INTEGRATED CIRCUITS DATA SHEET TDA7056B 5 W mono BTL audio amplifier with DC volume control Product specification Supersedes data of 1996 May 28 1997 Aug 15 NXP Semiconductors Product specification 5 W mono BTL audio amplifier with DC volume control TDA7056B FEATURES GENERAL DESCRIPTION DC volume control The TDA7056B is a mono Bridge-Tied Load (BTL) output amplifier with DC volume control. It is designed for use in TV and monitors, but is also suitable for battery-fed portable recorders and radios. The device is contained in a 9-pin medium power package. Few external components Mute mode Thermal protection Short-circuit proof A Missing Current Limiter (MCL) is built in. The MCL circuit is activated when the difference in current between the output terminal of each amplifier exceeds 100 mA (300 mA typ.). This level of 100 mA allows for headphone applications (single-ended). No switch-on and switch-off clicks Good overall stability Low power consumption Low HF radiation ESD protected on all pins. QUICK REFERENCE DATA SYMBOL PARAMETER VP supply voltage PO output power Gv(max) maximum total voltage gain CONDITIONS MIN. TYP. 4.5 RL = 16 3 RL = 8 5 MAX. UNIT 18 V 3.5 W 5.5 W 39.5 40.5 41.5 dB VP = 12 V gain control 68 73.5 dB Iq(tot) total quiescent current VP = 12 V; RL = 9.2 13 mA THD total harmonic distortion PO = 0.5 W 0.3 1 % ORDERING INFORMATION TYPE NUMBER TDA7056B 1997 Aug 15 PACKAGE NAME SIL9MPF DESCRIPTION plastic single in-line medium power package with fin; 9 leads 2 VERSION SOT110-1 NXP Semiconductors Product specification 5 W mono BTL audio amplifier with DC volume control TDA7056B BLOCK DIAGRAM VP handbook, full pagewidth 2 n.c. n.c. input DC volume control 1 TDA7056B 9 I + i 6 I – i 8 positive output 3 5 STABILIZER Vref negative output TEMPERATURE PROTECTION 4 7 MSA708 - 1 power ground signal ground Fig.1 Block diagram. PINNING SYMBOL PIN DESCRIPTION handbook, halfpage n.c. 1 not connected VP 2 positive supply voltage VI 3 voltage input GND1 4 signal ground VC 5 DC volume control OUT+ 6 positive output GND2 7 power ground OUT 6 OUT 8 negative output GND2 7 n.c. 9 not connected OUT 8 n.c. 1 VP 2 VI 3 GND1 4 VC 5 n.c. TDA7056B 9 MSA707 Fig.2 Pin configuration. 1997 Aug 15 3 NXP Semiconductors Product specification 5 W mono BTL audio amplifier with DC volume control FUNCTIONAL DESCRIPTION TDA7056B The maximum gain of the amplifier is fixed at 40.5 dB. The DC volume control stage has a logarithmic control characteristic. Therefore, the total gain can be controlled from 40.5 dB to 33 dB. If the DC volume control voltage falls below 0.4 V, the device will switch to the mute mode. The TDA7056B is a mono BTL output amplifier with DC volume control, designed for use in TV and monitor but is also suitable for battery-fed portable recorders and radios. In conventional DC volume circuits the control or input stage is AC coupled to the output stage via external capacitors to keep the offset voltage low. In the TDA7056B the DC volume control stage is integrated into the input stage so that no coupling capacitors are required. With this configuration, a low offset voltage is still maintained and the minimum supply voltage remains low. The amplifier is short-circuit proof to ground, VP and across the load. Also a thermal protection circuit is implemented. If the crystal temperature rises above +150 C the gain will be reduced, thereby reducing the output power. Special attention is given to switch-on and switch-off clicks, low HF radiation and a good overall stability. The BTL principle offers the following advantages: Lower peak value of the supply current Power dissipation The frequency of the ripple on the supply voltage is twice the signal frequency. Assume VP = 12 V; RL = 16 . The maximum sine wave dissipation is = 1.8 W. Consequently, a reduced power supply with smaller capacitors can be used which results in cost reductions. For portable applications there is a trend to decrease the supply voltage, resulting in a reduction of output power at conventional output stages. Using the BTL principle increases the output power. The Rth vj-a of the package is 55 K/W. Therefore Tamb (max) = 150 55 1.8 = 51 C. