INTEGRATED CIRCUITS DATA SHEET TDA2613 6 W hi-fi audio power amplifier Product specification File under Integrated circuits, IC01 July 1994 Philips Semiconductors Product specification 6 W hi-fi audio power amplifier TDA2613 GENERAL DESCRIPTION The TDA2613 is a hi-fi audio power amplifier encapsulated in a 9-lead SIL plastic power package. The device is especially designed for mains fed applications (e.g. tv and radio). Features • Requires very few external components • Input muted during power-on and off (no switch-on or switch-off clicks) • Low offset voltage between output and ground • Hi-fi according to IEC 268 and DIN 45500 • Short-circuit-proof • Thermally protected. QUICK REFERENCE DATA Supply voltage range VP 15 to 42 V Output power at THD = 0,5%, VP = 24 V Po typ. 6W Voltage gain Gv typ. 30 dB Supply voltage ripple rejection SVRR typ. 60 dB Noise output voltage Vno(rms) typ. 70 µV PACKAGE OUTLINE TDA2613: 9-lead SIL; plastic power (SOT110B); SOT110-1; 1996 August 07. July 1994 2 Philips Semiconductors Product specification 6 W hi-fi audio power amplifier TDA2613 Fig.1 Block diagram. PINNING 1. n.c. not connected 2. n.c. not connected 3. VP/2 4. n.c. July 1994 ⁄2 VP (asymmetrical) or 5. GND ground (asymmetrical) or negative supply (symmetrical) 1 6. OUT output ground (symmetrical) 7. +VP positive supply not connected 8. INV inverting input 9. −INV non-inverting input 3 Philips Semiconductors Product specification 6 W hi-fi audio power amplifier TDA2613 FUNCTIONAL DESCRIPTION This hi-fi power amplifier is designed for mains fed applications. The device is intended for asymmetrical power supplies, but a symmetrical supply may also be used. An output power of 6 watts (THD = 0,5%) can be delivered into an 8 Ω load with an asymmetrical power supply of 24 V. The gain is fixed internally at 30 dB. Internal gain fixing gives low gain spread. A special feature of this device is a mute circuit which suppresses unwanted input signals during switching on and off. Referring to Fig.4, the 100 µF capacitor creates a time delay when the voltage at pin 3 is lower than an internally fixed reference voltage. During the delay the amplifier remains in the DC operating mode but is isolated from the non-inverting input on pin 9. Two thermal protection circuits are provided, one monitors the average junction temperature and the other the instantaneous temperature of the power transistors. Both protection circuits activate at 150 °C allowing safe operation to a maximum junction temperature of 150 °C without added distortion. RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) PARAMETER CONDITIONS Supply voltage SYMBOL MIN. MAX. UNIT VP − 42 V IOSM − 4 A Non-repetitive peak output current Total power dissipation see Fig.2 Ptot Storage temperature range Tstg −55 + 150 °C Junction temperature Tj − 150 °C tsc − 1 hour Short-circuit time: see note outputs short-circuited to ground (full signal drive) Note to the Ratings For asymmetrical power supplies (at short-circuiting of the load) the maximum supply voltage is limited to VP = 28 V. If the total internal resistance of the supply (RS) ≥ 4 Ω, the maximum unloaded supply voltage is increased to 32 V. For symmetrical power supplies the circuit is short-circuit proof to VP = ± 21 V. July 1994 4 Philips Semiconductors Product specification 6 W hi-fi audio power amplifier TDA2613 Fig.2 Power derating curve. THERMAL RESISTANCE From junction to case Rth j-c = 8 K/W HEATSINK DESIGN EXAMPLE With derating of 8 K/W, the value of heatsink thermal resistance is calculated as follows: given RL = 8 Ω and VP = 24 V, the measured maximum dissipation is 4,1 W; then, for a maximum ambient temperature of 60 °C, the required thermal resistance of the heatsink is: 150 – 60 R th h-a = ---------------------- – 8 ≈ 14 K/W 4,1 Note: The metal tab (heatsink) has the same potential as pin 5 (GND). July 1994 5 Philips Semiconductors Product specification 6 W hi-fi audio power amplifier TDA2613 CHARACTERISTICS PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Supply voltage range operating mode VP 15 24 42 V input mute mode VP 4 − 10 V IORM 2.2 − − A Repetitive peak output current Operating mode: asymmetrical power supply; test circuit as per Fig.4; VP = 24 V; RL = 8 Ω; Tamb = 25 °C; f = 1 kHz Total quiescent current Output power Itot 10 20 35 mA THD = 0,5% Po 5 6 − W THD = 10% Po 6,5 8,0 − W Po = 4 W THD − 0,15 0,2 % B − 20 to 16 k − Hz Gv 29 30 31 dB Vno(rms) − 70 140 µV |Zi| 14 20 26 kΩ SVRR 35 44 − dB Iib − 0,3 − µA Vos − 30 200 mV Itot 5 15 20 mA Vi = 600 mV Vout − 2,0 2,8 mV RS = 2 kΩ Vno(rms) − 70 140 µV note 2 SVRR 35 55 − dB Vos − 40 200 mV Total harmonic distortion Power bandwidth THD = 0,5%; note 1 Voltage gain Noise output voltage (r.m.s. value); unweighted (20 Hz to 20 kHz) RS = 2 kΩ Input impedance Supply voltage ripple rejection note 2 Input bias current DC output offset voltage with respect to VP/2 Input mute mode: asymmetrical power supply; test circuit as per Fig.4; VP = 8 V; RL = 8 Ω; Tamb = 25 °C; f = 1 kHz Total quiescent current Output voltage Noise output voltage (r.m.s. value); unweighted (20 Hz to 20 kHz) Supply voltage ripple rejection DC output offset voltage July 1994 with respect to VP/2 6 Philips Semiconductors Product specification 6 W hi-fi audio power amplifier PARAMETER TDA2613 CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Operating mode: symmetrical power supply; test circuit as per Fig.3; VP = ± 12 V; RL = 8 Ω; Tamb = 25 °C; f = 1 kHz Total quiescent current Output power Itot 10 20 35 mA THD = 0,5% Po 5 6 − W THD = 10% Po 6,5 8,5 − W Total harmonic distortion Po = 4 W THD − 0,13 0,2 % Power bandwidth THD = 0,5% B − 40 to 16 k − Hz Gv 29 30 31 dB Vno(rms) − 70 140 µV |Zi| 14 20 26 kΩ SVRR 40 60 − dB Vos − 30 200 mV note 1 Voltage gain Noise output voltage (r.m.s. value); unweighted (20 Hz to 20 kHz) RS = 2 kΩ Input impedance Supply voltage ripple rejection DC output offset voltage with respect to ground Notes to the characteristics 1. Power bandwidth at Po max −3 dB. 2. Ripple rejection at RS = 0 Ω, f = 100 Hz to 20 kHz; ripple voltage = 200 mV (r.m.s. value) applied to positive or negative supply rail. July 1994 7 Philips Semiconductors Product specification 6 W hi-fi audio power amplifier TDA2613 APPLICATION INFORMATION Fig.3 Test and application circuit; symmetrical power supply. Fig.4 Test and application circuit; asymmetrical power supply. July 1994 8 Philips Semiconductors Product specification 6 W hi-fi audio power amplifier TDA2613 Input mute circuit The input mute circuit operates only during switching on and off of the supply voltage. The circuit compares the 1⁄2 supply voltage (at pin 3) with an internally fixed reference voltage (Vref), derived directly from the supply voltage. When the voltage at pin 3 is lower than Vref the non-inverting input (pin 9) is disconnected from the amplifier. The voltage at pin 3 is determined by an internal voltage divider and the external 100 µF capacitor. During switching on, a time delay is created between the reference voltage and the voltage at pin 3, during which the input terminal is disconnected, (as illustrated in Fig.5). Fig.5 Input mute circuit; time delay. July 1994 9 Philips Semiconductors Product specification 6 W hi-fi audio power amplifier TDA2613 PACKAGE OUTLINE SIL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110-1 D D1 q P A2 P1 A3 q1 q2 A A4 seating plane E pin 1 index c L 1 9 b e Z Q b2 w M b1 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 max. A3 A4 b b1 b2 c D (1) D1 E (1) e L P P1 Q q q1 q2 w Z (1) max. mm 18.5 17.8 3.7 8.7 8.0 15.8 15.4 1.40 1.14 0.67 0.50 1.40 1.14 0.48 0.38 21.8 21.4 21.4 20.7 6.48 6.20 2.54 3.9 3.4 2.75 2.50 3.4 3.2 1.75 1.55 15.1 14.9 4.4 4.2 5.9 5.7 0.25 1.0 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-02-25 SOT110-1 July 1994 EUROPEAN PROJECTION 10 Philips Semiconductors Product specification 6 W hi-fi audio power amplifier TDA2613 The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. July 1994 11