TC4426A/TC4427A/TC4428A
1.5A Dual High-Speed Power MOSFET Drivers
Features:
General Description:
• High Peak Output Current: 1.5A
• Wide Input Supply Voltage Operating Range:
- 4.5V to 18V
• High Capacitive Load Drive Capability: 1000 pF in
25 ns (typical)
• Short Delay Times: 30 ns (typical)
• Matched Rise, Fall and Delay Times
• Low Supply Current:
- With Logic ‘1’ Input – 1 mA (typical)
- With Logic ‘0’ Input – 100 µA (typical)
• Low Output Impedance: 7(typical)
• Latch-Up Protected: Will Withstand 0.5A Reverse
Current
• Input Withstands Negative Inputs Up to 5V
• Electrostatic Discharge (ESD) Protected: 2 kV
• Pin-compatible with TC426/TC427/TC428 and
TC4426/TC4427/TC4428
• Space-saving 8-Pin MSOP and 8-Pin 6x5 DFN-S
Packages
The TC4426A/TC4427A/TC4428A are improved
versions of the earlier TC4426/TC4427/TC4428 family
of MOSFET drivers. In addition to matched rise and fall
times, the TC4426A/TC4427A/TC4428A devices have
matched leading and falling edge propagation delay
times.
These devices are highly latch-up resistant under any
conditions within their power and voltage ratings. They
are not subject to damage when up to 5V of noise
spiking (of either polarity) occurs on the Ground pin.
They can accept, without damage or logic upset, up to
500 mA of reverse current (of either polarity) being
forced back into their outputs. All terminals are fully
protected against Electrostatic Discharge (ESD) up
to 2 kV.
The TC4426A/TC4427A/TC4428A MOSFET drivers
can
easily
charge/discharge
1000 pF
gate
capacitances in under 30 ns. These devices provide
low enough impedances in both the On and Off states
to ensure the MOSFET’s intended state will not be
affected, even by large transients.
Applications:
• Switch Mode Power Supplies
• Line Drivers
• Pulse Transformer Drive
Package Types
8-Pin MSOP/
PDIP/SOIC TC4426A
NC
IN A
GND
IN B
1
2
3
4
8
7
6
5
NC
OUT A
VDD
OUT B
TC4427A
NC
OUT A
VDD
OUT B
TC4428A
NC
OUT A
VDD
OUT B
8-Pin 6x5 DFN-S*
NC 1
IN A 2
GND 3
IN B 4
EP
9
TC4426A
TC4427A
TC4428A
8
NC
NC
NC
7
OUT A
OUT A
OUT A
6
5
VDD
VDD
VDD
OUT B
OUT B
OUT B
* Includes Exposed Thermal Pad (EP); see Table 3-1.
2002-2014 Microchip Technology Inc.
DS20001423J-page 1
TC4426A/TC4427A/TC4428A
Functional Block Diagram
VDD
Inverting
500 A
300 mV
Output
Non-Inverting
Input
Effective
Input C = 12 pF
(Each Input)
GND
4.7V
TC4426A/TC4427A/TC4428A
Note 1: TC4426A has two inverting drivers, while the TC4427A has two non-inverting
drivers. The TC4428A has one inverting and one non-inverting driver.
2: Ground any unused driver input.
DS20001423J-page 2
2002-2014 Microchip Technology Inc.
TC4426A/TC4427A/TC4428A
1.0
ELECTRICAL
CHARACTERISTICS
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only and functional operation of the
device at these or any other conditions above those indicated
in the operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
Absolute Maximum Ratings†
Supply Voltage ................................................................+22V
Input Voltage, IN A or IN B .......... (VDD + 0.3V) to (GND – 5V)
Package Power Dissipation (TA +70°C)
DFN-S ..................................................................... Note 2
MSOP .....................................................................340 mW
PDIP .......................................................................730 mW
SOIC.......................................................................470 mW
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V VDD 18V.
Parameters
Sym.
Min.
Typ.
Max.
