EQCO30R5.D EQCO30R5.D 3G/HD-SDI Video Cable Equalizer Features Introduction • Supports up to 140 Meters of Cable at 2.97 Gbps Using High-Quality Coax • Supports up to 200 Meters of Cable at 1.485 Gbps Using High-Quality Coax • Supports up to 450 Meters of Cable at 270 Mbps Using High-Quality Coax • Compatible with all SMPTE3G SDI data rates: - SMPTE259M SDI, 143 to 360 Mbps - SMPTE344M, 540 Mbps - SMPTE292M HD-SDI, 1.485 Gbps - SMPTE372M Dual-Link HD-SDI, 2.97 Gbps - SMPTE424M Dual-Speed 3G-SDI, 2.97 Gbps • Pin Compatible with Gennum and National Semiconductor Parts • Also Operates with 8B/10B Coding • Single 3.3V Supply. • Low Power Consumption (220 mW, 3.3V Supply; 80 mW, 1.2V Supply) • Better Robustness Due to Transmit Amplitude Independent Operation • 16-Pin, 0.65 mm Pin Pitch, 4 mm QFN Package • -40°C to +85°C Industrial Temperature Range • Pb-Free and RoHS Compliant The EQCO30R5 is a video equalizer for 3G/HD/SD-SDI video, with speeds up to 2.97 Gbps. It is designed to be a direct replacement for competing video equalizers. In addition to downlink functionality from camera to frame grabber, it can also transmit a 5 Mbps uplink signal from the frame grabber to the camera. Additionally, power can be provided over the same cable using the same chip and a few external components. The device operates with 8B/10B coded signals up to 3.125 Gbps. Applications • High Definition, High Frame Rate Pro-Video HD-SDI Frame Store • Surveillance, Industrial/Inspection, Medical Video Inputs • HDcctv Applications Note: The EQCO30R5 video equalizer can be used in combination with the EQCO30T5 cable driver. This device is capable of receiving the uplink signal whilst other key parameters remain compliant to SMPTE specifications. Please refer to the Microchip web site (www.microchip.com) for the EQCO30T5 data sheet. 2011-2016 Microchip Technology Inc. DS60001304B-page 1 EQCO30R5.D Typical Link Performance Table 1, Table 2, and Table 3 give an overview of video equalizer typical performance at room temperature without using the uplink and without providing power over the same coax. When providing power or using the uplink communication to the camera, a small length penalty may arise (in cable length, typically 10%) due to added parasitics and noise. The uplink operates to at least 400m at the 5 Mbps bit rate. TABLE 1: BELDEN TYPICAL EQUALIZATION PERFORMANCE Name Belden 7731A Belden 1694A Belden 1505A Belden 1505F Belden 1855A Type Long Distance Industry Standard Compromise Coax Flexible Thinnest Cable Diameter (mm) 10.3 6.99 5.94 6.15 4.03 270 Mbps (m) 718 469 384 302 270 1.485 Gbps (m) 332 223 187 136 132 2.97 Gbps (m) 219 149 128 89 91 TABLE 2: GEPCO TYPICAL EQUALIZATION PERFORMANCE Name Gepco VHD1100 Gepco VSD2001 Gepco VPM2000 Gepco VHD2000M Gepco VDM230 Type Long Distance Industry Standard Compromise Coax Flexible Thinnest Cable Diameter (mm) 10.3 6.91 6.15 6.15 4.16 270 Mbps (m) 772 502 387 305 273 1.485 Gbps (m) 372 241 187 138 133 2.97 Gbps (m) 252 163 128 91 92 TABLE 3: CANARE TYPICAL EQUALIZATION PERFORMANCE Name Canare L-7CFB Canare L-5CFB Canare L-4CFB Canare L-3CFB Canare L-2.5CFB Type Long Distance Industry Standard Compromise Coax Thin Cable Thinnest Cable Diameter (mm) 10.3 6.99 5.94 6.15 4.03 270 Mbps (m) 615 434 344 287 223 1.485 Gbps (m) 281 201 161 135 109 2.97 Gbps (m) 182 132 107 90 73 DS60001304B-page 2 2011-2016 Microchip Technology Inc. EQCO30R5.D Table of Contents 1.0 2.0 3.0 4.0 Device Overview .......................................................................................................................................................................... 