TC4626/TC4627 Power CMOS Drivers With Voltage Tripler Features: General Description: • • • • • • The TC4626/TC4627 are single CMOS high-speed drivers with an on-board voltage boost circuit. These parts work with an input supply voltage from 4 to 6 volts. The internal voltage booster will produce a VBOOST potential up to 12 volts above VIN. This VBOOST is not regulated, so its voltage is dependent on the input VDD voltage and output drive loading requirements. An internal undervoltage lockout circuit keeps the output in a low state when VBOOST drops below 7.8 volts. Output is enabled when VBOOST is above 11.3 volts. Power Driver With On-Board Voltage Booster Low IDD: < 4 mA Small Package: 8-Pin PDIP Undervoltage Circuitry Fast Rise/Fall Time: <40 ns @1000 pF Below-Rail Input Protection Applications: • Raises 5V to drive higher – Vgs (ON) MOSFETs • Eliminates one system power supply Note: Check the Microchip web site for available package types and package information. Package Type PDIP/CERDIP C1- 8 VDD 1 C1+ 2 TC4626 C2 3 TC4627 GND 4 SOIC C1- 1 16 VDD 7 IN NC 2 6 VBOOST C1+ 3 NC 4 5 OUT C2 5 NC 6 15 NC 14 NC TC4626 13 IN TC4627 12 NC 11 VBOOST NC 7 GND 8 10 NC 9 OUT Functional Block Diagram EXT + C1 EXT + C2 C1+ C1- 2 (Unregulated 3 x VDD) 6 1 3 C2 VBOOST V = 2 x VDD EXT + C3 Voltage Booster UV LOCK Noninverting 4# 5 VDD I0 GND 8 Output Clock 7 Inverting 4# 4 NOTE: Pin numbers correspond to 8-pin package. 2001-2014 Microchip Technology Inc. DS20001426D-page 1 TC4626/TC4627 1.0 † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings† Supply Voltage ......................................................6.2V Input Voltage, Any Terminal ..................................... VS + 0.3V to GND – 0.3V Package Power Dissipation (TA 70°C) PDIP ........................................................730 mW CERDIP...................................................800 mW SOIC .......................................................760 mW Derating Factor PDIP .......5.6 mW/°C Above 36°C CERDIP...............................................6.0 mW/°C Operating Temperature Range (Ambient) C Version......................................... 0°C to +70°C E Version ......................................-40°C to +85°C M Version ...................................-55°C to +125°C Storage Temperature Range ..............-65°C to +150°C TC4626/TC4627 ELECTRICAL SPECIFICATIONS Electrical Characteristics: TA = +25°C, VDD= 5V, C1 = C2 = C3 10µF unless otherwise noted. Parameter Symbol Min. Typ. Max. Units Test Conditions Logic ‘1’, High Input Voltage VIH 2.4 — — V Logic ‘0’, Low Input Voltage VIL — — 0.8 V Input Current IIN -1 — +1 µA High Output Voltage VOH VBOOST – 0.025 — — V Low Output Voltage VOL — — 0.025 V Output Resistance, High RO — 10 15 Ω IOUT = 10 mA, VDD = 5V Output Resistance, Low RO — 8 10 Ω IOUT = 10 mA, VDD = 5V Peak Output Current IPK — 1.5 — A Rise Time tR — 33 40 ns Figure 3-1, Figure 3-2 Fall Time tF — 27 35 ns Figure 3-1, Figure 3-2 Delay Time tD1 — 35 45 ns Figure 3-1, Figure 3-2 Delay Time tD2 — 45 55 ns Figure 3-1, Figure 3-2 FMAX 1.0 — — MHz Voltage Tripler Output Source Resistance