INTEGRATED CIRCUITS DATA SHEET TDA1517; TDA1517P 2 × 6 W stereo power amplifier Product specification Supersedes data of 1995 Dec 15 File under Integrated Circuits, IC01 1998 Apr 28 Philips Semiconductors Product specification 2 × 6 W stereo power amplifier TDA1517; TDA1517P FEATURES GENERAL DESCRIPTION • Requires very few external components The TDA1517 is an integrated class-B dual output amplifier in a plastic single in-line medium power package with fin (SIL9MPF) and a plastic heat-dissipating dual in-line package (HDIP18). The device is primarily developed for multi-media applications. • High output power • Fixed gain • Good ripple rejection • Mute/standby switch • AC and DC short-circuit safe to ground and VP • Thermally protected • Reverse polarity safe • Capability to handle high energy on outputs (VP = 0 V) • No switch-on/switch-off plop • Electrostatic discharge protection. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VP supply voltage 6.0 14.4 18.0 V IORM repetitive peak output current − − 2.5 A Iq(tot) total quiescent current − 40 80 mA Isb standby current − 0.1 100 µA Isw switch-on current − − 40 µA |ZI| input impedance Po output power 50 − − kΩ RL = 4 Ω; THD = 0.5% − 5 − W RL = 4 Ω; THD = 10% − 6 − W fi = 100 Hz to 10 kHz SVRR supply voltage ripple rejection 48 − − dB αcs channel separation 40 − − dB Gv closed loop voltage gain 19 20 21 dB Vno(rms) noise output voltage (RMS value) − 50 − µV Tc crystal temperature − − 150 °C ORDERING INFORMATION TYPE NUMBER TDA1517 TDA1517P 1998 Apr 28 PACKAGE NAME SIL9MPF HDIP18 DESCRIPTION VERSION plastic single in-line medium power package with fin; 9 leads SOT110-1 plastic heat-dissipating dual in-line package; 18 leads SOT398-1 2 Philips Semiconductors Product specification 2 × 6 W stereo power amplifier TDA1517; TDA1517P BLOCK DIAGRAM handbook, full pagewidth non-inverting input 1 1 mute switch Cm 60 kΩ 4 VA output 1 2 kΩ power stage 18 kΩ VP 8 stand-by switch mute/stand-by switch input stand-by reference voltage VA 15 kΩ x1 supply voltage ripple rejection output mute switch 3 15 kΩ mute reference voltage TDA1517 18 kΩ 2 kΩ non-inverting input 2 6 VA 9 60 kΩ input reference voltage mute switch Cm power stage signal ground 2 power ground 5 (substrate) 7 MLC351 VP SGND PGND Fig.1 Block diagram. 1998 Apr 28 3 output 2 Philips Semiconductors Product specification 2 × 6 W stereo power amplifier TDA1517; TDA1517P PINNING SYMBOL PIN DESCRIPTION −INV1 1 non-inverting input 1 SGND 2 signal ground SVRR 3 supply voltage ripple rejection output OUT1 4 output 1 PGND 5 power ground OUT2 6 output 2 VP 7 supply voltage M/SS 8 mute/standby switch input −INV2 9 non-inverting input 2 ndbook, halfpage INV1 1 SGND ndbook, halfpage INV1 1 18 2 SGND 2 17 SVRR 3 SVRR 3 16 OUT1 4 OUT1 4 15 PGND 5 PGND 5 OUT2 6 OUT2 6 13 VP 7 VP 7 12 M/SS 8 M/SS 8 11 INV2 9 INV2 9 10 TDA1517 MLC352 TDA1517P 14 MLC353 Pins 10 to 18 should be connected to GND or floating. Fig.2 Pin configuration for SOT110-1. Fig.3 Pin configuration for SOT398-1. FUNCTIONAL DESCRIPTION The TDA1517 contains two identical amplifiers with differential input stages. The gain of each amplifier is fixed at 20 dB. A special feature of the device is the mute/standby switch which has the following features: • Low standby current (<100 µA) • Low mute/standby switching current (low cost supply switch) • Mute condition. 1998 Apr 28 4 Philips Semiconductors Product specification 2 × 6 W stereo power amplifier TDA1517; TDA1517P LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VP supply voltage − 18 V VP(sc) AC and DC short-circuit safe voltage − 18 V VP(r) reverse polarity − 6 V ERGO energy handling capability at outputs − 200 mJ IOSM non-repetitive peak output current − 4 A IORM repetitive peak output current − 2.5 A Ptot total power dissipation − 15 W Tstg storage temperature −55 +150 °C Tamb operating ambient temperature −40 +85 °C Tc crystal temperature − 150 °C VP = 0 V see Fig.4 THERMAL RESISTANCE SYMBOL TYPE NUMBER PARAMETER VALUE UNIT Rth j-c TDA1517 thermal resistance from junction to case 8 K/W Rth j-p TDA1517P thermal resistance from junction to pins 15 K/W Rth j-a TDA1517; TDA1517P thermal resistance from junction to ambient 50 K/W MLC354 18 handbook, halfpage P (W) 12 (1) (2) 6 0 25 0 50 100 150 o T amb ( C) (1) Rth j-c = 8 K/W. (2) Rth j-p = 15 K/W. Fig.4 Power derating curve. 