TFA9887 Audio system with adaptive sound maximizer and speaker protection Rev. 1 — 11 July 2012 Product short data sheet 1. General description The TFA9887 is an audio system consisting of a high efficiency class-D audio amplifier, and embedded DSP with a sophisticated speaker-boost and protection algorithm and an intelligent DC-to-DC converter. It can safely deliver 2.65 W (RMS; THD = 1 %) output power into a 4 speaker that is nominally only rated for 0.5 W. The integrated intelligent DC-to-DC converter allows the system to deliver this power from a battery voltage of 3.6 V. The audio input interface is I2S and the control settings are communicated via an I2C-bus interface. The TFA9887 guarantees safe speaker operation under all operating conditions. It maximizes acoustic output while ensuring diaphragm displacement and voice coil temperature do not exceed rated limits. The processing is capable of providing a significant improvement in sound volume and quality, while also ensuring reliable operation. This function is based on and adaptive model that operates in all loudspeaker environments (e.g. free air, closed box or vented box). Furthermore, advanced signal processing ensures the quality of the audio signal is always optimized. Adaptive DC-to-DC conversion boosts the supply voltage only when necessary (when the output signal level is high). This maximizes the output power of the class-D audio amplifier while limiting quiescent power consumption. The TFA9887 also adapts the amplifier gain to limit battery current when the battery voltage is low. The device features low RF susceptibility because it has a digital input interface that is insensitive to clock jitter. The second order closed loop architecture used in a class-D audio amplifier provides excellent audio performance and high supply voltage ripple rejection. The TFA9887 is available in a 29-bump WLCSP (Wafer Level Chip-Size Package) with a 400 m pitch. 2. Features and benefits Sophisticated speaker-boost and protection algorithm that maximizes speaker performance while protecting the speaker: Fully embedded software, no additional license fee or porting required. Total integrated solution that includes DSP, amplifier, DC-to-DC, sensing and more. Adaptive excursion control - guarantees that the speaker membrane excursion never exceeds its rated limit Real-time temperature protection - direct measurement ensures that voice coil temperature never exceeds its rated limit TFA9887 NXP Semiconductors Audio system with adaptive sound maximizer and speaker protection Environmentally aware - automatically adapts speaker parameters to acoustic and thermal changes including compensation for speaker-box leakage Output power: 2.65 W (RMS) into 4 at 3.6 V supply voltage (THD = 1 %) Clip avoidance - DSP algorithm prevents clipping even with sagging supply voltage Bandwidth extension option to increase low frequency response Intelligent DC-to-DC converter maximizes audio headroom from any supply level and limits current consumption at low battery voltages Compatible with standard Acoustic Echo Cancellers (AECs) High efficiency and low-power dissipation High efficiency and low-power dissipation Wide supply voltage range (fully operational from 2.5 V to 5.5 V) Two I2S inputs to support two audio sources I2C-bus control interface (400 kHz) Dedicated speech mode with speech activity detector Speaker current and voltage monitoring (via the I2S-bus) for Acoustic Echo Cancellation (AEC) at the host Fully short-circuit proof across the load and to the supply lines Sample frequencies from 8 kHz to 48 kHz supported 3 bit clock/word select ratios supported (32x, 48x, 64x) Option to route I2S input direct to I2S output to allow a second I2S output slave device to be used in combination with the TFA9887 TDM interface supported Volume control Low RF susceptibility Input clock jitter insensitive interface Thermally protected ‘Pop noise' free at all mode transitions 3. Applications TFA9887_SDS Product short data sheet Mobile phones Tablets Ultrabooks and Notebooks Portable gaming devices Portable Navigation Devices (PND) MP3 players and portable media players All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 July 2012 © NXP B.V. 2012. All rights reserved. 