R3 — 300 400 Ω Voltage Doubler Output Source Resistance R2 — 120 200 Ω Oscillator Frequency FOSC 12 — 28 kHz Oscillator Amplitude Measured at C1- VOSC 4.5 — 10 V Input 0VVINVDRIVE Output Switching Time Maximum Switching Frequency VDD = 5V, VBOOST > 8.5V, Figure 3-1 Voltage Booster Undervoltage Threshold Start-Up Voltage DS20001426D-page 2 UV @VBOOST 7.0 7.8 8.5 V VSTART @VBOOST 10.5 11.3 12 V IL = 10mA, VDD = 5V RLOAD = 10 kΩ 2001-2014 Microchip Technology Inc. TC4626/TC4627 TC4626/TC4627 ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics: TA = +25°C, VDD= 5V, C1 = C2 = C3 10µF unless otherwise noted. Parameter @VDD = 5V Symbol Min. Typ. Max. Units VBOOST 14.6 — — V Test Conditions No Load Power Supply Power Supply Current IDD — — 2.5 mA Supply Voltage VDD 4.0 — 6.0 V Logic 1, High Input Voltage VIH 2.4 — — V Logic 0, Low Input Voltage VIL — — 0.8 V Input Current IIN -10 — 1 µA VIN = Low or High Input 0VVINVBOOST Output High Output Voltage VOH VDRIVE – 0.025 — — V Low Output Voltage VOL — — 0.025 V Output Resistance, High RO — 15 15 20 25 RO — 10 10 13 15 IPK — 1.5 — A Rise Time tR — — 55 ns Figure 3-1, Figure 3-2 Fall Time tF — — 50 ns Figure 3-1, Figure 3-2 Delay Time tD1 — — 60 ns Figure 3-1, Figure 3-2 Delay Time tD2 — — 70 ns Figure 3-1, Figure 3-2 FMAX 750 — — kHz Voltage Boost Output Source Resistance R3 — 400 500 Ω Voltage Doubler Output Source Resistance R2 — 170 300 Ω Oscillator Frequency FOSC 5 — 50 kHz Oscillator Amplitude Measured at C1- VOSC 4.5 — 10 V Output Resistance, Low Peak Output Current Ω IOUT = 10 mA, VDD = 5V C & E Version (TA = +70°C or +85°C) M Version (TA = +125°C) Ω IOUT = 10 mA, VDD = 5V C & E Version (TA = +70°C or +85°C) M Version (TA = +125°C) Switching Time Maximum Switching Frequency VDD = 5V, VBOOST > 8.5V, Figure 3-1 Voltage Booster UV @VBOOST 7.0 7.8 8.5 V VSTART @VBOOST 10.5 11.3 12 V VBOOST 14.6 — — V Power Supply Current IDD — — 4 mA Supply Voltage VDD 4.0 — 6.0 V Undervoltage Threshold Start-Up Voltage @VDD = 5V IL = 10 mA, VDD = 5V RLOAD = 10 kΩ No Load Power Supply 2001-2014 Microchip Technology Inc. VIN = Low or High DS20001426D-page 3 TC4626/TC4627 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: Pin No. (8-Pin PDIP, CERDIP) PIN FUNCTION TABLE Pin No. (16-Pin SOIC Wide) Symbol Description 1 1 C1- See Section 3.1 “Booster Function” for description 2 3 C1+ See Section 3.1 “Booster Function” for description See Section 3.1 “Booster Function” for description 3 5 C2 4 8 GND Ground. Output 5 9 OUT 6 11 VBOOST 7 13 IN Control Input 8 16 VDD Supply Input — 2, 4, 6, 7, 10, 12, 14, 15 NC Not connected. DS20001426D-page 4 See Section 3.1 “Booster Function” for description 2001-2014 Microchip Technology Inc. TC4626/TC4627 3.0 APPLICATIONS INFORMATION VBOOST VBOOST C3 10ȝF 0.1ȝF Ceramic C3 10ȝF 6 Input 6 7 2 C1 10ȝF 1 3 5 C1+ Output CL = 1000pF 7 2 C1 10ȝF 1 TC4626 C2 10ȝF 8 3 VDD = 5V 5 C1+ C2 TC4627 8 Input VDD = 5V 4 +5V 90% Output CL = 1000pF C1- C2 10ȝF 4 +5V 0V Input C1- C2 0.1ȝF Ceramic 90% Input 10% VBOOST tD1 tF tD2 0V tR VBOOST 90% 90% Output 0V tD1 90% 10% 10% Inverting Driver Switching 2001-2014 Microchip Technology Inc. 