MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS QFN22, 3x4, 0.5P CASE 485AT−01 ISSUE B 1 SCALE 2:1 D PIN 1 REFERENCE L A B ÈÈÈ ÈÈÈ ÈÈÈ ÈÈÈ L L1 DETAIL A OPTIONAL CONSTRUCTIONS ÏÏ ÏÏ E EXPOSED Cu 2X 0.15 C MOLD CMPD 2X MILLIMETERS DIM MIN NOM MAX A 0.80 0.90 1.00 A1 0.00 0.025 0.05 A3 0.20 REF b 0.20 0.25 0.30 D 3.00 BSC D2 1.45 1.50 1.55 D3 0.52 0.57 0.62 D4 1.02 1.07 1.12 E 4.00 BSC E2 1.05 1.10 1.15 E3 1.30 1.35 1.40 E4 1.40 1.45 1.50 e 0.50 BSC K 0.25 −−− −−− L 0.30 0.325 0.35 L1 −−− −−− 0.15 G 1.35 1.40 1.50 G1 0.95 1.05 1.15 G2 0.855 0.885 0.915 ÏÏÏ ÎÎÎ ÏÏÏ A3 A1 DETAIL B 0.15 C OPTIONAL CONSTRUCTIONS TOP VIEW DETAIL B 0.10 C A 25X 0.08 C NOTE 4 A3 SIDE VIEW C A1 SEATING PLANE D3 22X D4 7 DETAIL A L XXXXX XXXXX ALYWG G 12 G E3 G E2 XXXXX = Specific Device Code A = Assembly Location L = Wafer Lot Y = Year W = Work Week G = Pb−Free Package (Note: Microdot may be in either location) GENERIC MARKING DIAGRAM* G1 E4 22X 1 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. b SOLDERING FOOTPRINT* 0.10 C A B 0.05 C 16X DATE 17 SEP 2008 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PADS AS WELL AS THE TERMINALS. K NOTE 3 3.30 1.55 18 e 0.50 PITCH G2 D2 BOTTOM VIEW 0.925 PACKAGE OUTLINE 1 1.47 1.21 1.47 1.47 1.58 4.30 22X 0.39 0.52 22X DOCUMENT NUMBER: 98AON30555E 0.30 1.14 DIMENSIONS: MILLIMETERS Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed STATUS: ON SEMICONDUCTOR STANDARD versions are uncontrolled except when stamped “CONTROLLED COPY” in red. NEW STANDARD: © Semiconductor Components Industries, LLC, 2002 Case Outline Number: http://onsemi.com QFN22, 3X4, 0.5 P DESCRIPTION: October, 2002 − Rev. 0 PAGE 1 OFXXX 2 1 DOCUMENT NUMBER: 98AON30555E PAGE 2 OF 2 ISSUE REVISION DATE O RELEASED FOR PRODUCTION. REQ. BY S. BACHMAN. 18 JUN 2008 A CHANGED DIMENSIONS K, L AND G2. CHANGED SOLDERING FOOTPRINT DIMENSIONS. REQ. BY A. TAM. 28 JUL 2008 B ADDED NOMINAL VALUES. REQ. BY A. TAM. 17 SEP 2008 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2008 September, 2008 − Rev. 01B Case Outline Number: 485AT