APPLICATION NOTE Comparing Spansion® S34ML01G100 with Macronix MX30LF1G18AC 1. Introduction This application note is a guide for migrating to the Macronix MX30LF1G18AC from the Spansion® S34ML01G100 1Gb, 3V, NAND flash memory. The document does not provide detailed information on the individual devices, but highlights the major similarities and differences between them. The comparison covers the general features, performance, command codes and other differences. The information in this document is based on datasheets listed in Section 10. Newer versions of the datasheets may override the contents of this document. 2. Features Both flash device families have similar features and functions as shown in Table 2-1. Table 2-1: Feature Comparison Feature Vcc Voltage Range Macronix MX30LF1G18AC Spansion S34ML01G100 2.7V ~ 3.6V 2.7V ~ 3.6V x8 x8 Bus Width Operating Temperature Interface -40°C ~ 85°C -40°C ~ 85°C ONFI 1.0 Standard ONFI 1.0 Standard Block Size 128KB+4KB 128KB+4KB Page Size 2KB+64B 2KB+64B ECC Requirement 4b/528B 1b/528B OTP Size 30 pages 64 pages Block 0 Block 0, 1 ONFI standard ONFI standard C2h/F1h/80h/95h/02h 01h/F1h/00h/1Dh ONFI Signature 4Fh/4Eh/46h/49h 4Fh/4Eh/46h/49h Data Retention 10 Years 48-TSOP (12x20mm) 63-VFBGA (9x11mm) 10 Years 48-TSOP (12x20mm) 63-VFBGA (9x11mm) Guarantee Good Blocks at Shipping Unique ID ID Code Package P/N: AN0352 1 Ver.1, Jul.14, 2014 APPLICATION NOTE Comparing Spansion® S34ML01G100 with Macronix MX30LF1G18AC 3. Performance Table 3-1 and Table 3-2 show MX30LF1G18AC and S34ML01G100 Read/Write performance. Table 3-1: Read Performance (Read Latency and Sequential Read) Read function Macronix MX30LF1G18AC Spansion S34ML01G100 Read Latency time (tR) 25us (max.) 25us (max.) Sequential Read time (tRC) 20ns (min.) 25ns (min.) Table 3-2: Write Performance (Program and Erase) Write Function Macronix MX30LF1G18AC Spansion S34ML01G100 Page Program time (tPROG) 300us (typ.) / 600us (max.) 200us (typ.) / 700us (max.) Block Erase time (tERASE) 1ms (typ.) / 3.5ms (max.) 2ms (typ.) / 3ms (max.) NOP 4 (max.) 4 (max.) 1 Write/Erase Cycles* (Endurance) 100,000 100,000 Note: 100K Endurance cycle with ECC protection. 4. DC Characteristics Read/Write power requirements (Table 4-1) and I/O voltage limits (Table 4-2) are similar. Table 4-1: Read / Write Current DC Characteristic Macronix MX30LF1G18AC Sequential Read Current (ICC1) 20mA (typ.) / 30mA (max.) Program Current (ICC2) 20mA (typ.) / 30mA (max.) Erase Current (ICC3) 15mA (typ.) / 30mA (max.) Standby Current – CMOS 10uA (typ.) / 50uA (max.) Spansion S34ML01G100 15mA (typ.) / 30mA (max.) 15mA (typ.) / 30mA (max.) 15mA (typ.) / 30mA (max.) 10uA (typ.) / 50uA (max.) Table 4-2: Input / Output Voltage DC Characteristic Macronix MX30LF1G18AC Spansion S34ML01G100 Input Low Voltage (VIL) -0.3V (min.) / 0.2VCC (max.) -0.3V (min.) / 0.2Vcc (max.) Input High Voltage (VIH) 0.8VCC (min.) / VCC+0.3V (max.) 0.8Vcc (min.) / Vcc+0.3V (max.) Output Low Voltage (VOL) 0.2V (max.) 0.4V (max.) Output High Voltage (VOH) VCC-0.2 (min.) 2.4V (min.) P/N: AN0352 2 Ver.1, Nov.14, 2014 APPLICATION NOTE Comparing Spansion® S34ML01G100 with Macronix MX30LF1G18AC 5. Package Pin/Ball Definition Package physical dimensions are similar to each other. For detailed information, please refer to the individual datasheets. Tables 5-1 and 5-2 show differences in pin assignments between the Macronix and Spansion devices. S34ML01G100 can be replaced by the MX30LF1G18AC without pin conflicts. Only 48-TSOP pin #38 (ball G5 on VFBGA) may need special attention because the pin is designated “PT” which is chip protected function on the MX30LF1G18AC-TI, but S34ML01G100 is designated as NC. Figure 5-1: 48-TSOP (12x20mm) Package and Pin Layout Comparison NC NC NC NC NC NC R/B# RE# CE# NC NC VCC VSS NC NC CLE ALE WE# WP# NC NC NC NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 MX30LF1G18AC 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 VSS*1 NC NC NC IO7 IO6 IO5 IO4 NC VCC*1 PT VCC VSS NC VCC*1 NC IO3 IO2 IO1 IO0 NC NC NC VSS*1 NC NC NC NC NC NC R/B# RE# CE# NC NC VCC VSS NC NC CLE ALE WE# WP# NC NC NC NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 S34ML01G100 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 VSS*1 NC NC NC I/O7 I/O6 I/O5 I/O4 NC VCC*1 NC VCC VSS NC VCC*1 NC I/O3 I/O2 I/O1 IO0 NC NC NC VSS*1 Pin38: NC Pin38: PT Note: 1. These pins might not be connected internally. However it is recommended to connect these pins to power(or ground) as designated for ONFI compatibility. Table 5-1: 48-TSOP Package Pin Definition Brand Macronix Part Name MX30LF1G18AC-XKI #38 pin PT*1 Spansion Note S34ML01G100 If no connect, both pin functions are the same NC*2 Note: 1. PT pin has internal weak pull low. It enables the protection function if active. 