NL37WZ17 Triple Noninverting Schmitt-Trigger Buffer The NL37WZ17 is a high performance buffer with Schmitt−Trigger inputs operating from a 1.65 to 5.5 V supply. The NL37WZ17 can be used as a line receiver which will receive slow input signals. The NL37WZ17 is capable of transforming slowly changing input signals into sharply defined, jitter−free output signals. In addition, it has a greater noise margin than conventional inverters. The NL37WZ17 has hysteresis between the positive−going and the negative−going input thresholds (typically 1.0 V) which is determined internally by transistor ratios and is essentially insensitive to temperature and supply voltage variations. Features • Designed for 1.65 V to 5.5 V VCC Operation • Over Voltage Tolerant Inputs and Outputs • LVTTL Compatible − Interface Capability with 5 V TTL Logic • • • • • • with VCC = 3 V LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current Substantially Reduces System Power Requirements Current Drive Capability is 24 mA at the Outputs Chip Complexity: FET = 94 These Devices are Pb−Free and are RoHS Compliant IN A1 OUT Y3 1 8 2 7 http://onsemi.com MARKING DIAGRAM 8 1 LX M G = Device Code = Date Code* = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. PIN ASSIGNMENT Pin VCC OUT Y1 IN A2 3 6 IN A3 GND 4 5 OUT Y2 LX M G G US8 US SUFFIX CASE 493 Function 1 IN A1 2 OUT Y3 3 IN A2 4 GND 5 OUT Y2 6 IN A3 7 OUT Y1 8 VCC FUNCTION TABLE A Input Figure 1. Pinout Y Output L L H H ORDERING INFORMATION IN A1 1 OUT Y1 IN A2 1 OUT Y2 IN A3 1 OUT Y3 Device Package Shipping† NL37WZ17USG US8 (Pb−Free) 3000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Figure 2. Logic Symbol © Semiconductor Components Industries, LLC, 2012 April, 2012 − Rev. 7 1 Publication Order Number: NL37WZ17/D NL37WZ17 MAXIMUM RATINGS Symbol VCC Parameter DC Supply Voltage Value Units −0.5 to +7.0 V V VI DC Input Voltage −0.5 ≤ VI ≤ +7.0 VO DC Output Voltage Output in Z or LOW State (Note 1) −0.5 ≤ VO ≤ +7.0 IIK DC Input Diode Current VI < GND −50 IOK DC Output Diode Current VO < GND −50 IO DC Output Sink Current ±50 mA ICC DC Supply Current per Supply Pin ±100 mA IGND DC Ground Current per Ground Pin ±100 mA TSTG Storage Temperature Range −65 to +150 °C °C V mA mA TL Lead Temperature, 1 mm from Case for 10 Seconds 260 TJ Junction Temperature under Bias +150 °C qJA Thermal Resistance (Note 2) 333 °C/W PD Power Dissipation in Still Air at 85°C 200 mW MSL FR VESD Moisture Sensitivity Level 1 Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in ESD Withstand Voltage Human Body Model (Note 3) Machine Model (Note 4) Charged Device Model (Note 5) V > 2000 > 200 N/A Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. IO absolute maximum rating must be observed. 2. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 3. Tested to EIA/JESD22−A114−A. 4. Tested to EIA/JESD22−A115−A. 5. Tested to JESD22−C101−A. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max VCC Supply Voltage Operating Data Retention Only 2.3 1.5 5.5 5.5 Units V VI Input Voltage (Note 6) 0 5.5 V VO Output Voltage (HIGH or LOW State) 0 5.5 V TA Operating Free−Air Temperature −40 +85 °C Dt/DV Input Transition Rise or Fall Rate VCC = 2.5 V ±0.2 V VCC = 3.0 V ±0.3 V VCC = 5.0 V ±0.5 V 0 0 0 No Limit No Limit No Limit 6. Unused inputs may not be left open. All inputs must be tied to a high−logic voltage level or a low−logic input voltage level. http://onsemi.com 2 ns/V NL37WZ17 DC ELECTRICAL CHARACTERISTICS TA = 255C VCC Symbol Parameter Condition −405C 3 TA 3 855C (V) Min Typ Max Min Max Units VT+ Positive Input Threshold Voltage 2.3 2.7 3.0 4.5 5.5 1.0 1.2 1.3 1.9 2.2 1.5 1.7 1.9 2.7 3.3 1.8 2.0 2.2 3.1 3.6 1.0 1.2 1.3 1.9 2.2 1.8 2.0 2.2 3.1 3.6 V VT− Negative