APPLICATION NOTE Replacing Spansion® S34ML01G200 with Macronix MX30LF1G18AC 1. Introduction This application note is a guide for migrating to the Macronix MX30LF1G18AC from the Spansion® S34ML01G200 1Gb, 3V, NAND flash memory. The document does not provide detailed information on the individual devices, but highlights the major similarities and differences between them. The comparison covers the general features, performance, command codes and other differences. The information in this document is based on datasheets listed in Section 10. Newer versions of the datasheets may override the contents of this document. 2. Features Both flash device families have similar features and functions as shown in Table 2-1. Table 2-1: Feature Comparison Feature Macronix MX30LF1G18AC Vcc Voltage Range 2.7V ~ 3.6V Bus Width x8 Operating Temperature -40°C ~ 85°C Interface ONFI 1.0 Standard Block Size 128KB+4KB Page Size 2KB+64B ECC Requirement 4b/528B OTP Size 30 pages Guarantee Good Blocks Block 0 at Shipping Unique ID ONFI standard ID Code C2h/F1h/80h/95h/02h ONFI Signature 4Fh/4Eh/46h/49h Data Retention 10 Years Packages P/N: AN-0381 48-TSOP (12x20mm) 63-VFBGA (9x11mm) 1 Spansion S34ML01G200 2.7V ~ 3.6V x8 -40°C ~ 85°C ONFI 1.0 Standard 128KB+4KB 2KB+64B 4b/528B 64 pages Block 0, 1 ONFI standard 01h/F1h/80h/1Dh 4Fh/4Eh/46h/49h 10 Years 48-TSOP (12x20mm) 63-VFBGA (9x11mm) 67-BGA(8x6.5mm) Ver. 1, May 20, 2015 APPLICATION NOTE Replacing Spansion® S34ML01G200 with Macronix MX30LF1G18AC 3. Performance Table 3-1 and Table 3-2 show MX30LF1G18AC and S34ML01G200 Read/Write performance. Table 3-1: Read Performance (Read Latency and Sequential Read) Read function Macronix MX30LF1G18AC Spansion S34ML01G200 Read Latency time (tR) 25us (max.) 25us (max.) Sequential Read time (tRC) 20ns (min.) 25ns (min.) Table 3-2: Write Performance (Program and Erase) Write Function Macronix MX30LF1G18AC Page Program time (tPROG) 300us (typ.)/600us (max.) Block Erase time (tERASE) 1ms (typ.)/3.5ms (max.) NOP 4 (max.) Write/Erase Cycles*1 (Endurance) 100,000 Spansion S34ML01G200 300us (typ.)/700us (max.) 3ms (typ.)/10ms (max.) 4 (max.) 100,000 Note: 100K Endurance cycle with ECC protection. 4. DC Characteristics Read/Write power requirements (Table 4-1) and I/O voltage limits (Table 4-2) are similar. Table 4-1: Read / Write Current DC Characteristic Macronix MX30LF1G18AC Sequential Read Current (ICC1) 15mA (typ.) / 30mA (max.) Program Current (ICC2) 15mA (typ.) / 30mA (max.) Erase Current (ICC3) 15mA (typ.) / 30mA (max.) Standby Current – CMOS 10uA (typ.) / 50uA (max.) Spansion S34ML01G200 15mA (typ.) / 30mA (max.) 15mA (typ.) / 30mA (max.) 15mA (typ.) / 30mA (max.) 10uA (typ.) / 50uA (max.) Table 4-2: Input / Output Voltage DC Characteristic Input Low Voltage (VIL) Input High Voltage (VIH) Output Low Voltage (VOL) Output High Voltage (VOH) P/N: AN-0381 Macronix MX30LF1G18AC Spansion S34ML01G200 -0.3V (min.) / 0.2VCC (max.) -0.3V (min.) / 0.2Vcc (max.) 0.8VCC (min.) / VCC+0.3V (max.) 0.8Vcc (min.) / Vcc+0.3V (max.) 0.2V (max.) 0.4V (max.) VCC-0.2 (min.) 2.4V (min.) 2 Ver. 1, May 20, 2015 APPLICATION NOTE Replacing Spansion® S34ML01G200 with Macronix MX30LF1G18AC 5. Package Pin/Ball Definition Package physical dimensions are similar to each other. For detailed information, please refer to the individual datasheets. Tables 5-1 and 5-2 show differences in pin assignments between the Macronix and Spansion devices. S34ML01G200 can be replaced by the MX30LF1G18AC without pin conflicts. Only 48-TSOP pin #38 (ball G5 on VFBGA) may need special attention because the pin is designated “PT” which is chip protected function on the MX30LF1G18AC-TI, but S34ML01G200 is designated as NC. Figure 5-1: 48-TSOP (12x20mm) Package and Pin Layout Comparison NC NC NC NC NC NC R/B# RE# CE# NC NC VCC VSS NC NC CLE ALE WE# WP# NC NC NC NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 MX30LF1G18AC 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 VSS*1 NC NC NC IO7 IO6 IO5 IO4 NC VCC*1 PT VCC VSS NC VCC*1 NC IO3 IO2 IO1 IO0 NC NC NC VSS*1 NC NC NC NC NC NC R/B# RE# CE# NC NC VCC VSS NC NC CLE ALE