90% tD2 tF tR Output Input: 100kHz,square wave, tRISE = tFALL ≤ 10ns FIGURE 3-1: Time. 10% 10% 0V 10% Input: 100kHz,square wave, tRISE = tFALL ≤ 10ns FIGURE 3-2: Switching Time. Noninverting Driver DS20001426D-page 5 TC4626/TC4627 3.1 BOOSTER FUNCTION The voltage booster is an unregulated voltage tripler circuit. The tripler consists of three sets of internal switches and three external capacitors. S1a and S1b charge capacitor C1 to VDD potential. S2a and S2b add C1 potential to VDD input to charge C2 to 2 x VDD. S3a and S3b add C1 potential to C2 to charge C3 to 3 x VDD. The position of the switches is controlled by the internal four-phase clock. 6 3 x VDD, VBOOST 6 + C3 S3a 2 x VDD 3 + S2a C2 (4 to 6V) VDD S3b 8 S1a S2b 2 + C1 1 S1b GND 4 FIGURE 3-3: DS20001426D-page 6 Voltage Booster. 2001-2014 Microchip Technology Inc. TC4626/TC4627 Pin 1 CPF 2 Waveforms 3 x VDD 2 x VDD Pin 2 Voltage VDD 2 x VDD Pin 1 Voltage VDD 0 On S1 Off S2 On Off S3 On Off FIGURE 3-4: Position of Switches. 2001-2014 Microchip Technology Inc. DS20001426D-page 7 TC4626/TC4627 4.0 TYPICAL CHARACTERISTICS The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: TC4626 VOH vs. Frequency TC4626 VOH vs. Frequency 16 VS = 5V TA = -55°C 470pF 14 14 12 VOUT HI (Volts) VOUT HI (Volts) 12 10 2200pF 8 1000pF 6 10 8 6 2200pF 4 4 2 2 0 10 500 1,000 1,500 2,000 2,500 3,000 3,500 FREQUENCY (kHz) 500 1,000 1,500 2,000 2,500 3,000 3,500 FREQUENCY (kHz) Delay Time vs. Temperature TC4626 VOH vs. Frequency 100 14 VS = 5V TA = 125°C 12 10 80 470pF Time (nsec) VOUT HI (Volts) 1000pF 0 5 8 6 2200 pF 1000pF Input = 0-5V; TR& TF <10NS @ <20kHz VS = 4V CLOAD = 1000pF tD2 60 tD1 40 4 tRISE 20 2 0 5 tFALL 0 500 1,000 1,500 2,000 2,500 3,000 3,500 -40 -20 50 VS = 5V 40 30 20 60 80 100 120 VS = 6V 40 tD2 tD1 tFALL 40 CLOAD = 1000pF CLOAD = 1000pF Time (nsec) 50 20 Delay Time vs. Temperature Delay Time vs. Temperature 60 0 TEMPERATURE (°C) FREQUENCY (kHz) Time (nsec) VS = 5V TA = 25°C 470pF tD2 30 tD1 20 tRISE tFALL tRISE Input = 0-5V; TR & TF <10ns @ <20kHz 10 0 10 Input = 0-5V; TR & TF <10NS @ <20kHz 0 -40 -20 0 20 40 60 TEMPERATURE (°C) DS20001426D-page 8 80 100 120 -40 -20 0 20 40 60 80 100 120 TEMPERATURE (°C) 2001-2014 Microchip Technology Inc. TC4626/TC4627 TC4626 VOH vs. Frequency TC4626 VOH vs. Frequency 16 16 VS = 5V TA = 25°C 15 14 14 VOUT HI (Volts) VOUT HI (Volts) VS = 5V TA = -55°C 15 13 12 470pF 11 1,000pF 10 9 470pF 13 12 1,000pF 11 2,200pF 10 9 2,200pF 8 8 0 1 2 3 4 5 6 7 8 9 10 0 1 2 3 4 5 6 7 8 9 10 FREQUENCY x 100 kHz FREQUENCY x 100 kHz TC4626 VOH vs. Frequency 16 VS = 5V TA = 125°C 15 VOUT HI (Volts) 14 13 12 11 470pF 10 1,000pF 9 2,200pF 8 0 1 2 3 4 5 6 7 8 9 10 FREQUENCY x 100 kHz 2001-2014 Microchip Technology Inc. DS20001426D-page 9 TC4626/TC4627 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 8-Lead CERDIP (.300”) (TC4627 Only) Example XXXXXXXX XXXXXNNN TC4627 MJA e^^256 3 1423 YYWW 8-Lead PDIP (300 mil) Example XXXXXXXX XXXXXNNN TC4626 CPA e^^256 3 1423 YYWW TC4627EOE e^^ 3 1423256 e3 * Note: DS20001426D-page 10 TC4626 EPA e^^256 3 1423 Example 16-Lead SOIC (7.50 mm) Legend: XX...X Y YY WW NNN OR OR TC4627COE