2 of 20 TFA9887 NXP Semiconductors Audio system with adaptive sound maximizer and speaker protection 4. Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit VBAT battery supply voltage on pin VBAT 2.5 - 5.5 V VDDD digital supply voltage on pin VDDD 1.65 1.8 1.95 V IBAT battery supply current on pin VBAT and in DC-to-DC converter coil; operating modes with load; DC-to-DC converter in Adaptive boost mode - 1.55 - mA on pin VBAT and in DC-to-DC converter coil; Power-down mode - - 1 A on pin VDDD; operating modes; speaker-boost and protection activated - 20 - mA on pin VDDD; operating modes; CoolFlux DSP bypassed - 4.8 - mA on pin VDDD; Power-down mode; BCK1 = WS1 = DATAI1 = BCK2 = WS2 = DATAI2 = DATAI3 = 0 V - 10 - A RL = 4 ; fs = 48 kHz - 2.55 - W RL = 4 ; fs = 32 kHz - 2.65 - W RL = 8 ; fs = 48 kHz - 1.5 - W RL = 8 ; fs = 32 kHz - 1.65 - W digital supply current IDDD RMS output power Po(RMS) CLIP = 00 5. Ordering information Table 2. Ordering information Type number TFA9887UK Package Name Description Version WLCSP29 wafer level chip-size package; 29 bumps; 3.19 2.07 mm TFA9887 TFA9887_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 July 2012 © NXP B.V. 2012. All rights reserved. 3 of 20 TFA9887 NXP Semiconductors Audio system with adaptive sound maximizer and speaker protection 6. Block diagram VDDD ADS1 ADS2 VBAT INB E3 A5 A6 E5 E7 TFA9887 SCL D2 RAM/ROM MEMORY I2C INTERFACE SDA E2 ADAPTIVE DC-to-DC CONVERTER E6 BST D7 GNDB B6 VDDP C7 OUTA A7 OUTB B7 GNDP DATAI3 A4 REGISTERS DATAI1 A3 R 1/2 WS1 B2 I2S DATAI2 A1 L 1/2 INPUT INTERFACE (x2) BCK1 C2 M U X SPEAKER PROTECTION ALGORITHM AND VOLUME CONTOL (CoolFlux DSP) R3 M U X L3 gain CHS3 WS2 B1 CLIPPER DSP out PWM CLASS-D AUDIO AMPLIFIER HPF Isense gain without pilot tone BCK2 C1 DATAO A2 I2S OUTPUT INTERFACE M U X current sensing CURRENTSENSING PROCESSOR ADC I2SDOC TEMP SENSE M U X PLL VBAT SENSE PROTECTION: OTP OVP UVP OCP IDP IPLL Fig 1. E4 C6 D6 B4 C4 D4 D1, E1 GNDD TEST1 TEST2 TEST3 TEST4 TEST5 n.c. 010aaa719 Block diagram TFA9887_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 July 2012 © NXP B.V. 2012. All rights reserved. 4 of 20 TFA9887 NXP Semiconductors Audio system with adaptive sound maximizer and speaker protection 7. Pinning information 7.1 Pinning 1 2 3 4 5 6 bump A1 index area 7 E 2 3 4 5 6 7 A D B C C B D A E bump A1 index area 010aaa734 010aaa735 a. Bottom view Fig 2. 1 b. Transparent top view Bump configuration 1 2 A DATAI2 DATAO B WS2 WS1 C BCK2 D E 3 4 5 6 7 ADS1 ADS2 OUTB TEST3 VDDP GNDP BCK1 TEST4 TEST1 OUTA n.c. SCL TEST5 TEST2 GNDB n.c. SDA DATAI1 DATAI3 VDDD GNDD VBAT BST INB 010aaa736 Transparent top view Fig 3. TFA9887_SDS Product short data sheet Bump mapping All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 July 2012 © NXP B.V. 2012. All rights reserved. 5 of 20 TFA9887 NXP Semiconductors Audio system with adaptive sound maximizer and speaker protection Table 3. Pinning Symbol Pin Type Description DATAI2 A1 I digital audio data input 2 DATAO A2 O digital audio data output DATAI1 A3 I digital audio data input 1 DATAI3 A4 I digital audio data input 3 ADS1 A5 I address select input 1 ADS2 A6 I address select input 2 OUTB A7 O inverting output WS2 B1 I digital audio word select input 2 WS1 B2 I digital audio word select input 1 I test signal input 3; for test purposes only, connect to PCB ground B6 P power supply voltage GNDP B7 P power ground BCK2 C1 I digital audio bit clock input 2 BCK1 C2 I digital audio bit clock input 1 O test signal input 4; for test purposes only, connect to PCB ground B3 TEST3 B4 B5 VDDP C3 TEST4 C4 C5 TEST1 C6 I test signal input 1; for test purposes only, connect to BST OUTA C7 O