5V ECL 4-Bit Serial/Parallel Converter

MC10E445, MC100E445
5VECL 4-Bit Serial/Parallel
Converter
Description
The MC10/100E445 is an integrated 4-bit serial to parallel data
converter. The device is designed to operate for NRZ data rates of up to
http://onsemi.com
2.0 Gb/s. The chip generates a divide by 4 and a divide by 8 clock for
both 4-bit conversion and a two chip 8-bit conversion function. The
conversion sequence was chosen to convert the first serial bit to Q0, the
second to Q1 etc.
PLCC−28
FN SUFFIX
Two selectable serial inputs provide a loopback capability for testing
CASE 776
purposes when the device is used in conjunction with the E446 parallel to
serial converter.
The start bit for conversion can be moved using the SYNC input. A
single pulse applied asynchronously for at least two input clock cycles
MARKING DIAGRAM*
shifts the start bit for conversion from Qn to Qn−1. For each additional
1 28
shift required an additional pulse must be applied to the SYNC input.
Asserting the SYNC input will force the internal clock dividers to
“swallow” a clock pulse, effectively shifting a bit from the Qn to the Qn−1
output (see Timing Diagram B).
MCxxxE445FNG
The MODE input is used to select the conversion mode of the device.
AWLYYWW
With the MODE input LOW, or open, the device will function as a 4-bit
converter. When the mode input is driven HIGH the data on the output will
change on every eighth clock cycle thus allowing for an 8-bit conversion
xxx
= 10 or 100
scheme using two E445’s. When cascaded in an 8-bit conversion scheme
A
= Assembly Location
the devices will not operate at the 2.0 Gb/s data rate of a single device.
WL
= Wafer Lot
Refer to the applications section of this data sheet for more information on
YY
= Year
cascading the E445.
WW
= Work Week
Upon power-up the internal flip-flops will attain a random state. To
G
= Pb−Free Package
synchronize multiple E445’s in a system the master reset must be asserted.
The VBB pin, an internally generated voltage supply, is available to this
*For additional marking information, refer to
device only. For single-ended input conditions, the unused differential
Application Note AND8002/D.
input is connected to VBB as a switching reference voltage. VBB may also
rebias AC coupled inputs. When used, decouple VBB and VCC via a
ORDERING INFORMATION
0.01 mF capacitor and limit current sourcing or sinking to 0.5 mA. When
See detailed ordering and shipping information in the package
not used, VBB should be left open.
dimensions section on page 11 of this data sheet.
The 100 Series contains temperature compensation.
Features
• ESD Protection: Human Body Model; > 2 kV,
• On-Chip Clock ÷4 and ÷8
Machine Model; > 100 V
• 2.0 Gb/s Data Rate Capability
• Meets or Exceeds JEDEC Spec EIA/JESD78
IC Latchup Test
• Differential Clock and Serial Inputs
• Moisture Sensitivity Level: Pb = 1; Pb−Free = 3
• VBB Output for Single-Ended Input Applications
For Additional Information, see Application Note
• Asynchronous Data Synchronization
AND8003/D
• Mode Select to Expand to 8-Bits
•
Flammability Rating: UL 94 V−0 @ 0.125 in,
• PECL Mode Operating Range: VCC = 4.2 V to 5.7 V
Oxygen
Index: 28 to 34
with VEE = 0 V
• Transistor Count = 528 devices
• NECL Mode Operating Range: VCC = 0 V
• PECL Mode Operating Range: VCC = 4.2 V to 5.7 V
with VEE = −4.2 V to −5.7 V
with VEE = 0 V
• Internal Input 50 kW Pulldown Resistors
• Pb−Free Packages are Available*
*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
November, 2006 − Rev. 12
1
Publication Order Number:
MC10E445/D
SINB
26
SINB
27
SEL
28
25
24
RESET
SINA SINA
SYNC
MC10E445, MC100E445
23
22
Table 1. PIN DESCRIPTION
MODE NC VCCO
21
20
MC10E445
PIN
19
18
SOUT
17
SOUT
16
VCC
15
Q0
VEE
1
CLK
2
14
Q1
CLK
3
13
VCCO
VBB
4
12
Q2
5
6
7
8
9
10
SINA, SINA
SINB, SINB
SEL
Q0−Q3
CLK, CLK
CL/4, CL/4
CL/8, CL/8
MODE
SYNCH
VBB
VCC, VCCO
VEE
NC
11
CL/8 CL/8 VCCO CL/4 CL/4 VCCO Q3
* All VCC and VCCO pins are tied together on the die.
