APPLICATION NOTE Migrating to MX25L3235E from MX25L3235D 1. Introduction This application note introduces the related notices for migrating to MX25L3235E from MX25L3235D. The document does not provide detailed information on individual devices, but highlights the similarities and differences between them. The comparison covers the general features, performance, command sets and device ID. MX25L3235E supports new features, such as 1I/2O: single-input/dual-output, 1I/4O: single-input/quadoutput, HOLD# feature, software reset, SFDP, TB (Top/Bottom) bit configuration register and individual sector/block protection mode etc. The information provided is based on the data available at the time the document is released. MX25L3235E datasheet may override this application note if there are content differences in the latest datasheet. Please refer to the contents and comparison tables below for more details. Publication Number: AN129V2 1 Issued: JAN. 31, 2012 APPLICATION NOTE 2. General Features 2-1. Feature Comparison MX25L3235E supports 1I/2O (single-input/dual-output) and 1I/4O (single-input/quad-output) new features, which provide faster read speed than former product. MX25L3235E has a new TB (Top/Bottom) bit configuration register. By the control of TB bit, Block protect area by BP bit can be started from Top or Bottom of the memory array. MX25L3235E supports the SFDP feature, which provides a consistent method of describing the features and functional capabilities of this Serial Flash device. User or host system can read the SFDP to understand the capabilities of the MX25L3235E for more efficient control. HOLD#, software reset, and individual sector/block protection features of MX25L3235E provide user additional methods to control memory. For the differences between these products, please check the comparison tables below for the detail. Table 2-1. Feature Comparison Major Feature MX25L3235D MX25L3235E Voltage 2.7 to 3.6V 2.7 to 3.6V Interface x1, x2, x4 x1, x2, x4 -40°C to 85 °C -40°C to 85 °C Sector Structure 4KB 4KB Block Structure 64KB 32KB / 64KB HOLD# Feature No Yes 1 I/O= 104MHz 2 I/O=75MHz 4 I/O=75MHz Normal Read=33MHz 1 I/O= 104MHz 2 I/O= 86MHz 4 I/O= 86MHz Normal Read= 50MHz 1I/2O Single-Input / Dual Output No Yes 1I/4O Single-Input / Qual Output No Yes Byte Program Yes Yes CP Mode (Continuous Program) Yes Yes Software Reset No Yes 4K bit 4K bit BP0~BP3 BP0~BP3 No Yes No Yes 100K 100K 20 Years 20 Years No Yes Operation Temperature Clock Rate Secured OTP Data Protection BP Protection TB bit Individual Sector/ Block Protect Endurance (typ.) Data Retention (min) SFDP Publication Number: AN129V2 2 Issued: JAN. 31, 2012 APPLICATION NOTE 2-2. Performance Comparison Table below is the comparison of new product and the former product. Table 2-2: Performance Comparison Performance MX25L3235D MX25L3235E 4.7ns(min.)(fSCLK) 13ns(min.)(fRSCLK) 4.7ns(min.)(fSCLK) 13ns(min.)(fRSCLK) 4.5ns(min.)(fSCLK) 9ns(min.)(fRSCLK) 4.5ns(min.)(fSCLK) 9ns(min.)(fRSCLK) Byte 9us(typ.); 300us(max.) 12us(typ.); 300us(max.) Page 1.4ms(typ.); 5ms(max.) 1.4ms(typ.); 5ms(max.) Sector(4KB) 60ms(typ.); 300ms(max.) 60ms(typ.); 300ms(max.) Block(64KB) 0.7s(typ.); 2s(max.) 0.7s(typ.); 2s(max.) Chip 25s(typ.); 50s(max.) 25s(typ.); 50s(max.) CS# Active Setup Time tSLCH 5ns(min.) 5ns(min.) CS# Not Active Setup Time tSHCH 5ns(min.) 5ns(min.) CS# Active Hold Time tCHSH 5ns(min.) 5ns(min.) CS# Not Active Hold Time tCHSL 5ns(min.) 5ns(min.) VCC Standby ISB1 20uA(max.) 40uA(max.) Deep Power Down ISB2 20uA(max.) Clock High/Low Time Program Time Erase Time tCH tCL ICC1 (Read)/ Single I/O Active Current Publication Number: AN129V2 5uA(min.) 20uA(max.) 25mA(max.) @104MHz 10mA(max.) @33MHz 19mA(max.) @104MHz 10mA(max.) @33MHz ICC2 (PP) 20 mA(max.) 25 mA(max.) ICC3 (WRSR) 20 mA(max.) 20 mA(max.) ICC4 (SE) 20 mA(max.) 25 mA(max.) ICC5 (CE) 20 mA(max.) 25 mA(max.) 3 Issued: JAN. 31, 2012 APPLICATION NOTE 3. Command Set Comparison MX25L3235E is capable of new commands, such as DREAD, QREAD, RDSFDP, SBLK, SBULK, GBLK and GBULK. User has to check the differences in detail by comparison table below. For the details of command sets function, please refer to the datasheet of each product. Table 3. Command Set Comparison Command Type Command Description Write Read Erase Program Security Register OTP SO Output Deep Power Down SFDP Publication Number: AN129V2 WREN WRDI WRSR RDID RDSR READ Fast Read 2READ 4READ RES Write Enable Write Disable Write Status Register Read Identification Read Status Register Read Data Fast Read 2 x I/O Read 4 x I/O Read Read Electronic Signature Read Electronic Manufacturer REMS ID DREAD 1I/2O Dual Read QREAD 1I/4O Qual Read SE Sector Erase (4K) BE Block Erase (64K) CE Chip Erase PP Page Program CP Continuous Program RDSCUR Read Security Register WRSCUR Write Security Register ENSO Enter Secured OTP EXSO Exit Secured OTP SBLK Single Block Lock SBULK Single Block Unlock Protection GBLK Gang Block Lock GBULK Gang Block Unlock ESRY Enable SO to Output RY/BY# Disable SO to Output RY/BY# DSRY (DSRY) DP Deep Power Down Release from Deep Power RDP Down RDSFDP Read SFDP contents 4 MX25L3235D MX25L3235E 06h 04h 01h 9Fh 05h 03h 0Bh BB EB ABh 06h 04h 01h 9Fh 05h 03h 0Bh BB EB ABh 90h 90h --20h D8h 60h or C7h 02h ADh 2Bh 2Fh B1h C1h ----70h 3Bh 6Bh 20h D8h 60h or C7h 02h ADh 2Bh 2Fh B1h C1h 36h 39h 7Eh 98h 70h 80h 80h B9h B9h ABh ABh -- 5Ah Issued: JAN. 31, 2012 APPLICATION NOTE 4. Device ID Code Comparison The following table shows the ID Code Comparison. Be attention that some values are different. Table 4-1: ID Code Comparison Command Type RDID Command RES Command REMS MX25L3235D Manufactory ID C2 MX25L3235E Type Density 5E 16 Manufactory ID C2 Electronic ID 5E Manufactory ID C2 Type Density 20 16 Electronic ID Device ID 15 Manufactory ID Device ID 5E C2 15 5. References The following datasheets were used for preparing this comparison note: Datasheet Location Date Issued Versions MX25L3235D Macronix Website May, 2011 1.5 MX25L3235E Macronix Website December, 2011 0.01 For more functional and parametric specifications, please refer to the datasheet on the Macronix Website at http://www.macronix.com/ and go to: Products/Flash Memory/Serial Flash. Publication Number: AN129V2 5 Issued: JAN. 31, 2012 APPLICATION NOTE 6. Revision History Revision No. Description V1 1. Initial release V2 1. Added SFDP description Publication Number: AN129V2 Page All P1, 2, 4 6 Date DEC/26/2011 JAN/31/2011 Issued: JAN. 31, 2012 APPLICATION NOTE Except for customized products which have been expressly identified in the applicable agreement, Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial, personal, and/or household applications only, and not for use in any applications which may, directly or indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said Macronix's product qualified for its actual use in accordance with the applicable laws and regulations; and Macronix as well as it’s suppliers and/or distributors shall be released from any and all liability arisen therefrom. Copyright© Macronix International Co., Ltd. 2011~2012. All rights reserved. Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, NBiit, Macronix NBit, eLiteFlash, XtraROM, Phines, BE-SONOS, KSMC, Kingtech, MXSMIO, Macronix vEE are trademarks or registered trademarks of Macronix International Co., Ltd. The names and brands of other companies are for identification purposes only and may be claimed as the property of the respective companies. For the contact and order information, please visit Macronix’s Web site at: http://www.macronix.com MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice. Publication Number: AN129V2 7 Issued: JAN. 31, 2012