non-inverting output n.c. D1 - not connected; connect to D2 or to PCB ground SCL D2 I I2C-bus clock input I test signal input 5; for test purposes only, connect to PCB ground D3 TEST5 D4 D5 TFA9887_SDS Product short data sheet TEST2 D6 I test signal input 2; for test purposes only, connect to BST GNDB D7 P boosted ground n.c. E1 - not connected; connect to E2 or to PCB ground SDA E2 I/O I2C-bus data input/output VDDD E3 P digital supply voltage GNDD E4 P digital ground VBAT E5 I battery supply voltage sense input VBST E6 O boosted supply voltage output INB E7 P DC-to-DC boost converter input All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 July 2012 © NXP B.V. 2012. All rights reserved. 6 of 20 TFA9887 NXP Semiconductors Audio system with adaptive sound maximizer and speaker protection 8. Functional description The TFA9887 is a highly efficient mono Bridge Tied Load (BTL) class-D audio amplifier with a sophisticated speaker-boost protection algorithm. Figure 1 is a block diagram of the TFA9887. The device contains three I2S input interfaces and one I2S output interface. One of I2S inputs DATAI1 and DATAI2 can be selected as the audio input stream. The third I2S input, DATAI3, is provided to support stereo applications and the I2S pass-through option. The pass-through option is provided to allow an I2S output slave device (for example, a CODEC), connected in parallel with the TFA9887, to be routed directly to the audio host via the I2S output. The I2S output signal on DATAO can be configured to transmit the DSP output signal, amplifier output current information, DATAI3 Left or Right signal information or amplifier gain information. The gain information can be used to facilitate communication between two devices in stereo applications. The speaker-boost protection algorithm, running on a CoolFlux Digital Signal Processor (DSP) core, maximizes the acoustical output of the speaker while limiting membrane excursion and voice coil temperature to a safe level. The mechanical protection implemented guarantees that speaker membrane excursion never exceeds its rated limit, to an accuracy of 10 %. Thermal protection guarantees that the voice coil temperature never exceeds its rated limit, to an accuracy of 10 C. Furthermore, advanced signal processing ensures the audio quality remains acceptable at all times. The speaker-boost protection algorithm boosts the output sound pressure level within given mechanical, thermal and quality limits. An optional Bandwidth extension mode extends the low frequency response up to a predefined limit before maximizing the output level. This mode is suitable for listening to high-quality music in quiet environments. The frequency response of the TFA9887 can be modified via ten fully programmable cascaded second-order biquad filters. The first two biquads are processed with 48-bit double precision; biquads 3 to 8 are processed with 24-bit single precision. At low battery voltage levels, the gain is automatically reduced to limit battery current. The output volume can be controlled by the speaker-boost protection algorithm or by the host application (external). In the latter case, the boost features of the speaker-boost protection algorithm must be disabled to avoid neutralizing external volume control. The speaker-boost protection algorithm output is converted into two pulse width modulated (PWM) signals which are then injected into the class-D audio amplifier. The 3-level PWM scheme supports filterless speaker drive. The adaptive DC-to-DC converter boosts the battery supply voltage in line with the output of the speaker-boost protection algorithm. It switches to Follower mode (VBST = VBAT; no boost) when the audio output voltage is lower than the battery voltage. 8.1 Protection mechanisms The following protection circuits are included in the TFA9887: • OverTemperature Protection (OTP) TFA9887_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 July 2012 © NXP B.V. 2012. All rights reserved. 