NLX2G86 Dual 2-Input Exclusive-OR Gate The NLX2G86 is a high performance dual 2−input Exclusive−OR Gate operating from a 1.65 V to 5.5 V supply. Features • • • • • • • • • http://onsemi.com Extremely High Speed: tPD 2.4 ns (typical) at VCC = 5.0 V Designed for 1.65 V to 5.5 V VCC Operation Over Voltage Tolerant Inputs and Outputs LVTTL Compatible − Interface Capability With 5.0 V TTL Logic with VCC = 3.0 V LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current Substantially Reduces System Power Requirements Replacement for NC7WZ86 This is a Pb−Free Device A1 7 B1 6 8 1 UQFN8 MU SUFFIX CASE 523AN AC MG G AC = Device Code M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Y2 5 VCC 8 1 MARKING DIAGRAM See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. 4 GND A1 =1 Y1 B1 A2 1 Y1 2 B2 3 A2 Y2 B2 Figure 2. Logic Symbol Figure 1. Pinout (Top View) PIN ASSIGNMENT Pin Function 1 Y1 2 B2 3 A2 4 GND A B Y 5 Y2 L L L 6 B1 L H H 7 A1 H L H 8 VCC H H L © Semiconductor Components Industries, LLC, 2009 April, 2009 − Rev. 0 FUNCTION TABLE Input Output Y=A+B 1 Publication Order Number: NLX2G86/D NLX2G86 MAXIMUM RATINGS Symbol Parameter Value Unit VCC DC Supply Voltage *0.5 to )7.0 V VI DC Input Voltage *0.5 to )7.0 V VO DC Output Voltage *0.5 to )7.0 V IIK DC Input Diode Current VI < GND *50 mA IOK DC Output Diode Current VO < GND *50 mA IO DC Output Sink Current $50 mA ICC DC Supply Current per Supply Pin $100 mA IGND DC Ground Current per Ground Pin $100 mA TSTG Storage Temperature Range *65 to )150 _C TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature under Bias qJA Thermal Resistance PD Power Dissipation in Still Air at 85_C MSL Moisture Sensitivity FR Flammability Rating VESD ESD Withstand Voltage (Note 1) 260 _C )150 _C TBD _C/W TBD mW Level 1 Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) > 2000 > 200 N/A V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Supply Voltage VI Input Voltage VO Output Voltage TA Operating Free−Air Temperature Dt/DV Input Transition Rise or Fall Rate Min Max Unit 1.65 1.5 5.5 5.5 V (Note 5) 0 5.5 V (HIGH or LOW State) 0 5.5 V *40 )125 _C 0 0 0 0 20 20 10 5 ns/V Operating Data Retention Only VCC = 1.8 V $0.15 V VCC = 2.5 V $0.2 V VCC = 3.0 V $0.3 V VCC = 5.0 V $0.5 V 5. Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level. http://onsemi.com 2 NLX2G86 DC ELECTRICAL CHARACTERISTICS Symbol Parameter TA = 255C VCC (V) Min 0.75 VCC 0.7 VCC VIH High−Level Input Voltage 1.65 to 1.95 2.3 to 5.5 VIL Low−Level Input Voltage 1.65 to 1.95 2.3 to 5.5 VOH High−Level Output Voltage VIN = VIH VOL Low−Level Output Voltage VIN = VIL IIN Input Leakage Current IOFF Power Off Leakage Current ICC Quiescent Supply Current Typ *405C v TA v 855C Max Min Max Unit 0.75 VCC 0.7 VCC 0.25 VCC 0.3 VCC Condition V 0.25 VCC 0.3 VCC V 1.65 1.8 2.3 3.0 4.5 1.55 1.7 2.2 2.9 4.4 1.65 1.8 2.3 3.0 4.5 1.55 1.7 2.2 2.9 4.4 V IOH = −100 mA 1.65 2.3 3.0 3.0 4.5 1.29 1.9 2.4 2.3 3.8 1.52 2.15 2.80 2.68 4.20 1.29 1.9 2.4 2.3 3.8 V IOH = −4 mA IOH = −8 mA IOH = −16 mA IOH = −24 mA IOH = −32 mA 1.65 1.8 2.3 3.0 4.5 0.0 0.0 0.0 0.0 0.