Units
Logic ‘1’, High Input
Voltage
VIH
2.4
—
—
V
Logic ‘0’, Low Input Voltage
VIL
—
—
0.8
V
Input Current
IIN
–1.0
—
+1.0
µA
–10
—
+10
Conditions
Input
0V VIN VDD
Output
High Output Voltage
VOH
VDD – 0.025
—
—
V
DC Test
Low Output Voltage
VOL
—
—
0.025
V
DC Test
Output Resistance
RO
—
7
9
—
7
10
IOUT = 10 mA, VDD = 18V, TA = +25°C
0°C TA +70°C
—
8
11
-40°C TA +85°C
—
8
12
-40°C TA +125°C
Peak Output Current
IPK
—
1.5
—
A
VDD = 18V
Latch-Up Protection
Withstand Reverse Current
IREV
—
> 0.5
—
A
Duty cycle 2%, t 300 µs
VDD = 18V
tR
—
25
35
ns
TA = +25°C
—
27
40
0°C TA +70°C
—
29
40
-40°C TA +85°C
—
30
40
—
25
35
—
27
40
0°C TA +70°C
—
29
40
-40°C TA +85°C
—
30
40
—
30
35
—
33
40
0°C TA +70°C
—
35
45
-40°C TA +85°C
—
38
50
-40°C TA +125°C, Figure 4-1
Switching Time (Note 1)
Rise Time
Fall Time
tF
Delay Time
Note 1:
2:
tD1
-40°C TA +125°C, Figure 4-1
ns
TA = +25°C
-40°C TA +125°C, Figure 4-1
ns
TA = +25°C
Switching times ensured by design.
Package power dissipation is dependent on the copper pad area on the PCB.
2002-2014 Microchip Technology Inc.
DS20001423J-page 3
TC4426A/TC4427A/TC4428A
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V VDD 18V.
Parameters
Sym.
Min.
Typ.
Max.
Units
tD2
—
30
35
ns
—
33
40
0°C TA +70°C
—
35
45
-40°C TA +85°C
—
38
50
-40°C TA +125°C, Figure 4-1
Delay Time
Conditions
TA = +25°C
Power Supply
Power Supply Current
Note 1:
2:
IS
—
1.0
2.0
—
0.1
0.2
mA
VIN = 3V (Both inputs)
VIN = 0V (Both inputs), VDD = 18V
Switching times ensured by design.
Package power dissipation is dependent on the copper pad area on the PCB.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V VDD 18V.
Parameters
Sym.
Min.
Typ.
Max.
Units
TA
0
—
+70
°C
Specified Temperature Range (E)
TA
-40
—
+85
°C
Specified Temperature Range (V)
TA
-40
—
+125
°C
Conditions
Temperature Ranges
Specified Temperature Range (C)
Maximum Junction Temperature
TJ
—
—
+150
°C
Storage Temperature Range
TA
-65
—
+150
°C
Thermal Resistance, 8L-6x5 DFN-S
JA
—
35.7
—
°C/W
Thermal Resistance, 8L-MSOP
JA
—
211
—
°C/W
Thermal Resistance, 8L-PDIP
JA
—
89.3
—
°C/W
Thermal Resistance, 8L-SOIC
JA
—
149.5
—
°C/W
Package Thermal Resistances
DS20001423J-page 4
2002-2014 Microchip Technology Inc.
TC4426A/TC4427A/TC4428A
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, over operating temperature range with 4.5V VDD 18V.
100
CL = 1500 pF
CL = 1000 pF
CL = 470 pF
60
40
20
0
5.0
7.5
10.0
FIGURE 2-1:
Voltage.
40
CL= 100pF
CL = 100 pF
0
5.0
7.5
12.5
VDD (V)
60
50
40
30
20
17.5
10.0
FIGURE 2-4:
Voltage.
Rise Time vs. Supply
12.5
VDD (V)
15.0
17.5
Fall Time vs. Supply
60
tD1
100
90
80
70
15.0
CL = 1000 pF
VDD = 10V
55
Delay Time (nsec)
Delay Time (nsec)
110
tD2
CL = 1000 pF
tD1
50
45
tD2
40
35
30
25
20
1
2
3
FIGURE 2-2:
Amplitude.
4
5
6
7
Input Amplitude (V)
8
0
9
5
FIGURE 2-5:
Supply Voltage.
Delay Time vs. Input
10
VDD (V)
15
20
Propagation Delay Time vs.
40
28
CL = 1000 pF
VDD = 18V
Delay Time (nsec)
Time (nsec)
CL = 1500 pF
CL = 1000 pF
CL = 470 pF
60
20
CL = 100 pF
26
TA = +25°C
CL == 2200
2200pF
C
pF
L
80
tFALL (nsec)
tRISE (nsec)
80
100
TA = +25°C
CL = 2200 pF
24
22
20
18
16
14
-100
tRISE
tFALL
-50
0
50
100
150
35
CL = 1000 pF
VDD = 18V
30
25
tD2
20
tD1
15
-100
TEMPERATURE (°C)
FIGURE 2-3:
Temperature.