4 Application Information................................................................................................................................................................. 8 Electrical Characteristics ............................................................................................................................................................ 12 Packaging................................................................................................................................................................................... 14 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at [email protected] or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. 2011-2016 Microchip Technology Inc. DS60001304B-page 3 EQCO30R5.D 1.0 DEVICE OVERVIEW . Note: Email address: [email protected] The EQCO30R5 is a multi-rate adaptive cable equalizer, designed to restore signals received over coaxial cable. The EQCO30R5 chip is optimized for SMPTE HD/SDI signals, but works equally well with 8B/10B coded signals. The device operates from a single 3.3V power supply. A sister device operates from a single 1.2V power supply, which reduces power consumption at the cost of voltage compatibility with competitive parts. For more information on the 1.2V part, please contact Microchip. The EQCO30T5 is a cable driver that matches to the EQCO30R5, since it can receive the uplink signal. Implementing the uplink requires very few additional components on both sides of the link and complies with SMPTE specifications. The EQCO30T5 data sheet is available separately from Microchip. The EQCO30R5 has a DC restore circuit to recover SMPTE pathological patterns in the data stream. The EQCO30R5 has a variable gain to compensate for lowfrequency attenuation through the coax and variations in transmit amplitude. Figure 1-1 shows a typical communication link using the EQCO30T5 and EQCO30R5 chips FIGURE 1-1: TYPICAL EQCO30R5 SETUP Up to 2.97 Gbps downlink High Definition Camera EQCO 30T5 Up to 5 Mbps uplink DS60001304B-page 4 Up to 900 mA DC Up to 400 meters 75ɏCoax Up to 900 mA DC Up to 2.97 Gbps downlink Frame Store + Camera Control EQCO 30R5 Up to 5 Mbps uplink 2011-2016 Microchip Technology Inc. EQCO30R5.D 1.1 Pinout and Pin Description FIGURE 1-2: TABLE 1-1: Pin Number EQCO30R5.D PIN DIAGRAM (VIEWED FROM TOP) VCC NC NC VCC 16 15 14 13 GND 1 12 GND SDIp 2 11 SDOp SDIn 3 10 SDOn GND 4 9 GND EQCO30R5 GND TAB 5 6 7 LFI AmpR NC 8 NC EQCO30R5.D PIN DESCRIPTIONS Pin Name Signal Type Power Description (TAB) GND Use as single-point ground. 13, 16 VCC Power +3.3V of power supply. 1, 4, 9, 12 GND Power Connect to ground of power supply. 2, 3 SDIp, SDIn CML Input Serial input positive/negative differential serial input. Connect SDIn to ground reference via termination network. External 75Ω resistors are required. 11, 10 SDOp/SDOn CML Output Serial output positive/negative differential serial output. Output has a swing of 2x370 mV and has 50Ω on-chip termination resistors to internal VDD (1.2V). 5 LFI Input Uplink signal. (Low = 0V, High = 1.2V). When driving from 3.3V, an external series resistance of 6.2 kΩ is required. 