1998 Apr 28 5 Philips Semiconductors Product specification 2 × 6 W stereo power amplifier TDA1517; TDA1517P DC CHARACTERISTICS VP = 14.4 V; Tamb = 25 °C; measured in Fig.6; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VP supply voltage 6.0 14.4 18.0 V Iq(tot) total quiescent current note 1 − 40 80 mA VO DC output voltage − 6.95 − V see Fig.5 8.5 − − V VI(max) = 1 V; fi = 20 Hz to 15 kHz − − 2 mV Mute/standby switch V8 switch-on voltage level Mute condition VO output signal in mute position Standby condition Isb DC current in standby condition − − 100 µA Vsw switch-on current − 12 40 µA Note 1. The circuit is DC adjusted at VP = 6 to 18 V and AC operating at VP = 8.5 to 18 V. 1998 Apr 28 6 Philips Semiconductors Product specification 2 × 6 W stereo power amplifier TDA1517; TDA1517P AC CHARACTERISTICS VP = 14.4 V; RL = 4 Ω; f = 1 kHz; Tamb = 25 °C; measured in Fig.6; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. − UNIT Po output power THD = 10%; note 1 5.5 6.0 − W THD total harmonic distortion Po = 1 W − 0.1 − % flr low frequency roll-off at −3 dB; note 2 − 45 − Hz at −1 dB THD = 0.5%; note 1 4 5 W 20 − − kHz 19 20 21 dB on 48 − − dB mute 48 − − dB standby 80 − − dB 50 60 75 kΩ fhr high frequency roll-off Gv closed loop voltage gain SVRR supply voltage ripple rejection |Zi| input impedance Vno noise output voltage note 3 on Rs = 0 Ω; note 4 − 50 − µV on Rs = 10 Ω; note 4 − 70 100 µV note 5 − 50 − µV Rs = 10 Ω 40 − − dB − 0.1 1 dB mute αcs channel separation |∆Gv| channel unbalance Notes 1. Output power is measured directly at the output pins of the IC. 2. Frequency response externally fixed. 3. Ripple rejection measured at the output with a source impedance of 0 Ω, maximum ripple amplitude of 2 V (p-p) and a frequency between 100 Hz and 10 kHz. 4. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz. 5. Noise output voltage independent of Rs (VI = 0 V). 1998 Apr 28 7 Philips Semiconductors Product specification 2 × 6 W stereo power amplifier ,,,,,,, ,,,,,,, ,,,,,,, ,,,,,,, ,,,,,,, ,,,,,,, ,,,,,,, ,,,,,,, MLC355 handbook, halfpage 18 V11 (V) TDA1517; TDA1517P ON (IP = 40 mA) 8.5 6.4 mute (IP = 40 mA) 3.3 2 standby (I P 0 100 µA) Fig.5 Standby, mute and on conditions. APPLICATION INFORMATION standby switch handbook, full pagewidth VP 100 µF 100 nF 3 input reference voltage 8 2200 µF 7 internal 1/2 V P TDA1517 220 nF input 1 20 dB 60 kΩ 20 dB 1 60 kΩ 9 2 5 6 4 MLC356 signal ground power ground 1000 µF 1000 µF Fig.6 Application circuit diagram. 1998 Apr 28 8 220 nF input 2 Philips Semiconductors Product specification 2 × 6 W stereo power amplifier TDA1517; TDA1517P PACKAGE OUTLINES SIL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110-1 D D1 q P A2 P1 A3 q1 q2 A A4 seating plane E pin 1 index c L 1 9 b e Z Q b2 w M b1 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 max. A3 A4 b b1 b2 c D (1) D1 E (1) e L P P1 Q q q1 q2 w Z (1) max. mm 18.5 17.8 3.7 8.7 8.0 15.8 15.4 1.40 1.14 0.67 0.50 1.40 1.14 0.48 0.38 21.8 21.4 21.4 20.7 6.48 6.20 2.54 3.9 3.4 2.75 2.50 3.4 3.2 1.75 1.55 15.1 14.9 4.4 4.2 5.9 5.7 0.25 1.0 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-02-25 SOT110-1 1998 Apr 28 EUROPEAN PROJECTION 9 Philips Semiconductors Product specification 2 × 6 W stereo power amplifier TDA1517; TDA1517P HDIP18: plastic heat-dissipating dual in-line package; 18 leads SOT398-1 D seating plane ME A2 A A1 L e Z c w M b1 (e 1) b2 b 10 18 MH pin 1 index E 9 1 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.14 0.67 0.50 1.05 0.75 0.47 0.38 21.85 21.35 6.5 6.2 2.54 7.62 3.9 3.1 8.32 8.02 8.7 7.7 0.25 1.0 inches 0.19 0.02 0.15 0.06 0.04 0.03 0.02 0.04 0.03 0.02 0.01 0.87 0.84 0.26 0.24 0.10 0.30 0.15 0.12 0.33 0.32 0.34 0.30 0.01 0.04 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 94-04-13 95-01-25 SOT398-1 1998 Apr 28 EUROPEAN PROJECTION 10 Philips Semiconductors Product specification 2 × 6 W stereo power amplifier TDA1517; TDA1517P with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (order code 9398 652 90011). Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1998 Apr 28 11 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 545102/25/03/pp12 Date of release: 1998 Apr 28 Document order number: 9397 750 03772