NZ9F2V4T5G Series Zener Voltage Regulators

NZ9F2V4T5G,
SZNZ9F2V4T5G SERIES
Zener Voltage Regulators
200 mW SOD−923 Surface Mount
This series of Zener diodes is packaged in a SOD−923 surface
mount package. They are designed to provide voltage regulation
protection and are especially attractive in situations where space is at a
premium. They are well suited for applications such as cellular
phones, hand held portables, and high density PC boards.
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1
Cathode
Specification Features:
• Standard Zener Breakdown Voltage Range − 2.4 V to 24 V
• Steady State Power Rating of 200 mW
• Small Body Outline Dimensions:
MARKING
DIAGRAM
2
0.039″ x 0.024″ (1.00 mm x 0.60 mm)
• Low Body Height: 0.016″ (0.40 mm)
• ESD Rating of Class 3 (>16 kV) per Human Body Model
• SZ Prefix for Automotive and Other Applications Requiring Unique
•
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
These are Pb−Free Devices
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
Rating
Thermal Resistance from
Junction−to−Ambient
Junction and Storage Temperature Range
Symbol
Max
Unit
250
2.0
mW
mW/°C
RqJA
500
°C/W
TJ, Tstg
−65 to
+150
°C
PD
1
SOD−923
CASE 514AB
1
X MG
G
2
X = Specific Device Code
M = Month Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
MAXIMUM RATINGS
Total Device Dissipation FR−5 Board,
(Note 1) @ TA = 25°C
Derate above 25°C
2
Anode
Device
Package
Shipping†
NZ9FxxxxT5G,
SZNZ9FxxxxT5G
SOD−923
(Pb−Free)
8000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics tables starting on
page 3 of this data sheet.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 Minimum Pad.
© Semiconductor Components Industries, LLC, 2013
April, 2013 − Rev. 3
1
Publication Order Number:
NZ9F2V4/D
NZ9F2V4T5G, SZNZ9F2V4T5G SERIES
ELECTRICAL CHARACTERISTICS
I
(TA = 25°C unless otherwise noted,
VF = 0.9 V Max. @ IF = 10 mA for all types)
Parameter
Symbol
VZ
Reverse Zener Voltage @ IZT
IZT
Reverse Current
ZZT
Maximum Zener Impedance @ IZT
IZK
Reverse Current
ZZK
Maximum Zener Impedance @ IZK
VZ VR
IR
Reverse Leakage Current @ VR
VR
Reverse Voltage
IF
Forward Current
VF
Forward Voltage @ IF
C
IR VF
IZT
Zener Voltage Regulator
Maximum Temperature Coefficient of VZ
Max. Capacitance @VR = 0 and f = 1 MHz
100
80
POWER DISSIPATION (%)
QVZ
IF
60
40
20
0
0
25
50
75
100
125
TEMPERATURE (°C)
Figure 1. Steady State Power Derating
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2
150
V
NZ9F2V4T5G, SZNZ9F2V4T5G SERIES
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA for all types)
Zener Voltage
(Note 1)
VZ (Volts)
Zener Impedance
@ IZT
ZZT
@ IZT
