INTEGRATED CIRCUITS DATA SHEET TDA1517; TDA1517P 2 x 6 W stereo power amplifier Product specification Supersedes data of 2002 Jan 17 2004 Feb 18 NXP Semiconductors Product specification 2 x 6 W stereo power amplifier TDA1517; TDA1517P FEATURES GENERAL DESCRIPTION • Requires very few external components The TDA1517 is an integrated class-B dual output amplifier in a plastic single in-line medium power package with fin (SIL9MPF), a plastic rectangular-bent single in-line medium power package with fin (RBS9MPF) or a plastic heat-dissipating dual in-line package (HDIP18). The device is primarily developed for multi-media applications. • High output power • Fixed gain • Good ripple rejection • Mute/standby switch • AC and DC short-circuit safe to ground and VP • Thermally protected • Reverse polarity safe • Capability to handle high energy on outputs (VP = 0 V) • No switch-on/switch-off plop • Electrostatic discharge protection. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VP supply voltage 6.0 14.4 18.0 V IORM repetitive peak output current − − 2.5 A Iq(tot) total quiescent current − 40 80 mA Isb standby current − 0.1 100 μA Isw switch-on current − − 40 μA |ZI| input impedance Po output power 50 − − kΩ RL = 4 Ω; THD = 0.5% − 5 − W RL = 4 Ω; THD = 10% − 6 − W SVRR supply voltage ripple rejection 48 − − dB αcs channel separation 40 − − dB Gv closed loop voltage gain 19 20 21 dB Vno(rms) noise output voltage (RMS value) − 50 − μV Tc crystal temperature − − 150 °C fi = 100 Hz to 10 kHz ORDERING INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION VERSION TDA1517/N3 SIL9MPF plastic single in-line medium power package with fin; 9 leads SOT110-1 TDA1517/N3/S5 RBS9MPF plastic rectangular-bent single in-line medium power package with fin; 9 leads SOT352-1 plastic heat-dissipating dual in-line package; 18 leads SOT398-1 TDA1517P 2004 Feb 18 HDIP18 2 NXP Semiconductors Product specification 2 x 6 W stereo power amplifier TDA1517; TDA1517P BLOCK DIAGRAM handbook, full pagewidth non-inverting input 1 1 mute switch Cm 60 kΩ 4 VA output 1 2 kΩ power stage 18 kΩ VP 8 stand-by switch mute/stand-by switch input stand-by reference voltage VA 15 kΩ x1 supply voltage ripple rejection output mute switch 3 15 kΩ mute reference voltage TDA1517 18 kΩ 2 kΩ non-inverting input 2 6 VA 9 60 kΩ input reference voltage mute switch Cm power stage signal ground 2 power ground 5 (substrate) 7 MLC351 VP SGND PGND Fig.1 Block diagram. 2004 Feb 18 3 output 2 NXP Semiconductors Product specification 2 x 6 W stereo power amplifier TDA1517; TDA1517P PINNING SYMBOL PIN DESCRIPTION −INV1 1 non-inverting input 1 SGND 2 signal ground SVRR 3 supply voltage ripple rejection output OUT1 4 output 1 PGND 5 power ground OUT2 6 output 2 VP 7 supply voltage M/SS 8 mute/standby switch input −INV2 9 non-inverting input 2 handbook, halfpage INV1 1 SGND handbook, halfpage INV1 1 18 2 SGND 2 17 SVRR 3 SVRR 3 16 OUT1 4 OUT1 4 15 PGND 5 PGND 5 OUT2 6 OUT2 6 13 VP 7 VP 7 12 M/SS 8 M/SS 8 11 INV2 9 INV2 9 10 TDA1517 MLC352 TDA1517P 14 MLC353 Pins 10 to 18 should be connected to GND or floating. Fig.2 Pin configuration for SOT110-1 and SOT352-1. Fig.3 Pin configuration for SOT398-1. FUNCTIONAL DESCRIPTION The TDA1517 contains two identical amplifiers with differential input stages. The gain of each amplifier is fixed at 20 dB. A special feature of the device is the mute/standby switch which has the following features: • Low standby current (<100 μA) • Low mute/standby switching current (low cost supply switch) • Mute condition. 