7 of 20 TFA9887 NXP Semiconductors Audio system with adaptive sound maximizer and speaker protection • • • • OverVoltage Protection (OVP) UnderVoltage Protection (UVP) OverCurrent Protection (OCP) Invalid Data Protection (IDP) The reaction of the device to fault conditions differs depending on the protection circuit involved. 8.1.1 OverTemperature Protection (OTP) OTP prevents heat damage to the TFA9887. It is triggered when the junction temperature exceeds Tact(th_prot). When this happens, the output stages are set floating. OTP is cleared automatically via an internal timer (approximately 200 ms), after which the output stages will start to operate normally again. 8.1.2 Supply voltage protection (UVP and OVP) UVP is activated, setting the outputs floating, if VBAT drops below the undervoltage protection threshold, VP(uvp). When the supply voltage rises above VP(uvp) again, the system will be restarted after approximately 200 ms. OVP is activated, setting the power stages floating, if the power supply voltage (VDDP) rises above the overvoltage protection threshold, VP(ovp). The power stages are re-enabled as soon as the supply voltage drops below VP(ovp) again. The system will be restarted after approximately 200 ms. 8.1.3 OverCurrent Protection (OCP) OCP will detect a short circuit across the load or between one of the amplifier outputs and one of the supply lines. If the output current exceeds the overcurrent protection threshold (IO(ocp)), it will be limited to IO(ocp) while the amplifier outputs are switching (the amplifier is not powered down completely). This is called current limiting. The amplifier can distinguish between an impedance drop at the loudspeaker and a low-ohmic short circuit across the load or to one of the supply lines. The impedance threshold depends on which supply voltage is being used: 8.1.4 Invalid Data Protection (IDP) IDP checks if the word select signal is correctly connected to the TFA9887. It the bit clock/word select (BCK-to-WS) ratio is not stable, the IDP alarm is raised and the TFA9887 powers down.The TFA9887 starts up again automatically when the BCK-to-WS ratio stabilizes. 8.2 Battery supply voltage monitor The voltage level at the battery connected to the TFA9887 can be monitored via the I2C-bus. Status bits BATS in the Battery status register. TFA9887_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 July 2012 © NXP B.V. 2012. All rights reserved. 8 of 20 TFA9887 NXP Semiconductors Audio system with adaptive sound maximizer and speaker protection 9. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VBAT battery supply voltage on pin VBAT 0.3 +5.5 V VDDP power supply voltage on pin VDDP 0.3 +5.5 V VDDD digital supply voltage on pin VDDD 0.3 +1.95 V Tj junction temperature - +150 C Tstg storage temperature 55 +150 C Tamb ambient temperature VESD electrostatic discharge voltage 40 +85 C according to Human Body Model (HBM) 2 +2 kV according to Charge Device Model (CDM) 500 +500 V 10. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Typ Rth(j-a) thermal resistance from junction to ambient in free air; natural convection - 4-layer application board 60 Unit K/W 11. Characteristics 11.1 DC Characteristics Table 6. DC characteristics All parameters are guaranteed for VBAT = 3.6 V; VDDD = 1.8 V; VDDP = VBST = 5.3 V; LBST = 1 H[1]; RL = 4 [1]; LL = 20 H[1]; fi = 1 kHz; fs = 48 kHz; Tamb = 25 C; default settings, unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VBAT battery supply voltage on pin VBAT 2.5 - 5.5 V VDDP power supply voltage on pin VDDP 2.5 - 5.5 V VDDD digital supply voltage on pin VDDD 1.65 1.8 1.95 V IBAT battery supply current on pin VBAT and in the DC-to-DC converter coil; operating modes with load; DC-to-DC converter in Adaptive boost mode - 1.55 - mA on pin VBAT and in the DC-to-DC converter coil; Power-down mode - - 1 A on pin VDDD; operating modes; speaker-boost protection activated - 20 - mA on pin VDDD; operating modes; CoolFlux DSP bypassed - 4.8 - mA on pin VDDD; Power-down mode; BCK1 = WS1 = DATAI1 = BCK2 = WS2 = DATAI2 = DATAI3 = 0 V - 10 - A 3.6 V IDDD digital supply current Pins BCK1, WS1, DATA1, BCK2, WS2, DATAI2, DATAI3, ADS1, ADS2, SCL, SDA VIH HIGH-level input voltage TFA9887_SDS Product short data sheet 0.7VDDD All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 July 2012 © NXP B.V. 2012. All rights reserved. 