MMBV3700LT1G High Voltage Silicon Pin Diodes These devices are designed primarily for VHF band switching applications but are also suitable for use in general−purpose switching circuits. They are supplied in a cost−effective plastic package for economical, high−volume consumer and industrial requirements. They are also available in surface mount. http://onsemi.com SOT−23 Features 1 Anode • Long Reverse Recovery Time trr = 300 ns (Typ) • Rugged PIN Structure Coupled with Wirebond Construction for 3 Cathode Optimum Reliability • Low Series Resistance @ 100 MHz − MARKING DIAGRAM RS = 0.7 W (Typ) @ IF = 10 mA • Reverse Breakdown Voltage = 200 V (Min) • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 3 4R M G G 1 Rating 1 2 MAXIMUM RATINGS Symbol Value Unit Reverse Voltage VR 200 V Forward Power Dissipation @ TA = 25°C Derate above 25°C PD 200 2.8 mW mW/°C Junction Temperature TJ +125 °C Storage Temperature Range Tstg −55 to +150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. SOT−23 (TO−236AB) CASE 318 −08 STYLE 8 4R = Specific Device Code M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation and/or overbar may vary depending upon manufacturing location. ORDERING INFORMATION Device Package Shipping† MMBV3700LT1G SOT−23 (Pb−Free) 3000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2009 August, 2009 − Rev. 5 1 Publication Order Number: MMBV3700LT1/D MMBV3700LT1G ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Symbol Min Typ Max Unit V(BR)R 200 − − V Diode Capacitance (VR = 20 V, f = 1.0 MHz) CT − − 1.0 pF Series Resistance (Figure 5) (IF = 10 mA) RS − 0.7 1.0 W Reverse Leakage Current (VR = 150 V) IR − − 0.1 mA Reverse Recovery Time (IF = IR = 10 mA) trr − 300 − ns Characteristic Reverse Breakdown Voltage (IR = 10 mA) TYPICAL CHARACTERISTICS 800 700 2.8 I F , FORWARD CURRENT (mA) RS , SERIES RESISTANCE (OHMS) 3.2 TA = 25°C 2.4 2.0 1.6 1.2 0.8 0 2.0 4.0 6.0 8.0 10 12 14 400 TA = 25°C 300 200 0 16 0.7 0.8 0.9 1.0 IF, FORWARD CURRENT (mA) VF, FORWARD VOLTAGE (VOLTS) Figure 1. Series Resistance Figure 2. Forward Voltage 10 8.0 6.0 100 40 4.0 TA = 25°C 2.0 1.0 0.8 0.6 0.4 I R , REVERSE CURRENT ( μA) C T , DIODE CAPACITANCE (pF) 500 100 0.4 0 600 0.2 10 4.0 VR = 15 V 1.0 0.4 0.1 0.04 0.01 0.004 0.1 0 -10 -20 -30 -40 0.001 -60 -50 VR, REVERSE VOLTAGE (VOLTS) -20 0 +20 +60 +100 TA, AMBIENT TEMPERATURE (°C) Figure 3. Diode Capacitance Figure 4. Leakage Current http://onsemi.com 2 +140 MMBV3700LT1G PACKAGE DIMENSIONS SOT−23 (TO−236) CASE 318−08 ISSUE AN NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. 318−01 THRU −07 AND −09 OBSOLETE, NEW STANDARD 318−08. D SEE VIEW C 3 HE E c 1 2 e b DIM A A1 b c D E e L L1 HE 0.25 q A L A1 L1 MIN 0.89 0.01 0.37 0.09 2.80 1.20 1.78 0.10 0.35 2.10 MILLIMETERS NOM MAX 1.00 1.11 0.06 0.10 0.44 0.50 0.13 0.18 2.90 3.04 1.30 1.40 1.90 2.04 0.20 0.30 0.54 0.69 2.40 2.64 MIN 0.035 0.001 0.015 0.003 0.110 0.047 0.070 0.004 0.014 0.083 INCHES NOM 0.040 0.002 0.018 0.005 0.114 0.051 0.075 0.008 0.021 0.094 MAX 0.044 0.004 0.020 0.007 0.120 0.055 0.081 0.012 0.029 0.104 STYLE 8: PIN 1. ANODE 2. NO CONNECTION 3. CATHODE VIEW C SOLDERING FOOTPRINT* 0.95 0.037 0.95 0.037 2.0 0.079 0.9 0.035 SCALE 10:1 0.8 0.031 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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