2. NC= Not Connected P/N: AN0352 3 Ver.1, Nov.14, 2014 APPLICATION NOTE Comparing Spansion® S34ML01G100 with Macronix MX30LF1G18AC Figure 5-2: 63-VFBGA (9x11mm) Package and Pin Layout Comparison MX30LF1G18AC 1 2 A NC NC B NC 3 4 5 6 7 S34ML01G100 8 9 10 NC NC NC NC 1 2 A NC NC B NC 3 4 5 6 7 8 C WP# ALE VSS CE# WE# R/B# C WP# ALE VSS CE# WE# R/B# D VCC *1 RE# CLE NC NC NC D VCC *1 RE# CLE NC NC NC E NC NC NC NC NC NC E NC NC NC NC NC NC F NC NC NC NC VSS *1 NC F NC NC NC NC VSS *1 NC G NC VCC *1 PT NC NC NC G NC VCC *1 NC NC NC NC H NC IO0 NC NC NC VCC H NC I/O0 NC NC NC Vcc J NC IO1 NC VCC IO5 IO7 J NC I/O1 NC Vcc I/O5 I/O7 K VSS IO2 IO3 IO4 IO6 VSS K Vss I/O2 I/O3 I/O4 I/O6 Vss 9 10 NC NC NC NC L NC NC NC NC L NC NC NC NC M NC NC NC NC M NC NC NC NC G5 : NC G5: PT Note: 1. These pins might not be connected internally. However it is recommended to connect these pins to power(or ground) as designated for ONFI compatibility. Table 5-2: 63-VFBGA Package Ball Definition Brand Macronix Part Name MX30LF1G18AC-XKI #G5 ball PT*1 Spansion Note S34ML01G100 If no connect, both pin functions are the same NC*2 Note: PT pin has internal weak pull low. It enables the protection function if active. NC= Not Connected P/N: AN0352 4 Ver.1, Nov.14, 2014 APPLICATION NOTE Comparing Spansion® S34ML01G100 with Macronix MX30LF1G18AC 6. Command Set Basic command sets and status checking methods are similar. The Read and Write operation commands are identical, but the devices have different command sequences when accessing the Cache Read function. Additionally, Macronix supports a Cache Read Begin, Unique ID Read, Set/Get feature and Block Protection Status Read function and Spansion® does not (Table 6-1). Table 6-1: Command Table Command Random Data Input Random Data Output Cache Read Begin Cache Read Sequential Read Mode Cache Read End Copy Back Read Read ID Reset Page Program Cache Program Copy Back Program Block Erase Read Status Read Parameter Pg. Unique ID Read Set Feature Get Feature Block Protection Status Read P/N: AN0352 Macronix Spansion MX30LF1G18AC S34ML01G100 1st Cycle 2nd Cycle 1st Cycle 2nd Cycle 85h 85h 05h E0h 05h E0h 00h 31h 31h 31h 00h 30h 00h 30h 3Fh 3Fh 00h 35h 90h 90h FFh FFh 80h 10h 80h 10h 80h 15h 80h 15h 85h 10h 60h D0h 60h D0h 70h 70h ECh ECh EDh EFh EEh 7Ah - 5 Ver.1, Nov.14, 2014 APPLICATION NOTE Comparing Spansion® S34ML01G100 with Macronix MX30LF1G18AC 6-2 Status Register When a flash Read/Program/Erase operation is in progress, either the “Ready/Busy# Pin Checking” or “Status Output Checking” method may be used to monitor the operation. Both are standard NAND flash algorithms and can be used for both device families. Table 6-3 shows that Status Output content provided by the Read Status command (70h) is compatible. Table 6-3: Status Output Status Output Macronix MX30LF1G18AC Spansion S34ML01G100 SR[0] PGM/ERS status: Pass/Fail PGM/ERS status: Pass/Fail SR[1] Cache Program status: Pass/Fail Cache Program status: Pass/Fail SR[2] Reserved Reserved SR[3] Reserved Reserved SR[4] Reserved Reserved SR[5] PGM/ERS/Read internal controller: Ready/Busy PGM/ERS/Read internal controller: Ready/Busy SR[6] PGM/ERS/Read status: Ready/Busy PGM/ERS/Read status: Ready/Busy SR[7] Write Protect Write Protect P/N: AN0352 6 Ver.1, Nov.14, 2014 APPLICATION NOTE Comparing Spansion® S34ML01G100 with Macronix MX30LF1G18AC 7. Read ID Command The ID of the Macronix MX30LF1G18AC begins with a one-byte Manufacturer Code followed by a four-byte Device ID while the Spansion NAND only outputs a three-byte Device ID. While the same command set is used to read the Manufacturer ID, Device ID, and flash structure, the IDs are different, allowing software to distinguish between the device manufacturer, Sequential Read Cycle Times, and ECC