6 AmpR Input Connect to ground with a 1 kΩ resistor, defining the uplink amplitude to 150 mV. 7 NC Input Do not connect. Used for internal testing. 8 NC Input Do not connect. Used for internal testing. 14 NC Input Do not connect. Used for internal testing. 15 NC Input Do not connect. Used for internal testing. 2011-2016 Microchip Technology Inc. DS60001304B-page 5 EQCO30R5.D 1.1.1 SDIp/SDIn SDIp/SDIn together form a differential input pair. The EQCO30R5 analyzes the differential voltage between these pins and adaptively equalizes for signal level and frequency response. The equalizer automatically detects and adapts to signals with different edge rates, different attenuation levels and different cable characteristics. Both SDIp and SDIn inputs need to be terminated by an external 75Ω resistor to GND. 1.1.2 SDOp/SDOn SDOp/SDOn together form a differential CML pair outputting the reconstructed far-end transmit signal. SDOp/SDOn are terminated on-chip with two 50Ω resistors to 1.2V. These outputs should be AC coupled to the deserializer (unless a 800 mV-1V common-mode voltage is acceptable). For SMPTE signals, it is best to use 4.7 µF AC coupling capacitors. 1.1.3 LFI LFI is the uplink input signal that will be transmitted on the SDIp/SDIn pair. LFI must be a 0-1.2V signal. The pin has an internal resistor of 3.6 kΩ. When driving with a 3.3V (2.5V) signal, an external resistor of 6.2 kΩ (3.9 kΩ) should be placed in series close to the EQCO30R5 chip. When not using uplink communications, leave this pin floating. 1.1.4 AmpR AmpR is a VCC resistor that sets the transmit amplitude of the uplink output driver. The typical value is Ramp = 1 kΩ for 150 mV transmit amplitude. When not using uplink communications, leave this pin floating. DS60001304B-page 6 2011-2016 Microchip Technology Inc. EQCO30R5.D 1.2 Circuit Operation FIGURE 1-3: EQCO30R5.D BLOCK DIAGRAM SHOWING ELECTRICAL CONNECTIONS LFI, AmpR SDIp SDIn Equalizer Core Limiting Amplifier with DC restore + CML Driver SDOp SDOn EQCO30R5 1.2.1 EQUALIZER CORE • Variable Coax The EQCO30R5 has an embedded equalizer in the receive path with the following characteristics: The equalizer can receive attenuated signals from other types of cables besides the Belden1694A. • Auto-Adaptive • Multi-Speed The equalizer controls a multiple-pole analog filter which compensates for attenuation of the cable, as illustrated in Figure 1-4. The filter frequency response needed to restore the signal is automatically determined by the device using a time-continuous feedback loop that measures the frequency components in the signal. Upon the detection of a valid signal, the control loop converges within a few microseconds. The EQCO30R5 works at data rates from 143 Mbps to 2.97 Gbps. With 8B/10B coding, the allowable bit rate is extended from 50 Mbps to 3.125 Gbps. • Variable Gain The EQCO30R5 equalizer has variable gain to compensate for low-frequency attenuation through the coax and variations in transmit amplitude; this makes the equalizer performance more robust, even at maximum cable lengths. FIGURE 1-4: Example equalizer performance measurements can be found in Appendix B: “Typical Equalizer Characteristics”. 