VISHAY SUD42N03-3M9P-GE3

SUD42N03-3m9P
Vishay Siliconix
N-Channel 30 V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
30
RDS(on) ()
ID (A)
Qg (Typ.)
d
0.0039 at VGS = 10 V
107
0.0045 at VGS = 4.5 V
103d
67
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET® Power MOSFET
• 100 % Rg and UIS Tested
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
• DC/DC Converters
- Synchronous Buck Low Side
TO-252
D
G
Drain Connected to Tab
G
D
S
Top View
S
N-Channel MOSFET
Ordering Information: SUD42N03-3m9P-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
30
Gate-Source Voltage
VGS
± 20
ID
85d
Pulsed Drain Current (t = 300 µs)
IDM
120
Avalanche Current
IAS
45
TC = 70 °C (Silicon Limited)
TC = 25 °C (Package Limited)
Single Avalanche
Energya
L = 0.1 mH
TC = 25 °C
Maximum Power Dissipationa
TA = 25 °Cc
Operating Junction and Storage Temperature Range
V
107d
TC = 25 °C (Silicon Limited)
Continuous Drain Current
Unit
42
EAS
PD
101
73.5b
2.5
A
mJ
W
TJ, Tstg
- 55 to 150
°C
Symbol
Limit
Unit
THERMAL RESISTANCE RATINGS
Parameter
Junction-to-Ambient (PCB Mount)
Junction-to-Case (Drain)
c
RthJA
50
RthJC
1.7
°C/W
Notes:
a. Duty cycle  1 %.
b. See SOA curve for voltage derating.
c. When mounted on 1" square PCB (FR-4 material).
d. Calculated continuous current based on maximum allowable junction temperature. Package limitation current is 42 A.
Document Number: 66824
S10-2006-Rev. A, 06-Sep-10
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SUD42N03-3m9P
Vishay Siliconix
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
Parameter
Symbol
Test Conditions
Min.
Typ.
Max.
VDS
VDS = 0 V, ID = 250 µA
30
VGS(th)
VDS = VGS, ID = 250 µA
1
IGSS
VDS = 0 V, VGS = ± 20 V
± 250
VDS = 30 V, VGS = 0 V
1
Unit
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Currenta
Drain-Source On-State Resistancea
Forward Transconductancea
IDSS
2.5
VDS = 30 V, VGS = 0 V, TJ = 125 °C
50
VDS = 30 V, VGS = 0 V, TJ = 150 °C
250
ID(on)
RDS(on)
gfs
VDS 10 V, VGS = 10 V
50
V
nA
µA
A
VGS = 10 V, ID = 22 A
0.0032
0.0039
VGS = 4.5 V, ID = 20 A
0.0037
0.0045
VDS = 15 V, ID = 20 A
110

S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Chargec
Qg
Gate-Source Chargec
Qgs
c
Gate-Drain Charge
Qgd
Gate Resistance
Rg
Turn-On Delay Timec
Rise Timec
Turn-Off Delay Timec
Fall Timec
3535
VGS = 0 V, VDS = 15 V, f = 1 MHz
tr
pF
400
67
VDS = 15 V, VGS = 10 V, ID = 20 A
100
10.5
nC
12.2
f = 1 MHz
td(on)
td(off)
680
VDD = 15 V, RL = 1.5 
ID  10 A, VGEN = 10 V, Rg = 1 
tf
0.3
1.4
2.8
11
20
10
20
35
53
10
20