WE# WP# NC NC NC NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 S34ML01G200 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 VSS*1 NC NC NC I/O7 I/O6 I/O5 I/O4 NC VCC*1 NC VCC VSS NC VCC*1 NC I/O3 I/O2 I/O1 IO0 NC NC NC VSS*1 Pin38: NC Pin38: PT Note: 1. These pins might not be connected internally. However it is recommended to connect these pins to power(or ground) as designated for ONFI compatibility. Table 5-1: 48-TSOP Package Pin Definition Brand Macronix Spansion Part Name MX30LF1G18AC-TI S34ML01G200 PT* NC* #38 #3 8 pin 1 2 Note If no connect, both pin functions are the same Note: 1. PT pin has internal weak pull low. It enables the protection function if active. 2. NC= Not Connected P/N: AN-0381 3 Ver. 1, May 20, 2015 APPLICATION NOTE Replacing Spansion® S34ML01G200 with Macronix MX30LF1G18AC Figure 5-2: 63-VFBGA (9x11mm) Package and Pin Layout Comparison MX30LF1G18AC 1 2 A NC NC B NC 3 4 5 6 7 S34ML01G200 8 9 10 NC NC NC NC 1 2 A NC NC B NC 3 4 5 6 7 8 C WP# ALE VSS CE# WE# R/B# C WP# ALE VSS CE# WE# R/B# D VCC *1 RE# CLE NC NC NC D VCC *1 RE# CLE NC NC NC E NC NC NC NC NC NC E NC NC NC NC NC NC F NC NC NC NC VSS *1 NC F NC NC NC NC VSS *1 NC G NC VCC *1 PT NC NC NC G NC VCC *1 NC NC NC NC H NC IO0 NC NC NC VCC H NC I/O0 NC NC NC Vcc J NC IO1 NC VCC IO5 IO7 J NC I/O1 NC Vcc I/O5 I/O7 K VSS IO2 IO3 IO4 IO6 VSS K Vss I/O2 I/O3 I/O4 I/O6 Vss 9 10 NC NC NC NC L NC NC NC NC L NC NC NC NC M NC NC NC NC M NC NC NC NC G5 : NC G5: PT Note: 1. These pins might not be connected internally. However it is recommended to connect these pins to power(or ground) as designated for ONFI compatibility. Table 5-2: 63-VFBGA Package Ball Definition Brand Macronix Spansion Part Name MX30LF1G18AC-XKI S34ML01G200 PT* NC* #G5 #G 5 ball 1 2 Note If no connect, both pin functions are the same Note: 1. PT pin has internal weak pull low. It enables the protection function if active. 2. NC= Not Connected P/N: AN-0381 4 Ver. 1, May 20, 2015 APPLICATION NOTE Replacing Spansion® S34ML01G200 with Macronix MX30LF1G18AC 6. Command Set Basic command sets and status checking methods are similar. Read and Write commands are identical. Additionally, Macronix supports a Unique ID Read, Set/Get Feature and Block Protection Status Read function not supported by Spansion® (Table 6-1). Table 6-1: Command Table Command Read Mode Random Data Input Random Data Output Cache Read Begin Cache Read Sequential Cache Read End Read ID Reset Page Program Cache Program Block Erase Read Status Read Parameter Pg. Unique ID Read Set Feature Get Feature Block Protection Status Read Macronix Spansion MX30LF1G18AC S34ML01G200 1st Cycle 2nd Cycle 1st Cycle 2nd Cycle 00h 00h 30h 30h 85h 85h 05h E0h 05h E0h 00h 31h 00h 31h 31h 31h 3Fh 3Fh 90h 90h FFh FFh 80h 10h 80h 10h 80h 15h 80h 15h 60h D0h 60h D0h 70h 70h ECh ECh EDh EDh EFh EEh 7Ah - 6-2 Status Register When a flash Read, Program, or Erase operation is in progress, either the “Ready/Busy# Pin Checking” or “Status Output Checking” method may be used to monitor the operation. Both are standard NAND flash algorithms and can be used for both device families. Table 6-3 shows that Status Output content provided by the Read Status command (70h) is compatible. P/N: AN-0381 5 Ver. 1, May 20, 2015 APPLICATION NOTE Replacing Spansion® S34ML01G200 with Macronix MX30LF1G18AC Table 6-3: Status Output Status Output Macronix MX30LF1G18AC SR[0] SR[1] SR[2] SR[3] SR[4] SR[5] SR[6] SR[7] PGM/ERS status: Pass/Fail Cache Program status: Pass/Fail Reserved Reserved Reserved PGM/ERS/Read internal controller: Ready/Busy PGM/ERS/Read status: Ready/Busy Write Protect Spansion S34ML01G200 PGM/ERS status: Pass/Fail Cache Program status: Pass/Fail Reserved Reserved Reserved PGM/ERS/Read internal controller: Ready/Busy PGM/ERS/Read status: Ready/Busy Write Protect 7. Read ID Command The ID codes of the Macronix MX30LF1G18AC and S34ML01G200 differ in the manufacturer ID and in the last byte (Table 7-1). Table 7-1: Manufacturer and Device IDs ID Code Value 1st Byte 2nd Byte IO1, IO0 IO3, IO2 3rd Byte IO5, IO4 IO6 4th Byte 5th Byte IO7 IO1, IO0 IO2 IO5, IO4 IO6 