CM1220 4 and 8-Channel ESD Protection Arrays in CSP Description The CM1220 ESD protection arrays are available in four and eight channel configurations. Each ESD channel features a nominal capacitance of 14 pF making the devices ideal for protecting high speed I/O ports and LCD and camera data lines without significantly affecting signal integrity. The CM1220 integrates avalanche−type ESD diodes on every channel, providing a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). These diodes safely dissipate ESD strikes of ±15 kV, exceeding the maximum requirement of the IEC61000−4−2 international standard. Using the MIL−STD−883 (Method 3015) specification for Human Body Model (HBM) ESD, the CM1220 protect against contact discharges at greater than ±30 kV. These devices are particularly well−suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of their small package and easy−to−use pin assignments. In particular, the CM1220 is ideal for protecting high speed I/O ports and data and control lines for the LCD display and camera interface in mobile handsets. The CM1220 incorporates ON Semiconductor’s OptiGuardt coating for improved reliability at assembly in a space−saving, low−profile Chip Scale Package. http://onsemi.com WLCSP5 CP SUFFIX CASE 567AY WLCSP10 CP SUFFIX CASE 567BL A1 B2 A3 ESD_4 ESD_3 ESD_2 ESD_1 BLOCK DIAGRAM C3 C1 GND A1 A3 A5 A7 C1 C3 C5 ESD_8 ESD_7 ESD_6 ESD_5 ESD_4 ESD_3 ESD_2 ESD_1 CM1220−04 C7 Features • Four and Eight Channels of ESD Protection • OptiGuardtCoated for Improved Reliability • ±15 kV ESD Protection on each Channel (IEC 61000−4−2 Level 4, • • • • • contact discharge) ±30 kV ESD Protection on each Channel (HBM) Chip Scale Package (CSP) Features Extremely Low Lead Inductance for Optimum ESD Protection 5 bump, 0.960 mm X 1.330 mm CSP Footprint for CM1220−04 10 bump, 1.960 mm X 1.330 mm CSP Footprint for CM1220−08 These Devices are Pb−Free and are RoHS Compliant Applications • LCD and Camera Data Lines in Mobile Handsets • I/O Port Protection for Mobile Handsets, Notebook Computers, • • • • PDAs, etc. Keypads and Buttons Wireless Handsets Handheld PCs/PDAs LCD and Camera Modules B1, B2 GND CM1220−08 MARKING DIAGRAM L208 J CM1220−04 5−Bump CSP Package J L208 CM1220−08 10−Bump CSP Package = CM1220−04CP = CM1220−08CP ORDERING INFORMATION Package Shipping† CM1220−04CP CSP−5 (Pb−Free) 3500/Tape & Reel CM1220−08CP CSP−10 (Pb−Free) 3500/Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2011 February, 2011 − Rev. 3 1 Publication Order Number: CM1220/D CM1220 PACKAGE / PINOUT DIAGRAMS Top View (Bumps Down View) Orientation Marking Bottom View (Bumps Up View) 1 2 3 + A J B C1 B2 Orientation Marking C CM1220−04 5−bump CSP Package with OptiGuard Orientation Marking 1 2 3 A A1 A1 A3 C3 C5 5 6 7 + C1 L208 B C3 Orientation Marking C B2 A1 A1 C7 B6 A3 A5 A7 CM1220−08 10−bump CSP Package with OptiGuard Table 1. PIN DESCRIPTIONS CM1220−08 CM1220−04 Pins Name Pins Name A1 ESD1 A1 ESD1 A3 ESD2 A3 ESD2 A5 ESD3 − A7 ESD4 B2 GND CM1220−08 CM1220−04 Pins Name Pins Name ESD Channel C1 ESD5 C1 ESD3 ESD Channel ESD Channel C3 ESD6 C3 ESD4 ESD Channel − ESD Channel C5 ESD7 − − ESD Channel − − ESD Channel C7 ESD8 − − ESD Channel B2 GND Device Ground B6 GND − − Device Ground Description Description SPECIFICATIONS Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Storage