TC4404 DATA SHEET (04/12/2016) DOWNLOAD

TC4404/TC4405
1.5A Dual Open-Drain MOSFET Drivers
Features
General Description
•
•
•
•
•
•
The TC4404/TC4405 are CMOS buffer-drivers
constructed with complementary MOS outputs, where
the drains of the totem-pole output have been left
separated so that individual connections can be made
to the pull-up and pull-down sections of the output. This
allows the insertion of drain-current-limiting resistors in
the pull-up and/or pull-down sections, allowing the user
to define the rates of rise and fall for a capacitive load.
It also enables a reduced output swing, if driving a
resistive load, or limiting base current when driving a
bipolar transistor. Minimum rise and fall times, with no
resistors, will be less than 30 ns for a 1000 pF load.
Independently Programmable Rise and Fall Times
Low Output Impedance: 7 Typical
High Speed tR, tF: <30 ns with 1000 pF Load
Short Delay Times: <30 ns
Wide Operating Range: 4.5V to 18V
Latch-Up Protected: withstands > 500 mA
Reverse Current (Either Polarity)
• Input Withstands Negative Swings up to -5V
Applications
•
•
•
•
Motor Controls
Driving Bipolar Transistors
Driver for Non-Overlapping Totem Poles
Reach-Up/Reach-Down Driver
TABLE 1:
DEVICE SELECTION TABLE
Part Number
Package
Temp. Range
TC4404COA
8-Lead SOIC
0°C to +70°C
TC4404CPA
8-Lead PDIP
0°C to +70°C
TC4404EOA
8-Lead SOIC
-40°C to +85°C
TC4404EPA
8-Lead PDIP
-40°C to +85°C
TC4405COA
8-Lead SOIC
0°C to +70°C
TC4405CPA
8-Lead PDIP
0°C to +70°C
TC4405EOA
8-Lead SOIC
-40°C to +85°C
TC4405EPA
8-Lead PDIP
-40°C to +85°C
For driving MOSFETs in motor-control applications,
where slow-ON/fast-OFF operation is desired, these
devices are superior to the previously used technique
of adding a diode-resistor combination between the
driver output and the MOSFET, because they allow
accurate control of turn-on, while maintaining fast
turn-off and maximum noise immunity for an OFF
device.
When used to drive bipolar transistors, these drivers
maintain the high speeds common to other Microchip
drivers. They allow insertion of a base current-limiting
resistor, while providing a separate half-output for fast
turn-off. By proper positioning of the resistor, either
NPN or PNP transistors can be driven.
For driving many loads in low-power regimes, these
drivers require significantly less power at higher
frequencies and can be helpful in meeting low-power
budgets as they eliminate shoot-through currents in the
output stage.
Package Type
8-Lead PDIP/SOIC
VDD
1
IN A 2
TC4404
8
A TOP
VDD
7
A BOTTOM
IN A 2
1
3
6
B TOP
IN B
GND 4
5
B BOTTOM
GND 4
IN B
 2002-2016 Microchip Technology Inc.
3
TC4405
8
A TOP
7
A BOTTOM
6
B TOP
5
B BOTTOM
DS20001418E-page 1
TC4404/TC4405
Because neither drain in an output is dependent on the
other, these devices can also be used as open-drain
buffer/drivers where both drains are available in one
device, thus minimizing chip count. Unused open
drains should be returned to the supply rail so that their
device sources are connected (pull-downs to ground,
pull-ups to VDD), to prevent static damage. In addition,
in situations where timing resistors or other means of
limiting crossover currents are used, like drains from
drivers A and B, they may be paralleled for greater
current carrying capacity.
These devices are built to operate in the most
demanding electrical environments. They will not
latch-up under any conditions within their power and
voltage ratings; they are not subject to damage when
up to 5V of noise spiking of either polarity occurs on
their ground pin; and they can accept, without damage
or logic upset, up to 0.5A of reverse current (of either
polarity) being forced back into their outputs. All
terminals are fully protected against up to 2 kV (HBM)
of electrostatic discharge.
Functional Block Diagram
1
VDD
TC4404
Inverting
8 (6)
300 mV
7 (5)
Input
Pull-Down
2 (3)
4.7V
GND
Pull-Up
TC4405
Noninverting
4
Effective
Input
C ≤ 12 pF
DS20001418E-page 2
A (B)
 2002-2016 Microchip Technology Inc.
