NZ9F2V4ST5G Series Zener Voltage Regulators

NZ9F2V4ST5G,
SZNZ9F2V4ST5G SERIES
Zener Voltage Regulators
250 mW SOD−923 Surface Mount
This series of Zener diodes is packaged in a SOD−923 surface
mount package. They are designed to provide voltage regulation
protection and are especially attractive in situations where space is at a
premium. They are well suited for applications such as cellular
phones, hand held portables, and high density PC boards.
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1
Cathode
Specification Features
• Standard Zener Breakdown Voltage Range −2.4 V to 18 V
• Steady State Power Rating of 250 mW
• Small Body Outline Dimensions:
•
•
•
•
•
0.039″ x 0.024″ (1.00 mm x 0.60 mm)
Low Body Height: 0.016″ (0.40 mm)
ESD Rating of Class 3 (>16 kV) per Human Body Model
Tight Tolerance VZ
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
These are Pb−Free Devices
Mechanical Characteristics
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94, V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
Device Meets MSL 1 Requirements
MAXIMUM RATINGS
Rating
Thermal Resistance from
Junction−to−Ambient
Junction and Storage Temperature Range
MARKING
DIAGRAM
2
1
SOD−923
CASE 514AB
1
X MG
G
2
X = Specific Device Code
M = Month Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Total Device Dissipation FR−5 Board,
(Note 1) @ TA = 25°C
Derate above 25°C
2
Anode
Symbol
Max
Unit
250
2.0
mW
mW/°C
RqJA
500
°C/W
TJ, Tstg
−65 to
+150
°C
Device
Package
Shipping†
NZ9FxxxST5G,
SZNZ9FxxxST5G
SOD−923
(Pb−Free)
8000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
PD
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−4 Minimum Pad.
© Semiconductor Components Industries, LLC, 2014
July, 2014 − Rev. 3
1
Publication Order Number:
NZ9F2V4S/D
NZ9F2V4ST5G, SZNZ9F2V4ST5G SERIES
ELECTRICAL CHARACTERISTICS
(TA = 25°C unless otherwise noted,
VF = 0.9 V Max. @ IF = 10 mA for all types)
Symbol
I
IF
Parameter
VZ
Reverse Zener Voltage @ IZT
IZT
Reverse Current
ZZT
Maximum Zener Impedance @ IZT
IZK
Reverse Current
ZZK
Maximum Zener Impedance @ IZK
IR
Reverse Leakage Current @ VR
VR
Reverse Voltage
IF
Forward Current
VF
Forward Voltage @ IF
QVZ
Maximum Temperature Coefficient of VZ
C
Max. Capacitance @VR = 0 and f = 1 MHz
VZ VR
IR VF
IZT
Figure 1. Zener Voltage Regulator
100
POWER DISSIPATION (%)
80
60
40
20
0
0
25
50
75
100
125
TEMPERATURE (°C)
Figure 2. Steady State Power Derating
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2
150
V
NZ9F2V4ST5G, SZNZ9F2V4ST5G SERIES
ELECTRICAL CHARACTERISTICS (VF = 0.9 Max @ IF = 10 mA for all types)
Zener Voltage
VZ
ZZT
IZ = IZT
@ 10%
Mod W
Max
ZZK IZ
= 1.0
mA W
Max
Max
IR @ VR
dVZ/dt (mV/k)
@ IZT1 = 5 mA
IZK
mA
mA
V
Min
Max
CpF Max @
VR = 0
f = 1 MHz
Device***
Device
Marking
Min
Max
Test
Current
Izt mA
SZ, NZ9F2V4ST5G
2*
2.43
2.63
5
100
1000
1
50
1
−3.5
0
210
SZ, NZ9F2V7ST5G
3*
2.67
2.91
5
100
1000
1
20
1
−3.5
0
210
SZ, NZ9F3V0ST5G
4*
2.94
3.26
5
100
1000
1
10
1
−3.5
0
210
SZ, NZ9F3V3ST5G
5*
3.32
3.53
5
100
1000
1
10
1
−3.5
0
210
SZ, NZ9F3V6ST5G
6*
3.6
3.85
5
100
1000
1
10
1
−3.5
0
210
SZ, NZ9F3V9ST5G
A**
3.89
4.16
5
100
1000
1
5
1
−3.5
−2.5
210
SZ, NZ9F4V3ST5G
D**
4.17
4.43
5
100
1000
1
5
1
−3.5
0
210
SZ, NZ9F4V7ST5G
E**
4.55
4.75
5
100
800
0.5
2
1
−3.5
0.2
150
SZ, NZ9F5V1ST5G
F**
4.989
5.2
5
80
500
0.5
2
1.5
−2.7
1.2
130
SZ, NZ9F5V6ST5G
J**
5.49
5.73
5
60
200
0.5
1
2.5
−2.0
2.5
115
SZ, NZ9F6V2ST5G
K**
6.06
6.33
5
60
100
0.5
1
3
0.4
3.7
110
SZ, NZ9F6V8ST5G
L**
6.65
6.93
5
40
60
0.5
0.5
3.5
1.2
4.5
105
SZ, NZ9F7V5ST5G
P**
7.28
7.6
5
30
60
0.5
0.5
4
2.5
5.3
100
SZ, NZ9F8V2ST5G
Q**
8.02
8.36
5
30
60
0.5
0.5
5
3.2
6.2
90
SZ, NZ9F9V1ST5G
R**
8.85
9.23
5
30
60
0.5
0.5
6
3.8
7
80
SZ, NZ9F10VST5G
T**
9.77
10.21
5
30
60
0.5
0.1
7
4.5
8
80
SZ, NZ9F11VST5G
V**
10.76
11.22
5
30
60
0.5
0.1
8
5.4
9
80
SZ, NZ9F12VST5G
Y**
11.74
12.24
5
30
80
0.5
0.1
9
6
10
80
SZ, NZ9F13VST5G
2**
12.91
13.49
5
37
80
0.5
0.1
10
7
11
75
SZ, NZ9F15VST5G
3**
14.34
14.98
5
42
80
0.5
0.1
11
9.2
13
70
SZ, NZ9F16VST5G
4**
15.85
16.51
5
50
80
0.5
0.1
12
10.4
14
65
SZ, NZ9F18VST5G
5**
17.56
18.35
5
50
80
0.5
0.1
14
12.4
16
60
*Rotated 90°.
**Rotated 180°.
***SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP
Capable.
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3
NZ9F2V4ST5G, SZNZ9F2V4ST5G SERIES
PACKAGE DIMENSIONS
SOD−923
CASE 514AB
ISSUE C
−X−
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
−Y−
E
1
2X b
0.08 X Y
2
TOP VIEW
DIM
A
b
c
D
E
HE
L
L2
A
c
HE
MILLIMETERS
MIN
NOM MAX
0.34
0.37
0.40
0.15
0.20
0.25
0.07
0.12
0.17
0.75
0.80
0.85
0.55
0.60
0.65
0.95
1.00
1.05
0.19 REF
0.05
0.10
0.15
INCHES
MIN
NOM MAX
0.013 0.015 0.016
0.006 0.008 0.010
0.003 0.005 0.007
0.030 0.031 0.033
0.022 0.024 0.026
0.037 0.039 0.041
0.007 REF
0.002 0.004 0.006
SIDE VIEW
2X
SOLDERING FOOTPRINT*
L
2X
0.36
2X
1.20
2X
0.25
L2
BOTTOM VIEW
PACKAGE
OUTLINE
DIMENSIONS: MILLIMETERS
See Application Note AND8455/D for more mounting details
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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NZ9F2V4S/D