Warning: All VCC, VCCO, and VEE pins must be externally connected to Power Supply to guarantee proper operation.
Figure 1. Pinout: PLCC−28 (Top View)
http://onsemi.com
2
FUNCTION
ECL Differential Serial Data Input A
ECL Differential Serial Data Input B
ECL Serial Input Selector Pin
ECL Parallel Data Outputs
ECL Differential Clock Inputs
ECL Differential ÷4 Clock Output
ECL Differential ÷8 Clock Output
ECL Conversion Mode 4-Bit/8-Bit
ECL Conversion Synchronizing Input
Reference Voltage Output
Positive Supply
Negative Supply
No Connect
MC10E445, MC100E445
SINB
SINB
SINA
D
Q
D
Q
Q3
D
Q
D
Q
Q2
D
Q
D
Q
Q1
D
Q
D
Q
Q0
SINA
SEL
SOUT
SOUT
1
0
MODE
CLK
In Out
Latch
EN
CLK
D
SYNC
Q
CL/4
Out
÷4
R
CL/4
CL/8
Out
÷2
R
D
CL/8
Q
VBB
RESET
Figure 2. Logic Diagram
Table 2. FUNCTION TABLES
Mode
Conversion
SEL
Serial Input
L
H
4-Bit
8-Bit
H
L
A
B
http://onsemi.com
3
MC10E445, MC100E445
Table 3. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
VCC
PECL Mode Power Supply
VEE = 0 V
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
Iout
Output Current
Continuous
Surge
IBB
VBB Sink/Source
TA
Operating Temperature Range
Tstg
Storage Temperature Range
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
Tsol
Wave Solder
Pb
Pb−Free
Condition 2
VI ≤ VCC
VI ≥ VEE
Rating
Unit
8
V
6
−6
V
V
50
100
mA
mA
± 0.5
mA
0 to +85
°C
−65 to +150
°C
PLCC−28
PLCC−28
63.5
43.5
°C/W
°C/W
PLCC−28
22 to 26
°C/W
265
265
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
http://onsemi.com
4
MC10E445, MC100E445
Table 4. 10E SERIES PECL DC CHARACTERISTICS VCCx = 5.0 V; VEE = 0.0 V (Note 1)
0°C
Symbol
Characteristic
Min
25°C
Typ
Max
Min
154
185
4070
4160
4020
4170
3975
85°C
Typ
Max
Min
154
185
4105
4190
4090
4170
3975
Typ
Max
Unit
154
185
mA
4185
4280
mV
4170
mV
3227
3405
mV
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 2)
3980
VOHsout
Output HIGH Voltage sout/sout
3975
VOL
Output LOW Voltage (Note 2)
3050
3210
3370
3050
3210
3370
3050
VIH
Input HIGH Voltage (Single−Ended)
3830
3995
4160
3870
4030
4190
3940
4110
4280
mV
VIL
Input LOW Voltage (Single−Ended)
3050
3285
3520
3050
3285
3520
3050
3302
3555
mV
VBB
Output Voltage Reference
3.62
3.74
3.65
3.75
3.69
3.81
V
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 3)
2.2
4.6
2.2
4.6
2.2
4.6
V
IIH
Input HIGH Current
150
mA
IIL
Input LOW Current
150
0.5
0.3
150
0.5
0.25
0.3
0.2
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Input and output parameters vary 1:1 with VCC. VEE can vary −0.46 V / +0.06 V.
