APPLICATION NOTE Comparison of MX25L6435E and MX25L6445E 1. Introduction This application note compares MX25L6435E and MX25L6445E. The document does not provide detailed information on individual device, but highlights the similarities and differences between them. The comparison covers the general features, performance, command sets and device ID. MX25L6435E supports Dual Output mode (1I/2O: Single input / Dual output) and Quad Output mode (1I/4O: Single input / Quad output). MX25L6435E supports T/B (Top/Bottom) bit new function. However, MX25L6435E does not support DTR mode. The information provided is based on the data available at the time. MX25L6435E and MX25L6445E datasheets may override this application note if there is a different description for the same specification in the datasheets. Please refer to the contents and comparison tables below for more details. Publication Number: AN137V1 1 Issued: FEB. 10, 2012 APPLICATION NOTE 2. General Features 2-1. Feature Comparison MX25L6435E has a new T/B (Top/Bottom) bit configuration register. By the control of T/B bit, Block protect area by BP bit can be started from Top or Bottom of the memory array. The SFDP is one of the new features for both MX25L6435E and MX25L6445E, which provides a consistent method of describing the features and functional capabilities of this Serial Flash device. User or host system can read the SFDP to understand the capabilities of the MX25L6435E and MX25L6445E for more efficient control. SFDP is a standard of JEDEC, JESD216 for serial flash. It is similar to JEDEC Standard, JESD68 on CFI (Common Flash Interface) for Parallel Flash. For the differences between these products, please check the comparison tables below for details. Publication Number: AN137V1 2 Issued: FEB. 10, 2012 APPLICATION NOTE Table 2-1. Feature Comparison Feature MX25L6435E MX25L6445E Voltage 2.7~3.6 V 2.7~3.6 V Interface x1, x2, x4 x1, x2, x4 16-SOP (300mil) 8-SOP(209mil) 8-WSON(6x5mm) -40~85°C 16-SOP(300mil) 8-SOP(209mil) 8-WSON(8x6mm) -40~85°C 4KB / 32KB or 64KB 4KB / 32KB or 64KB 104MHz 50MHz 104MHz 50MHz 70MHz -- 86MHz Up to 104MHz ---86MHz Yes. for 4READ mode only -Yes 4Kbits BP3~BP0 70MHz 70MHz 50MHz 50MHz 50MHz 20MHz No Yes Yes 4Kbits BP3~BP0 Yes -- Individual Sector/Block Protect Individual Sector/Block Protect Yes Yes No Yes Package Operation Temperature Sector / Block Fast Read (x 1I/O) Read DREAD (Dual Output) 2READ(x2 I/O) Clock Rate (max.) 4READ(x4 I/O) 1DDRRD 2DDRRD 4DDRRD 4PP Configurable Dummy Cycle DTR mode CP Mode Secured OTP Block Protection Data T/B (Top/Bottom) Protection bit Individual Protection HOLD# SFDP Publication Number: AN137V1 3 Issued: FEB. 10, 2012 APPLICATION NOTE 2-2. Performance Comparison Table below is the comparison of new product and the former product. Table 2-2: Performance Comparison Performance Clock High/Low Time Program Time MX25L6435E MX25L6445E tCH 104MHz: 4.5ns 50MHz: 9ns 104MHz: 4.5ns 50MHz: 9ns tCL 104MHz: 4.5ns 50MHz: 9ns 104MHz: 4.5ns 50MHz: 9ns Byte 12us(typ.) ; 300us(max.) 9us(typ.) ; 300us(max.) Page 1.4ms(typ.) ; 5ms(max.) 1.4ms(typ.) ; 5ms(max.) 60ms(typ.) 60ms(typ.) 32KB:0.5s(typ.); 2s(max.) 32KB:0.5s(typ.); 2s(max.) 64KB:0.7s(typ.); 2s(max.) 64KB:0.7s(typ.); 2s(max.) 50s (typ.) / 80s(max.) 50s (typ.) / 80s(max.) 5ns(min.) 5ns(min.) 5ns(min.) 5ns(min.) 5ns(min.) 5ns(min.) 5ns(min.) 5ns(min.) Read=15ns(min.) ; Write=50ns(min.) Read=15ns(min.) ; Write=50ns(min.) 40uA(max.) 50uA(max.) 20uA(max.) 