e^^ 3 1423256 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2001-2014 Microchip Technology Inc. TC4626/TC4627 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2001-2014 Microchip Technology Inc. DS20001426D-page 11 TC4626/TC4627 /HDG3ODVWLF'XDO,Q/LQH3$PLO%RG\>3',3@ 1RWH For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A N B E1 NOTE 1 1 2 TOP VIEW E C A2 A 3/$1( L c A1 e eB 8X b1 8X b .010 C SIDE VIEW END VIEW Microchip Technology Drawing No. C04-018D Sheet 1 of 2 DS20001426D-page 12 2001-2014 Microchip Technology Inc. TC4626/TC4627 /HDG3ODVWLF'XDO,Q/LQH3$PLO%RG\>3',3@ 1RWH For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging ALTERNATE LEAD DESIGN (VENDOR DEPENDENT) DATUM A DATUM A b b e 2 e 2 e Units Dimension Limits Number of Pins N e Pitch Top to Seating Plane A Molded Package Thickness A2 Base to Seating Plane A1 Shoulder to Shoulder Width E Molded Package Width E1 Overall Length D Tip to Seating Plane L c Lead Thickness Upper Lead Width b1 b Lower Lead Width Overall Row Spacing eB § e MIN .115 .015 .290 .240 .348 .115 .008 .040 .014 - INCHES NOM 8 .100 BSC .130 .310 .250 .365 .130 .010 .060 .018 - MAX .210 .195 .325 .280 .400 .150 .015 .070 .022 .430 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing No. C04-018D Sheet 2 of 2 2001-2014 Microchip Technology Inc. DS20001426D-page 13 TC4626/TC4627 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001426D-page 14 2001-2014 Microchip Technology Inc. TC4626/TC4627 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2001-2014 Microchip Technology Inc. DS20001426D-page 15 TC4626/TC4627 /HDG3ODVWLF6PDOO2XWOLQH2(±:LGHPP%RG\>62,&@/DQG3DWWHUQ 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ DS20001426D-page 16 2001-2014 Microchip Technology Inc. TC4626/TC4627 APPENDIX A: REVISION HISTORY Revision D (July 2014) The following is the list of modifications: • Restructured Table 2-1 for readability purposes. • Updated package specification drawings in Section 5.0, Packaging Information to match all views available. • Added new Product Identification System. Revision C (December 2012) Added a note to each package outline drawing. 2001-2014 Microchip Technology Inc. DS20001426D-page 17 TC4626/TC4627 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device – X /XX Temperature Range Package Device: TC4626: TC4627: Temperature Range: C E Package: JA = a) TC4626CPA: b) TC4626EPA: High-Speed Inverting Single CMOS Driver, 0C to +70C. High-Speed Inverting Single CMOS Driver, -40C to +85C. = 0C to +70C = -40C to +85C OE = PA = DS20001426D-page 18 Single CMOS High-Speed Driver, Inverting Single CMOS High-Speed Driver, Non-Inverting Examples: 8-Lead Ceramic Dual In-Line, 300" Body (CERDIP) (TC4627 only) 16-Lead Plastic Small Outline, Wide, 7.50 mm Body (SOIC) 8-Lead Plastic Dual In-Line, 300 mil Body (PDIP) 2001-2014 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2001-2014, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-63276-380-8 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2001-2014 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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