Rise and Fall Times vs.
2002-2014 Microchip Technology Inc.
-50
0
50
100
150
TEMPERATURE (°C)
FIGURE 2-6:
Temperature.
Propagation Delay Time vs.
DS20001423J-page 5
TC4426A/TC4427A/TC4428A
Note: Unless otherwise indicated, over operating temperature range with 4.5V VDD 18V.
30
30
TA = +125°C
20
25
RDS(ON) (Ω)
RDS(ON) (Ω)
25
TA = +25°C
15
10
15
TA = +25°C
10
5
5
0
0
5
FIGURE 2-7:
Resistance.
60
10
VDD (V)
15
20
FIGURE 2-10:
Resistance.
High-State Output
CL = 2200 pF
50
40
CL = 1500 pF
CL = 1000 pF
15
2 MHz
VDD = 18V
900 kHz
50
CL = 100 pF
30
20
10
20
Low-State Output
60
VDD = 18V
10
VDD (V)
5
0
ISUPPLY (mA)
0
ISUPPLY (mA)
TA = +125°C
20
40
600 kHz
30
20
200 kHz
10
20 kHz
0
0
0
500
1000
1500
2000
0
2500
500
1000
1500
CLOAD (pF)
FREQUENCY (kHz)
80
ISUPPLY (mA)
CL = 1500 pF
50
CL = 1000 pF
40
30
CL = 100 pF
20
50
40
0
1500
2000
2500
600 kHz
20
10
1000
900 kHz
30
0
500
2 MHz
60
10
0
200 kHz
20 kHz
0
1000
500
FREQUENCY (kHz)
FIGURE 2-9:
Frequency.
DS20001423J-page 6
Supply Current vs.
Supply Current vs.
VDD = 12V
70
60
2500
80
CL = 2200 pF
VDD = 12V
70
FIGURE 2-11:
Capacitive Load.
Supply Current vs.
ISUPPLY (mA)
FIGURE 2-8:
Frequency.
2000
FIGURE 2-12:
Capacitive Load.
1500
CLOAD (pF)
2000
2500
Supply Current vs.
2002-2014 Microchip Technology Inc.
TC4426A/TC4427A/TC4428A
Note: Unless otherwise indicated, over operating temperature range with 4.5V VDD 18V.
40
40
VDD = 6V
CL = 2200 pF
30
CL = 1500 pF
25
CL = 1000 pF
20
15
CL = 100 pF
10
VDD = 6V
35
ISUPPLY (mA)
ISUPPLY (mA)
35
5
0
2 MHz
30
25
20
900 kHz
15
600 kHz
10
200 kHz
20 kHz
5
0
0
500
1000
1500
2000
0
2500
500
FREQUENCY (kHz)
FIGURE 2-15:
Capacitive Load.
Supply Current vs.
900
800 BOTH INPUTS = 1
700
IQUIESCENT (µA)
IQUIESCENT (µA)
FIGURE 2-13:
Frequency.
TA = 25°C
600
500
400
300
200
BOTH INPUTS = 0
100
0
0
5
10
15
20
Quiescent Supply Current
2002-2014 Microchip Technology Inc.
1500
CLOAD (pF)
2000
2500
Supply Current vs.
1100
1000
900 BOTH INPUTS = 1
800
700
600
500
400
300
200 BOTH INPUTS = 0
100
0
-100
-50
0
VDD = 18V
50
100
150
TEMPERATURE (°C)
VDD (V)
FIGURE 2-14:
vs. Voltage.
1000
FIGURE 2-16:
vs. Temperature.
Quiescent Supply Current
DS20001423J-page 7
TC4426A/TC4427A/TC4428A
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE (Note 1)
PDIP, MSOP, SOIC
6x5 DFN-S
Symbol
1
1
NC
Note 1:
3.1
2
IN A
Input A
3
3
GND
Ground
4
4
IN B
5
5
OUT B
6
6
VDD
7
7
OUT A
8
8
NC
No connection
—
9
EP
Exposed Metal Pad
Input B
Output B
Supply input
Output A
Duplicate pins must be connected for proper operation.
Inputs A and B (IN A, IN B)
3.4
Supply Input (VDD)
The VDD input is the bias supply for the MOSFET driver
and is rated for 4.5V to 18V, with respect to the ground
pin. The VDD input should be bypassed with local
ceramic capacitors. The value of these capacitors
should be chosen based on the capacitive load that is
being driven.