2. Outputs are terminated through a 50 W resistor to VCC − 2.0 V.
3. VIHCMR min varies 1:1 with VEE, max varies 1:1 with VCC.
Table 5. 10E SERIES NECL DC CHARACTERISTICS VCCx = 0.0 V; VEE = −5.0 V (Note 4)
0°C
Symbol
Characteristic
Min
25°C
Typ
Max
Min
154
185
−930
−840
−980
−830
−1025
−1630
−1950
85°C
Typ
Max
Min
154
185
−895
−810
−910
−830
−1025
−1630
−1950
Typ
Max
Unit
154
185
mA
−815
−720
mV
−830
mV
−1595
mV
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 5)
−1020
VOHsout
Output HIGH Voltage sout/sout
−1025
VOL
Output LOW Voltage (Note 5)
−1950
−1790
VIH
Input HIGH Voltage (Single−Ended)
−1170
−1005
−840
−1130
−970
−810
−1060
−970
−720
mV
VIL
Input LOW Voltage (Single−Ended)
−1950
−1715
−1480
−1950
−1715
−1480
−1950
−1698
−1445
mV
VBB
Output Voltage Reference
−1.38
−1.27
−1.35
−1.25
−1.31
−1.19
V
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 6)
−2.8
−0.4
−2.8
−0.4
−2.8
−0.4
V
IIH
Input HIGH Current
150
mA
IIL
Input LOW Current
−1790
150
0.5
0.3
−1773
150
0.5
0.065
0.3
0.2
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
4. Input and output parameters vary 1:1 with VCC. VEE can vary −0.46 V / +0.06 V.
5. Outputs are terminated through a 50 W resistor to VCC − 2.0 V.
6. VIHCMR min varies 1:1 with VEE, max varies 1:1 with VCC.
http://onsemi.com
5
MC10E445, MC100E445
Table 6. 100E SERIES PECL DC CHARACTERISTICS VCCx = 5.0 V; VEE = 0.0 V (Note 7)
0°C
Symbol
Characteristic
Min
25°C
Typ
Max
Min
154
185
4050
4120
3975
4170
3975
85°C
Typ
Max
Min
154
185
4050
4120
3975
4170
3975
Typ
Max
Unit
177
212
mA
4050
4120
mV
4170
mV
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 8)
3975
VOHsout
Output HIGH Voltage sout/sout
3975
VOL
Output LOW Voltage (Note 8)
3190
3295
3380
3190
3255
3380
3190
3260
3380
mV
VIH
Input HIGH Voltage (Single−Ended)
3835
3975
4120
3835
3975
4120
3835
3975
4120
mV
VIL
Input LOW Voltage (Single−Ended)
3190
3355
3525
3190
3355
3525
3190
3355
3525
mV
VBB
Output Voltage Reference
3.62
3.74
3.62
3.74
3.62
3.74
V
VIHCMR
Input HIGH Voltage Common Mode Range
(Differential Configuration Configuration)
(Note 9)
2.2
4.6
2.2
4.6
2.2
4.6
V
IIH
Input HIGH Current
150
mA
IIL
Input LOW Current
150
0.5
0.3
150
0.5
0.25
0.5
0.2
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
7. Input and output parameters vary 1:1 with VCC. VEE can vary −0.46 V / +0.8 V.
8. Outputs are terminated through a 50 W resistor to VCC − 2.0 V.
9. VIHCMR min varies 1:1 with VEE, max varies 1:1 with VCC.
Table 7. 100E SERIES NECL DC CHARACTERISTICS VCCx = 0.0 V; VEE = −5.0 V (Note 10)
0°C5
Symbol
Characteristic
Min
25°C
Typ
Max
Min
154
185
−950
−880
−1025
−830
−1025
−1620
−1810
−1745
85°C
Typ
Max
Min
Typ
Max
Unit
154
185
177
212
mA
−950
−880
−1025
−950
−880
mV
−830
−1025
−830
mV
−1620
−1810
−1740
−1620
mV
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 11)
−1025
VOHsout
Output HIGH Voltage sout/sout
−1025
VOL
Output LOW Voltage (Note 11)
−1810
−1705
VIH
Input HIGH Voltage (Single−Ended)
−1165
−1025
−880
−1165
−1025
−880
−1165
−1025
−880
mV
VIL
Input LOW Voltage (Single−Ended)
−1810
−1645
−1475
−1810
−1645
−1475
−1810
−1645
−1475
mV
VBB
Output Voltage Reference
−1.38
−1.26
−1.38
−1.26
−1.38
−1.26
V
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential) Configuration
(Note 12)
−2.8
−0.4
−2.8
−0.4
−2.8
−0.4
V
IIH
Input HIGH Current
150
mA
IIL
Input LOW Current
150
0.5
0.3
150
0.5
0.25
0.5
0.2
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification
limit values are applied individually under normal operating conditions and not valid simultaneously.
