NUP4103FC Four Channel ESD Array This integrated transient voltage suppressor device (TVS) is designed for applications requiring transient overvoltage protection. It is intended for use in sensitive portable equipment and other applications. Its integrated design provides very effective and reliable protection for four (4) separate lines using only one package. These devices are ideal for situations where board space is a premium. http://onsemi.com Features • • • • • CIRCUIT DESCRIPTION Unidirectional, Quad ESD Protection Ultra−small Flip−Chip Packaging (0.95 mm x 1.33 mm) Compliance with IEC61000−4−2 (Level 4) Requirements Maximum Leakage Current of 100 nA at 3.3 V Pb−Free Package is Available* A1 C1 B2 Benefits • Protects Four Data Lines from ESD while Reducing Component A3 C3 Count • Small Package Saves on PCB Real Estate • Provides Protection for ESD Industry Standards, IEC 61000, HBM and MM • Low Leakage Capability Minimizes Power Loss in the System Applications • • • • ESD Protection for Portable Equipment Cell Phones MP3 Players PDAs Rating Symbol VPP Value Unit kV 30 30 16 1.6 TJ 150 °C Operating Ambient Temperature Range TA −40 to +85 °C TSTG −55 to +150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2006 March, 2006 − Rev. 1 EMG G = Specific Device Code = Date Code = Pb−Free Package (Note: Microdot may be in either location) Junction Temperature Storage Temperature Range È È 5−PIN FLIP−CHIP CSP PLASTIC CASE 766AB E M G MAXIMUM RATINGS ESD Discharge IEC61000−4−2, − Air Discharge − Contact Discharge Human Body Model Machine Model MARKING DIAGRAM 1 1 TOP VIEW (Bumps Down) 1 2 3 BOTTOM VIEW (Bumps Up) 3 2 1 A A B B C C ORDERING INFORMATION Device Package Shipping † NUP4103FCT1 Flip−Chip 3000/Tape & Reel NUP4103FCT1G Flip−Chip (Pb−Free) 3000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Publication Order Number: NUP4103FC/D NUP4103FC ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified) Symbol Conditions VRWM IRWM = 10 mA (Note 1) VBR IT = 1.0 mA (Note 2) Leakage Current IR VRM = 3.3 V per line Junction Capacitance CJ VR = 2.5 V, f = 1 MHz Parameter Reverse Stand−Off Voltage Breakdown Voltage Min 6.0 Typ 7.0 Max Unit 5.5 V 8.0 V 100 nA 30 pF 1. TVS devices are normally selected according to the working peak reverse voltage (VRWM) which should be equal or greater than the DC or continuous peak operating voltage level. 2. VBR is measured at pulse test current IT. TYPICAL PERFORMANCE CURVES (TJ = 25°C unless otherwise specified) 50 100.0E−9 IR, Leakage Current (A) C, Capacitance (pF) 45 40 35 30 10.0E−9 1.0E−9 100.0E−12 25 20 0 1 2 3 VR, Reverse Voltage (V) 4 5 10.0E−12 −40 Figure 1. Reverse Voltage vs Junction Capacitance −15 35 10 T, Temperature (°C) 60 Figure 2. Reverse Leakage Current vs Junction Temperature http://onsemi.com 2 85 NUP4103FC 200 ns 2.0 V/div Figure 3. ESD Response for Human Body Model (+8 kV) 500 mV/div 200 ns Figure 4. ESD Response for Human Body Model (−8 kV) http://onsemi.com 3 NUP4103FC Printed Circuit Board Recommendations 500 mm Pitch 300 mm Solder Ball Parameter PCB Pad Size 250 mm +25 / −0 Pad Shape Round Pad Type NSMD Solder Mask Opening 350 mm ±25 Solder Stencil Thickness 125 mm Stencil Aperture 250 x 250 mm sq. Solder Flux Ratio 50/50 Solder Paste Type No Clean Type 3 or Finer Trace Finish OSP Cu Trace Width 150 mm Max Copper Solder Mask NSMD SMD Figure 5. Solder Mask versus Non−Solder Mask Definition Controlled Atmosphere 250 225°C Min 235°C Max TEMPERATURE (°C) 200 183 °C 2 to 5 °C/s 150 140 to 160 °C 100 50 0 1 to 5 °C/s 0 1 2 3 4 1 to 2 min 30−100 sec TIME (minutes) Figure 6. Solder Reflow Profile http://onsemi.com 4 5 NUP4103FC PACKAGE DIMENSIONS 5−PIN FLIP−CHIP CSP CASE 766AB−01 ISSUE O D 4X A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B 0.10 C È TERMINAL A1 LOCATOR E DIM A A1 A2 D E b e f D1 A1 0.10 C A2 A C MILLIMETERS MIN MAX 0.680 −−− 0.210 0.270 0.380 0.430 1.330 BSC 0.960 BSC 0.290 0.340 0.500 BSC 0.433 BSC 0.866 BSC 0.05 C SEATING PLANE D1 f 1 5X b 0.05 C A B 0.03 C e 2 3 A B C ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Phone: 81−3−5773−3850 Email: [email protected] http://onsemi.com 5 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. NUP4013FC/D