A minimum size, standalone motor application using the LV8907UW

AND9388/D
A minimum size, standalone motor
application using the LV8907UW
Overview
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An example application for LV8907UW (a sensor-less three-phase brushless
DC motor controller with gate drivers) is described. The target application is
an automotive 60 watt oil pump. The various features of the LV8907UW
allow running this pump throughout all application conditions without prior
software development.
This application note focusses on designing a minimum PCB circuit using the
LV8907UWand not on the advanced features of the device. For more
information on the capabilities of the IC consult the datasheet. The PCB
described consists of the LV8907UW motor controller, three dual power FETs
for the power stage, and passive peripheral components. The inputs are power
supply and a control PWM, the outputs are the three motor winding terminals.
APPLICATION NOTE
PICTURE of BOARD ASSEMBLY
An SPI interface is featured as well, which is used to setup and program the
system parameters. In the present example the SPI is intended to be contacted
by test points at the assembly line.
Features
• Nominal operation voltage range from 5.5V to 20V,
transient tolerant from 4.5V to 40V.
• Nominal power 60W, max 120W (current limit).
• Input:
o Power supply and ground.
o Low frequency, supply tolerant PWM.
o Motor enable line (optional).
• Output:
o Three motor phases.
• Fault feedback through PWM pulldown.
• Three NVMFD5852NLT1G MOSFETs.
• Single 10mOhm current sense shunt.
• On-board thermistor for FET temperature monitoring.
• Minimum two layer FR4 board size (40mm × 40mm).
The information herein is subject to be change without notice.
© Semiconductor Components Industries, LLC, 2016
March 2016- Rev. 1
1
Publication Order Number:
AND9388/D
AND9388/D
SCHEMATICS
VM
L1
VS
V3RI
1
VCC
45
WAKE
15
LIN_PWMIN
C11
41
43
42
38
VGL
V3RO
C10
40
CP2P
47
48
44
VS
P7
39
CP2N
C8
C31
CHP
GND
CP1P
C29
C9
+
CP1N
P4
C12
R52
PWMIN
P6
R50
COM
R14
24
R13
IC
3
TXD
2
RXD
UH
36
7
CSB
UOUT
35
8
SCLK
9
SI
CP1
CP2
CP3
CP4
10
T1a
SO
R1
T2a
R2
R3
R15
T3a
P1 U
VH
32
VOUT
31
P2
WH
28
WOUT
27
V
P3 W
EN
UL
34
4
PWMIN
VL
30
11
FG
WL
26
12
DIAG
SUL
33
SVL
29
17
TEST
C15
CP6
R18
R19
R53
PGND
T9
EN
AGND
R20
R7
46
LGND
CP5
R51
TH
P8
T1b
19
13
5
37
SWL
25
RF
22
RFSENS
20
R8
T2b
R54
R9
R55
VS
R17
C7
R16
C27
High current line
Figure 1 Schematics
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2
+
C30
Critical line
C14
T3b
+
C28
AND9388/D
DETAILED DESCRIPTION
Startup and Shutdown
Note:
For OPT programming the supply voltage must be
at least 14V!
The layout suggestion of this application note does not
provide for a specific SPI connector. It is assumed the
necessary pads can be accessed through the assembly
line programmer. The location of the SPI pads is
marked up in Figure 2.
After SPI write and OTP program the connection can be
removed, and the power supply voltage can be returned
to the nominal 12V. The detailed SPI timing and OTP
writing sequence is described in the data sheet.
The application described here will be active as soon as
power is supplied.
If low quiescent current operation (< 100uA) is required,
a separate control signal must be connected to the
WAKE pin. WAKE is supply voltage tolerant but an
in-line 1k filter resistor is recommended.
Motor control and Fault handling
The motor is controlled by applying a PWM signal to
supply voltage tolerant pin LIN_PWMIN. The
LV8907UW requires the PWM signal frequency to be
less than 1kHz. The PWM input polarity is high active.
The input duty cycle 15 to 85% is translated to the
output duty cycle 0 to 100%. These configurations can
be selected in the system registers of the IC.
Power Line Noise Filter
To reduce EMC noise, a common mode choke is
inserted into the power line. The filter coils (L1) are put
in the power lines both plus side and ground side. Its
impedance is 850Ω at 100MHz.
The capacitor C31 is used for the power supply input.
The capacitors C30 and C28 for the motor power node,
are necessary to prevent voltage trip due to fly-back of
the motor coil as well as noise.
In this application, the motor control signal EN is pulled
up to the 3.3V on-chip regulator, but can be used as an
additional motor enable/disable line:
EN open:
The motor runs.
