CMPWR330 400 mA SmartORt Regulator with VAUX Switch Product Description The CMPWR330 is a dual input regulator with a fully integrated VAUX switch capable of delivering up to 400 mA continuously at 3.3 V. The input is taken from three independent voltage sources on a prioritized basis. Power is always taken in priority using the order of VCC, VSBY, and VAUX. When VCC, (5 V) or VSBY is present, the device automatically enables the regulator and produces a stable 3.3 V output at VOUT. When only VAUX (3.3 V) is present, the device provides a low impedance direct connection (0.25 TYP.) from VAUX to VOUT. All the necessary control circuitry needed to provide a smooth and automatic transition between all three supplies has been incorporated. This allows the VCC input supply to be dynamically switched without loss of output voltage. The CMPWR330 is housed in an 8−pin SOIC package and is available with RoHS compliant lead−free finishing. http://onsemi.com SIOC 8 SF SUFFIX CASE 751BD MARKING DIAGRAM CMPWR330SF Features • • • • • • • • • Continuous 3.3 V Output from Three Inputs Complete Power Management Solution VCC, VSBY Regulator Supplies 400 mA Output Built−In Hysteresis when Selecting Input Supplies Integrated Switch Has Very Low RDS(ON) Resistance of 0.25 (TYP) Foldback Current Limiting Protection Thermal Overload Shutdown Protection 8−Pin Power SOIC Package These Devices are Pb−Free and are RoHS Compliant Applications • • • • CMPWR330SF = Specific Device Code ORDERING INFORMATION Device Package Shipping† CMPWR330SF Power SOIC (Pb−Free) 750/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. PCI Adapter Cards with Wake−On−LAN Network Interface Cards (NICs) Multiple Power Systems Systems with Standby Capabilities © Semiconductor Components Industries, LLC, 2011 April, 2011 − Rev. 4 1 Publication Order Number: CMPWR330/D CMPWR330 TYPICAL APPLICATION CIRCUIT 5V VSBY CMPWR330 + 1 F VSBY GND 5V VCC VOUT VCC + 1 F + − 3.3 V/400 mA VOUT + CEXT VAUX 10 F GND VAUX 3.3 V GND SIMPLIFIED ELECTRICAL SCHEMATIC VSBY VCC Controller SELECT (VCC/VSBY) + ENABLE - VCC AUXSW VDeselect 4.1 V + AUXSW 0.25 VREF 3.3 V VSBY - Regulator Amp VOUT 3.3 V 400 mV VAUX GND http://onsemi.com 2 CMPWR330 PACKAGE / PINOUT DIAGRAM Top View VSBY 1 8 GND VCC 2 7 GND VOUT 3 6 GND VAUX 4 5 GND 8−Pin Power SOIC Table 1. PIN DESCRIPTIONS Pin(s) Name Description 1 VSBY VSBY is the standby input supply (5 V), which is used to power the regulator whenever VCC is below the deselect level (4.2 V). If the VSBY connection is made within a few inches of the main input filter, a bypass capacitor may not be necessary. Otherwise a bypass filter capacitor in the range of 1 F to 10 F will ensure adequate filtering. 2 VCC VCC is a positive input supply for the voltage regulator. Whenever this supply voltage exceeds the VCCSEL level (4.4 V), it will be given priority and be used to power the regulator output. If this supply voltage falls below the VCCDES level (4.2 V) it will immediately be deselected and no longer provide power for the regulator output. An internal hysteresis voltage of 0.2 V is used to prevent any chatter during selection and deselection of VCC. The effective source impedance of VCC should be kept below 0.3 to ensure changeover disturbances do not exceed the hysteresis level. If the connection to VCC is made within a few inches of the main input filter, a bypass capacitor may not be necessary. Otherwise a bypass filter capacitor in the range of 1 F to 10 F will ensure adequate filtering. 