Input Threshold Voltage 2.3 2.7 3.0 4.5 5.5 0.4 0.5 0.6 1.0 1.2 0.75 0.87 1.0 1.5 1.9 1.15 1.4 1.5 2.0 2.3 0.4 0.5 0.6 1.0 1.2 1.15 1.4 1.5 2.0 2.3 V VH Input Hysteresis Voltage 2.3 2.7 3.0 4.5 5.5 0.25 0.3 0.4 0.6 0.7 0.75 0.83 0.93 1.2 1.4 1.1 1.15 1.2 1.5 1.7 0.25 0.3 0.4 0.6 0.7 1.1 1.15 1.2 1.5 1.7 V VCC − 0.1 1.29 1.9 2.2 2.4 2.3 3.8 VCC 1.52 2.1 2.4 2.7 2.5 4.0 VOH High−Level Output Voltage VIN = VIH or VIL IOH = −100 mA IOH = −3 mA IOH = −8 mA IOH = −12 mA IOH = −16 mA IOH = −24 mA IOH = −32 mA 1.65 to 5.5 1.65 2.3 2.7 3.0 3.0 4.5 VOL Low−Level Output Voltage VIN = VIH or VIL IOL = 100 mA IOL = 4 mA IOL = 8 mA IOL = 12 mA IOL = 16 mA IOL = 24 mA IOL = 32 mA 1.65 to 5.5 1.65 2.3 2.7 3.0 3.0 4.5 Input Leakage Current VIN = 5.5 V or GND IOFF Power Off Leakage Current VIN = 5.5 V or VOUT = 5.5 V ICC Quiescent Supply Current VIN = 5.5 V or GND IIN 0.08 0.2 0.22 0.28 0.38 0.42 VCC − 0.1 1.29 1.9 2.2 2.4 2.3 3.8 V 0.1 0.24 0.3 0.4 0.4 0.55 0.55 0.1 0.24 0.3 0.4 0.4 0.55 0.55 V 0 to 5.5 ±0.1 ±1.0 mA 0 1 10 mA 5.5 1 10 mA AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) VCC Symbol tPLH tPHL Parameter Propagation Delay Input A to Y (Figures 3 and 4) TA = 255C −405C 3 TA 3 855C Condition (V) Min Typ Max Min Max Units RL = 1 MW, CL = 15 pF 2.5 ± 0.2 1.8 4.3 7.4 1.8 8.1 ns RL = 1 MW, CL = 15 pF RL = 500 W, CL = 50 pF 3.3 ± 0.3 1.5 1.8 3.3 4.0 5.0 5.0 1.5 1.8 5.5 6.6 RL = 1 MW, CL = 15 pF RL = 500 W, CL = 50 pF 5.0 ± 0.5 1.0 1.2 2.7 3.2 4.1 4.9 1.0 1.2 4.5 5.4 CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Units CIN Input Capacitance VCC = 5.5 V, VI = 0 V or VCC 2.5 pF CPD Power Dissipation Capacitance (Note 7) 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 9 11 pF 7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. http://onsemi.com 3 NL37WZ17 A or B OUTPUT GND tPLH Y INPUT VCC 50% RL tPHL 50% VCC A 1−MHz square input wave is recommended for propagation delay tests. Figure 3. Switching Waveforms VT , TYPICAL INPUT THRESHOLD VOLTAGE (VOLTS) CL Figure 4. Test Circuit 4 3 (VT)) 2 VHtyp (VT*) 1 2 2.5 3.5 3 VCC, POWER SUPPLY VOLTAGE (VOLTS) VHtyp = (VT) typ) − (VT* typ) 3.6 Figure 5. Typical Input Threshold, VT), VT* versus Power Supply Voltage VH Vin VCC VH VT) VT* VCC VT) VT* Vin GND GND VOH VOH Vout Vout VOL VOL (a) A Schmitt−Trigger Squares Up Inputs With Slow Rise and Fall Times (b) A Schmitt−Trigger Offers Maximum Noise Immunity Figure 6. Typical Schmitt−Trigger Applications http://onsemi.com 4 NL37WZ17 PACKAGE DIMENSIONS US8 CASE 493−02 ISSUE B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION “A” DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURR. MOLD FLASH. PROTRUSION AND GATE BURR SHALL NOT EXCEED 0.140 MM (0.0055”) PER SIDE. 4. DIMENSION “B” DOES NOT INCLUDE INTER−LEAD FLASH OR PROTRUSION. INTER−LEAD FLASH AND PROTRUSION SHALL NOT E3XCEED 0.140 (0.0055”) PER SIDE. 5. LEAD FINISH IS SOLDER PLATING WITH THICKNESS OF 0.0076−0.0203 MM. (300−800 “). 6. ALL TOLERANCE UNLESS OTHERWISE SPECIFIED ±0.0508 (0.0002 “). −X− A 8 J −Y− 5 DETAIL E B L 1 4 R S G P U C −T− SEATING PLANE H 0.10 (0.004) T K D N 0.10 (0.004) M R 0.10 TYP T X Y V M F DETAIL E MILLIMETERS MIN MAX 1.90 2.10 2.20 2.40 0.60 0.90 0.17 0.25 0.20 0.35 0.50 BSC 0.40 REF 0.10 0.18 0.00 0.10 3.00 3.20 0_ 6_ 5_ 10 _ 0.23 0.34 0.23 0.33 0.37 0.47 0.60 0.80 0.12 BSC DIM A B C D F G H J K L M N P R S U V INCHES MIN MAX 0.075 0.083 0.087 0.094 0.024 0.035 0.007 0.010 0.008 0.014 0.020 BSC 0.016 REF 0.004 0.007 0.000 0.004 0.118 0.126 0_ 6_ 5_ 10 _ 0.010 0.013 0.009 0.013 0.015 0.019 0.024 0.031 0.005 BSC SOLDERING FOOTPRINT* 3.8 0.15 0.50 0.0197 1.8 0.07 0.30 0.012 1.0 0.0394 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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