EN pulled down: Standby
Charge pump
The required capacitance of the charge pump is defined
by the gate capacitance (Ciss) of the output power FET.
The charge pump circuit consists of two bucket
capacitors at pins CP1P/CP1N and CP2P/CP2N (C9 and
C10 in the schematic), and two storage capacitors at
pins CHP/VS and VGL/GND (C8 and C11 in the
schematic). The following table shows appropriate
capacitance values based on FET gate capacitance.
When a fault event is detected, the LV8907UW pin
DIAG is activated and through transistor T9 will pull
down the PWM input to stop the motor. A series
resistor may be required to prevent overstressing the
external driver of the PWM signal.
A multitude of fault scenarios can be selected in the
LV8907UW system registers, but it is important to set
the IC to NOT latch errors, so the application can
recover on its own.
ON Suggestions
NVD5807N
NVMFD5852NL
NVD5803N
NVMFS5C604NL
The sample parameter list on page 5 is a good setup to
run most motors. Detailed register usage, is described
in the data sheet of LV8907UW.
Device configuration via SPI
The LV8907UW has register bits for device
configuration, feature selection, and parameters. For
the type of standalone control system application
described here, the settings must be stored in the
one-time programmable, non-volatile memory (OTP),
and are automatically loaded to the RAM registers at the
beginning of each device wake-up.
To program and store these parameters, the SPI
interface of the LV8907UW must be accessed at least
once through the following pins:
App.
VM
CP6
EN
CP1
CP2
CP3
CP4
LV8907UW
VS
AGND
EN
CSB
SCLK
SI
SO
Ciss
[nF]
0.6
1.8
3.22
8.9
CP1, CP2
[µF]
0.068
0.1
0.1
0.22
CHP, VGL
[µF]
0.1
0.22
0.47
1.5
Output Stage
In the schematic (Figure 1), the critical lines are
highlighted in light blue, and high current lines are
highlighted in light pink. The FET gate lines must be
routed as short as possible, as the gate current flows
through them. The same is true for the FET source lines
which must also be routed away from high current line
to prevent VGS bouncing caused by phase current
switching. From circuit network point of view, the low
side FET source return pins (SUL, SVL, SWL) and
current sense resistor are connected to the same node.
But, it must be separated geometrically. The FET
source lines are highlighted green in Figure 2. The high
current path from the source pins of the low side FETs
to ground through the current sense resistor, is separated
from the source lines as shown in Figure 3.
To adjust the switching slew rate, a series resistor is
inserted to each gate line of the power MOSFETs. And,
to prevent shoot through while the gate driver outputs
Purpose
Supply ≥14V!!
Reference GND
must be low for SPI access
active low chip select
SPI clock
Master out slave in
Slave out Master in
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3
AND9388/D
In this case 20A is the threshold of the over current
protection.
R17 and C7 defines a switching noise filter with the
cutoff of 160kHz. The cutoff frequency should be
higher than output PWM frequency 19.5kHz to reject
high frequency noise like a switching spike.
1
2
2
1
3
1
2
1
1
1
2
1
2
1
To monitor the power FET temperature, an NTC
thermistor (NCP15XH103F0SRC) is located close to
the power FET pair of the phase W. It is connected to
the external temperature monitor input pin TH. The
threshold of the temperature detection can be adjusted
within limits.
In this example, the threshold temperature is defined to
127°C. To configure it,
1 1
𝑅𝑅𝑁𝑁𝑁𝑁𝑁𝑁 = 𝑅𝑅0 exp �𝐵𝐵 � − ��
𝑇𝑇 𝑇𝑇0
Where,
𝑅𝑅0 = 10kΩ
𝑇𝑇0 = 298.15K
𝐵𝐵 = 3380
The thermistor resistance at 127°C is,
𝑅𝑅𝑁𝑁𝑁𝑁𝑁𝑁127 = 556Ω
1
1
2
Temperature Monitoring
1
are floating state, a pull down resistor between gate and
source of each low side power MOSFET.