3 VOUT VOUT is the output voltage. Power is provided from the regulator or via the low impedance auxiliary switch. This output requires a capacitance of 10 F to ensure regulator stability and minimize the peak output disturbance during power supply changeover. 4 VAUX VAUX is the auxiliary voltage power source. This supply is selected only when VCC falls below 4.2 V and the VSBY is not present. Under these conditions an internal switch is enabled and provides a very low impedance connection directly between VAUX and VOUT. 5−8 GND The negative reference for all voltages. Also functions as a thermal path for heat dissipation. SPECIFICATIONS Table 2. ABSOLUTE MAXIMUM RATINGS Parameter ESD Protection (HBM) Pin Input Voltages VCC, VSBY VAUX Rating Units ±2000 V [GND − 0.5] to +6.0 [GND − 0.5] to +4.0 Storage Temperature Range −40 to +150 Operating Temperature Range Ambient Junction 0 to +70 0 to +125 Power Dissipation (Note 1) Internally Limited V °C °C W Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. At rated load, the power dissipation will be 0.68 W (1.7 V x 0.4 A). Under these conditions, (in a 70°C ambient), the thermal resistance from junction to ambient (JA) must not exceed 80°C/W. This is typically achieved with 2 square inches of copper printed circuit board area connected to the GND pins for heat spreading, or equivalent. http://onsemi.com 3 CMPWR330 SPECIFICATIONS (Cont’d) Table 3. STANDARD OPERATING CONDITIONS Parameter Rating Units VCC, VSBY 5.0 ±0.25 V VAUX 3.3 ±0.3 V Ambient Operating Temperature Range 0 to +70 °C Load Current 0 to 400 mA CEXT 10 ±20% F Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol VOUT Parameter Conditions Min Typ Max Units 3.135 3.300 3.465 V Regulator Output Voltage 0 mA < ILOAD < 400 mA ILIM Regulator Current Limit VOUT > 1 V 500 mA IS/C Short Circuit Current VCC/SBY = 5 V, VOUT = 0 V 150 mA VR LOAD Load Regulation VCC = 5 V, 5 mA ≤ ILOAD ≤ 400 mA 20 mV VR LINE Line Regulation xx ILOAD = 5 mA, 4.5 V ≤ VIN ≤ to 5.5 V 2 mV VCCSEL VCC Select Voltage VSBY or VAUX Present VCCDES VCC Deselect Voltage VSBY or VAUX Present Hysteresis Voltage VSBY or VAUX Present (Note 2) VHYST RSW VAUX Switch Resistance IRCC IRSBY IRAUX VCC Reverse Leakage VSBY Reverse Leakage VAUX Reverse Leakage One supply input taken to GND while the others remain at nominal voltage. ICC VCC Supply Current ISBY 4.40 4.00 4.60 V 4.20 V 0.20 V 0.25 0.40 5 100 A VCC > VCCSEL, ILOAD = 0 mA 0.8 1.5 mA VSBY Supply Current VCC < VCCSEL, ILOAD = 0 mA 0.8 1.5 mA IAUX VAUX Supply Current VAUX is Selected, ILOAD = 0 mA 0.20 0.30 mA IGND Ground Current VAUX is Selected, (VCC/SBY = 0 V) VCC/SBY = 5 V, ILOAD = 0 mA VCC/SBY = 5 V, ILOAD = 400 mA 0.20 0.80 1.00 0.30 1.50 2.00 mA TDISABLE THYST Shutdown Temperature Thermal Hysteresis 160 20 °C 1. Operating characteristics are over Standard Operating Conditions unless otherwise specified. 2. The disturbance on VCC during supply changeover should be kept below the hysteresis voltage to prevent any chatter. The source resistance on the VCC supply should be kept to less than 0.3 to ensure precise switching. http://onsemi.com 4 CMPWR330 PERFORMANCE INFORMATION CMPWR330 Typical DC Characteristics (nominal conditions unless specified otherwise) Figure 1. VCC Supply Current vs. Voltage Figure 2. VSBY Supply Current vs. Voltage Figure 3. VAUX Supply Current vs. Voltage Figure 4. Ground Current vs. Output Load Figure 5. ?????????? Figure 6. ?????????? http://onsemi.com 5 CMPWR330 PERFORMANCE INFORMATION (Cont’d) CMPWR330 Typical DC Characteristics (cont’d, nominal conditions unless specified otherwise) Figure 7. Load Regulation (5 V Supply) Figure 8. Foldback Current Limit Protection