EQCO30T5.2 EQCO30T5.2 3G/HD-SDI Video Cable Driver Features Introduction • Compatible with all SMPTE3G SDI Data Rates: - SMPTE259M SDI, 143 to 360 Mbps - SMPTE344M, 540 Mbps - SMPTE292M HD-SDI, 1.485 Gbps - SMPTE372M Dual-Link HD-SDI, 2.97 Gbps - SMPTE424M Dual-Speed 3G-SDI, 2.97 Gbps • Pin Compatible with Gennum and National Semiconductor Parts • Loss of Signal Detect at Input, Optional 3 dB Input Trace/Receive Equalization • Also Operates with 8B/10B Coding • Single 3.3V Supply. • Low Power Consumption (150 mW, 3.3V supply) • Output Driver Enable • LF-Uplink Receiver Included, Receiving 5 Mbps in Full-Duplex Communication for Cable Lengths in 0-450m Range • Up to 900 mA can be Received for Powering Camera Devices • Selectable Slew Rate for SD and HD/3G • 16-Pin, 0.65 mm Pin Pitch, 4 mm QFN Package • -40°C to +85°C Industrial Temperature Range • Pb-Free and RoHS Compliant The EQCO30T5 is a video cable driver for 3G/HD/SDI video, with speeds up to 4.0 Gbps. It is designed to be a direct replacement for competing cable drivers. In addition to downlink functionality from camera to frame grabber, it can also receive a 5 Mbps uplink signal from the frame grabber to the camera. Additionally, power can be provided over the same cable using the same chip and a few external components. The device operates with 8B/10B coded signals and with SMPTE signals up to 2.97 Gbps. Applications • High Definition, High Frame Rate Pro-Video HD-SDI Frame Store • Surveillance, Industrial/Inspection, Medical Video Inputs • HDcctv Applications Note: The EQCO30T5 cable driver can be used in combination with the EQCO30R5 video equalizer. This device is capable of transmitting the uplink signal whilst other key parameters remain compliant to SMPTE specifications. Please refer to the Microchip web site (www.microchip.com) for the EQCO30R5 data sheet. 2012-2016 Microchip Technology Inc. DS60001303C-page 1 EQCO30T5.2 Typical Link Performance Table 1, Table 2 and Table 3 give an overview of link performance (EQCO30T5 and EQCO30R5 combined) at room temperature without using the uplink and without providing power over the same coax. When providing power or using the uplink communication to the camera, a small length penalty may arise (in cable length, typically 10%) due to added parasitics and noise. The uplink operates to at least 400m at the 5 Mbps bit rate. TABLE 1: BELDEN TYPICAL LINK PERFORMANCE Name Belden 7731A Belden 1694A Belden 1505A Belden 1505F Belden 1855A Type Long Distance Industry Standard Compromise Coax Flexible Thinnest Cable Diameter (mm) 10.3 6.99 5.94 6.15 4.03 270 Mbps (m) 718 469 384 302 270 1.485 Gbps (m) 332 223 187 136 132 2.97 Gbps (m) 219 149 128 89 91 TABLE 2: GEPCO TYPICAL LINK PERFORMANCE Name Gepco VHD1100 Gepco VSD2001 Gepco VPM2000 Gepco VHD2000M Gepco VDM230 Type Long Distance Industry Standard Compromise Coax Flexible Thinnest Cable Diameter (mm) 10.3 6.91 6.15 6.15 4.16 270 Mbps (m) 772 502 387 305 273 1.485 Gbps (m) 372 241 187 138 133 2.97 Gbps (m) 252 163 128 91 92 TABLE 3: CANARE TYPICAL LINK PERFORMANCE Name Canare L-7CFB Canare L-5CFB Canare L-4CFB Canare L-3CFB Canare L-2.5CFB Type Long Distance Industry Standard Compromise Coax Thin Cable Thinnest Cable Diameter (mm) 10.3 6.99 5.94 6.15 4.03 270 Mbps (m) 615 434 344 287 223 1.485 Gbps (m) 281 201 161 135 109 2.97 Gbps (m) 182 132 107 90 73 DS60001303C-page 2 2012-2016 Microchip Technology Inc. EQCO30T5.2 Table of Contents 1.0 2.0 3.0 4.0 Device Overview .......................................................................................................................................................................... 4 Application Information................................................................................................................................................................. 