Integrated Relay/Solenold Driver

MDC3205
Advance Information
Integrated Relay/Solenoid
Driver
• Optimized to Switch 3 V to 5 V Relays from a 5 V Rail
• Compatible with “TX’’ and “TQ’’ Series Telecom Relays Rated up to
•
•
•
•
•
•
625 mW at 3 V to 5 V
Features Low Input Drive Current
Internal Zener Clamp Routes Induced Current to Ground Rather
Than Back to Supply
Guaranteed Off State with No Input Connection
Supports Large Systems with Minimal Off−State Leakage
ESD Resistant in Accordance with the 2000 V Human Body Model
Provides a Robust Driver Interface Between Relay Coil and Sensitive
Logic Circuits
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RELAY/SOLENOID DRIVER
SILICON MONOLITHIC
CIRCUIT BLOCK
Applications include:
•
•
•
•
•
•
Telecom Line Cards and Telephony
Industrial Controls
Security Systems
Appliances and White Goods
Automated Test Equipment
Automotive Controls
CASE 29−11, STYLE 14
TO−92
INTERNAL CIRCUIT DIAGRAM
Vout
This device is intended to replace an array of three to six discrete
components with an integrated part. It can be used to switch other 3 to
5 Vdc Inductive Loads such as solenoids and small DC motors.
Vin 1.0 k
(3)
6.8 V
33 k
MAXIMUM RATINGS
GND
Rating
(2)
(1)
Symbol
Value
Unit
Power Supply Voltage
VCC
6.0
Vdc
Recommended Operating Supply Voltage
VCC
2.0−5.5
Vdc
Input Voltage
Vin(fwd)
6.0
Vdc
Reverse Input Voltage
Vin(rev)
−0.5
Vdc
Output Sink Current ⎯ Continuous
IO
300
mA
Junction Temperature
TJ
150
°C
Operating Ambient Temperature Range
TA
−40 to +85
°C
Storage Temperature Range
Tstg
−65 to +150
°C
Symbol
Max
Unit
PD
625
mW
RqJA
200
°C/W
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation(1)
Derate above 25°C
Thermal Resistance Junction to Ambient
1. FR−5 PCB of 1″ x 0.75″ x 0.062″, TA = 25°C
This document contains information on a new product. Specifications and information herein are subject to change without notice.
© Semiconductor Components Industries, LLC, 2006
July, 2006 − Rev. 3
1
Publication Order Number:
MDC3205/D
MDC3205
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
V(BRout)
V(−BRout)
6.4
—
6.8
−0.7
7.2
—
V
—
—
—
—
5.0
30
—
2.5
—
—
0.2
0.4
250
—
—
OFF CHARACTERISTICS
Output Zener Breakdown Voltage
(@ IT = 10 mA Pulse)
Output Leakage Current @ 0 Input Voltage
(Vout = 5.5 Vdc, Vin = O.C., TA = 25°C)
(Vout = 5.5 Vdc, Vin = O.C., TA = 85°C)
IOO
μA
ON CHARACTERISTICS
Input Bias Current @ Vin = 4.0 Vdc
(IO = 250 mA, Vout = 0.4 Vdc, TA = −40°C)
(correlated to a measurement @ 25°C)
Iin
mAdc
Output Saturation Voltage
(IO = 250 mA, Vin = 4.0 Vdc, TA = −40°C)
(correlated to a measurement @ 25°C)
Vdc
Output Sink Current ⎯ Continuous
(TA = −40°C, VCE = 0.4 Vdc, Vin = 4.0 Vdc )
(correlated to a measurement @ 25°C)
IC(on)
mA
TYPICAL APPLICATION−DEPENDENT SWITCHING PERFORMANCE
SWITCHING CHARACTERISTICS
Symbol
VCC
Min
Typ
Max
Propagation Delay Times:
High to Low Propagation Delay; Figures 1, 2 (5.0 V 74HC04)
Low to High Propagation Delay; Figures 1, 2 (5.0 V 74HC04)
Characteristic
tPHL
tPLH
5.5
5.5
—
—
55
430
—
—
High to Low Propagation Delay; Figures 1, 3 (3.0 V 74HC04)
Low to High Propagation Delay; Figures 1, 3 (3.0 V 74HC04)
tPHL
tPLH
5.5
5.5
—
—
85
315
—
—
High to Low Propagation Delay; Figures 1, 4 (5.0 V 74LS04)
Low to High Propagation Delay; Figures 1, 4 (5.0 V 74LS04)
tPHL
tPLH
5.5
5.5
—
—
55
2385
—
—
Transition Times:
Fall Time; Figures 1, 2 (5.0 V 74HC04)
Rise Time; Figures 1, 2 (5.0 V 74HC04)
tf
tr
5.5
5.5
—
—
45
160
—
—
Fall Time; Figures 1, 3 (3.0 V 74HC04)
Rise Time; Figures 1, 3 (3.0 V 74HC04)
tf
tr
5.5
5.5
—
—
70
195
—
—
Fall Time; Figures 1, 4 (5.0 V 74LS04)
Rise Time; Figures 1, 4 (5.0 V 74LS04)
tf
tr
5.5
5.5
—
—
45
2400
—
—
ΔV/Δt in
5.5
TBD
—
—
ns
ns
Input Slew Rate(1)