TC4404/TC4405
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage ..................................................... +22V
Power Dissipation (TA 70°C)
PDIP..................................................... 730 mW
SOIC .................................................... 470 mW
Operating Temperature Range
C Version ........................................ 0°C to +70°C
E Version...................................... -40°C to +85°C
Storage Temperature Range .............. -65°C to +150°C
† Notice: Stresses above those listed under “Absolute
Maximum Ratings” may cause permanent damage to
the device. This is a stress rating only and functional
operation of the device at those or any other conditions
above those indicated in the operational sections of this
specification is not intended. Exposure to maximum
rating conditions for extended periods may affect
device reliability.
DC CHARACTERISTICS
Electrical Characteristics: Unless otherwise specified, all limits apply for typical values at ambient temperature
TA = +25°C, with 4.5V  VDD  18V.
Parameter
Sym.
Min.
Typ.
Max.
Units
Logic 1, High Input Voltage
VIH
2.4
Logic 0, Low Input Voltage
VIL
—
Input Current
IIN
High Output Voltage
Low Output Voltage
Output Resistance
Conditions
—
—
V
—
0.8
V
–1
—
1
A
VOH
VDD – 0.025
—
—
V
VOL
—
—
0.025
V
RO
—
7
10

IOUT = 10 mA, VDD = 18V;
any drain
Duty cycle2%, t 300 sec
Input
0VVINVDD
Output
Peak Output Current (Any Drain)
IPK
—
1.5
—
A
Continuous Output Current
(Any Drain)
IDC
—
—
100
mA
Latch-Up Protection (Any Drain)
Withstand Reverse Current
IR
—
> 500
—
mA
Duty cycle2%, t 300 sec
tR
—
25
30
ns
Figure 4-1, CL = 1000 pF
Fall Time
tF
—
25
30
ns
Figure 4-1, CL = 1000 pF
Delay Time
tD1
—
15
30
ns
Figure 4-1, CL = 1000 pF
Delay Time
tD2
—
32
50
ns
Figure 4-1, CL = 1000 pF
IS
—
—
—
—
4.5
0.4
mA
VIN = 3V (both inputs)
VIN = 0V (both inputs)
Switching Time (Note 1)
Rise Time
Power Supply
Power Supply Current
Note 1:
Switching times ensured by design.
 2002-2016 Microchip Technology Inc.
DS20001418E-page 3
TC4404/TC4405
DC CHARACTERISTICS (OVER OPERATING TEMPERATURE RANGE)
Electrical Characteristics: Unless otherwise indicated, operating temperature range with 4.5V VDD18V.
Parameter
Sym.
Min.
Typ.
Max.
Units
Conditions
Logic 1, High Input Voltage
VIH
2.4
—
—
V
Logic 0, Low Input Voltage
VIL
—
—
0.8
V
Input Current
IIN
–10
—
10
A
High Output Voltage
VOH
VDD – 0.025
—
—
V
Low Output Voltage
VOL
—
—
0.025
V
Output Resistance
RO
—
9
12

IOUT = 10 mA, VDD = 18V;
any drain
Duty cycle2%, t 300 sec
0VVINVDD
Output
Peak Output Current (Any Drain)
IPK
—
1.5
—
A
Continuous Output Current
(Any Drain)
IDC
—
—
100
mA
Latch-Up Protection (Any Drain)
Withstand Reverse Current
IR
—
> 500
—
mA
Duty cycle2%, t 300 sec
tR
—
—
40
ns
Figure 4-1, CL = 1000 pF
Fall Time
tF
—
—
40
ns
Figure 4-1, CL = 1000 pF
Delay Time
tD1
—
—
40
ns
Figure 4-1, CL = 1000 pF
Delay Time
tD2
—
—
60
ns
Figure 4-1, CL = 1000 pF
IS
—
—
—
—
8
0.6
mA
VIN = 3V (both inputs)
VIN = 0V (both inputs)
Switching Time (Note 1)
Rise Time
Power Supply
Power Supply Current
Note 1:
Switching times ensured by design.
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V  VDD  18V.
Parameters
Sym.
Min.
Typ.
Max.
Units
Operating Temperature Range, C Version
TA
0
—
+70
°C
Operating Temperature Range, E Version
TA
-40
—
+85
°C
Storage Temperature Range
TA
-65
—
+150
°C
Thermal Resistance, 8-Lead PDIP
JA
—
+94
—
°C/W
Thermal Resistance, 8-Lead PDIP
JC
—
+45
—
°C/W
Thermal Resistance, 8-Lead SOIC
JA
—
+163
—
°C/W
Thermal Resistance, 8-Lead SOIC
JC
—
+42
—
°C/W
Conditions
Temperature Ranges
Package Thermal Resistances
DS20001418E-page 4
 2002-2016 Microchip Technology Inc.