8 Electrical Characteristics ............................................................................................................................................................ 11 Packaging................................................................................................................................................................................... 13 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at [email protected] or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. 2012-2016 Microchip Technology Inc. DS60001303C-page 3 EQCO30T5.2 1.0 DEVICE OVERVIEW The EQCO30T5 is a dual slew rate cable driver designed to drive digital signals over coaxial cable. The EQCO30T5 chip is optimized for driving SMPTE HD-SDI signals, but works equally well with 8B/10B coded signals. The EQCO30R5 is a video equalizer that matches to the EQCO30T5, since it can transmit the uplink signal. Implementing the uplink requires very few additional components on both sides of the link, and complies with SMPTE specifications. The EQCO30R5 data sheet is available separately from Microchip. Figure 1-1 shows a typical communication link using the EQCO30T5 and EQCO30R5 chips: FIGURE 1-1: TYPICAL EQCO30T5 SETUP Up to 2.97 Gbps downlink High Definition Camera Up to 900 mA DC EQCO 30T5 Up to 400 meters 75Ω Coax Up to 5 Mbps uplink Up to 900 mA DC Up to 2.97 Gbps downlink Frame Store + Camera Control EQCO 30R5 Up to 5 Mbps uplink The EQCO30T5 includes an uplink receiver for receiving digital data coming from the frame store in full-duplex, giving 5 Mbps of bandwidth for: • • • • Triggering purposes, Auxiliary outputs Firmware upgrades, Audio channels Etc. DS60001303C-page 4 2012-2016 Microchip Technology Inc. EQCO30T5.2 1.1 Pinout and Pin Description FIGURE 1-2: TABLE 1-1: Pin Number (TAB) EQCO30T5.2 PIN DIAGRAM (VIEWED FROM TOP) EQdis LFout NC NC 16 15 14 13 SDIp 1 12 SDOp SDIn 2 11 SDOn GND 3 10 SD/HDB Rref 4 EQCO30T5 GND TAB 9 5 6 7 8 NC enable NC NC VCC EQCO30T5.2 PIN DESCRIPTIONS Pin Name GND Signal Type Power Description Use as single-point ground. 1, 2 SDIp, SDIn Differential Input Serial input positive/negative differential serial input. 3 GND Power Ground. Connect to GND TAB. 4 Rref Analog Input Input determining output amplitude of cable driver. 9 VCC Power +3.3V of power supply. 6 Enable Input Enables the output driver pins. 5, 7, 8, 13, 14 NC Input Do not connect; leave floating. Used for internal testing. 10 SD/HDB Input Select edge rate. 11 SDOn Driver Output Serial negative cable driver output with 50Ω on-chip serial output resistance. Complement with 25Ω externally. 12 SDOp Driver Output Serial positive cable driver output with 50Ω on-chip serial output resistance. Complement with 25Ω externally. 15 LFout Output Digital output signal of the full-duplex uplink. 16 EQdis Input Disables input trace equalization. 1.1.1 SDIP/SDIN SDIp/SDIn together form a differential input pair. Between SDIp and SDIn inputs, there is a termination resistor of 100Ω. The intention is to always use AC coupling. When AC-coupled, the common-mode gets biased to 600 mV. 1.1.2 RREF A resistor is to be connected between VCC and the Rref pin. A resistor of 750Ω gives an 800 mV launch amplitude in the 75Ω coaxial cables. A larger resistor gives a smaller amplitude. 1.1.3 ENABLE When enable is floating or pulled high, the output driver is enabled. When enable is low, the output is disabled and power consumption drops significantly. 2012-2016 Microchip Technology Inc. DS60001303C-page 5 EQCO30T5.2 1.1.4 SD/HDB With SD/HDB set to high, the output rise and fall times are set for SD operation. When left floating or pulled low, the rise and fall times are set for 3G/HD operation. 