NLU1G07 Single Non-Inverting Buffer with Open Drain Output The NLU1G07 MiniGatet is an advanced high−speed CMOS non−inverting buffer with open drain output in ultra−small footprint. The NLU1G07 input and output structures provide protection when voltages up to 7.0 V are applied, regardless of the supply voltage. http://onsemi.com MARKING DIAGRAMS Features • • • • • • • High Speed: tPD = 3.8 ns (Typ) @ VCC = 5.0 V Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C Power Down Protection Provided on inputs Balanced Propagation Delays Overvoltage Tolerant (OVT) Input and Output Pins Ultra−Small Packages These are Pb−Free Devices 1 1 NC 1 6 VCC OVT IN A 1 5 2 GND 3 UDFN6 MU SUFFIX CASE 517AA JM ULLGA6 1.0 x 1.0 CASE 613AD JM ULLGA6 1.2 x 1.0 CASE 613AE JM ULLGA6 1.45 x 1.0 CASE 613AF JM UDFN6 1.0 x 1.0 CASE 517BX XM UDFN6 1.45 x 1.0 CASE 517AQ XM NC 4 1 OUT Y Figure 1. Pinout (Top View) 1 1 IN A OUT Y 1 Figure 2. Logic Symbol J M PIN ASSIGNMENT = Device Marking = Date Code 1 NC 2 IN A 3 GND ORDERING INFORMATION 4 OUT Y 5 NC See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. 6 VCC FUNCTION TABLE A Y L H L Z © Semiconductor Components Industries, LLC, 2012 July, 2012 − Rev. 3 1 Publication Order Number: NLU1G07/D NLU1G07 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage −0.5 to +7.0 V VIN DC Input Voltage −0.5 to +7.0 V DC Output Voltage −0.5 to +7.0 V VIN < GND −20 mA VOUT < GND ±20 mA VOUT Parameter IIK DC Input Diode Current IOK DC Output Diode Current IO DC Output Source/Sink Current ±12.5 mA ICC DC Supply Current Per Supply Pin ±25 mA IGND DC Ground Current per Ground Pin ±25 mA TSTG Storage Temperature Range −65 to +150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature Under Bias 150 °C MSL Moisture Sensitivity FR Flammability Rating VESD ILATCHUP Level 1 Oxygen Index: 28 to 34 ESD Withstand Voltage UL 94 V−0 @ 0.125 in Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) Latchup Performance Above VCC and Below GND at 125°C (Note 5) > 2000 > 200 N/A V ±500 mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA / JESD22−A114−A. 3. Tested to EIA / JESD22−A115−A. 4. Tested to JESD22−C101−A. 5. Tested to EIA / JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit 1.65 5.5 V VCC Positive DC Supply Voltage VIN Digital Input Voltage 0 5.5 V Output Voltage 0 5.5 V −55 +125 °C 0 0 100 20 ns/V VOUT TA Operating Free−Air Temperature Dt/DV Input Transition Rise or Fall Rate VCC = 3.3 V ± 0.3 V VCC = 5.0 V ± 0.5 V http://onsemi.com 2 NLU1G07 DC ELECTRICAL CHARACTERISTICS Symbol VIH VIL VOL ILKG Parameter Conditions Low−Level Input Voltage Low−Level Input Voltage Low−Level Output Voltage VCC (V) TA = +855C TA = 25 5C Min Typ Max Min 1.65 0.75 x VCC 0.75 x VCC 2.3 to 5.5 0.70 x VCC 0.70 x VCC Max TA = −555C to +1255C Min Max V 1.65 0.25 x VCC 0.25 x VCC 0.25 x VCC 2.3 to 5.5 0.30 x VCC 0.30 x VCC 0.30 x VCC 