10. Input and output parameters vary 1:1 with VCC. VEE can vary −0.46 V / +0.8 V.
11. Outputs are terminated through a 50 W resistor to VCC − 2.0 V.
12. VIHCMR min varies 1:1 with VEE, max varies 1:1 with VCC.
http://onsemi.com
6
MC10E445, MC100E445
Table 8. AC CHARACTERISTICS VCCx = 5.0 V; VEE = 0.0 V or VCCx = 0.0 V; VEE = −5.0 V (Note 13)
0°C
Symbol
Characteristic
Min
fMAX
Maximum Conversion Frequency
tPLH
tPHL
Propagation Delay to Output
CLK to Q, Reset to Q
CLK to SOUT (Diff)
CLK to CL/4(Diff)
CLK to CL/8(Diff)
ts
Setup Time
th
Hold Time
tRR
Reset Recovery Time
tPW
Minimum Pulse Width
tJITTER
Random Clock Jitter (RMS)
VPP
Input Voltage Swing
(Differential Configuration)
tr
tf
Rise/Fall Times 20%−80%
Typ
25°C
Max
2.0
1800
975
1325
1325
SINA, SINB
SEL
−100
0
SINA, SINB, SEL
2100
1150
1550
1550
1800
975
1325
1325
−250
−200
−100
0
450
300
500
300
400
2100
1150
1550
1550
225
425
Min
Typ
1800
975
1325
1325
−250
−200
−100
0
−250
−200
450
300
450
300
500
300
500
300
150
350
650
100
200
2100
1150
1550
1550
225
425
150
350
650
100
200
ps
ps
ps
ps
<1
1000
Unit
ps
400
<1
1000
Max
Gb/s
NRZ
1500
800
1100
1100
400
150
100
200
85°C
Max
2.0
1500
800
1100
1100
<1
SOUT
Other
Typ
2.0
1500
800
1100
1100
CLK, MR
Min
ps
1000
225
425
350
650
mV
ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
13. 10 Series: VEE can vary −0.46 V / +0.06 V.
100 Series: VEE can vary −0.46 V / +0.8 V.
14. Devices are designed to meet the AC specifications shown in the above table, after thermal equilibrium has been established. The circuit
is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained.
tRR
Reset
CLK / CLK
Figure 3.
http://onsemi.com
7
MC10E445, MC100E445
CLK
SIN
Dn-4
Dn-3
Dn-2
Dn-1
Dn
Dn+1
Dn+2
Dn+3
RESET
Q0
Dn-4
Dn
Q1
Dn-3
Dn+1
Q2
Dn-2
Dn+2
Q3
Dn-1
Dn+3
SOUT
Dn-4
Dn-3
Dn-2
Dn-1
Dn
Dn+1
Dn+2
Dn+3
CL/4
CL/8
Timing Diagram A. 1:4 Serial to Parallel Conversion
CLK
SIN
Dn-4
Dn-3
Dn-2
Dn-1
Dn
Dn+1
Dn+2
Dn+3
Dn+4
RESET
SYNC
Q0
Dn-4
Dn+1
Q1
Dn-3
Dn+2
Q2
Dn-2
Dn+3
Q3
Dn-1
Dn+4
SOUT
Dn-4
Dn-3
Dn-2
Dn-1
Dn
Dn+1
Dn+2
Dn+3
CL/4
CL/8
Timing Diagram B. 1:4 Serial to Parallel Conversion With SYNC Pulse
Figure 4. Timing Diagrams
http://onsemi.com
8
Dn+4
MC10E445, MC100E445
APPLICATIONS INFORMATION
The MC10E/100E445 is an integrated 1:4 serial to parallel
converter. The chip is designed to work with the E446 device
to provide both transmission and receiving of a high speed
serial data path. The E445, can convert up to a 2.0 Gb/s NRZ
data stream into 4-bit parallel data. The device also provides
a divide by four clock output to be used to synchronize the
parallel data with the rest of the system.