1.1.5 SDOn, SDOp The output driver is not based on a CML output stage. Both outputs operate independently, so there is very little interference between the outputs and their termination condition. There is also no LRoutput network needed for achieving good returnloss. A 25Ω resistor should be connected in series with the output to drive a 75Ω coax cable. The output amplitude is achieved behind this 25Ω resistor; refer to the application circuits at the end of the data sheet. The PCB doesn’t require layout changes when migrating from competing cable drivers, however, fewer components are needed. One does not need to optimize the return-loss network, since it is omitted. 1.1.6 LFOUT LFout provides the 5 Mbps received uplink signal (LVTTL voltage levels). It can easily drive a PCB trace of 20 pF at this speed. For longer distance communication from this pin to the next chip, using a buffer is recommended. The output impedance is about 300Ω. 1.1.7 EQdis When EQdis is left floating or pulled low, the input trace equalization is turned on and invokes a typical 3 dB gain at 1.5 GHz. This value is optimized for compensating the highfrequency losses of approximately 20 cm of 5-mil stripline in FR4. When pulled high, this equalization is turned off. DS60001303C-page 6 2012-2016 Microchip Technology Inc. EQCO30T5.2 1.2 Circuit Operation Figure 1-3 is a block diagram of the EQCO30T5, showing electrical connections. The input pre-driver brings the input signal to a digital signal, with or without the use of input trace equalization. The active splitter/ combiner/driver launches the digital signal in the cable, with an amplitude determined by the external resistor connected to Rref and with an edge rate for SD or 3G/ HD-SDI depending on the SD/HDB signal. It also splits the incoming signal towards the LF receiver to provide the 5 Mbps LFout signal. FIGURE 1-3: EQCO30T5 BLOCK DIAGRAM SHOWING ELECTRICAL CONNECTIONS EQdis SDIp Input Pre-Driver SDIn enable SD/HD Rref Active Signal Splitter/Combiner/Driver SDOp SDOn LF receiver EQCO30T5 2012-2016 Microchip Technology Inc. DS60001303C-page 7 EQCO30T5.2 2.0 APPLICATION INFORMATION 2.1 Typical Application Circuit as SMPTE Cable Driver Figure 2-1 illustrates a typical schematic implementation of the EQCO30T5 used as a cable driver for SMPTE video signals. FIGURE 2-1: EQCO30T5.2 TYPICAL APPLICATION CIRCUIT AS SMPTE CABLE DRIVER Resistors R8 and R9 are to be placed close to pins 12 and 11, respectively. From there onwards, the traces up to the coax connectors should be laid-out as 75Ω traces (including the C3 and C4 capacitors as AC-couplers). 2.1.1 RETURN-LOSS NETWORK Competing cable drivers need external RL return-loss networks. The EQCO30T5 does not need these type of external networks. Figure 2-2 compares the output network of the EQCO30T5 with the network of competing cable drivers. The EQCO30T5 is pin-compatible with other cable drivers, but with a different component population. No termination resistor to VCC is required (do not fit = DNF). The inductor of the return loss network must not be populated and the 75Ω resistor of this network should be replaced with a 25Ω resistor to achieve correct operation. DS60001303C-page 8 2012-2016 Microchip Technology Inc. EQCO30T5.2 FIGURE 2-2: Note: COMPARISON BETWEEN EQCO30T5 AND COMPETING SOLUTIONS Resistors marked DNF indicate “Do Not Fit” 2012-2016 Microchip Technology Inc. DS60001303C-page 9 EQCO30T5.2 2.2 EQCO30T5 in Bidirectional Link (Including Power Supply) FIGURE 2-3: EQCO30T5 IN BIDIRECTIONAL LINK (INCLUDING POWER SUPPLY TRANSMISSION) Resistors R8 and R9 are to be placed close to pins 12 and 11, respectively. From there onwards, the traces up to the coax connector SDIP1 should be laid out as 75Ω traces (including the C3 and C4 capacitors as AC couplers). Resistor R1 has to be placed very close to this coax connector with a very short, low-impedance connection between one of the shielding pins of the connector and the resistor. To achieve the return-loss illustrated in the appendix, the power and ground planes below components FB1, FB2, R3, R4, L1, R5, L2 should be removed (applying cut-outs). 