1. Minimum input slew rate must be followed to avoid overdissipating the device.
tf
Vin
Units
tr
VCC
90%
50%
10%
GND
tPLH
tPHL
VCC
90%
50%
10%
Vout
VZ
GND
tTHL
tTLH
Figure 1. Switching Waveforms
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2
V/ms
MDC3205
+4.5 ≤ VCC ≤ +5.5 Vdc
+ +
AROMAT
TX2−L2−3 V
Vout (3)
Vout (3)
MDC3205
74HC04 OR
EQUIVALENT
Vin (1)
MDC3205
1k
1k
6.8 V
Vin (1)
6.8 V
33 k
74HC04 OR
EQUIVALENT
33 k
GND (2)
GND (2)
Figure 2. A 3.0−V, 200−mW Dual Coil Latching Relay Application
with 5.0 V−HCMOS Interface
+3.0 ≤ VDD ≤ +3.75 Vdc
+4.5 ≤ VCC ≤ +5.5 Vdc
+ +
AROMAT
TX2−L2−3 V
Vout (3)
Vout (3)
MDC3205
74HC04 OR
EQUIVALENT
Vin (1)
MDC3205
1k
1k
6.8 V
Vin (1)
6.8 V
33 k
33 k
GND (2)
GND (2)
Figure 3. A 3.0−V, 200−mW Dual Coil Latching Relay Application
with 3.0 V−HCMOS Interface
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3
74HC04 OR
EQUIVALENT
MDC3205
+4.5 ≤ VCC ≤ +5.5 Vdc
+ +
AROMAT
TX2−L2−3 V
Vout (3)
Vout (3)
MDC3205
74LS04
BAL99LT
1
MDC3205
1k
1k
6.8 V
6.8 V
33 k
BAL99LT
1
74LS04
33 k
Vin (1)
Vin (1)
GND (2)
GND (2)
Figure 4. A 3.0−V, 200−mW Dual Coil Latching Relay Application
with TTL Interface
+4.5 TO +5.5 Vdc
+
+
AROMAT
R1
TX2−5 V
R2
−
AROMAT
TX2−5 V
−
Max Continuous Current Calculation
R1 = R2 = 178 Ω Nominal @ TA = 25°C
Assuming ±10% Make Tolerance,
R1 = R2 = (178 Ω) (0.9) = 160 Ω Min @ TA = 25°C
Vout (3)
TC for Annealed Copper Wire is 0.4%/°C
74HC04 OR
EQUIVALENT
N R1 = R2 = (160 Ω) [1+(0.004) (−40°−25°)] = 118 Ω
Min @ −40°C
Vin (1)
R1 in Parallel with R2 = 59 Ω Min @ −40°C
Io + 5.5 V Max – 0.4 V + 86 mA Max
59 W Min
86 mA ≤ 300 mA Max Io spec.
GND (2)
Figure 5. Typical 5.0 V, 140 mW Coil Dual Relay Application
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4
MDC3205
TYPICAL OPERATING WAVEFORMS
4.5
225
3.5
175
IC (mA)
V in (VOLTS)
(Circuit of Figure 5)
2.5
125
1.5
75
500
M
25
10
30
50
TIME (ms)
70
90
10
172
7
132
IZ (mA)
Vout (VOLTS)
9
5
52
1
12
50
TIME (ms)
70
90
10
Figure 8. 20 Hz Square Wave Response
600
TJ = 85°C
300
TJ = 25°C
70
90
TJ = 25°C
TJ = − 40°C
175
0.6
1
10
50
125
250
IC = 350 mA
0.4
0.2
100
0
50
TIME (ms)
0.8
400
200
30
1
OUTPUT VOLTAGE (V)
hFE
500
90
Figure 9. 20 Hz Square Wave Response
TJ = 125°C
Vo = 1.0 V
Vo = 0.25 V
70
92
3
30
50
TIME (ms)
Figure 7. 20 Hz Square Wave Response
Figure 6. 20 Hz Square Wave Input
10
30
1
10
100
Io, OUTPUT SINK CURRENT (mA)
0
1E−5
100
0
Figure 10. Pulsed Current Gain
1E−4
1E−3
INPUT CURRENT
Figure 11. Collector Saturation Region
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5
1E−2
MDC3205
PACKAGE DIMENSIONS
TO−92 (TO−226)
CASE 29−11
ISSUE AL
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND
BEYOND DIMENSION K MINIMUM.
B
R
P
L
SEATING
PLANE
K
STYLE 14:
PIN 1. EMITTER
2. COLLECTOR
3. BASE
D
X X
G
J
H
V
C
1
N
SECTION X−X
DIM
A
B
C
D
G
H
J
K
L
N
P
R
V
INCHES
MIN
MAX
0.175
0.205
0.170
0.210
0.125
0.165
0.016
0.021
0.045
0.055
0.095
0.105
0.015
0.020
0.500
−−−
0.250
−−−
0.080
0.105
−−− 0.100
0.115
−−−
0.135
−−−
MILLIMETERS
MIN
MAX
4.45
5.20
4.32
5.33
3.18
4.19
0.407
0.533
1.15
1.39
2.42
2.66
0.39
0.50
12.70
−−−
6.35
−−−
2.04
2.66
−−−
2.54
2.93
−−−
3.43
−−−
N
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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MDC3205/D