1.2.2 RX OUTPUT DRIVER The output driver converts the output of the equalizer core to an LVDS-like signal and sends it onto a 100Ω differential transmission line. PRINCIPLE OF EQUALIZER OPERATION 2011-2016 Microchip Technology Inc. DS60001304B-page 7 EQCO30R5.D 2.0 APPLICATION INFORMATION 2.1 Typical Application Circuit for SMPTE Video Signals Figure 2-1 illustrates a typical schematic implementation of the EQCO30R5 used as an equalizer for SMPTE video signals. FIGURE 2-1: 2.1.1 EQCO30R5.D TYPICAL APPLICATION CIRCUIT FOR SMPTE VIDEO SIGNALS RETURN-LOSS NETWORK For optimal return-loss, an external return-loss network is needed. The value of R2 is 75Ω, and the value of L1 is 2.7 nH. TABLE 2-1: COMPONENT RECOMMENDATION FOR THE EQCO30R5.D BOARD LAYOUT FOR SMPTE VIDEO SIGNALS Element Value Size R2, R3, R4, R5 75Ω ±1% 0402 L1 2.7 nH 0402 DS60001304B-page 8 Recommended Component 2011-2016 Microchip Technology Inc. EQCO30R5.D 2.1.2 GUIDELINES FOR PCB LAYOUT All components in the high-speed signal path should be 0402 size for minimal parasitic effects. The transmission line between the BNC connector and the return-loss network (L1, R2) shall be a 75Ω singleended transmission line. Components R2, R4 and R5 are 75Ω resistors, and component L1 is a 2.7 nH inductor. Component R3 is the 75Ω termination resistor to GND. Components C1 and C2 are AC coupling capacitors connected to the input of the chip. Two decoupling capacitors (C10, C11) are placed between VCC and GND, close to the chip. The output of the chip is connected to the deserializer or FPGA with a 100Ω differential transmission line. To minimize unwanted parasitic effects, a cutout of the ground and power plane is made underneath capacitor C6 and underneath the input pins of the EQCO30R5 chip. Figure 2-2 shows a recommended layout for the EQCO30R5 implementation. FIGURE 2-2: RECOMMENDED PCB LAYOUT FOR EQCO30R5 2011-2016 Microchip Technology Inc. DS60001304B-page 9 EQCO30R5.D 2.2 Typical Application Circuit for Bidirectional Link with Power Over Coax FIGURE 2-3: TABLE 2-2: EQCO30R5.D TYPICAL APPLICATION CIRCUIT FOR BIDIRECTIONAL LINK WITH POWER OVER COAX COMPONENT RECOMMENDATION FOR THE EQCO30R5.D BOARD LAYOUT Element Value Size Recommended Component Fb1, Fb2 1 kΩ @ 100 MHz Ferrite Bead 0603 FBMH1608HM102 from Taiyo Yuden L1 10 µH 1812 1812PS_103 from Coilcraft 2.2.1 BIDIRECTIONAL LINK IN SMPTE APPLICATIONS When using the bidirectional link with power supply transmission, the components (FB1, L1 and L2) and layout are very critical. Changes in the design or components may result in decreased performance. 2.2.2 PCB LAYOUT All components in the high-speed signal path should be 0402 size for minimal parasitic effects. Figure 2-4 shows a recommended layout for the EQCO30R5 with uplink and power over coax. DS60001304B-page 10 2011-2016 Microchip Technology Inc. EQCO30R5.D FIGURE 2-4: RECOMMENDED PCB LAYOUT FOR EQCO30R5 IN BIDIRECTIONAL LINK 2011-2016 Microchip Technology Inc. DS60001304B-page 11 EQCO30R5.D 3.0 ELECTRICAL CHARACTERISTICS 3.1 Absolute Maximum Ratings Stresses beyond those listed under this section may cause permanent damage to the device. These are stress ratings only and are not tested. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections are not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. TABLE 3-1: ABSOLUTE MAXIMUM RATINGS Parameter Conditions Min. Typ. Max. Units — -65 — +150 °C Storage Temperature Ambient Temperature Operating Temperature Power applied -55 — +125 °C Normal operation (VCC = 3.3V ±5%) -40 — +85 °C — -0.8 — +3.6 V Supply Voltage to Ground DC Input Voltage — -0.8 — +3.6 V DC Voltage to Outputs — -0.8 — +3.6 V Outputs low — — 90 mA Current into Outputs TABLE 3-2: ELECTRICAL CHARACTERISTICS (OVER THE OPERATING VCC AND -40 TO +85°C RANGE) Parameter Description Min. Typ. Max. Unit 3.15 3.3 3.45 V — 55 — mA Power Supply VCC Supply voltage IS Supply current, both transmitting and receiving Operational Bit Rate BRsmpte Bit rate using SMPTE data 0.143 — 3.0 Gbps BR8B10B Bit rate using 8B/10B coded data 0.05 — 3.125 Gbps SDIp Connection to Coax Zcoax Coax cable characteristic impedance — 75 — Ω Rloss Coax return-loss as seen on SDIp pin. Frequency range = 1 MHz-1.5 GHz — — -15 dB Rloss Coax return-loss as seen on SDIp pin Frequency range = 1.5 GHz-3 GHz — — -10 dB ⌂VTX Transmit amplitude (at camera end into 75Ω) 500 800 1200 mV 2x300 2x370 2x450 mV SDOp/SDOn Outputs (CML to 1.2V) ⌂Vo Output amplitude VSDOp,n (into 2x50Ω) Vcmout Common-mode output voltage when AC coupled — 0.83 — V Routput Termination on SDOp/SDOn to VCC — 50 — Ω trise_o Rise/Fall time 20% to 80% of VSDOp,n — 75 — ps DS60001304B-page 12 2011-2016 Microchip Technology Inc. EQCO30R5.D TABLE 3-2: ELECTRICAL CHARACTERISTICS (OVER THE OPERATING VCC AND -40 TO +85°C RANGE) Uplink Parameters VLF Uplink transmit amplitude for Ramp = 1 kΩ measured inside cable 110 150 190 mV trise_lf Rise/Fall time 20% to 80% of LF output on SDIp with Ramp = 1 kΩ 30 40 55 ns Vih LFI input high voltage 0.8 — 1.3 V Vil LFI input low voltage -0.5 — 0.4 V Rinput Internal resistor to GND — 3.6 — kΩ Min. Typ. Max. Units — — 0.25 UI — 0.3 — UI — — 0.25 UI — 0.3 — UI TABLE 3-3: JITTER NUMBERS(1) Parameter Jitter in Equalizer Output Conditions 2.97 Gbps from 0-120m(2) (2) Jitter in Equalizer Output 2.97 Gbps from 120-140m Jitter in Equalizer Output 1.485 Gbps from 0-160m(2) (2) Jitter in Equalizer Output 1.485 Gbps from 160-200m Jitter in Equalizer Output 270 Mbps from 0-400m(2) — — 0.2 UI Additive Jitter on LF Output 8B/10B coded signal at 5 Mbps over full VCC and temperature range. — — 10 ns DCD in LF Output 1: 2: 8B/10B coded signal at 5 Mbps over full VCC and temperature — — 10 ns range. Jitter numbers (over operating VCC range at -40°C to +85°C and full ⌂VTX range with pathological patterns) Measured with Belden 1694A 2011-2016 Microchip Technology Inc. DS60001304B-page 13 EQCO30R5.D 4.0 PACKAGING INFORMATION 4.1 Package Marking Information 16-Lead Plastic Quad Flat, No Lead Package – 4x4x0.9 mm Body [QFN] 16-Lead QFN (4x4x0.9 mm) PIN 1 Example PIN 1 EQCO 30R5.D YYWWNNN Legend: XX...X Y YY WW NNN e3 * Note: DS60001304B-page 14 YYWWNNN Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2011-2016 Microchip Technology Inc. EQCO30R5.D 16-Lead Plastic Quad Flat, No Lead Package (8E) - 4x4x0.9 mm Body [QFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N NOTE 1 1 2 E (DATUM B) (DATUM A) 2X 0.20 C 2X TOP VIEW 0.20 C 0.10 C C A1 A SEATING PLANE 16X SIDE VIEW (A3) 0.10 0.08 C C A B D2 (16X K) 0.10 C A B E2 e 2 2 1 16X L N e BOTTOM VIEW 16X b 0.10 0.05 C A B C Microchip Technology Drawing C04-259B Sheet 1 of 2 2011-2016 Microchip Technology Inc. DS60001304B-page 15 EQCO30R5.D 16-Lead Plastic Quad Flat, No Lead Package (8E) - 4x4x0.9 mm Body [QFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits Number of Pins N e Pitch A Overall Height