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0 0 0 Unit VIN = VIH or VIL IOL = 50 mA 2.0 3.0 4.5 VIN = VIH or VIL IOL = 4 mA IOL = 8 mA 3.0 4.5 0.36 0.36 0.44 0.44 0.52 0.52 V V Z−State Output Leakage Current VIN = VIH, VOUT = VCC or GND 5.5 ±0.25 ±2.5 ±5.0 mA Input Leakage Current 0 = VIN = 5.5 V 0 to 5.5 ±0.1 ±1.0 ±1.0 mA IOFF Power off Input Leakage Current 0 VIN, VOUT = 5.5 V 0.0 0.25 2.5 5 mA ICC Quiescent Supply Current 0 VIN VCC 5.5 1.0 20 40 mA TA = +855C TA = −555C to +1255C IIN AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) Symbol tPZL Parameter Output Enable Time, Input A to Output Y VCC (V) Test Condition 3.0 to 3.6 Max Unit 8.5 10.0 ns 10.6 12.0 14.5 3.8 5.5 6.5 8.0 RL = R1 = 50 W, CL = 50 pF 5.3 7.5 8.5 10.0 3.0 to 3.6 RL = R1 = 50 W, CL = 50 pF 7.5 10.6 12.0 14.5 4.5 to 5.5 RL = R1 = 50 W, CL = 50 pF 5.3 7.5 8.5 10.0 4 10 10 10.0 4.5 to 5.5 tPLZ Output Disable Time CIN Input Capacitance CPD Power Dissipation Capacitance (Note 6) TA = 25 5C Min Typ Max RL = R1 = 50 W, CL = 15 pF 5.0 7.1 RL = R1 = 50 W, CL = 50 pF 7.5 RL = R1 = 50 W, CL = 15 pF 5.0 18 Min Max Min ns pF pF 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without load. Average operating current can be obtained by the equation ICC(OPR) = CPD • VCC • fin + ICC. CPD is used to determine the no−load dynamic power consumption: PD = CPD • VCC2 • fin + ICC • VCC. http://onsemi.com 3 NLU1G07 VCC 2 50% tPZL Y R1 VCC A tPLZ 50% VCC A GND HIGH IMPEDANCE CL * RL VOL 0.3 V *Includes jig and probe capacitance. RL = R1 = 500 W Figure 3. Switching Waveforms Figure 4. Test Circuit VCC A 1.5 V to 7 V OVT RL Figure 5. Output Voltage Mismatch Application ORDERING INFORMATION Package Shipping† UDFN6, 1.2 x 1.0, 0.4P (Pb−Free) 3000 / Tape & Reel NLU1G07AMX1TCG ULLGA6, 1.45 x 1.0, 0.5P (Pb−Free) 3000 / Tape & Reel NLU1G07BMX1TCG ULLGA6, 1.2 x 1.0, 0.4P (Pb−Free) 3000 / Tape & Reel NLU1G07CMX1TCG ULLGA6, 1.0 x 1.0, 0.35P (Pb−Free) 3000 / Tape & Reel NLU1G07AMUTCG UDFN6, 1.45 x 1.0, 0.5P (Pb−Free) 3000 / Tape & Reel NLU1G07CMUTCG UDFN6, 1.0 x 1.0, 0.35P (Pb−Free) 3000 / Tape & Reel Device NLU1G07MUTCG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 4 NLU1G07 PACKAGE DIMENSIONS UDFN6 1.45x1.0, 0.5P CASE 517AQ ISSUE O A B D PIN ONE REFERENCE 0.10 C L1 ÉÉÉ ÉÉÉ DETAIL A E OPTIONAL CONSTRUCTIONS DETAIL B A1 SIDE VIEW MOLD CMPD OPTIONAL CONSTRUCTIONS A 0.05 C DIM A A1 A2 b D E e L L1 DETAIL B 0.05 C 6X A2 6X C 6X SEATING PLANE 0.30 PACKAGE OUTLINE L 1.24 3 1 DETAIL A 6X 0.53 4 BOTTOM VIEW MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.07 REF 0.20 0.30 1.45 BSC 1.00 BSC 0.50 BSC 0.30 0.40 −−− 0.15 MOUNTING FOOTPRINT e 6 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. ÉÉ ÉÉ EXPOSED Cu TOP VIEW 0.10 C L L 6X 0.50 PITCH DIMENSIONS: MILLIMETERS b 0.10 C A B 0.05 C 1 NOTE 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 NLU1G07 PACKAGE DIMENSIONS UDFN6 