9 of 20 TFA9887 NXP Semiconductors Audio system with adaptive sound maximizer and speaker protection Table 6. DC characteristics …continued All parameters are guaranteed for VBAT = 3.6 V; VDDD = 1.8 V; VDDP = VBST = 5.3 V; LBST = 1 H[1]; RL = 4 [1]; LL = 20 H[1]; fi = 1 kHz; fs = 48 kHz; Tamb = 25 C; default settings, unless otherwise specified. Symbol Parameter VIL LOW-level input voltage Cin input capacitance ILI input leakage current Conditions Min Typ Max Unit - - 0.3VDDD V - - 3 pF 1.8 V on input pin - - 0.1 A Pins DATAO, SDA VOH HIGH-level output voltage IOH = 4 mA - - VDDD 0.4 V VOL LOW-level output voltage IOL = 4 mA - - 400 mV VDDP = 5.3 V - 100 - m 130 - 150 C Pins OUTA, OUTB RDSon drain-source on-state resistance Protection Tact(th_prot) thermal protection activation temperature VP(ovp) overvoltage protection supply voltage protection on VDDP 5.5 - 6.0 V VP(uvp) undervoltage protection supply protection on VBAT voltage 2.3 - 2.5 V IO(ocp) overcurrent protection output current 1.45 - - A 5.25 5.3 5.35 V DC-to-DC converter VBST [1] voltage on pin BST DCVO = 111; Boost mode LBST = boot converter inductance; RL = load resistance; LL = load inductance (speaker). TFA9887_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 July 2012 © NXP B.V. 2012. All rights reserved. 10 of 20 TFA9887 NXP Semiconductors Audio system with adaptive sound maximizer and speaker protection 11.2 AC characteristics Table 7. AC characteristics All parameters are guaranteed for VBAT = 3.6 V; VDDD = 1.8 V; VDDP = VBST = 5.3 V; LBST = 1 H[1]; RL = 4 [1]; LL = 20 H[1]; fi = 1 kHz; fs = 48 kHz; Tamb = 25 C; default settings, unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit RL = 4 ; fs = 48 kHz - 2.55 - W RL = 4 ; fs = 32 kHz - 2.65 - W Amplifier output power Po(RMS) RMS output power THD+N = 1 %; CLIP = 00 RL = 8 ; fs = 48 kHz - 1.5 - W RL = 8 ; fs = 32 kHz - 1.65 - W RL = 4 ; fs = 48 kHz - 3.75 - W RL = 4 ; fs = 32 kHz - 3.75 - W RL = 8 ; fs = 48 kHz - 2 - W RL = 8 ; fs = 32 kHz - 2 - W - - 1 mV - 0.03 0.1 % CoolFlux DSP bypassed - 31 - V CoolFlux DSP enabled - 45 - V CoolFlux DSP bypassed - 100 - dB CoolFlux DSP enabled - 97 - dB - 90 - dB - - 2 ms - - 6 ms THD+N = 10 %; CLIP = 00 Amplifier output; pins OUTA and OUTB VO(offset) output offset voltage absolute value Amplifier performance THD+N total harmonic distortion-plus-noise Po(RMS) = 100 mW; RL = 8 ; LL = 44 H Vn(o) output noise voltage S/N signal-to-noise ratio PSRR power supply rejection ratio A-weighted; DATAI1 = DATAI2 = 0 V VO = 4.5 V (peak); A-weighted Vripple = 200 mV (RMS); fripple = 217 Hz Amplifier power-up, power-down and propagation delays td(on) turn-on delay time PLL locked on BCK (IPLL = 0) fs = 8 kHz to 48 kHz PLL locked on WS (IPLL = 1) fs = 48 kHz td(off) turn-off delay time - - 10 s td(mute_off) mute off delay time - 1 - ms td(soft_mute) soft mute delay time - 1 - ms [1] LBST = boot converter inductance; RL = load resistance; LL = load inductance (speaker). TFA9887_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 July 2012 © NXP B.V. 2012. All rights reserved. 11 of 20 TFA9887 NXP Semiconductors Audio system with adaptive sound maximizer and speaker protection 12. Application information 12.1 Application diagram 1.8 V battery SDA I2C E3 E5 C6 VDDP BASEBAND PROCESSOR TEST2 100 nF VBAT VDDD CVDDD TEST1 LBST D6 SCL 22 μF B6 E6 E1 E7 n.c. CVBAT 10 μF CVDDP E2 1 μH BST INB D2 n.c. D1 BCK2 DATAI3 OUTB speaker 4 Ω, 6 Ω or 8 Ω A2 A1 B1 C1 A4 ADS2 ADS1 A5 A6 D7 B7 E4 B4 C4 D4 TEST5 WS2 A7 TEST4 DATAI2 TFA9887 C2 TEST3 DATAO OUTA B2 GNDD BCK1 GNDP WS1 I2S C7 A3 GNDB DATAI1 010aaa723 Fig 4. TFA9887_SDS Product short data sheet Typical mono application (simplified) All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 July 2012 © NXP B.V. 2012. All rights reserved. 