NL27WZ86 Dual 2-Input Exclusive-OR Gate The NL27WZ86 is a high performance dual 2−input Exclusive−OR Gate operating from a 1.65 V to 5.5 V supply. Features • • • • • • • • • http://onsemi.com Extremely High Speed: tPD 2.4 ns (typical) at VCC = 5.0 V Designed for 1.65 V to 5.5 V VCC Operation Over Voltage Tolerant Inputs and Outputs LVTTL Compatible − Interface Capability With 5.0 V TTL Logic with VCC = 3.0 V LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current Substantially Reduces System Power Requirements Replacement for NC7WZ86 These Devices are Pb−Free and are RoHS Compliant MARKING DIAGRAM 8 L8 M G G US8 US SUFFIX CASE 493 L8 M G 1 = Specific Device Code = Date Code* = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. A1 1 B1 8 2 Y2 B2 6 4 PIN ASSIGNMENT Y1 7 3 GND VCC 5 A2 Figure 1. Pinout (Top View) Pin Function 1 A1 2 B1 3 Y2 4 GND 5 A2 6 B2 7 Y1 8 VCC FUNCTION TABLE Output Y=A+B Input A1 B1 A2 =1 B2 A B Y1 L L Y L L H H Y2 H L H H H L Figure 2. Logic Symbol ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. © Semiconductor Components Industries, LLC, 2013 March, 2013 − Rev. 7 1 Publication Order Number: NL27WZ86/D NL27WZ86 MAXIMUM RATINGS Symbol Value Units DC Supply Voltage −0.5 to +7.0 V VI DC Input Voltage −0.5 to +7.0 V VO DC Output Voltage −0.5 to +7.0 V IIK DC Input Diode Current VI < GND −50 mA IOK DC Output Diode Current VO < GND −50 mA IO DC Output Sink Current ±50 mA ICC DC Supply Current per Supply Pin ±100 mA IGND DC Ground Current per Ground Pin TSTG Storage Temperature Range VCC Parameter ±100 mA −65 to +150 _C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 _C TJ Junction Temperature under Bias +150 _C qJA Thermal Resistance (Note 1) 250 _C/W PD Power Dissipation in Still Air at 85_C 250 mW MSL FR VESD ILATCHUP Moisture Sensitivity Level 1 Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in ESD Withstand Voltage Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) V > 2000 > 200 N/A Latchup Performance Above VCC and Below GND at 125°C (Note 5) mA ±100 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. 5. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Units VCC Supply Voltage Operating Data Retention Only 1.65 1.5 5.5 5.5 VI Input Voltage (Note 6) 0 5.5 V VO Output Voltage (HIGH or LOW State) 0 5.5 V TA Operating Free−Air Temperature −40 +125 _C Dt/DV Input Transition Rise or Fall Rate VCC = 1.8 V ±0.15 V VCC = 2.5 V ±0.2 V VCC = 3.0 V ±0.3 V VCC = 5.0 V ±0.5 V 0 0 0 0 20 20 10 5 6. Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level. http://onsemi.com 2 V ns/V NL27WZ86 DC ELECTRICAL CHARACTERISTICS Symbol Parameter Condition TA = 255C VCC (V) Min 0.75 VCC 0.7 VCC VIH High−Level Input Voltage 1.65 to 1.95 2.3 to 5.5 VIL Low−Level Input Voltage 1.65 to 1.95 2.3 to 5.5 VOH High−Level Output Voltage VIN = VIH VOL IIN Low−Level Output Voltage VIN = VIL −405C 3 TA 3 855C Typ Max Min Max 0.75 VCC 0.7 VCC 0.25 VCC 0.3 VCC Units V 0.25 VCC 0.3 VCC V IOH = −100 mA 1.65 1.8 2.3 3.0 4.5 1.55 1.7 2.2 2.9 4.4 1.65 1.8 2.3 3.0 4.5 1.55 1.7 2.2 2.9 4.4 V IOH = −4 mA IOH = −8 mA IOH = −16 mA IOH = −24 mA IOH = −32 mA 1.65 2.3 3.0 3.0 4.5 1.29 1.9 2.4 2.3 3.8 1.52 2.15 2.80 2.68 4.20 1.29 1.9 2.4 2.3 3.8 V IOL = 100 mA 1.65 1.8 2.3 3.0 4.5 0.0 0.0 0.0 0.0 0.