1.0x1.0, 0.35P CASE 517BX ISSUE O PIN ONE REFERENCE 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D ÉÉÉ ÉÉÉ ÉÉÉ E 0.10 C 2X 0.10 C DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.12 0.22 1.00 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 0.05 C SIDE VIEW A1 C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE 5X e 5X 0.48 L 6X 0.22 3 1 L1 1.18 6 4 BOTTOM VIEW 6X b 0.10 M C A B 0.05 M C 0.53 1 PKG OUTLINE NOTE 3 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 NLU1G07 PACKAGE DIMENSIONS UDFN6, 1.2x1.0, 0.4P CASE 517AA ISSUE C EDGE OF PACKAGE PIN ONE REFERENCE 2X 0.10 C ÉÉ ÉÉ ÉÉ L1 E DETAIL A Bottom View (Optional) TOP VIEW 2X EXPOSED Cu 0.10 C (A3) 0.10 C A1 A 10X 0.08 C ÉÉÉ ÉÉÉ A3 DETAIL B Side View (Optional) 5X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 1.20 BSC 1.00 BSC 0.40 BSC 0.30 0.40 0.00 0.15 0.40 0.50 MOUNTING FOOTPRINT* 6X C A1 DIM A A1 A3 b D E e L L1 L2 MOLD CMPD SEATING PLANE SIDE VIEW 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A B D 6X 0.42 0.22 L 3 L2 6X b 0.10 C A B 0.05 C 6 4 0.40 PITCH e NOTE 3 1.07 DIMENSIONS: MILLIMETERS BOTTOM VIEW *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 NLU1G07 PACKAGE DIMENSIONS ULLGA6 1.0x1.0, 0.35P CASE 613AD ISSUE A PIN ONE REFERENCE 0.10 C ÉÉ ÉÉ ÉÉ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D E DIM A A1 b D E e L L1 TOP VIEW 0.05 C A 6X 0.05 C MOUNTING FOOTPRINT SOLDERMASK DEFINED* SEATING PLANE SIDE VIEW C A1 e 5X L MILLIMETERS MIN MAX −−− 0.40 0.00 0.05 0.12 0.22 1.00 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 5X 0.48 NOTE 4 3 1 6X 0.22 1.18 L1 0.53 6 4 6X b 0.35 PITCH DIMENSIONS: MILLIMETERS 0.10 C A B BOTTOM VIEW 1 PKG OUTLINE 0.05 C NOTE 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 8 NLU1G07 PACKAGE DIMENSIONS ULLGA6 1.2x1.0, 0.4P CASE 613AE ISSUE A PIN ONE REFERENCE 0.10 C ÉÉ ÉÉ ÉÉ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D E DIM A A1 b D E e L L1 TOP VIEW 0.05 C A 6X 0.05 C MOUNTING FOOTPRINT SOLDERMASK DEFINED* SEATING PLANE SIDE VIEW C A1 e 5X L MILLIMETERS MIN MAX −−− 0.40 0.00 0.05 0.15 0.25 1.20 BSC 1.00 BSC 0.40 BSC 0.25 0.35 0.35 0.45 5X 0.49 NOTE 4 3 1 1.24 L1 0.53 6 4 6X b 0.10 C A B BOTTOM VIEW 6X 0.26 0.05 C NOTE 3 1 PKG OUTLINE 0.40 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 9 NLU1G07 PACKAGE DIMENSIONS ULLGA6 1.45x1.0, 0.5P CASE 613AF ISSUE A PIN ONE REFERENCE 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D ÉÉÉ ÉÉÉ ÉÉÉ E DIM A A1 b D E e L L1 TOP VIEW 0.10 C 0.05 C A 6X 0.05 C MOUNTING FOOTPRINT SOLDERMASK DEFINED* SEATING PLANE SIDE VIEW 5X C A1 e 5X L MILLIMETERS MIN MAX −−− 0.40 0.00 0.05 0.15 0.25 1.45 BSC 1.00 BSC 0.50 BSC 0.25 0.35 0.30 0.40 0.49 NOTE 4 3 1 1.24 L1 0.53 6 4 BOTTOM VIEW 6X 0.30 6X b 0.10 C A B 0.05 C NOTE 3 1 PKG OUTLINE 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. 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