2004 Feb 18 4 NXP Semiconductors Product specification 2 x 6 W stereo power amplifier TDA1517; TDA1517P LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VP PARAMETER CONDITIONS supply voltage MIN. MAX. UNIT operating − 18 V no signal − 20 V VP(sc) AC and DC short-circuit safe voltage − 18 V VP(r) reverse polarity − 6 V ERGO energy handling capability at outputs − 200 mJ IOSM non-repetitive peak output current − 4 A IORM repetitive peak output current − 2.5 A Ptot total power dissipation − 15 W Tstg storage temperature −55 +150 °C Tamb operating ambient temperature −40 +85 °C Tc crystal temperature − 150 °C VP = 0 V see Fig.4 THERMAL RESISTANCE SYMBOL TYPE NUMBER PARAMETER VALUE UNIT Rth(j-c) TDA1517/N3; TDA1517/N3/S5 thermal resistance from junction to case 8 K/W Rth(j-p) TDA1517P thermal resistance from junction to pins 15 K/W Rth(j-a) TDA1517/N3; TDA1517/N3/S5; thermal resistance from junction to TDA1517P ambient 50 K/W MLC354 18 handbook, halfpage P (W) 12 (1) (2) 6 0 25 0 50 100 150 o T amb ( C) (1) Rth j-c = 8 K/W. (2) Rth j-p = 15 K/W. Fig.4 Power derating curve. 2004 Feb 18 5 NXP Semiconductors Product specification 2 x 6 W stereo power amplifier TDA1517; TDA1517P DC CHARACTERISTICS VP = 14.4 V; Tamb = 25 °C; measured in Fig.6; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT 18.0 V Supply VP supply voltage Iq(tot) VO note 1 6.0 14.4 total quiescent current − 40 80 mA DC output voltage − 6.95 − V see Fig.5 8.5 − − V VI(max) = 1 V; fi = 20 Hz to 15 kHz − − 2 mV Mute/standby switch V8 switch-on voltage level Mute condition VO output signal in mute position Standby condition Isb DC current in standby condition − − 100 μA Vsw switch-on current − 12 40 μA Note 1. The circuit is DC adjusted at VP = 6 to 18 V and AC operating at VP = 8.5 to 18 V. 2004 Feb 18 6 NXP Semiconductors Product specification 2 x 6 W stereo power amplifier TDA1517; TDA1517P AC CHARACTERISTICS VP = 14.4 V; RL = 4 Ω; f = 1 kHz; Tamb = 25 °C; measured in Fig.6; unless otherwise specified. SYMBOL Po PARAMETER output power THD total harmonic distortion CONDITIONS MIN. TYP. MAX. UNIT THD = 0.5%; note 1 4 5 − W THD = 10%; note 1 5.5 6.0 − W Po = 1 W − 0.1 − % flr low frequency roll-off at −3 dB; note 2 − 45 − Hz fhr high frequency roll-off at −1 dB 20 − − kHz Gv closed loop voltage gain 19 20 21 dB SVRR supply voltage ripple rejection on 48 − − dB mute 48 − − dB standby 80 − − dB 50 60 75 kΩ − 50 − μV |Zi| input impedance Vno noise output voltage note 3 on Rs = 0 Ω; note 4 on Rs = 10 Ω; note 4 − 70 100 μV mute note 5 − 50 − μV Rs = 10 Ω 40 − − dB − 0.1 1 dB αcs channel separation |ΔGv| channel unbalance Notes 1. Output power is measured directly at the output pins of the IC. 2. Frequency response externally fixed. 3. Ripple rejection measured at the output with a source impedance of 0 Ω, maximum ripple amplitude of 2 V (p-p) and a frequency between 100 Hz and 10 kHz. 4. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz. 5. Noise output voltage independent of Rs (VI = 0 V). 2004 Feb 18 7 NXP Semiconductors Product specification 2 x 6 W stereo power amplifier ;;;;;;; ;;;;;;; ;;;;;;; ;;;;;;; ;;;;;;; ;;;;;;; ;;;;;;; ;;;;;;; MLC355 handbook, halfpage 18 V11 (V) TDA1517; TDA1517P ON (IP = 40 mA) 8.5 6.4 mute (IP = 40 mA) 3.3 2 standby (I P 0 100 μA) Fig.5 Standby, mute and on conditions. APPLICATION INFORMATION standby switch handbook, full pagewidth VP 100 μF 100 nF 3 input reference voltage 8 2200 μF 7 internal 1/2 V P TDA1517 220 nF input 1 20 dB 60 kΩ 20 dB 1 60 kΩ 9 2 5 6 4 MLC356 signal ground power ground 1000 μF 1000 μF Fig.6 Application circuit diagram. 