20uA(max.) 104MHz: 35mA(4/IO) 19mA(1/IO) 86MHz: 25mA(4/IO) 20mA(2/IO) 33MHz: 10mA 104MHz: 19mA 66MHz: 15mA 33MHz: 10mA 25mA 25mA 20mA 20mA 25mA 25mA 25mA 20mA Sector Erase Time Block Chip CS# Active Setup Time tSLCH CS# Not Active Setup Time tSHCH CS# Active Hold Time tCHSH CS# Not Active Hold Time tCHSL CS# Deselect Time tSHSL VCC Standby Deep Power Down ISB1 ISB2 ICC1 Active Current (max.) ICC2 ICC3 ICC4 ICC5 Publication Number: AN137V1 4 Issued: FEB. 10, 2012 APPLICATION NOTE 3. Command Set Comparison User has to check the differences in detail by comparison table below. For the details of command sets function, please refer to the datasheet of each product. Table 3. Command Set Comparison Command Write Read Erase Program Security Register Secured OTP SO output Deep Power Down Block Lock Clear SR High Performance Block Protect Read Publication Number: AN137V1 WREN WRDI WRSR RDID RDSR READ Fast Read 2READ 4READ FASTDTRD 2DTRD 4DTRD DREAD QREAD RES REMS REMS2 REMS4 REMS4D SE BE BE32K CE 4PP PP CP RDSCUR WRSCUR ENSO EXSO ESRY DSRY DP RDP SBLK SBULK GBLK GBULK CLSR HPM RDBLOCK MX25L6435E 06h 04h 01h 9Fh 05h 03h 0Bh BBh EBh ---3Bh 6Bh Abh 90h EFh DFh -20h D8h 52h 60h or C7h 38h 02h ADh 2Bh 2Fh B1h C1h 70h 80h B9h ABh 36h 39h 7Eh 98h --3Ch 5 MX25L6445E 06h 04h 01h 9Fh 05h 03h 0Bh BBh EBh 0Dh BDh EDh --Abh 90h EFh DFh CFh 20h D8h 52h 60h or C7h 38h 02h ADh 2Bh 2Fh B1h C1h 70h 80h B9h ABh 36h 39h 7Eh 98h 30h A3h 3Ch Issued: FEB. 10, 2012 APPLICATION NOTE 4. Device ID Code Comparison The following table shows that the Manufacturer and Device IDs have not changed. Table 4-1: ID Code Comparison Command Type RDID Command MX25L6435E M ID Type Density M ID Type Density C2 20 17 C2 20 17 RES Command REMS MX25L6445E E ID E ID 16 16 M ID Device ID M ID Device ID C2 16 C2 16 5. References The following datasheets were used for preparing this comparison note: Datasheet Location Date Issued Versions MX25L6435E Macronix Website Feb. 2012 0.02 MX25L6445E Macronix Website Jul. 2010 1.4 For more functional and parametric specifications, please refer to the datasheet on the Macronix Website at http://www.macronix.com/ and go to: Products/Flash Memory/Serial Flash. Publication Number: AN137V1 6 Issued: FEB. 10, 2012 APPLICATION NOTE Except for customized products which have been expressly identified in the applicable agreement, Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial, personal, and/or household applications only, and not for use in any applications which may, directly or indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said Macronix's product qualified for its actual use in accordance with the applicable laws and regulations; and Macronix as well as it’s suppliers and/or distributors shall be released from any and all liability arisen therefrom. Copyright© Macronix International Co., Ltd. 2012. All rights reserved, including the trademarks and tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, NBiit, Macronix NBit, eLiteFlash, XtraROM, Phines, KH Logo, BE-SONOS, KSMC, Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich Audio, Rich Book, Rich TV, and FitCAM. The names and brands of other companies are for identification purposes only and may be claimed as the property of the respective companies. For the contact and order information, please visit Macronix’s Web site at: http://www.macronix.com MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice. Publication Number: AN137V1 7 Issued: FEB. 10, 2012