12 of 20 TFA9887 NXP Semiconductors Audio system with adaptive sound maximizer and speaker protection 13. Package outline :/&63ZDIHUOHYHOFKLSVL]HSDFNDJHEXPSV[PP ^ 7)$ % ] \ _ _[ ^ Z % ^ % > * + 9 $ \ ] \% ' ><< < ?<<@J < Q ; < < < << '=9 % '=%% '=># '=%# >=%%> %=' '=%' '=>9 '=%9 >="> %='$ '=* '=# '=>* '=%* >=9> %='* % %=* '=+#$ '=%99 '=%9+ =9 '='+ '='* '='% '=++$ '=%>9 '=%>+ '=+%$ '=%'9 '=%'+ [ Z \ \% \ WIDBSR %&'*&$ %&'+&9 !"##$ Fig 5. Package outline TFA9887 (WLCSP29) TFA9887_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 July 2012 © NXP B.V. 2012. All rights reserved. 13 of 20 TFA9887 NXP Semiconductors Audio system with adaptive sound maximizer and speaker protection 14. Soldering of WLCSP packages 14.1 Introduction to soldering WLCSP packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface mount reflow soldering description”. Wave soldering is not suitable for this package. All NXP WLCSP packages are lead-free. 14.2 Board mounting Board mounting of a WLCSP requires several steps: 1. Solder paste printing on the PCB 2. Component placement with a pick and place machine 3. The reflow soldering itself 14.3 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 6) than a PbSn process, thus reducing the process window • Solder paste printing issues, such as smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature), and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic) while being low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 8. Table 8. Lead-free process (from J-STD-020C) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 6. TFA9887_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 July 2012 © NXP B.V. 2012. All rights reserved. 14 of 20 TFA9887 NXP Semiconductors Audio system with adaptive sound maximizer and speaker protection maximum peak temperature = MSL limit, damage level temperature minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 6. Temperature profiles for large and small components For further information on temperature profiles, refer to application note AN10365 “Surface mount reflow soldering description”. 14.3.1 Stand off The stand off between the substrate and the chip is determined by: • The amount of printed solder on the substrate • The size of the solder land on the substrate • The bump height on the chip The higher the stand off, the better the stresses are released due to TEC (Thermal Expansion Coefficient) differences between substrate and chip. 14.3.2 Quality of solder joint A flip-chip joint is considered to be a good joint when the entire solder land has been wetted by the solder from the bump. The surface of the joint should be smooth and the shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps after reflow can occur during the reflow process in bumps with high ratio of bump diameter to bump height, i.e. low bumps with large diameter. No failures have been found to be related to these voids. Solder joint inspection after reflow can be done with X-ray to monitor defects such as bridging, open circuits and voids. 14.3.3 Rework In general, rework is not recommended. By rework we mean the process of removing the chip from the substrate and replacing it with a new chip. If a chip is removed from the substrate, most solder balls of the chip will be damaged. In that case it is recommended not to re-use the chip again. TFA9887_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 July 2012 © NXP B.V. 2012. All rights reserved. 