TC4404/TC4405
TYPICAL PERFORMANCE CURVES
100
1000 pF
40
470 pF
20
0
80
1500 pF
60
tRISE (ns)
60
100
2200 pF
80
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
2200 pF
TA = +25°C
40
1
1
4
0
16
FIGURE 2-1:
Voltage.
60
1000 pF
1000 pF
40
40
470 pF
20
100 pF
414
1500 pF
60
470 pF
20
100 pF
18
1
0
20
100 pF
41
VDD
614
816
118
tFALL (ns)
0
414
16
6
18
8
VDD = 5
VDD = 5V
TA = +25°C
80
60
60 10V
10V
15V
15V
40
40
20
20
0
1
1 100
14
FIGURE 2-3:
Load.
100
100
80
500 pF
1
100 pF
Rise Time vs. Supply
2200 pF
TA = +25°C
T = +25°C
A
470 pF
100
TA = +25°C
100
2200 pF
T = +25°C
A
80
80
1500 pF
2200 pF
TA = +25°C
80
1500 pF
1000 pF
100
100
100
tRISE (ns)
Note:
TA = +25°C
T = +25°C
A
60
60
1000 pF
40
40
1000
18
16
0
100
CLOAD (pF)
10000
40
1
60
VDD = 5V
TA = +25°C
60
1000
Rise Time vs. Capacitive
VDD = 5V
80
80
1500 pF
tFALL (ns)
2.0
10V
10V
15V
15V
50
CLOAD = 100
VDD = 17.5V
40
30
tFAL
470 pF
20
1
1
14
16
18
0
20
100 pF
4
FIGURE 2-2:
Voltage.
6
8
1
1
VDD
14
16
Fall Time vs. Supply
 2002-2016 Microchip Technology Inc.
18
0
100
20
20
0
100
1000
FIGURE 2-4:
Load.
1000
10,000
10000
10
CLOAD (pF)
Fall Time vs. Capacitive
DS20001418E-page 5
-55 -35 -15
5
TC4404/TC4405
40
40
40
tD2
30
30
tFALL
20
20
tRISE
000
10000
10
Delay Time (ns)
50
tD1
20
20
10
48
108
6
FIGURE 2-6:
Supply Voltage.
tD1
tD1
60
CLOAD =1000pF
VDD = 10V
TA = +25°C
Delay Time (ns)
50
40
tD2
30
30
2
4
6
8
10
DS20001418E-page 6
=0
0.1
4
6
8
10
Propagation Delay Time vs.
BRWK IQSXWV = 1
1
0.1
4
6
8
Effect of Input Amplitude on
3.5
10
12
14
VDD
16
18
Quiescent Supply Current
25
10
TA = +25°C
VDD = 18V
BRWK IQSXWV
=1
t
D2
B
I
20
=1
1
3.0
2.5
10
-55 -35 -15 5
VDRIVE (V)
FIGURE 2-7:
Delay Time.
tD1
10
1 -55
1 -3514
18 45 65 85 105125
-15 16
5 25
4.0
VDD = 17.5V
VLOAD = 1000pF
20
tD1
0
tD1
FIGURE 2-9:
vs. Voltage.
Propagation Delay vs.
40
10
I
30
VDD
60
20
B
1
BRWK IQSXWV = 0
10
-35 -15
1-55 1
14 516 2518 45 65 85 105 125
50
=1
tD2
tRISE
2 85 105
4 125 6
45 65
I
TA = +25°C
tD2
30
B
10
VDD ==17.5V
CLOAD
1000 pF
VLOAD = 1000pF
+25°C
TA =
40
30
tD2
40
FIGURE 2-8:
Temperature.
tD2
40
TA = +25°C
Temperature
Rise and Fall Times vs.
60
8
10
10
VDD == 1000
17.5VpF
CLOAD
=LOAD
+25°C= 1000pF
TA V
20
Temperature
60
CLOAD =1000pF
VDD = 10V
50
TA = +25°C
tD2
20
tD1
10
10
-55 -35 -15 5 250 45 65
2 85 105125
4
6 4 8 6
FIGURE 2-5:
Temperature.
F
30
50
Delay Time (ns)
15V
Time (ns)
10V
50
60
60
CLOAD =1000pF
VDD = 10V
50
TA = +25°C
IQUIESCENT (mA)
VDD = 5V
60
CLOAD = 1000 pF
VDD = 17.5V
50
IQUIESCENT (mA)
60
tD1
W
@
15
10
B
I
T
=0
2.0
5
0.1
25 -45
65 -15
85 105
4 856105125
8
10 4 12 6 14 8 16 118
55 -35
5 125
25 45 65
Temperature
FIGURE 2-10:
vs. Temperature.