The E445 features multiplexed dual serial inputs to
provide test loop capability when used in conjunction with
the E446. Figure 5 illustrates the loop test architecture. The
architecture allows for the electrical testing of the link
without requiring actual transmission over the serial data
path medium. The SINA serial input of the E445 has an extra
buffer delay and thus should be used as the loop back serial
input.
PARALLEL
DATA
SOUT
SOUT
CLOCK
CLOCK
E445a
SERIAL
INPUT
DATA
SIN
SIN
E445b
SOUT
SOUT
SIN
SIN
Q3 Q2 Q1 Q0
Q3 Q2 Q1 Q0
Q7 Q6 Q5 Q4
Q3 Q2 Q1 Q0
PARALLEL OUTPUT DATA
100ps
CLOCK
TO SERIAL
MEDIUM
Tpd CLK
to SOUT
800 ps
1150 ps
PARALLEL
DATA
SINA
SINA
SINB
SINB
Figure 6. Cascaded 1:8 Converter Architecture
FROM
SERIAL
MEDIUM
With a minimum delay of 800 ps on this output the clock
for the lower order E445 cannot be delayed more than 800 ps
relative to the clock of the first E445 without potentially
missing a bit of information. Because the setup time on the
serial input pin is negative coincident excursions on the data
and clock inputs of the E445 will result in correct operation.
Figure 5. Loopback Test Architecture
The E445 features a differential serial output and a divide
by 8 clock output to facilitate the cascading of two devices
to build a 1:8 demultiplexer. Figure 6 illustrates the
architecture for a 1:8 demultiplexer using two E445’s; the
timing diagram for this configuration can be found on the
following page. Notice the serial outputs (SOUT) of the
lower order converter feed the serial inputs of the the higher
order device. This feed through of the serial inputs bounds
the upper end of the frequency of operation. The clock to
serial output propagation delay plus the setup time of the
serial input pins must fit into a single clock period for the
cascade architecture to function properly. Using the worst
case values for these two parameters from the data sheet,
TPD CLK to SOUT = 1150 ps and tS for SIN = −100 ps,
yields a minimum period of 1050 ps or a clock frequency of
950 MHz.
The clock frequency is significantly lower than that of a
single converter, to increase this frequency some games can
be played with the clock input of the higher order E445. By
delaying the clock feeding the second E445 relative to the
clock of the first E445 the frequency of operation can be
increased. The delay between the two clocks can be
increased until the minimum delay of clock to serial out
would potentially cause a serial bit to be swallowed
(Figure 7).
CLOCK A
CLOCK B
Tpd CLK
to SOUT
800 ps
1150 ps
Figure 7. Cascade Frequency Limitation
Perhaps the easiest way to delay the second clock relative
to the first is to take advantage of the differential clock inputs
of the E445. By connecting the clock for the second E445 to
the complementary clock input pin the device will clock a
half a clock period after the first E445 (Figure 8). Utilizing
this simple technique will raise the potential conversion
frequency up to 1.4 GHz. The divide by eight clock of the
second E445 should be used to synchronize the parallel data
to the rest of the system as the parallel data of the two E445’s
will no longer be synchronized. This skew problem between
the outputs can be worked around as the parallel information
will be static for eight more clock pulses.