15 of 20 TFA9887 NXP Semiconductors Audio system with adaptive sound maximizer and speaker protection Device removal can be done when the substrate is heated until it is certain that all solder joints are molten. The chip can then be carefully removed from the substrate without damaging the tracks and solder lands on the substrate. Removing the device must be done using plastic tweezers, because metal tweezers can damage the silicon. The surface of the substrate should be carefully cleaned and all solder and flux residues and/or underfill removed. When a new chip is placed on the substrate, use the flux process instead of solder on the solder lands. Apply flux on the bumps at the chip side as well as on the solder pads on the substrate. Place and align the new chip while viewing with a microscope. To reflow the solder, use the solder profile shown in application note AN10365 “Surface mount reflow soldering description”. 14.3.4 Cleaning Cleaning can be done after reflow soldering. TFA9887_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 July 2012 © NXP B.V. 2012. All rights reserved. 16 of 20 TFA9887 NXP Semiconductors Audio system with adaptive sound maximizer and speaker protection 15. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes TFA9887_SDS v.1 20120711 Product short data sheet - - TFA9887_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 July 2012 © NXP B.V. 2012. All rights reserved. 17 of 20 TFA9887 NXP Semiconductors Audio system with adaptive sound maximizer and speaker protection 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 16.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. TFA9887_SDS Product short data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 July 2012 © NXP B.V. 2012. All rights reserved. 18 of 20 TFA9887 NXP Semiconductors Audio system with adaptive sound maximizer and speaker protection Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP B.V. CoolFlux — is a trademark of NXP B.V. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] TFA9887_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 July 2012 © NXP B.V. 2012. All rights reserved. 19 of 20 TFA9887 NXP Semiconductors Audio system with adaptive sound maximizer and speaker protection 18. Contents 1 2 3 4 5 6 7 7.1 8 8.1 8.1.1 8.1.2 8.1.3 8.1.4 8.2 9 10 11 11.1 11.2 12 12.1 13 14 14.1 14.2 14.3 14.3.1 14.3.2 14.3.3 14.3.4 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Quick reference data . . . . . . . . . . . . . . . . . . . . . 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pinning information . . . . . . . . . . . . . . . . . . . . . . 5 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Functional description . . . . . . . . . . . . . . . . . . . 7 Protection mechanisms . . . . . . . . . . . . . . . . . . 7 OverTemperature Protection (OTP) . . . . . . . . . 8 Supply voltage protection (UVP and OVP) . . . . 8 OverCurrent Protection (OCP) . . . . . . . . . . . . . 8 Invalid Data Protection (IDP) . . . . . . . . . . . . . . 8 Battery supply voltage monitor . . . . . . . . . . . . . 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9 Thermal characteristics . . . . . . . . . . . . . . . . . . 9 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 9 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . 9 AC characteristics. . . . . . . . . . . . . . . . . . . . . . 11 Application information. . . . . . . . . . . . . . . . . . 12 Application diagram . . . . . . . . . . . . . . . . . . . . 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13 Soldering of WLCSP packages. . . . . . . . . . . . 14 Introduction to soldering WLCSP packages . . 14 Board mounting . . . . . . . . . . . . . . . . . . . . . . . 14 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 14 Stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Quality of solder joint . . . . . . . . . . . . . . . . . . . 15 Rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 17 Legal information. . . . . . . . . . . . . . . . . . . . . . . 18 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Contact information. . . . . . . . . . . . . . . . . . . . . 19 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 11 July 2012 Document identifier: TFA9887_SDS