Leakage Current
ZZK @ IZK
QVZ
(mV/k) @ IZT
IR @ VR
C
@ VR = 0
f = 1 MHz
Device***
Device
Marking
Min
Max
mA
W
W
mA
mA
Volts
Min
Max
pF
SZ, NZ9F2V4T5G
J
2.28
2.52
5
100
1000
1
50
1
−3.5
0
210
SZ, NZ9F2V7T5G
E**
2.57
2.84
5
100
1000
1
20
1
−3.5
0
210
SZ, NZ9F3V0T5G
T**
2.85
3.15
5
100
1000
1
10
1
−3.5
0
210
SZ, NZ9F3V3T5G
Q
3.14
3.47
5
100
1000
1
10
1
−3.5
0
210
SZ, NZ9F3V6T5G
3**
3.42
3.78
5
100
1000
1
10
1
−3.5
0
210
SZ, NZ9F3V9T5G
V**
3.71
4.10
5
100
1000
1
5
1
−3.5
−2.5
210
SZ, NZ9F4V3T5G
Y**
4.09
4.52
5
100
1000
1
5
1
−3.5
0
210
SZ, NZ9F4V7T5G
3
4.47
4.94
5
100
800
0.5
2
1
−3.5
0.2
150
SZ, NZ9F5V1T5G
4
4.85
5.36
5
80
500
0.5
2
1.5
−2.7
1.2
130
SZ, NZ9F5V6T5G
5
5.32
5.88
5
60
200
0.5
1
2.5
−2.0
2.5
115
SZ, NZ9F6V2T5G
6
5.89
6.51
5
60
100
0.5
1
3
0.4
3.7
110
SZ, NZ9F6V8T5G
A*
6.46
7.14
5
40
60
0.5
0.5
3.5
1.2
4.5
105
SZ, NZ9F7V5T5G
D*
7.13
7.88
5
30
60
0.5
0.5
4
2.5
5.3
100
SZ, NZ9F8V2T5G
E*
7.79
8.61
5
30
60
0.5
0.5
5
3.2
6.2
90
SZ, NZ9F9V1T5G
F*
8.65
9.56
5
30
60
0.5
0.5
6
3.8
7
80
SZ, NZ9F10VT5G
J*
9.50
10.50
5
30
60
0.5
0.1
7
4.5
8
80
SZ, NZ9F11VT5G
K*
10.45
11.55
5
30
60
0.5
0.1
8
5.4
9
80
SZ, NZ9F12VT5G
L*
11.40
12.60
5
30
80
0.5
0.1
9
6
10
80
SZ, NZ9F13VT5G
P*
12.35
13.65
5
37
80
0.5
0.1
10
7
11
75
SZ, NZ9F15VT5G
Q*
14.25
15.75
5
42
80
0.5
0.1
11
9.2
13
70
SZ, NZ9F16VT5G
R*
15.20
16.80
5
50
80
0.5
0.1
12
10.4
14
65
SZ, NZ9F18VT5G
T*
17.10
18.90
5
50
80
0.5
0.1
14
12.4
16
60
SZ, NZ9F20VT5G
V*
19.00
21.00
5
55
100
0.5
0.1
15.4
14.4
18
55
SZ, NZ9F22VT5G
Y*
20.90
23.10
5
55
100
0.5
0.1
16.8
15.4
20
55
SZ, NZ9F24VT5G
F
22.80
25.20
5
70
120
0.5
0.1
18.9
16.8
22
50
*Rotated 90°.
**Rotated 270°.
***SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP
Capable.
1. Zener voltage is measured with a pulse test current IZ at an ambient temperature of 25°C.
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NZ9F2V4T5G, SZNZ9F2V4T5G SERIES
PACKAGE DIMENSIONS
SOD−923
CASE 514AB
ISSUE C
D
−X−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
−Y−
E
1
2X b
0.08 X Y
2
TOP VIEW
DIM
A
b
c
D
E
HE
L
L2
A
c
HE
MILLIMETERS
MIN
NOM MAX
0.34
0.37
0.40
0.15
0.20
0.25
0.07
0.12
0.17
0.75
0.80
0.85
0.55
0.60
0.65
0.95
1.00
1.05
0.19 REF
0.05
0.10
0.15
INCHES
MIN
NOM MAX
0.013 0.015 0.016
0.006 0.008 0.010
0.003 0.005 0.007
0.030 0.031 0.033
0.022 0.024 0.026
0.037 0.039 0.041
0.007 REF
0.002 0.004 0.006
SIDE VIEW
2X
SOLDERING FOOTPRINT*
L
2X
0.36
2X
1.20
2X
0.25
L2
BOTTOM VIEW
PACKAGE
OUTLINE
DIMENSIONS: MILLIMETERS
See Application Note AND8455/D for more mounting details
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
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NZ9F2V4/D