2.2.1 COMPONENT RECOMMENDATION When using the components below, a maximum current of 900 mA can be communicated to power-up the camera side. Different types of inductors may be suitable in order to allow a higher current level, however, the RF quality of the inductor should be checked. Ferrite Beads Fb1, Fb2 = FBMH1608HM102 from Taiyo Yuden Inductor L1= 1812PS_103 from Coilcraft DS60001303C-page 10 2012-2016 Microchip Technology Inc. EQCO30T5.2 3.0 ELECTRICAL CHARACTERISTICS 3.1 Absolute Maximum Ratings Stresses beyond those listed under this section may cause permanent damage to the device. These are stress ratings only and are not tested. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections are not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. TABLE 3-1: ABSOLUTE MAXIMUM RATINGS Parameter Storage Temperature Ambient Temperature Operating Temperature Conditions Min. Typ. Max. Units — -65 — +150 °C Power applied -55 — +125 °C Normal operation (VCC = 1.2V ±5%) -40 — +85 °C — -0.8 — +3.6 V Supply Voltage to Ground DC Input Voltage — -0.8 — +3.6 V DC Voltage to Outputs — -0.8 — +3.6 V Outputs low — — 90 mA Current into Outputs TABLE 3-2: ELECTRICAL CHARACTERISTICS (OVER THE OPERATING VCC AND -40 TO +85°C RANGE) Parameter Description Min. Typ. Max. Unit 3.15 3.3 3.45 V — 45 — mA Power Supply VCC Supply voltage IS Supply current, both transmitting and receiving Operational Bit Rate BRoutput Bit rate cable driver output 0.05 — 4 Gbps BRuplink Bit rate uplink receiver 0.5 — 5 Mbps ⌂Vi Input amplitude VSDIp,n 2x100 — 2x900 mV VCMIN Input common-mode voltage — 600 — mV Rinput Differential input termination — 2x50 — Ω SDIp/SDIn Input 2012-2016 Microchip Technology Inc. DS60001303C-page 11 EQCO30T5.2 TABLE 3-2: ELECTRICAL CHARACTERISTICS (OVER THE OPERATING VCC AND -40 TO +85°C RANGE) (CONTINUED) SDOp connection to Coax Zcoax Coax cable characteristic impedance — 75 — Ω RSDOp, RSDOn Input impedance between SDOp and VCC/GND. To get to 75, add external 25Ω series resistor. 45 50 55 Ω Return-Loss as seen on SDOp pin having 25Ω series resistor. Frequency range = 5 MHz-1.5 GHz — — -15 dB Rloss Return-Loss as seen on SDOp pin having 25Ω series resistor. Frequency range = 1.5 GHz-3.0 GHz — — -10 dB Rloss ⌂VTX Transmit amplitude with Rref = 750Ω 720 800 880 mV trise_tx_SD Rise/Fall time 20% to 80% of ⌂VTX (SD/HDB = High) 400 — 800 ps trise_tx Rise/Fall time 20% to 80% of ⌂VTX (SD/HDB = Low) — — 65 ps — 15 — ns Min. Typ. Max. Units — 10 — ps LFO Output (LVTTL-like) Rise/Fall time 20% to 80% of VCC for 20 pF load trise_lLFO TABLE 3-3: JITTER NUMBERS(1) Parameter Conditions Additive peak to peak jitter on SDOp and Downlink signal = 3.0 Gbps SDOn 0-450m(2), @ low-speed signal = 5 Mbps, 8B/10B, and @ downlink — 50 — ns signal = 270 Mbps, 8B/10B Jitter numbers (over operating VCC range at -40°C to +85°C and full ⌂VTX range with pathological patterns) Measured with Belden 1694A coaxial cable Peak to peak jitter on LFO 1: 2: DS60001303C-page 12 2012-2016 Microchip Technology Inc. EQCO30T5.2 4.0 PACKAGING INFORMATION 4.1 Package Marking Information 16-Lead Plastic Quad Flat, No Lead Package – 4x4x0.9 mm Body [QFN] 16-Lead QFN (4x4x0.9 mm) PIN 1 Example PIN 1 EQCO 30T5.2 YYWWNNN Legend: XX...X Y YY WW NNN e3 * Note: YYWWNNN Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2012-2016 Microchip Technology Inc. DS60001303C-page 13 EQCO30T5.2 16-Lead