Figure 9. Regulation Dropout Characteristics Figure 10. Switch Resistance vs. VAUX Supply http://onsemi.com 6 CMPWR330 PERFORMANCE INFORMATION (Cont’d) CMPWR330 Transient Characteristics (nominal conditions unless specified otherwise) (VCC source resistance set to 0.2 ) Figure 11. VCC Cold Start (Load = 400 mA) Figure 12. VCC Full Power Down (Load = 400 mA) Figure 13. VSBY Cold Start (Load = 400 mA) Figure 14. VSBY Full Power Down (Load = 400 mA) Figure 15. VAUX Cold Start (Load = 400 mA) Figure 16. VAUX Full Power Down (Load = 400 mA) http://onsemi.com 7 CMPWR330 PERFORMANCE INFORMATION (Cont’d) CMPWR330 Transient Characteristics (cont’d; nominal conditions unless specified otherwise) (VCC source resistance set to 0.2 ) Figure 17. VCC Power Up (VSBY = 5 V, Load = 300 mA) Figure 18. VCC Power Down (VSBY = 5 V, Load = 300 mA) Figure 19. VCC Power Up (VAUX = 3.3 V, Load = 300 mA) Figure 20. VCC Power Down (VAUX = 3.3 V, Load = 300 mA) Figure 21. Load Transient Response (10% − 90% Rated) Figure 22. Line Transient (1 VPP) Response http://onsemi.com 8 CMPWR330 PERFORMANCE INFORMATION (Cont’d) CMPWR330 Typical Thermal Characteristics The overall junction to ambient thermal resistance (JA) for device power dissipation (PD) consists primarily of two paths in series. The first path is the junction to the case (JC) which is defined by the package style, and the second path is case to ambient (CA) thermal resistance which is dependent on board layout. The final operating junction temperature for any set of conditions can be estimated by the following thermal equation: T J + T A ) (P D)(q JC) ) (P D)(q CA) + T A ) (P D)(q JA) The CMPWR330 uses a thermally enhanced package where all the GND leads (pins 5 through 8) are integral to the leadframe. When this package is mounted on a double−sided printed circuit board with two square inches of copper allocated for “heat spreading”, the resulting JA is about 50°C/W. Based on a typical operating power dissipation of 0.7 W (1.75 V x 0.4 A) with an ambient of 70°C, the resulting junction temperature will be: Figure 23. VOUT Variation with TAMB(400 mA Load)T T J + T A ) (P D)(q JA) + 70° C ) 0.7W (50° CńW) + 70° C ) 35° C + 105° C The thermal characteristics were measured using a double−sided board with two square inches of copper area connected to the GND pin for “heat spreading”. Measurements showing performance up to junction temperature of 125°C were performed under light load conditions (5 mA). This allows the ambient temperature to be representative of the internal junction temperature. NOTE: The use of multi−layer board construction with separate ground and power planes will further enhance the overall thermal performance. In the event of no copper area being dedicated for heat spreading, a multi−layer board construction, using only the minimum size pad layout, will provide the CMPWR330 with an overall JA of 70°C/W which allows up to 780 mW to be safely dissipated for the maximum junction temperature. Figure 24. Select/Deselect Threshold Variation with TJUNC Figure 25. VAUX Switch Resistance vs. TAMB http://onsemi.com 9 CMPWR330 PACKAGE DIMENSIONS SOIC 8, 150 mils CASE 751BD−01 ISSUE O E1 E SYMBOL MIN A 1.35 1.75 A1 0.10 0.25 b 0.33 0.51 c 0.19 0.25 D 4.80 5.00 E 5.80 6.20 E1 3.80 4.00 MAX 1.27 BSC e PIN # 1 IDENTIFICATION NOM h 0.25 0.50 L 0.40 1.27 θ 0º 8º TOP VIEW D h A1 θ A c e b L SIDE VIEW END VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MS-012. SmartOR is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 10 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative CMPWR330/D