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VP supply voltage 18 V V3, 5 input voltage pins 3 and 5 5 V IORM repetitive peak output current 1.25 A IOSM non-repetitive peak output current 1.5 A Ptot total power dissipation 9 W Tamb operating ambient temperature 40 +85 C Tstg storage temperature 55 +150 C Tvj virtual junction temperature +150 C Tsc short-circuit time 1 h Tcase 60 C THERMAL CHARACTERISTICS SYMBOL PARAMETER VALUE UNIT Rth j-a thermal resistance from junction to ambient in free air 55 K/W Rth j-c thermal resistance from junction to case 10 K/W 1997 Aug 15 4 NXP Semiconductors Product specification 5 W mono BTL audio amplifier with DC volume control TDA7056B CHARACTERISTICS VP = 12 V; VDC = 1.4 V; f = 1 kHz; RL = 16 ; Tamb = 25 C; unless otherwise specified (see Fig.13). SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VP positive supply voltage Iq(tot) total quiescent current 4.5 18 V note 1; RL = 9.2 13 mA W Maximum gain (V5 = 1.4 V) PO output power THD = 10%; RL = 16 3 3.5 THD = 10%; RL = 8 5 5.5 W THD total harmonic distortion PO = 0.5 W 0.3 1 % Gv(max) maximum total voltage gain 39.5 40.5 41.5 dB VI input signal handling (RMS value) Gv(max) = 0 dB; THD 1% 1.0 V Vno noise output voltage (RMS value) note 2; f = 500 kHz 210 V B bandwidth at 1 dB 0.02 to 300 kHz SVRR supply voltage ripple rejection note 3 34 38 dB VO DC output offset voltage V8 v6 0 200 mV ZI input impedance (pin 3) 15 20 25 k 35 45 V 68 73.5 dB 20 25 30 A Mute position VO output voltage in mute position note 4; V5 0.4 V; VI = 1.0 V DC volume control; note 5 gain control I5 control current V5 = 0 V Notes 1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being equal to the DC output offset voltage divided by RL. 2. The noise output voltage (RMS value) at f = 500 kHz is measured with RS = 0 and B = 5 kHz. 3. The ripple rejection is measured with RS = 0 and f = 100 Hz to 10 kHz. The ripple voltage VR of 200 mV (RMS value) is applied to the positive supply rail. 4. The noise output voltage (RMS value) is measured with RS = 5 k unweighted. 5. The DC volume control can be configured in several ways. Two possible circuits are shown in Figs 14 and 15. The circuits at the volume control pin will influence the switch-on and switch-off behaviour and the maximum voltage gain. 1997 Aug 15 5 NXP Semiconductors Product specification 5 W mono BTL audio amplifier with DC volume control TDA7056B MBH372 40 MBH365 1 handbook, halfpage handbook, halfpage Gv (dB) Vno (mV) 0 10−1 −40 −80 −120 0 0.4 0.8 1.2 10−2 1.6 2.0 VDC (V) 0 0.4 0.8 1.2 1.6 2 VDC (V) Measured with RS = 5 k unweighted. Frequency range is 22 Hz to 22 kHz. Fig.3 Gain control as a function of DC volume control. Fig.4 MBH376 25 Noise output voltage as a function of DC volume control. MBH367 20 handbook, halfpage handbook, halfpage IDC (μA) IP (mA) 15 15 5 −5 10 −15 −25 5 0 Fig.5 0.4 0.8 1.2 1.6 2.0 VDC (V) 0 8 12 16 VP (V) 20 Measured with RL = . Control current as a function of DC volume control. 1997 Aug 15 4 Fig.6 Quiescent current versus supply voltage. 6 NXP Semiconductors Product specification 5 W mono BTL audio amplifier with DC volume control TDA7056B MBH361 10 MBH362 10 handbook, halfpage handbook, halfpage THD (%) 8 THD (%) 8 (1) (2) 6 6 4 4 2 2 (1) (2) 0 10-1 1 0 10−2 10 PO (W) (1) RL 16 . (2) RL = 8 . Fig.7 10−1 1 10 f (kHz) 102 PO = 0.1 W. (1) Gv(max) = 40 dB. (2) Gv(max) = 30 dB. Total harmonic distortion versus output power. Fig.8 Total harmonic distortion versus frequency. MBH363 MBH364 6 Pd (W) 5 10 handbook, halfpage handbook, halfpage PO (W) 8 4 6 3 (2) (1) (1) 4 (2) 2 2 1 0 0 0 4 8 12 16 VP (V) 20 0 Measured at a THD of 10%. The maximum output power is limited by the maximum power dissipation and the maximum available output current. (1) RL = 8 . (2) RL = 16 . 