Ground (GND)
The Ground pin is the return path for both the bias
current and the high-peak current that discharges the
external load capacitance. The Ground pin should be
tied into a ground plane or have a very short trace to the
bias supply source return.
3.3
No connection
2
MOSFET driver inputs A and B are high-impedance,
TTL/CMOS compatible inputs. These inputs also have
300 mV of hysteresis between the high and low
thresholds that prevents output glitching, even when
the rise and fall time of the input signal is very slow.
3.2
Description
3.5
Exposed Metal Pad (EP)
The exposed metal pad of the 6x5 DFN-S package is
not internally connected to any potential. Therefore,
this pad can be connected to a ground plane or other
copper plane on a printed circuit board, to aid in heat
removal from the package.
Output A and B (OUT A, OUT B)
MOSFET driver outputs A and B are low-impedance,
CMOS push-pull style outputs. The pull-down and
pull-up devices are of equal strength, making the rise
and fall times equivalent.
DS20001423J-page 8
2002-2014 Microchip Technology Inc.
TC4426A/TC4427A/TC4428A
4.0
APPLICATIONS INFORMATION
+5V
90%
Input
VDD = 18V
0V
4.7 µF
0.1 µF
Input
tD1
7
VDD
tR
90%
90%
Output
5
10%
10%
0V
Inverting Driver
(TC4426A, ½ TC4428A)
CL = 1000 pF
4
tD2
tF
Output
6
2
10%
+5V
90%
Input
3
Input: 100 kHz,
square wave,
tRISE = tFALL 10 ns
0V
VDD
10%
tD190%
tR
Output
0V
tD2
10%
90%
tF
10%
Non-Inverting Driver
(TC4427A, ½ TC4428A)
FIGURE 4-1:
Switching Time Test Circuit.
2002-2014 Microchip Technology Inc.
DS20001423J-page 9
TC4426A/TC4427A/TC4428A
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
8-Lead DFN-S (6x5x0.9 mm)
NNN
PIN 1
Example
TC4426A
EMF e
^^3
1330
256
PIN 1
8-Lead MSOP (3x3 mm)
Example
4426AE
330256
8-Lead PDIP (300 mil)
XXXXXXXX
XXXXXNNN
YYWW
8-Lead SOIC (3.90 mm)
NNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
DS20001423J-page 10
Example
TC4427A
EPA e^^3 256
1330
Example
TC2248AC
OA e^^3 330
256
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2002-2014 Microchip Technology Inc.
TC4426A/TC4427A/TC4428A
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D
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b
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K
E2
E
EXPOSED PAD
NOTE 1
1
2
2
NOTE 1
1
D2
BOTTOM VIEW
TOP VIEW
A
A3
A1
NOTE 2
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2002-2014 Microchip Technology Inc.
DS20001423J-page 11
TC4426A/TC4427A/TC4428A
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DS20001423J-page 12
2002-2014 Microchip Technology Inc.
TC4426A/TC4427A/TC4428A
8$
1RWH
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2002-2014 Microchip Technology Inc.
DS20001423J-page 13
TC4426A/TC4427A/TC4428A
UA
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20001423J-page 14
2002-2014 Microchip Technology Inc.
TC4426A/TC4427A/TC4428A
8-Lead Plastic Micro Small Outline Package (UA) [MSOP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2002-2014 Microchip Technology Inc.
DS20001423J-page 15
TC4426A/TC4427A/TC4428A
/HDG3ODVWLF'XDO,Q/LQH3$PLO%RG\>3',3@
1RWH
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
N
B
E1
NOTE 1
1
2
TOP VIEW
E
C
A2
A
3/$1(
L
c
A1
e
eB
8X b1
8X b
.010
C
SIDE VIEW
END VIEW
Microchip Technology Drawing No. C04-018D Sheet 1 of 2
DS20001423J-page 16
2002-2014 Microchip Technology Inc.