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 V IOL = 100 mA 1.65 2.3 3.0 3.0 4.5 0.08 0.10 0.15 0.22 0.22 0.24 0.30 0.40 0.55 0.55 0.24 0.30 0.40 0.55 0.55 V IOL = 4 mA IOL = 8 mA IOL = 16 mA IOL = 24 mA IOL = 32 mA 0 to 5.5 $1.0 $1.0 mA 0 V v VIN v 5.5 V 0.0 1.0 10 mA VIN or VOUT = 5.5 V 1.65 to 5.5 1.0 10 mA VIN = 5.5 V, GND AC ELECTRICAL CHARACTERISTICS tR = tF = 3.0 ns VCC Symbol tPLH tPHL Parameter Propagation Delay (Figure 3 and 4) TA = 25_C *40_C v TA v 125_C Condition (V) Min Typ Max Min Max Unit RL = 1 MW, CL = 15 pF 1.8 $ 0.15 2.0 7.9 9.0 2.0 10.5 ns RL = 1 MW, CL = 15 pF 2.5 $ 0.2 1.2 4.1 7.0 1.2 7.5 RL = 1 MW, CL = 15 pF 3.3 $ 0.3 0.8 3.0 4.8 0.8 5.2 1.2 3.8 5.4 1.2 5.9 0.5 2.2 3.5 0.5 3.8 0.8 2.9 4.2 1.0 4.6 RL = 500 W, CL = 50 pF RL = 1 MW, CL = 15 pF 5.0 $ 0.5 RL = 500 W, CL = 50 pF CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Unit 2.5 pF pF CIN Input Capacitance VCC = 5.5 V, VI = 0 V or VCC CPD Power Dissipation Capacitance (Note 6) 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 9 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 11 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. http://onsemi.com 3 NLX2G86 tf = 3 ns tf = 3 ns INPUT A and B 90% 50% VCC or GND VCC 90% 50% 10% 10% tPHL OUTPUT INPUT GND RL CL tPLH VOH OUTPUT Y 50% A 1−MHz square input wave is recommended for propagation delay tests. 50% VOL Figure 3. Switching Waveform Figure 4. Test Circuit DEVICE ORDERING INFORMATION Device Order Number NLX2G86MUTCG Package Type Tape and Reel Size† UQFN8 (Pb−Free) 3000 Units / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 4 NLX2G86 PACKAGE DIMENSIONS UQFN8 MU SUFFIX CASE 523AN−01 ISSUE O A B D PIN ONE REFERENCE 2X 0.10 C ÉÉÉ ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ ÉÉÉ MOLD CMPD EXPOSED Cu E A1 A3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. DETAIL B DIM A A1 A3 b D E e L L1 L3 OPTIONAL CONSTRUCTION 2X 0.10 C TOP VIEW L1 (A3) DETAIL B L3 A 0.05 C b 0.05 C SIDE VIEW (0.10) C A1 SEATING PLANE MILLIMETERS MIN MAX 0.45 0.60 0.00 0.05 0.13 REF 0.15 0.25 1.60 BSC 1.60 BSC 0.50 BSC 0.35 0.45 −−− 0.15 0.25 0.35 (0.15) SOLDERING FOOTPRINT* DETAIL A OPTIONAL CONSTRUCTION 1.70 0.50 PITCH 8X 8X L3 L 1 e 5 3 0.35 1 DETAIL A 1.70 7 8 8X b 0.10 C A B BOTTOM VIEW 0.05 C 7X 0.25 8X 0.53 NOTE 3 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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