1
2
2
3
1
2
1
1
2
1
3
8
3
9
4
0
4
1
2
1
2
1
33
31
6
2
2
1
32
30
3
29
5
26
25
2
11
12
1
27
4
2
3
2
4
2
2
2
1
2
0
1
9
1
5
1
6
1
7
1
8
1
3
1
4
1
2
1
28
1
1
1
34
2
1
1
1
9
MISO
GND
35
25
8
10
MOSI
36
SUL
SVL
SWL
4
5
6
7
SCLK
1
1
2
3
CSB
4
2
4
3
4
4
4
5
4
6
4
7
4
2
4
8
2
1
5
4
3
7
2
2
1
6
1
1
1
5
4
2
1
1
1
3
2
2
1
2
1
1
1
2
1
1
2
6
2
3
2
2
1
2
1
2
1
2
sepalate
ground
Where,
𝑉𝑉 = 3.3V (LV8907UW internal regulator)
𝑉𝑉𝑇𝑇𝑇𝑇 = 0.35V (register THTH=00)
The required resistance of R18 is,
𝑅𝑅18 = 4686 = 4.7kΩ
2
11
2
2
𝑉𝑉
− 1�
𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇
𝑅𝑅18 = 𝑅𝑅𝑁𝑁𝑁𝑁𝑁𝑁127 �
2
1
thermistor
1
Figure 2 SPI, thermistor and FET routing
1
To measure the temperature of the power FET, the
thermistor must be located close to the FET. But, the
ground line must be separated from the high current
path. See Figure 2 lines marked in purple.
2
3
1
1
1
1
4
1
1
2
2
1
2
2
2
0
1
R
F
S
R
E
F
N
S
E
1
1
1
2
1
1
1
2
2
The motor current is monitored across the shunt resistor
R16 by the IC inputs RFSENS and RF. The traces must
be Kelvin connected to the resistor terminals and should
be protected from switching signals and high current
paths. In this application, the sense traces are separated
from the shunt resistor by the different layer. ()
Shunt resistance RS is determined by the target
cycle-by-cycle current limit ILIM. The threshold voltage
is 100mV at the pin RF, therefore,
𝑅𝑅𝑆𝑆 = 0.1 ÷ 𝐼𝐼𝐿𝐿𝐿𝐿𝐿𝐿
When the limit current is defined to 10A for instance,
the resistance can be obtained by
𝑅𝑅𝑆𝑆 = 0.1 ÷ 10 = 10 [mΩ]
The over current threshold voltage is 200mV at the pin
RF. Thus, the over current threshold IOCP is
automatically defined to be twice of the cycle-by-cycle
current limit.
𝐼𝐼𝑂𝑂𝑂𝑂𝑂𝑂 = 2𝐼𝐼𝐿𝐿𝐿𝐿𝐿𝐿
1
2
1
2
1
Current sense input
2
1
2
1
1
1
2
1
1
2
1
Figure 3 High current path and current sense
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4
AND9388/D
REGISTER SETTINGS
This is a sample register configuration of the LV8907UW to be used for the application board described in this application
note. Most motors will start and run with this setting, but may require parameter modification for optimum performance.
ADDR
0x00
0x01
0x02
0x03
0x04
0x05
0x06
0x07
0x08
0x09
NAME
MRCONF0
MRCONF1
MRCONF2
MRCONF3
MRCONF4
MRCONF5
MRCONF6
MRCONF7
MRCONF8
MRCONF9
BYTE
0x2C
0xC8
0xB1
0x1B
0x50
0x00
0x00
0x58
0x00
0x3E
0x0A
MRCONF10
0x01
0x0B
0x0C
0x10
0x11
0x12
0x13
0x14
0x15
0x16
0x17
0x18
0x19
0x1A
MRCONF11
MRCONF12
MRSPCT0
MRSPCT1
MRSPCT2
MRSPCT3
MRSPCT4
MRSPCT5
MRSPCT6
MRSPCT7
MRSPCT8
MRSPCT9
MRSPCT10
0x80
0x10
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
BITS
FRMD=0 FRREN=0 SCEN=1 PWMF=0 REGSEL=1 VCEN=1 LINSLP=0 LINIO=0
FLSEL[1:0]=11 ZPSEL[1:0]=00 PWMFL=1 PWMZP=0 PDTC=0 PWMON=0
SSTEN=1 FGOF[1:0]=01 FDTI[4:0]=10001
PDTSEL[1:0]=00 SSTT[5:0]=011011
STOSC[7:0]= 01010000