ns
Drain-Source Body Diode Ratings and Characteristicsb TC = 25 °C
IS
42
Pulsed Current
ISM
120
Forward Voltagea
VSD
Continuous Current
Reverse Recovery Time
Peak Reverse Recovery Current
Reverse Recovery Charge
IF = 10 A, VGS = 0 V
trr
IRM(REC)
Qrr
IF = 10 A, dI/dt = 100 A/µs
A
0.83
1.5
V
41
62
ns
2
3
A
40
60
nC
Notes:
a. Pulse test; pulse width  300 µs, duty cycle  2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 66824
S10-2006-Rev. A, 06-Sep-10
SUD42N03-3m9P
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
120
0.0045
I D - Drain Current (A)
R DS(on) - On-Resistance (Ω)
VGS = 10 V thru 4 V
100
VGS = 3 V
80
60
40
0.0040
VGS = 4.5 V
0.0035
VGS = 10 V
0.0030
20
0
0.0025
0
0.5
1.0
1.5
2.0
0
20
40
VDS - Drain-to-Source Voltage (V)
4
0.012
R DS(on) - On-Resistance (Ω)
I D - Drain Current (A)
0.015
3
2
TC = 25 °C
1
0.009
TJ = 150 °C
0.006
0.003
TC = 125 °C
TJ = 25 °C
TC = - 55 °C
0
1.2
100
On-Resistance vs. Drain Current
5
0.6
80
ID - Drain Current (A)
Output Characteristics
0
60
1.8
2.4
0
3.0
0
2
4
6
8
VGS - Gate-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Transfer Characteristics
On-Resistance vs. Gate-to-Source Voltage
10
10
300
VGS - Gate-to-Source Voltage (V)
g fs - Transconductance (S)
ID = 20 A
TC = - 55 °C
240
180
TC = 25 °C
120
TC = 125 °C
60
8
VDS = 15 V
6
VDS = 8 V
VDS = 24 V
4
2
0
0
0
12
Document Number: 66824
S10-2006-Rev. A, 06-Sep-10
24
36
48
60
0
20
40
60
I D - Drain Current (A)
Qg - Total Gate Charge (nC)
Transconductance
Gate Charge
80
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SUD42N03-3m9P
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
2.1
100
I S - Source Current (A)
1.8
ID = 250 µA
TJ = 150 °C
VGS(th) (V)
10
TJ = 25 °C
1.5
1.2
1
0.9
0.1
0.0
0.2
0.4
0.6
0.8
1.0
0.6
- 50
1.2
0
25
50
75
TJ - Temperature (°C)
Source-Drain Diode Forward Voltage
Threshold Voltage
5000
100
125
150
100
125
150
VDS - Drain-to-Source Voltage (V)
41
Ciss
4000
C - Capacitance (pF)
- 25
VSD - Source-to-Drain Voltage (V)
3000
2000
Coss
1000
39
ID = 250 µA
37
35
Crss
0
0
5
10
15
20
25
33
- 50
30
- 25
0
25
50
75
VDS - Drain-to-Source Voltage (V)
TJ - Junction Temperature (°C)
Capacitance
Drain Source Breakdown vs. Junction Temperature
1.8
160
1.5
120
I D - Drain Current (A)
(Normalized)
R DS(on) - On-Resistance
ID = 20 A
1.2
0.9
VGS = 10 V
0.6
- 50
0
25
0
50
75
100
125
TJ - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
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Package Limited
40
VGS = 4.5 V
- 25
80
150
0
25
50
75
100
125
150
TC - Case Temperature (°C)
Current Derating
Document Number: 66824
S10-2006-Rev. A, 06-Sep-10
SUD42N03-3m9P
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
1000
100
Limited by RDS(on)*
TJ = 25 °C
TJ = 150 °C
10
I D - Drain Current (A)
I D_AV (A)
100
100 µs
10
1 ms
10 ms
100 ms,
1 s, 10 s, DC
1
TC = 25 °C
Single Pulse
0.1
1
10-5
10-4
10-3
10-2
10-1
Time (s)
Single Pulse Avalanche Current Capability vs. Time
0.01
0.1
BVDSS
Limited
1
10
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which RDS(on) is specified
Safe Operating Area
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.02
0.05
Single Pulse
0.01
10-4
10-3
10-2
10-1
Square Wave Pulse Duration (s)
1
10
100
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?66824.
Document Number: 66824
S10-2006-Rev. A, 06-Sep-10
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Package Information
Vishay Siliconix
TO-252AA CASE OUTLINE
E
A
MILLIMETERS
C1
e
b1
D1
e1
E1
L
gage plane height (0.5 mm)
L1
b
L3
H
D
L2
b2
C
A2
A1
INCHES
DIM.
MIN.
MAX.
MIN.
MAX.
A
2.21
2.38
0.087
0.094
A1
0.89
1.14
0.035
0.045
A2
0.030
0.127
0.001
0.005
b
0.71
0.88
0.028
0.035
b1
0.76
1.14
0.030
0.045
b2
5.23
5.44
0.206
0.214
C
0.46
0.58
0.018
0.023
C1
0.46
0.58
0.018
0.023
D
5.97
6.22
0.235
0.245
D1
4.10
4.45
0.161
0.175
E
6.48
6.73
0.255
0.265
E1
4.49
5.50
0.177
0.217
e
e1
2.28 BSC
4.57 BSC
0.090 BSC
0.180 BSC
H
9.65
10.41
0.380
L
1.40
1.78
0.055
0.410
0.070
L1
0.64
1.02
0.025
0.040
L2
0.89
1.27
0.035
0.050
L3
1.15
1.52
0.040
0.060
ECN: T11-0110-Rev. L, 18-Apr-11
DWG: 5347
Note
• Dimension L3 is for reference only.
Document Number: 71197
18-Apr-11
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This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Application Note 826
Vishay Siliconix
RECOMMENDED MINIMUM PADS FOR DPAK (TO-252)
0.224
0.243
0.087
(2.202)
0.090
(2.286)
(10.668)
0.420
(6.180)
(5.690)
0.180
0.055
(4.572)
(1.397)
Recommended Minimum Pads
Dimensions in Inches/(mm)
Return to Index
Return to Index
APPLICATION NOTE
Document Number: 72594
Revision: 21-Jan-08
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Vishay
Disclaimer
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including but not limited to the warranty expressed therein.
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Document Number: 91000
Revision: 11-Mar-11
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