Quiescent Supply Current
 2002-2016 Microchip Technology Inc.
TC4404/TC4405
25
25
20
20
RDS(ON) ()
=1
WRUVW&DVH
@ TJ = +150°C
15
15
10
25 45 65 85 105 125
W
@ TJ = +150°C
5
10
T\S @ +25°C
4
6
8
FIGURE 2-11:
1
1
VDD
14
16
18
5
T
4
6
8
1
@ +25°C
1
14
16
18
Pull-Up Output Resistance.
25
WRUVW&DVH
@ TJ = +150°C
T
1
RDS(ON) ()
20
W
@ TJ = +150°C
10
@ +25°C
1
14
15
16
18
5
T\S @ +25°C
4
6
FIGURE 2-12:
Resistance.
8
1
1
VDD
14
16
18
Pull-Down Output
 2002-2016 Microchip Technology Inc.
DS20001418E-page 7
TC4404/TC4405
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
8-Lead PDIP/SOIC
Symbol
Description
1
VDD
Supply Input, 4.5V to 18V
2
IN A
Control Input A, TTL/CMOS compatible input
3
IN B
Control Input B, TTL/CMOS compatible input
4
GND
Ground
5
B BOTTOM Output B, pull-down
6
B TOP
7
A BOTTOM Output A, pull-down
8
A TOP
DS20001418E-page 8
Output B, pull-up
Output A, pull-up
 2002-2016 Microchip Technology Inc.
TC4404/TC4405
4.0
APPLICATIONS INFORMATION
4.1
Circuit Layout Guidelines
In addition, it is advisable that low ESR (Equivalent
Series Resistance) bypass capacitors (4.7 µF or 10 µF
tantalum) be placed as close to the driver as possible.
In order to minimize the length of the output trace, the
driver should be physically located as close as possible
to the device it is driving.
Long power supply and ground traces should be
avoided as the added inductance causes unwanted
voltage transients. Power and ground planes should be
used wherever possible.
+5V
90%
Input
VDD = 18V
0V
4.7 µF
Input
0.1 µF
tD2
tF
tR
90%
90%
Output
8.7
1
tD1
18V
1
2
10%
Output
10%
10%
0V
Inverting Driver
CL = 1000 pF
2
+5V
90%
Input
0V
4
10%
18V
Input: 100 kHz,
square wave,
tRISE = tFALL  10 ns
Output
tD1
90%
tR
10%
0V
90%
tD2
tF
10%
Noninverting Driver
FIGURE 4-1:
4.2
Switching Time Test Circuit.
Typical Applications
VDD
(4.5V - 18V)
VDD
(4.5V - 18V)
From TTL
TC4404
RT
RT
VOUT
GND
FIGURE 4-2:
Zero Crossover Current
Totem-Pole Switch.
 2002-2016 Microchip Technology Inc.
From TTL
TC4405
RIB
RIB
GND
FIGURE 4-3:
Driving Bipolar Transistors.
DS20001418E-page 9
TC4404/TC4405
+24V
47 k
47 k
+12V
15V
0.1µF
15V
0.1µF
Direction
(TTL Level)
RT
Speed
(PWM)
Motor
RT
GND
FIGURE 4-4:
TC4469
TC4404
ISENSE
Servo Motor Control.
+12V
+12V
Switched
+12V
+5V
+5V
From TTL
GND
TC4404
GND
Switched
-12V
-12V
FIGURE 4-5:
DS20001418E-page 10
-12V
Reach-Up and Reach-Down Driving.
 2002-2016 Microchip Technology Inc.
TC4404/TC4405
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
8-Lead PDIP (300 mil)
XXXXXXXX
XXXXXNNN
YYWW
8-Lead SOIC (3.90 mm)
NNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
Example
TC4404
EPA e3 256
1519
Example
TC4404C
OA e3 1519
256
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
 2002-2016 Microchip Technology Inc.
DS20001418E-page 11
TC4404/TC4405
/HDG3ODVWLF'XDO,Q/LQH3$PLO%RG\>3',3@
1RWH
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
N
B
E1
NOTE 1
1
2
TOP VIEW
E
C
A2
A
3/$1(
L
c
A1
e
eB
8X b1
8X b
.010
C
SIDE VIEW
END VIEW
Microchip Technology Drawing No. C04-018D Sheet 1 of 2
DS20001418E-page 12
 2002-2016 Microchip Technology Inc.