http://onsemi.com
9
MC10E445, MC100E445
CLOCK
CLOCK
E445a
SERIAL
INPUT
DATA
SIN
SIN
700ps
(1.4GHz)
E445b
CLOCK A
SIN
SIN
SOUT
SOUT
Q3 Q2 Q1 Q0
100ps
CLOCK B
Tpd CLK
to SOUT
Q3 Q2 Q1 Q0
800ps
Q7 Q6 Q5 Q4
1150ps
Q3 Q2 Q1 Q0
PARALLEL OUTPUT DATA
Figure 8. Extended Frequency 1:8 Demultiplexer
CLK
SINa
Dn-4
Dn-3
Dn-2
Dn-1
Dn
Dn+1
Dn+2
Dn+3
Q0
Dn-4
Q1
Dn-3
Q2
Dn-2
Q3
Dn-1
Q4 (Q0 a)
Dn
Q5 (Q1 a)
Dn+1
Q6 (Q2 a)
Dn+2
Q7 (Q3 a)
Dn+3
SOUTa
Dn-4
Dn-3
Dn-2
SOUTb
Dn-1
Dn
Dn+1
Dn+2
Dn+3
Dn-4
Dn-3
Dn-2
Dn-1
CL/4a
CL/4b
CL/8a
CL/8b
Figure 9. Timing Diagram A. 1:8 Serial to Parallel Conversion
http://onsemi.com
10
Dn
Dn+1
MC10E445, MC100E445
Q
Zo = 50 W
D
Receiver
Device
Driver
Device
Q
D
Zo = 50 W
50 W
50 W
VTT
VTT = VCC − 2.0 V
Figure 10. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
ORDERING INFORMATION
Package
Shipping †
MC10E445FN
PLCC−28
37 Units / Rail
MC10E445FNG
PLCC−28
(Pb−Free)
37 Units / Rail
MC10E445FNR2
PLCC−28
500 / Tape & Reel
MC10E445FNR2G
PLCC−28
(Pb−Free)
500 / Tape & Reel
MC100E445FN
PLCC−28
37 Units / Rail
MC100E445FNG
PLCC−28
(Pb−Free)
37 Units / Rail
MC100E445FNR2
PLCC−28
500 / Tape & Reel
MC100E445FNR2G
PLCC−28
(Pb−Free)
500 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D
− ECL Clock Distribution Techniques
AN1406/D
− Designing with PECL (ECL at +5.0 V)
AN1503/D
− ECLinPSt I/O SPiCE Modeling Kit
AN1504/D
− Metastability and the ECLinPS Family
AN1568/D
− Interfacing Between LVDS and ECL
AN1672/D
− The ECL Translator Guide
AND8001/D
− Odd Number Counters Design
AND8002/D
− Marking and Date Codes
AND8020/D
− Termination of ECL Logic Devices
AND8066/D
− Interfacing with ECLinPS
AND8090/D
− AC Characteristics of ECL Devices
http://onsemi.com
11
MC10E445, MC100E445
PACKAGE DIMENSIONS
PLCC−28
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776−02
ISSUE E
B
Y BRK
−N−
0.007 (0.180)
U
T L−M
M
0.007 (0.180)
M
N
S
T L−M
S
S
N
S
D
Z
−M−
−L−
W
28
D
X
V
1
G1
A
0.007 (0.180)
R
0.007 (0.180)
C
M
M
T L−M
T L−M
S
S
N
S
N
S
H
0.007 (0.180)
N
S
S
G
J
0.004 (0.100)
−T− SEATING
T L−M
S
N
T L−M
S
N
S
K
PLANE
F
VIEW S
G1
M
K1
E
S
T L−M
S
VIEW D−D
Z
0.010 (0.250)
0.010 (0.250)
VIEW S
S
NOTES:
1. DATUMS −L−, −M−, AND −N− DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM −T−, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE
MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.485
0.495
0.485
0.495
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
−−−
0.025
−−−
0.450
0.456
0.450
0.456
0.042
0.048
0.042
0.048
0.042
0.056
−−− 0.020
2_
10_
0.410
0.430
0.040
−−−
http://onsemi.com
12
MILLIMETERS
MIN
MAX
12.32
12.57
12.32
12.57
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
−−−
0.64
−−−
11.43
11.58
11.43
11.58
1.07
1.21
1.07
1.21
1.07
1.42
−−−
0.50
2_
10_
10.42
10.92
1.02
−−−
0.007 (0.180)
M
T L−M
S
N
S
MC10E445, MC100E445
ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
http://onsemi.com
13
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MC10E445/D