Temperature Range Rating Units −65 to +150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 3. STANDARD OPERATING CONDITIONS Parameter Operating Temperature Range http://onsemi.com 2 Rating Units −40 to +85 °C CM1220 Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol Parameter Conditions Min Typ Max Units 11 14 17 pF 0.1 1 mA 6.8 −0.8 9.0 −0.4 CDIODE Diode (Channel) Capacitance At 2.5 VDC Reverse Bias, 1 MHz, 30 mVAC VDIODE Diode Standoff Voltage IDIODE = 10 mA 6.0 ILEAK Diode Leakage Current VIN = +3.3 V (reverse bias voltage) VSIG Signal Clamp Voltage Positive Clamp Negative Clamp IDIODE = 10 mA VESD In−system ESD Withstand Voltage a) Human Body Model, MIL−STD−883, Method 3015 b) Contact Discharge per IEC 61000−4−2 (Note 2) RDYN Dynamic Resistance Positive Negative 5.6 −1.5 PERFORMANCE INFORMATION Capacitance (Normalized) Diode Characteristics (nominal conditions unless specified otherwise) DC Voltage Figure 1. Insertion Loss vs. Frequency (0 V Bias) http://onsemi.com 3 V kV ±30 ±15 2.3 0.9 1. TA = 25 °C unless otherwise specified. 2. ESD applied to input and output pins with respect to GND, one at a time. Unused pins are left open. V W CM1220 APPLICATION INFORMATION Table 5. PRINTED CIRCUIT BOARD RECOMMENDATIONS Parameter Value Pad Size on PCB 0.240 mm Pad Shape Round Pad Definition Non−Solder Mask defined pads Solder Mask Opening 0.290 mm Round Solder Stencil Thickness 0.125 − 0.150 mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300 mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance − Edge To Corner Ball ±50 mm Solder Ball Side Coplanarity ±20 mm Maximum Dwell Time Above Liquidous (183°C) 60 seconds Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste Non−Solder Mask Defined Pad 0.240 mm DIA. Solder Stencil Opening 0.300 mm DIA. Solder Mask Opening 0.290 mm DIA. Figure 2. Recommended Non−Solder Mask Defined Pad Illustration Figure 3. Lead−free (SnAgCu) Solder Ball Reflow Profile http://onsemi.com 4 260°C CM1220 PACKAGE DIMENSIONS WLCSP5, 0.96x1.33 CASE 567AY−01 ISSUE O D 2X A ÈÈ PIN A1 REFERENCE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B E DIM A A1 A2 b D E eD eE 0.05 C 2X 0.05 C TOP VIEW A2 OptiGuard Option 0.05 C ÉÉÉ A RECOMMENDED SOLDERING FOOTPRINT* 0.05 C NOTE 3 A1 SIDE VIEW C SEATING PLANE A1 eD/2 5X 0.05 C A B 0.03 C PACKAGE OUTLINE 0.87 eD b MILLIMETERS MIN MAX 0.56 0.72 0.21 0.27 0.40 REF 0.29 0.35 0.96 BSC 1.33 BSC 0.50 BSC 0.435 BSC eE C 0.44 B 0.25 0.50 A 5X 0.25 DIMENSIONS: MILLIMETERS 1 2 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. BOTTOM VIEW http://onsemi.com 5 CM1220 PACKAGE DIMENSIONS WLCSP10, 1.96x1.33 CASE 567BL−01 ISSUE O PIN A1 REFERENCE 2X ÈÈ D A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B E DIM A A1 A2 b D E eD eE 0.05 C 2X 0.05 C TOP VIEW ÉÉÉÉÉÉ OptiGuard Option 0.05 C A2 RECOMMENDED SOLDERING FOOTPRINT* A 0.05 C NOTE 3 A1 SIDE VIEW MILLIMETERS MIN MAX 0.72 0.56 0.21 0.27 0.40 REF 0.29 0.35 1.96 BSC 1.33 BSC 0.50 BSC 0.435 BSC C 0.25 SEATING PLANE A1 0.25 PACKAGE OUTLINE eD 10X 0.05 C A B 0.03 C 0.87 eD/2 b eE C 0.44 B 0.50 PITCH A 1 2 3 4 5 6 10X 0.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. BOTTOM VIEW OptiGuardt is a trademark of Semiconductor Components Industries, LLC. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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