2004 Feb 18 8 220 nF input 2 NXP Semiconductors Product specification 2 x 6 W stereo power amplifier TDA1517; TDA1517P PACKAGE OUTLINES SIL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110-1 D D1 q A2 P1 P A3 q1 q2 A A4 seating plane E pin 1 index c L 1 9 b e Z Q b2 w M b1 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 max. A3 A4 b b1 b2 c D (1) D1 E (1) e L P P1 Q q q1 q2 w Z (1) max. mm 18.5 17.8 3.7 8.7 8.0 15.8 15.4 1.40 1.14 0.67 0.50 1.40 1.14 0.48 0.38 21.8 21.4 21.4 20.7 6.48 6.20 2.54 3.9 3.4 2.75 2.50 3.4 3.2 1.75 1.55 15.1 14.9 4.4 4.2 5.9 5.7 0.25 1 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEITA ISSUE DATE 95-02-25 03-03-12 SOT110-1 2004 Feb 18 EUROPEAN PROJECTION 9 NXP Semiconductors Product specification 2 x 6 W stereo power amplifier TDA1517; TDA1517P RBS9MPF: plastic rectangular-bent single in-line medium power package with fin; 9 leads SOT352-1 D L 1 9 b e Z b2 w M b1 D1 A2 q P P1 Q A3 q1 q2 A E pin 1 index c seating plane v M 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A (1) mm 14.45 13.95 A2 max. A3 b b1 b2 c D (2) D1 E (2) e L P P1 Q q q1 q2 v w Z (2) max. 3.7 8.7 8.0 1.40 1.14 0.67 0.50 1.40 1.14 0.48 0.38 21.8 21.4 21.4 20.7 6.48 6.20 2.54 3.8 3.3 2.75 2.50 3.4 3.2 1.75 1.55 15.1 14.9 4.4 4.2 5.9 5.7 0.6 0.25 1 Notes 1. Dimension is specified at seating plane. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEITA ISSUE DATE 97-12-16 03-03-12 SOT352-1 2004 Feb 18 EUROPEAN PROJECTION 10 NXP Semiconductors Product specification 2 x 6 W stereo power amplifier TDA1517; TDA1517P HDIP18: plastic heat-dissipating dual in-line package; 18 leads SOT398-1 D seating plane ME A2 A A1 L e Z c w M b1 (e 1) b2 b 10 18 MH pin 1 index E 9 1 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.14 0.67 0.50 1.05 0.75 0.47 0.38 21.85 21.35 6.5 6.2 2.54 7.62 3.9 3.1 8.32 8.02 8.7 7.7 0.25 1 inches 0.19 0.02 0.15 0.06 0.04 0.03 0.02 0.04 0.03 0.02 0.01 0.87 0.84 0.26 0.24 0.1 0.3 0.15 0.12 0.33 0.32 0.34 0.30 0.01 0.04 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEITA ISSUE DATE 95-01-25 03-02-13 SOT398-1 2004 Feb 18 EUROPEAN PROJECTION 11 NXP Semiconductors Product specification 2 x 6 W stereo power amplifier TDA1517; TDA1517P SOLDERING The total contact time of successive solder waves must not exceed 5 seconds. Introduction to soldering through-hole mount packages The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board. Manual soldering Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. Soldering by dipping or by solder wave Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. Suitability of through-hole mount IC packages for dipping and wave soldering methods SOLDERING METHOD PACKAGE DIPPING WAVE CPGA, HCPGA − suitable DBS, DIP, HDIP, RDBS, SDIP, SIL suitable suitable(1) PMFP(2) − not suitable Notes 1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 2. For PMFP packages hot bar soldering or manual soldering is suitable. 2004 Feb 18 12 NXP Semiconductors Product specification 2 x 6 W stereo power amplifier TDA1517; TDA1517P DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DISCLAIMERS property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Limited warranty and liability ⎯ Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Applications ⎯ Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Right to make changes ⎯ NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use ⎯ NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe 2004 Feb 18 13 NXP Semiconductors Product specification 2 x 6 W stereo power amplifier TDA1517; TDA1517P Limiting values ⎯ Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Quick reference data ⎯ The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products ⎯ Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. Terms and conditions of commercial sale ⎯ NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 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Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: [email protected] © NXP B.V. 2010 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R30/05/pp15 Date of release: 2004 Feb 18 Document order number: 9397 750 12926