8 12 16 VP (V) 20 (1) RL = 8 . (2) RL = 16 . Fig.10 Total worst case power dissipation versus supply voltage. Fig.9 Output power versus supply voltage. 1997 Aug 15 4 7 NXP Semiconductors Product specification 5 W mono BTL audio amplifier with DC volume control TDA7056B MBH374 −20 MBH375 2.0 VI (V) handbook, halfpage handbook, halfpage SVRR (dB) −30 1.6 (1) −40 1.2 −50 0.8 (2) −60 −70 10−2 0.4 10−1 1 10 f (kHz) 0 102 0 Measured with VR = 0.2 V. (1) VDC = 1.4 V. (2) VDC = 0.4 V. 8 12 16 VP (V) Measured at a THD of 1% and a voltage gain of 0 dB. Fig.11 Supply voltage ripple rejection versus frequency. 1997 Aug 15 4 Fig.12 Input signal handling. 8 20 NXP Semiconductors Product specification 5 W mono BTL audio amplifier with DC volume control TDA7056B TEST AND APPLICATION INFORMATION (1) VP = 12 V handbook, full pagewidth 220 μF 100 nF 2 n.c. n.c. input 0.47 μF 1 9 TDA7056B I+i 6 + 3 5 RL = 8 Ω I−i 8 − RS 5 kΩ DC volume control STABILIZER TEMPERATURE PROTECTION 4 7 MSA709 - 2 ground To avoid instabilities and too high distortion, the input- and power ground must be separated as long as possible and connected together as close as possible to the IC. (1) This capacitor can be omitted if the 220 F electrolytic capacitor is connected close to pin 2. Fig.13 Test and application diagram. For single-end application the output peak current may not exceed 100 mA; at higher output currents the short circuit protection (MLC) will be activated. 1997 Aug 15 9 NXP Semiconductors Product specification 5 W mono BTL audio amplifier with DC volume control handbook, halfpage TDA7056B VP = 12 V handbook, halfpage volume control volume control 5 100 kΩ 5 1 μF 1 MΩ 1 μF 22 kΩ MSA710 MBH366 Fig.14 Application with potentiometer as volume control; maximum gain = 34 dB. 1997 Aug 15 Fig.15 Application with potentiometer as volume control; maximum gain = 40 dB. 10 NXP Semiconductors Product specification 5 W mono BTL audio amplifier with DC volume control TDA7056B PACKAGE OUTLINE SIL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110-1 D D1 q A2 P1 P A3 q1 q2 A A4 seating plane E pin 1 index c L 1 9 b e Z Q b2 w M b1 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 max. A3 A4 b b1 b2 c D (1) D1 E (1) e L P P1 Q q q1 q2 w Z (1) max. mm 18.5 17.8 3.7 8.7 8.0 15.8 15.4 1.40 1.14 0.67 0.50 1.40 1.14 0.48 0.38 21.8 21.4 21.4 20.7 6.48 6.20 2.54 3.9 3.4 2.75 2.50 3.4 3.2 1.75 1.55 15.1 14.9 4.4 4.2 5.9 5.7 0.25 1 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEITA ISSUE DATE 95-02-25 03-03-12 SOT110-1 1997 Aug 15 EUROPEAN PROJECTION 11 NXP Semiconductors Product specification 5 W mono BTL audio amplifier with DC volume control SOLDERING The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. 1997 Aug 15 TDA7056B 12 NXP Semiconductors Product specification 5 W mono BTL audio amplifier with DC volume control TDA7056B DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. DEFINITIONS Product specification The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. DISCLAIMERS Limited warranty and liability Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. 1997 Aug 15 13 NXP Semiconductors Product specification 5 W mono BTL audio amplifier with DC volume control Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Quick reference data The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Terms and conditions of commercial sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 1997 Aug 15 TDA7056B 14 NXP Semiconductors provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: [email protected] © NXP B.V. 2011 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands RM5/03/pp15 Date of release: 1997 Aug 15