.1
0.05
0.02
0.01
0.01
SINGLE PULSE
0.001
0.00001
0.0001
0.001
0.01
0.1
t, TIME (s)
1.0
10
100
1000
Figure 9. Normalized Thermal Response
ORDERING INFORMATION
Marking
Package
Shipping†
NTA4153NT1
TR
SC−75 / SOT−416
3000 / Tape & Reel
NTA4153NT1G
TR
SC−75 / SOT−416
(Pb−Free)
3000 / Tape & Reel
NTE4153NT1G
TP
SC−89
(Pb−Free)
3000 / Tape & Reel
NVA4153NT1G
VR
SC−75 / SOT−416
(Pb−Free)
3000 / Tape & Reel
NVE4153NT1G
VP
SC−89
(Pb−Free)
3000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
NTA4153N, NTE4153N, NVA4153N, NVE4153N
PACKAGE DIMENSIONS
SC−75/SOT−416
CASE 463
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
−E−
2
3
b 3 PL
0.20 (0.008)
e
DIM
A
A1
b
C
D
E
e
L
HE
−D−
1
M
D
HE
C
0.20 (0.008) E
STYLE 5:
PIN 1. GATE
2. SOURCE
3. DRAIN
A
L
MILLIMETERS
MIN
NOM MAX
0.70
0.80
0.90
0.00
0.05
0.10
0.15
0.20
0.30
0.10
0.15
0.25
1.55
1.60
1.65
0.70
0.80
0.90
1.00 BSC
0.10
0.15
0.20
1.50
1.60
1.70
A1
SOLDERING FOOTPRINT*
0.356
0.014
1.803
0.071
0.787
0.031
0.508
0.020
1.000
0.039
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
INCHES
NOM MAX
0.031 0.035
0.002 0.004
0.008 0.012
0.006 0.010
0.063 0.067
0.031 0.035
0.04 BSC
0.004 0.006 0.008
0.061 0.063 0.065
MIN
0.027
0.000
0.006
0.004
0.059
0.027
NTA4153N, NTE4153N, NVA4153N, NVE4153N
PACKAGE DIMENSIONS
SC−89
CASE 463C−03
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
4. 463C−01 OBSOLETE, NEW STANDARD 463C−02.
A
−X−
3
1
2
B −Y− S
K
DIM
A
B
C
D
G
H
J
K
L
M
N
S
G
2 PL
D
0.08 (0.003)
M
3 PL
X Y
N
M
C
J
−T−
MILLIMETERS
MIN
NOM MAX
1.50
1.60
1.70
0.75
0.85
0.95
0.60
0.70
0.80
0.23
0.28
0.33
0.50 BSC
0.53 REF
0.10
0.15
0.20
0.30
0.40
0.50
1.10 REF
−−−
−−−
10 _
−−−
−−−
10 _
1.50
1.60
1.70
INCHES
NOM MAX
0.063 0.067
0.034 0.040
0.028 0.031
0.011 0.013
0.020 BSC
0.021 REF
0.004 0.006 0.008
0.012 0.016 0.020
0.043 REF
−−−
−−−
10 _
−−−
−−−
10 _
0.059 0.063 0.067
MIN
0.059
0.030
0.024
0.009
SEATING
PLANE
SOLDERING FOOTPRINT*
0.53
0.020
1.10
0.043
0.53
0.020
1.00
0.039
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and the
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For additional information, please contact your local
Sales Representative
NTA4153N/D