IO7, IO3 IO1, IO0 IO3, IO2 IO6~IO4 IO7 P/N: AN-0381 Macronix MX30LF1G18AC Spansion S34ML01G200 C2h/F1h/80h/95h/02h Manufacturer Code Device Identifier Number of Die per Chip Enable Cell Structure Number of Simultaneously Programmed Pages Interleaved Programming Between Multiple Chips Cache Program Page Size (exclude Spare Area) Spare Area Size(Byte per 512Byte) Block Size (exclude Spare Area) Organization Sequential Read Cycle Time (tRC) ECC Level Requirement Number of Plane per CE Plane Size Reserved 01h/F1h/80h/1Dh Manufacturer Code Device Identifier Number of Die per Chip Enable Cell Structure Number of Simultaneously Programmed Pages Interleaved Programming Between Multiple Chips Cache Program Page Size (exclude Spare Area) Spare Area Size (Byte per 512Byte) Block Size (exclude Spare Area) Organization Serial Access Time (tRC) - 6 Ver. 1, May 20, 2015 APPLICATION NOTE Replacing Spansion® S34ML01G200 with Macronix MX30LF1G18AC 8. Power-Up Timing Macronix and Spansion® power-up sequences are similar, but the timing is slightly different. Although both devices use 2.7V (VCC min.) as the start point, timing references are different. Check the system timing to determine if adjustments are needed. Table 8-1: Power-Up Timing H/W Timing Characteristic Vcc (min.) to WE# Low Vcc (min.) to R/B# High Vcc (min.) to R/B# Low Macronix MX30LF1G18AC 1ms (max.) N/A 10us (max.) Spansion S34ML01G200 N/A 5ms (max.) 100us (max.) Vcc(min.) VCC WE# R/B# Figure 8-1: Power-Up Timing P/N: AN-0381 7 Ver. 1, May 20, 2015 APPLICATION NOTE Replacing Spansion® S34ML01G200 with Macronix MX30LF1G18AC 9. Summary Macronix MX30LF1G18AC and Spansion® S34ML01G200 NAND have similar features and pinouts. More advanced features such as cache access are implemented slightly differently. Because basic Read, Program, and Erase commands as well as block, page, spare area sizes and ECC requirements are the same, device migration may require minimal or no firmware modifications. 10. Reference Table 10-1 shows the datasheet versions used for comparison in this application note. For the most current, detailed Macronix specification, please refer to the Macronix Website at http://www.macronix.com Table 10-1: Datasheet Version Datasheet Location MX30LF1G18AC S34ML01G200 Website Website Date Issue Revision Feb. 02, 2015 Apr. 17, 2015 Rev. 1.0 Rev. 11 Note: Macronix data sheet is subject to change without notice. 11. Appendix Cross Reference Table 11-1 shows basic part number and package information for the Macronix MX30LF1G18AC and Spansion® S34ML01G200 product families. Table 11-1: Part Number Cross Reference Density Macronix Part No. Spansion Part No. MX30LF1G18AC-TI S34ML01G200TFI00 1Gb MX30LF1G18AC-XKI S34ML01G200BHI00 Package 48-TSOP 63-VFBGA Dimension 12x20mm 9x11x1.0mm 12. Revision History Revision 1.0 P/N: AN-0381 Description Initial Release 8 Date May. 20, 2015 Ver. 1, May 20, 2015 APPLICATION NOTE Replacing Spansion® S34ML01G200 with Macronix MX30LF1G18AC Except for customized products which have been expressly identified in the applicable agreement, Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial, personal, and/or household applications only, and not for use in any applications which may, directly or indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said Macronix's product qualified for its actual use in accordance with the applicable laws and regulations; and Macronix as well as it’s suppliers and/or distributors shall be released from any and all liability arisen therefrom. Copyright© Macronix International Co., Ltd. 2015. All rights reserved, including the trademarks and tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, Nbit, NBiit, Macronix NBit, eLiteFlash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo, BE-SONOS, KSMC, Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich Au-dio, Rich Book, Rich TV, and FitCAM. The names and brands of third party referred thereto (if any) are for identification purposes only. For the contact and order information, please visit Macronix’s Web site at: http://www.macronix.com P/N: AN-0381 9 Ver. 1, May 20, 2015