TC4426A/TC4427A/TC4428A
/HDG3ODVWLF'XDO,Q/LQH3$PLO%RG\>3',3@
1RWH
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
ALTERNATE LEAD DESIGN
(VENDOR DEPENDENT)
DATUM A
DATUM A
b
b
e
2
e
2
e
Units
Dimension Limits
Number of Pins
N
e
Pitch
Top to Seating Plane
A
Molded Package Thickness
A2
Base to Seating Plane
A1
Shoulder to Shoulder Width
E
Molded Package Width
E1
Overall Length
D
Tip to Seating Plane
L
c
Lead Thickness
Upper Lead Width
b1
b
Lower Lead Width
Overall Row Spacing
eB
§
e
MIN
.115
.015
.290
.240
.348
.115
.008
.040
.014
-
INCHES
NOM
8
.100 BSC
.130
.310
.250
.365
.130
.010
.060
.018
-
MAX
.210
.195
.325
.280
.400
.150
.015
.070
.022
.430
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing No. C04-018D Sheet 2 of 2
2002-2014 Microchip Technology Inc.
DS20001423J-page 17
TC4426A/TC4427A/TC4428A
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20001423J-page 18
2002-2014 Microchip Technology Inc.
TC4426A/TC4427A/TC4428A
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2002-2014 Microchip Technology Inc.
DS20001423J-page 19
TC4426A/TC4427A/TC4428A
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DS20001423J-page 20
2002-2014 Microchip Technology Inc.
TC4426A/TC4427A/TC4428A
APPENDIX A:
REVISION HISTORY
Revision J (July 2014)
The following is the list of modifications:
1.
Updated Figure 4-1.
Revision H (September 2013)
The following is the list of modifications:
1.
2.
3.
Changed ESD protection value to 2 kV on the
Features page.
Updated the package specification drawings in
Section 5.0 “Packaging Information”, to
show all views available.
Minor typographical corrections.
2002-2014 Microchip Technology Inc.
DS20001423J-page 21
TC4426A/TC4427A/TC4428A
NOTES:
DS20001423J-page 22
2002-2014 Microchip Technology Inc.
TC4426A/TC4427A/TC4428A
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X
Temperature
Range
XX
XXX
X
Package
Tape & Reel
PB Free
Examples:
a) TC4426ACOA:
b) TC4426AEOA:
Device:
Temperature Range:
Package:
TC4426A: 1.5A Dual MOSFET Driver, Inverting
TC4427A: 1.5A Dual MOSFET Driver, Non-Inverting
TC4428A: 1.5A Dual MOSFET Driver, Complementary
C
E
V
= 0°C to +70°C (PDIP & SOIC Only)
= -40°C to +85°C
= -40ºC to +125°C
MF
= Dual, Flat, No-Lead (6X5 mm Body), 8-lead
MF713 = Dual, Flat, No-Lead (6X5 mm Body), 8-lead
(Tape and Reel)
OA
= Plastic SOIC, (150 mil Body), 8-lead
OA713 = Plastic SOIC, (150 mil Body), 8-lead
(Tape and Reel)
PA
= Plastic DIP (300 mil Body), 8-lead
UA
= Plastic Micro Small Outline (MSOP), 8-lead
UA713 = Plastic Micro Small Outline (MSOP), 8-lead
(Tape and Reel)
c) TC4426AEMF:
a) TC4427ACPA:
b) TC4427AEPA:
c) TC4427AVMF713:
a) TC4428AEPA:
b) TC4428ACOA713:
c) TC4428AVMF:
2002-2014 Microchip Technology Inc.
1.5A Dual Inverting
MOSFET driver,
0°C to +70°C,
8LD SOIC package.
1.5A Dual Inverting
MOSFET driver,
-40°C to +85°C,
8LD SOIC package.
1.5A Dual Inverting
MOSFET driver,
-40°C to +85°C,
8LD DFN-S package.
1.5A Dual Non-Inverting
MOSFET driver,
0°C to +70°C,
8LD PDIP package.
1.5A Dual Non-Inverting
MOSFET driver,
-40°C to +85°C,
8LD PDIP package.
1.5A Dual Non-Inverting
MOSFET driver,
-40°C to +125°C,
8LD DFN-S package,
Tape and Reel.
1.5A Dual Complementary
MOSFET driver,
-40°C to +85°C,
8LD PDIP package.
1.5A Dual Complementary
MOSFET driver,
0°C to +70°C
8LD SOIC package,
Tape and Reel.
1.5A Dual Complementary
MOSFET driver,
-40°C to +125°C,
8LD DFN-S package.
DS20001423J-page 23
TC4426A/TC4427A/TC4428A
NOTES:
DS20001423J-page 24
2002-2014 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2002-2014, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN: 978-1-63276-361-7
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
2002-2014 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS20001423J-page 25
Worldwide Sales and Service
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DS20001423J-page 26
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03/25/14
2002-2014 Microchip Technology Inc.