Standoff A1 A3 Terminal Thickness Overall Width E E2 Exposed Pad Width D Overall Length D2 Exposed Pad Length b Terminal Width Terminal Length L K Terminal-to-Exposed-Pad MIN 0.80 0.00 1.95 1.95 0.25 0.45 MILLIMETERS NOM 16 0.65 BSC 0.87 0.02 0.20 REF 4.00 BSC 2.05 4.00 BSC 2.05 0.30 0.55 0.425 REF MAX 0.95 0.05 2.15 2.15 0.35 0.65 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-259B Sheet 2 of 2 DS60001304B-page 16 2011-2016 Microchip Technology Inc. EQCO30R5.D 16-Lead Plastic Quad Flat, No Lead Package (8E) - 4x4x0.9 mm Body [QFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging C1 X2 16 G1 1 X1 2 C2 Y2 Y1 E SILK SCREEN RECOMMENDED LAND PATTERN Units Dimension Limits E Contact Pitch Optional Center Pad Width X2 Optional Center Pad Length Y2 Contact Pad Spacing C1 Contact Pad Spacing C2 Contact Pad Width (X16) X1 Contact Pad Length (X16) Y1 Contact Pad to Center Pad (X16) G1 MIN MILLIMETERS NOM 0.65 BSC MAX 2.15 2.15 3.625 3.625 0.30 0.725 0.20 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-2259A 2011-2016 Microchip Technology Inc. DS60001304B-page 17 EQCO30R5.D APPENDIX A: REVISION HISTORY Revision B (February 2016) • Removed electrostatic discharge ratings from Table 3-1. • Minor typographical changes. Revision A (September 2014) This is the initial release of the document in the Microchip format. This replaces EqcoLogic document version 1v0. TABLE A-1: REVISION HISTORY Version Date 1v0 1/27/14 Finalizing document 0v2 6/27/13 Revision 0v1 11/23/11 New document DS60001304B-page 18 Comments 2011-2016 Microchip Technology Inc. EQCO30R5.D APPENDIX B: TYPICAL EQUALIZER CHARACTERISTICS All measurements at VCC = 3.3V, Temp = +25ºC, data pattern = prbs15 (including 20 µs of each polarity of pathological pattern), measured with Belden 1694A cable. FIGURE B-1: 270 Mbps, 410m, VTX = 620 mV FIGURE B-4: 1.485 Gbps, 200m, VTX = 620 mV FIGURE B-2: 270 Mbps, 410m, VTX = 800 mV FIGURE B-5: 1.485 Gbps, 200m, VTX = 800 mV FIGURE B-3: 270 Mbps, 410m, VTX = 980 mV FIGURE B-6: 1.485 Gbps, 200m, VTX = 980 mV 2011-2016 Microchip Technology Inc. DS60001304B-page 19 EQCO30R5.D FIGURE B-7: 2.97 Gbps, 140m, VTX = 620 mV FIGURE B-8: 2.97 Gbps, 140m, VTX = 800 mV FIGURE B-9: 2.97 Gbps, 140m, VTX = 980 mV DS60001304B-page 20 2011-2016 Microchip Technology Inc. EQCO30R5.D THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our web site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. 2011-2016 Microchip Technology Inc. DS60001304B-page 21 EQCO30R5.D PRODUCT IDENTIFICATION SYSTEM To order parts, including industrial, or obtain information, for e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. I RM Device Temp. Range Radio Module XXX Firmware F Revision Number Examples: a) b) Device: EQCO30R5.D Temperature Range: I Package: DS60001304B-page 22 EQCO30R5.D = Industrial temperature, 16-Lead QFN Tube packaging EQCO30R5.D-TRAY = Industrial temperature, 16-Lead QFN Tray packaging = -40C to +85C (Industrial temperature) TRAY = Tray (Blank) = Tube 2011-2016 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. 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Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2011-2016 Microchip Technology Inc. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2011-2016, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. 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