Level Requirement (Table 7-1). Table 7-1: Manufacturer and Device IDs ID Code Value 1st Byte 2nd Byte IO1, IO0 IO3, IO2 3rd Byte IO5, IO4 IO6 4th Byte 5th Byte P/N: AN0352 IO7 IO1, IO0 IO2 IO7, IO3 IO5, IO4 IO6 IO0, IO1 IO2, IO3 IO4~IO6 IO7 Macronix MX30LF1G18AC Spansion S34ML01G100 C2h/F1h/80h/95h/62h Manufacturer Code Device Identifier Number of Die per Chip Enable Cell Structure Number of Simultaneously Programmed Pages Interleaved Programming Between Multiple Chips Cache Program Page Size (exclude Spare Area) Size of Spare Area (Byte per 512Byte) Sequential Read Cycle Time (tRC) Block Size (exclude Spare Area) Organization ECC Level Requirement Number of Plane per CE Plane Size Reserved 01h/F1h/00h/1Dh Manufacturer Code Device Identifier Number of Die per Chip Enable Cell Structure Number of Simultaneously Programmed Pages Interleaved Programming Between Multiple Chips Cache Program Page Size (exclude Spare Area) Size of Spare Area (Byte per 512Byte) Serial Access Time (tRC) Block Size (exclude Spare Area) Organization - 7 Ver.1, Nov.14, 2014 APPLICATION NOTE Comparing Spansion® S34ML01G100 with Macronix MX30LF1G18AC 8. Power-Up Timing Macronix and Spansion® power-up sequences are similar, but the timing is slightly different. Although both devices use 2.7V (VCC min.) as the start point, timing references are different. Check the system timing to determine if adjustments are needed. Table 8-1: Power-Up Timing H/W Timing Characteristic Macronix MX30LF1G18AC Spansion S34ML01G100 Vcc (min.) to WE# Low 1ms (max.) N/A Vcc (min.) to R/B# High N/A 5ms (max.) Vcc (min.) to R/B# Low 10us (max.) 100us (max.) Vcc(min.) VCC WE# R/B# Figure 8-1: Power-Up Timing 9. Summary Macronix MX30LF1G18AC and Spansion® S34ML01G100 NAND have similar features and pinouts. Because basic Read/Program/Erase commands as well as block, page, and spare area sizes are the same, device migration may require only minimal firmware modification if special features such as Copy Back Read/Program are used, or to support Macronix 4-bit ECC. P/N: AN0352 8 Ver.1, Nov.14, 2014 APPLICATION NOTE Comparing Spansion® S34ML01G100 with Macronix MX30LF1G18AC 10. Reference Table 10-1 shows the datasheet versions used for comparison in this application note. For the most current, detailed Macronix specification, please refer to the Macronix Website at http://www.macronix.com Table 10-1: Datasheet Version Datasheet MX30LF1G18AC S34ML01G100 Location - Date Issue Sep. 04, 2014 Feb. 10, 2014 Revision Rev. 0.01 Rev. 17 Note: Macronix data sheet is subject to change without notice. 11. Appendix Cross Reference Table 11-1 shows basic part number and package information for the Macronix MX30LF1G18AC and Spansion® S34ML01G100 product families. Table 11-1: Part Number Cross Reference Density 1Gb Macronix Part No. MX30LF1G18AC-TI MX30LF1G18AC-XKI Spansion Part No. S34ML01G100TFI00 S34ML01G100BHI00 Package 48-TSOP 63-VFBGA Dimension 12x20mm 9x11x1.0mm 12. Revision History Revision 1.0 P/N: AN0352 Description Initial Release 9 Date Nov. 14, 2014 Ver.1, Nov.14, 2014 APPLICATION NOTE Comparing Spansion® S34ML01G100 with Macronix MX30LF1G18AC Except for customized products which have been expressly identified in the applicable agreement, Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial, personal, and/or household applications only, and not for use in any applications which may, directly or indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said Macronix's product qualified for its actual use in accordance with the applicable laws and regulations; and Macronix as well as it’s suppliers and/or distributors shall be released from any and all liability arisen therefrom. Copyright© Macronix International Co., Ltd. 2014. All rights reserved, including the trademarks and tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, Nbit, NBiit, Macronix NBit, eLiteFlash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo, BE-SONOS, KSMC, Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich Au-dio, Rich Book, Rich TV, and FitCAM. The names and brands of third party referred thereto (if any) are for identification purposes only. For the contact and order information, please visit Macronix’s Web site at: http://www.macronix.com P/N: AN0352 10 Ver.1, Nov.14, 2014