TC4404/TC4405
/HDG3ODVWLF'XDO,Q/LQH3$PLO%RG\>3',3@
1RWH
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
ALTERNATE LEAD DESIGN
(VENDOR DEPENDENT)
DATUM A
DATUM A
b
b
e
2
e
2
e
Units
Dimension Limits
Number of Pins
N
e
Pitch
Top to Seating Plane
A
Molded Package Thickness
A2
Base to Seating Plane
A1
Shoulder to Shoulder Width
E
Molded Package Width
E1
Overall Length
D
Tip to Seating Plane
L
c
Lead Thickness
Upper Lead Width
b1
b
Lower Lead Width
Overall Row Spacing
eB
§
e
MIN
.115
.015
.290
.240
.348
.115
.008
.040
.014
-
INCHES
NOM
8
.100 BSC
.130
.310
.250
.365
.130
.010
.060
.018
-
MAX
.210
.195
.325
.280
.400
.150
.015
.070
.022
.430
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing No. C04-018D Sheet 2 of 2
 2002-2016 Microchip Technology Inc.
DS20001418E-page 13
TC4404/TC4405
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20001418E-page 14
 2002-2016 Microchip Technology Inc.
TC4404/TC4405
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2002-2016 Microchip Technology Inc.
DS20001418E-page 15
TC4404/TC4405
!"#$%&
'
!
"#$%&"'""
($)
%
*++&&&!
!+$
DS20001418E-page 16
 2002-2016 Microchip Technology Inc.
TC4404/TC4405
APPENDIX A:
REVISION HISTORY
Revision E (April 2016)
The following is the list of modifications:
1.
2.
3.
4.
Removed all information regarding the
discontinued CERDIP package.
Added Temperature Specifications Table.
Added Section 5.0, Packaging Information.
Added Product Identification System page.
Revision D (December 2012)
Added a note to each package outline drawing.
 2002-2016 Microchip Technology Inc.
DS20001418E-page 17
TC4404/TC4405
NOTES:
DS20001418E-page 18
 2002-2016 Microchip Technology Inc.
TC4404/TC4405
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
X
XX
Device
Temperature
Range
Package
Device:
TC4404:
TC4405:
Temperature
Range:
C
E
=
0C to +70C
= -40C to +85C
Package:
OA
=
PA
=
OA713 =
Dual Open-Drain MOSFET Driver
Dual Open-Drain MOSFET Driver
Plastic Small Outline (3.90 mm Body),8-Lead,
SOIC
Plastic Dual In-Line (300 mil Body), 8-Lead, PDIP
Plastic Small Outline (3.90 mm Body),8-Lead,
SOIC
(Tape and Reel)
 2002-2016 Microchip Technology Inc.
Examples:
a)
TC4404COA:
b)
TC4404EOA:
c)
TC4404CPA:
d)
TC4405EPA:
e)
TC4404EOA713:
1.5A Dual Open-Drain
Driver,
0°C to +70°C,
8LD SOIC Package
1.5A Dual Open-Drain
Driver,
-40°C to +85°C,
8LD SOIC Package
1.5A Dual Open-Drain
Driver,
0°C to +70°C,
8LD PDIP Package
1.5A Dual Open-Drain
Driver,
-40°C to +85°C,
8LD PDIP Package
1.5A Dual Open-Drain
Driver,
-40°C to +85°C,
8LD SOIC Package,
Tape and Reel
MOSFET
MOSFET
MOSFET
MOSFET
MOSFET
DS20001418E-page 19
TC4404/TC4405
NOTES:
DS20001418E-page 20
 2002-2016 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITYMANAGEMENTSYSTEM
CERTIFIEDBYDNV
== ISO/TS16949==
 2002-2016 Microchip Technology Inc.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate,
dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq,
KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST,
MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo,
RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O
are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
ClockWorks, The Embedded Control Solutions Company,
ETHERSYNCH, Hyper Speed Control, HyperLight Load,
IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut,
BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, Dynamic Average Matching, DAM, ECAN,
EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip
Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker,
Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2002-2016, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN: 978-1-5224-0445-3
DS20001418E-page 21
Worldwide Sales and Service
AMERICAS
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Technical Support:
http://www.microchip.com/
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Web Address:
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Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
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Fax: 65-6334-8850
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Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
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Tel: 886-3-5778-366
Fax: 886-3-5770-955
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Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
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Tel: 886-7-213-7828
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Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Poland - Warsaw
Tel: 48-22-3325737
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07/14/15
DS20001418E-page 22
 2002-2016 Microchip Technology Inc.