CLMASK[3:0]=0000 OCMASK[3:0]=0000
SROFFT[3:0]=0000 CRMASK[3:0]=0000
SYNCEN=0 PPDOSEL=1 FSCDT[1:0]=01 FSCDL[3:0]=1000
SSCG=0 CPTM[3:0]=0000 THTH[1:0]=00 TSTS=0
WDTEN=0 WDTP=0 WDT[5:0]=111110
VCLVPEN=0 CPEN=0 THWEN=0 THPEN=0 FSPEN=0 OVPEN=0 OCPEN=0
DIAGSEL=1
DWNSET[1:0]=10 WDTSEL[1:0]=00 CPLT=0 FSPLT=0 OCPLT=0 DLTO=0
STEPSEL[2:0]=000 SLMD=1 LASET[3:0]=0000
0=0 PX[2:0]=000 0=0 PG[2:0]=000
0=0 IX[2:0]=000 0=0 IG[2:0]=000
FGT0[6:0]=0000000
FGT1[6:0]=0000000
FGT2[6:0]=0000000
FGT3[6:0]=0000000
FGT4[6:0]=0000000
FGT5[6:0]=0000000
FGT6[6:0]=0000000
FGT7[6:0]=0000000
FGT8[6:0]=0000000
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AND9388/D
BILL OF MATERIALS
Designator
Quantity
Type
Value
Tolerance
Footprint
Manufacturer
Manufacturer Part Number
IC
R1-3, R7-9
R13-15, R50
R16
R17
R18
R19
R20, R51-52
R53-55
C7, C14, C15
C8, C11, C12
C9, C10
C27, C29
C28,C30-31
L1
T1-3
1
6
4
1
1
1
1
3
3
3
3
2
2
3
1
3
Motor Pre-Driver
Thick film Resistor
Thick film Resistor
Shunt Resistor
Thick film Resistor
Thick film Resistor
Chip Thermistor
Thick film Resistor
Thick film Resistor
Ceramic multilayer Capacitor
Ceramic multilayer Capacitor
Ceramic multilayer Capacitor
Ceramic multilayer Capacitor
Electrolytic Capacitor
Common mode noise filter
Dual N-ch MOSFET
30Ω, 1/10W
1kΩ, 1/10W
10mΩ, 1W
100Ω, 1/16W
4.7kΩ, 1/16W
10kΩ, 1/10W
5.1kΩ, 1/16W
100kΩ, 1/10W
0.01µF, 50V
4.7µF, 25V
1.0µF, 25V
0.1µF, 50V
47µF, 35V
850Ω, 3.5A
40V, 6.9mΩ,
44A
±5%
±1%
±1%
±1%
±1%
±1%
±5%
±5%
±5%
±10%
±10%
±10%
±20%
SQFP48K
1608(0603)
1608(0603)
5025(2010)
1608(0603)
1608(0603)
1005(0402)
1005(0402)
1005(0402)
1608(0603)
3225(1210)
3216(1206)
2012(0805)
3X8
7.5X7.5
WDFN-8
ON Semiconductor
ROHM
ROHM
Vishay
ROHM
ROHM
Murata
ROHM
ROHM
TDK
TDK
TDK
TDK
Rubycon
Sumida
ON Semiconductor
LV8907UW
MCR03EZPJ300
MCR03EZPF1001
WSL2010R0100FEA18
MCR03EZPF1000
MCR03MZPF4701
NCP15XH103F0SRC
MCR01MZPJ512
MCR01MZPJ104
CGA3E2NP01H103J080AA
CGA6P3X8R1E475K250AB
CGA5L2X8R1E105K160AA
CGA4J2X8R1H104K125AA
35THV47M6
CPFC74BNP-851
NVMFD5852NLT1G
T9
P1-4,P6-8
1
7
NPN Bip-Tr
Through-hole
SOT-23
ON Semiconductor
Mac8
BC846ALT1G
ST-1-3
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6
AND9388/D
2
1
1
1
1
2
1
2
2
1
1
2
1
1
LAYOUT
1
2
2
3
1
2
5
4
3
7
3
8
3
9
4
0
4
1
4
2
4
3
4
4
4
5
4
6
4
7
4
8
2
1
1
6
34
4
33
5
32
49
6
30
8
29
9
28
3
27
26
12
25
5
4
2
4
2
3
2
2
2
1
2
0
1
9
1
8
1
7
1
5
1
4
1
6
1
1
1
3
1
1
11
2
10
1
6
2
31
1
1
7
1
2
35
3
1
36
2
2
1
1
1
1
2
6
1
1
2
Figure 4 Top layer
Figure 5 Silk for top layer
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7
1
5
4
2
2
1
1
3
2
1
1
1
1
3
1
2
2
1
2
2
2
2
2
2
1
1
1
AND9388/D
1
1
1
3
2
1
1
1
1
1
1
2
1
2
1
1
1
1
1
2
2
4
2
1
2
2
1
1
2
1
2
1
1
1
2
1
1
2
1
Figure 6 Bottom layer
Figure 7 Silk for bottom layer
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AND9388/D
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