Plastic Quad Flat, No Lead Package (8E) - 4x4x0.9 mm Body [QFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N NOTE 1 1 2 E (DATUM B) (DATUM A) 2X 0.20 C 2X TOP VIEW 0.20 C 0.10 C C A1 A SEATING PLANE 16X SIDE VIEW (A3) 0.10 0.08 C C A B D2 (16X K) 0.10 C A B E2 e 2 2 1 16X L N e BOTTOM VIEW 16X b 0.10 0.05 C A B C Microchip Technology Drawing C04-259B Sheet 1 of 2 DS60001303C-page 14 2012-2016 Microchip Technology Inc. EQCO30T5.2 16-Lead Plastic Quad Flat, No Lead Package (8E) - 4x4x0.9 mm Body [QFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits Number of Pins N e Pitch A Overall Height Standoff A1 A3 Terminal Thickness Overall Width E E2 Exposed Pad Width D Overall Length D2 Exposed Pad Length b Terminal Width Terminal Length L K Terminal-to-Exposed-Pad MIN 0.80 0.00 1.95 1.95 0.25 0.45 MILLIMETERS NOM 16 0.65 BSC 0.87 0.02 0.20 REF 4.00 BSC 2.05 4.00 BSC 2.05 0.30 0.55 0.425 REF MAX 0.95 0.05 2.15 2.15 0.35 0.65 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-259B Sheet 2 of 2 2012-2016 Microchip Technology Inc. DS60001303C-page 15 EQCO30T5.2 16-Lead Plastic Quad Flat, No Lead Package (8E) - 4x4x0.9 mm Body [QFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging C1 X2 16 G1 1 X1 2 C2 Y2 Y1 E SILK SCREEN RECOMMENDED LAND PATTERN Units Dimension Limits E Contact Pitch Optional Center Pad Width X2 Optional Center Pad Length Y2 Contact Pad Spacing C1 Contact Pad Spacing C2 Contact Pad Width (X16) X1 Contact Pad Length (X16) Y1 Contact Pad to Center Pad (X16) G1 MIN MILLIMETERS NOM 0.65 BSC MAX 2.15 2.15 3.625 3.625 0.30 0.725 0.20 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-2259A DS60001303C-page 16 2012-2016 Microchip Technology Inc. EQCO30T5.2 APPENDIX A: REVISION HISTORY Revision C (February 2016) • Removed electrostatic discharge ratings from Table 3-1. • Minor typographical changes. Revision B (February 2015) • Updated the typical application circuit diagrams in Figures 2-1 and 2-3. Revision A (September 2014) This is the initial release of the document in the Microchip format. This replaces EqcoLogic document version 2v0. TABLE A-1: VERSION HISTORY Version Date Author 2v0 1/27/14 A. Peeters Revision 1v0 3/13/12 A. Peeters Final document 0v2 1/17/12 M. Kuijk 0v1 1/6/12 B. Devuyst 2012-2016 Microchip Technology Inc. Comments Added Return-Loss measurement New document DS60001303C-page 17 EQCO30T5.2 APPENDIX B: TYPICAL RETURN-LOSS MEASUREMENT All measurements at VCC = 3.3V, Temp = +25ºC, data pattern = prbs15 (including 20 µs of each polarity of pathological pattern), measured with Belden 1694A cable. FIGURE B-1: TYPICAL RETURN-LOSS MEASUREMENT (DB VS MHZ) DS60001303C-page 18 2012-2016 Microchip Technology Inc. EQCO30T5.2 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our web site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. 2012-2016 Microchip Technology Inc. DS60001303C-page 19 EQCO30T5.2 PRODUCT IDENTIFICATION SYSTEM To order parts, including industrial, or obtain information, for e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. I RM Device Temp. Range Radio Module Device: Firmware F Revision Number EQCO30T5.2 Temperature Range: I Package: XXX Examples: a) EQCO30T5.2 b) EQCO30T5.2-TRAY = Industrial temperature, 16-Lead QFN Tube packaging = Industrial temperature, 16-Lead QFN Tray packaging = -40C to +85C (Industrial temperature) TRAY = Tray (Blank) = Tube DS60001303C-page 20 2012-2016 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. 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Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2012-2016 Microchip Technology Inc. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2012-2016, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. 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