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 V IOL = 4 mA IOL = 8 mA IOL = 16 mA IOL = 24 mA IOL = 32 mA 1.65 2.3 3.0 3.0 4.5 0.08 0.10 0.15 0.22 0.22 0.24 0.30 0.40 0.55 0.55 0.24 0.30 0.40 0.55 0.55 V 0 to 5.5 ±0.1 ±1.0 mA 0 1.0 10 mA 5.5 1.0 10 mA Input Leakage Current VIN = 5.5 V or GND IOFF Power Off Leakage Current VIN = 5.5 V or VOUT = 5.5 V ICC Quiescent Supply Current VIN = 5.5 V or GND AC ELECTRICAL CHARACTERISTICS tR = tF = 3.0 ns VCC Symbol tPLH tPHL Parameter Propagation Delay (Figure 3 and 4) TA = 25_C *40_C 3 TA 3 125_C Condition (V) Min Typ Max Min Max Units RL = 1 MW, CL = 15 pF 1.8 ± 0.15 2.0 7.9 9.0 2.0 10.5 ns RL = 1 MW, CL = 15 pF 2.5 ± 0.2 1.2 4.1 7.0 1.2 7.5 RL = 1 MW, CL = 15 pF RL = 500 W, CL = 50 pF 3.3 ± 0.3 0.8 1.2 3.0 3.8 4.8 5.4 0.8 1.2 5.2 5.9 RL = 1 MW, CL = 15 pF RL = 500 W, CL = 50 pF 5.0 ± 0.5 0.5 0.8 2.2 2.9 3.5 4.2 0.5 1.0 3.8 4.6 CAPACITIVE CHARACTERISTICS Symbol Typical Units CIN Input Capacitance Parameter VCC = 5.5 V, VI = 0 V or VCC Condition 2.5 pF CPD Power Dissipation Capacitance (Note 7) 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 9 11 pF 7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. http://onsemi.com 3 NL27WZ86 tf = 3 ns tf = 3 ns 90% INPUT A and B 50% VCC or GND VCC 90% 50% 10% 10% tPHL OUTPUT INPUT GND RL CL tPLH VOH OUTPUT Y 50% A 1−MHz square input wave is recommended for propagation delay tests. 50% VOL Figure 3. Switching Waveform Figure 4. Test Circuit DEVICE ORDERING INFORMATION Device Order Number NL27WZ86USG Package Shipping† US8 (Pb−Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 4 NL27WZ86 PACKAGE DIMENSIONS US8 CASE 493−02 ISSUE B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION “A” DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURR. MOLD FLASH. PROTRUSION AND GATE BURR SHALL NOT EXCEED 0.140 MM (0.0055”) PER SIDE. 4. DIMENSION “B” DOES NOT INCLUDE INTER−LEAD FLASH OR PROTRUSION. INTER−LEAD FLASH AND PROTRUSION SHALL NOT E3XCEED 0.140 (0.0055”) PER SIDE. 5. LEAD FINISH IS SOLDER PLATING WITH THICKNESS OF 0.0076−0.0203 MM. (300−800 “). 6. ALL TOLERANCE UNLESS OTHERWISE SPECIFIED ±0.0508 (0.0002 “). −X− A 8 J −Y− 5 DETAIL E B L 1 4 R S G P U C −T− SEATING PLANE H 0.10 (0.004) T K D N 0.10 (0.004) M R 0.10 TYP T X Y V M F DETAIL E MILLIMETERS MIN MAX 1.90 2.10 2.20 2.40 0.60 0.90 0.17 0.25 0.20 0.35 0.50 BSC 0.40 REF 0.10 0.18 0.00 0.10 3.00 3.20 0_ 6_ 5_ 10 _ 0.23 0.34 0.23 0.33 0.37 0.47 0.60 0.80 0.12 BSC DIM A B C D F G H J K L M N P R S U V INCHES MIN MAX 0.075 0.083 0.087 0.094 0.024 0.035 0.007 0.010 0.008 0.014 0.020 BSC 0.016 REF 0.004 0.007 0.000 0.004 0.118 0.126 0_ 6_ 5_ 10 _ 0.010 0.013 0.009 0.013 0.015 0.019 0.024 0.031 0.005 BSC SOLDERING FOOTPRINT* 3.8 0.15 0.50 0.0197 1.8 0.07 0.30 0.012 1.0 0.0394 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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